JP2003303657A - Ic socket, socket board, connection electrode, and manufacturing method of connection electrode - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC socket with excellent reliability of contact. <P>SOLUTION: The IC socket electrically connected to an IC comprises a connection electrode connected to the IC, and a housing movement capably holding the connection electrode. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket, a socket board, a connection electrode, and a connection electrode manufacturing method. In particular, the present invention relates to an IC socket electrically connected to an IC.

[0002]

2. Description of the Related Art In recent years, with the speeding up of IC operations and the narrowing of pitches of terminals, there is an increasing demand for low inductance and narrow pitches of IC sockets used in IC operation tests and the like. A conventional IC socket is, for example, a pogo pin type IC including a probe pin and a coil spring.
Sockets and elastomer type IC sockets in which an insulating low-elasticity elastomer holds individual rod-shaped contacts are known.

[0003]

However, since the pogo pin type IC socket has a complicated structure, it has a problem that it is difficult to narrow the pitch and reduce the cost. Further, the elastomer type IC socket has a problem that contact reliability and durability are not sufficient.
Therefore, conventionally, ICs with low cost and excellent contact reliability
Providing a socket was difficult.

Therefore, the present invention provides an IC socket, a socket board, a connection electrode, which can solve the above problems.
Another object of the present invention is to provide a method for manufacturing a connection electrode. This object is achieved by a combination of features described in independent claims of the invention. The dependent claims define further advantageous specific examples of the present invention.

[0005]

That is, according to a first aspect of the present invention, there is provided an IC socket electrically connected to an IC, comprising a connection electrode electrically connected to the IC and a connection electrode. Provided is an IC socket, which is provided with a movably holding housing. It is preferable that the IC socket includes a plurality of connecting electrodes, and the housing holds the plurality of connecting electrodes independently of each other.

The housing may movably hold the connection electrode in a direction substantially orthogonal to the connection direction in which the IC and the connection electrode are in contact with each other. The housing has a housing for housing the connection electrode, and the housing includes a device-side housing opening on a surface of the housing facing the IC, and the connection electrode is connected to the IC through the device-side housing opening. You may The diameter of the device-side housing opening is preferably smaller than the diameter of the figure in which the connection electrode is projected in the connection direction. The diameter of the device-side housing opening may be smaller than the diameter of the cross section of the accommodating portion formed by the plane orthogonal to the connection direction. Moreover, the connection electrode may protrude from the device-side housing opening in the connection direction. It is preferable that the housing further includes a locking portion that locks the connection electrode in the connection direction.

Further, the IC socket electrically connects the IC and the substrate, the accommodating portion further includes a substrate side housing opening on a surface of the housing facing the substrate, and the connection electrode has the substrate side in the connection direction. It may protrude from the housing opening and may be electrically connected to a substrate electrode of the substrate.
The housing may be split in the connecting direction. Further, it is preferable that the housing movably holds the connection electrode in the connection direction. The housing may hold the connection electrode rotatably about the connection direction.

It is preferable that the connection electrode moves in a direction substantially orthogonal to the connection direction by being pressed by the IC electrode of the IC in the connection direction and engages with the IC electrode. The connection electrode may have a substantially cylindrical device-side electrode, and may be electrically connected to the IC electrode at the edge of the opening of the device-side electrode. Further, the IC electrode is a BGA type IC electrode, and the device-side electrode accommodates the tip portion of the IC electrode in the opening of the device-side electrode and contacts the peripheral portion of the tip portion to form an IC electrode. It is preferably electrically connected. The IC socket electrically connects the IC and the board,
The connection electrode further has a substantially cylindrical substrate-side electrode and an electrode holding portion that is an elastic body that holds the device-side electrode and the substrate-side electrode. It may be electrically connected.

Further, the housing may have a locking portion for locking the electrode holding portion in the connecting direction. Further, the central axis of the substrate-side electrode may be substantially on the same straight line as the central axis of the device-side electrode. The electrode holder may electrically connect the device-side electrode and the substrate-side electrode. One end of the electrode holder may be joined to the side surface of the device-side electrode, and the other end of the electrode holder may be joined to the side surface of the substrate-side electrode.

When the connection electrode is pressed by the IC electrode or the substrate electrode, the electrode holding portion may be deformed so as to bring the device-side electrode and the substrate-side electrode closer to each other. The substrate electrode preferably faces the IC electrode with the connection electrode interposed therebetween. The device-side electrode, the substrate-side electrode, and the electrode holding portion are preferably formed integrally. The device side electrode is
It may be formed into a substantially cylindrical shape by winding a conductive plate. In this case, it is preferable that the conductive plate form a portion of the side surface of the substantially cylindrical shape that is equal to or more than 1/2 circumference. The IC socket is I
C is electrically connected to the substrate, the connection electrode further has a substrate-side electrode electrically connected to the substrate electrode of the substrate, and the device-side electrode has a first end and a second end. The conductive plate having a U-shape has a substantially cylindrical shape by winding a portion including the first end, and the substrate-side electrode includes a second end of the conductive plate having the substantially U-shape. By winding the portion, it may be formed into a substantially cylindrical shape. The device-side electrode may be formed by spirally winding a conductive plate. In this case, it is preferable that the outer periphery of the spirally wound conductive plate protrudes from the inner periphery in the connecting direction. Further, the device-side electrode may have a notch that is substantially parallel to the substantially cylindrical generatrix.

The IC socket electrically connects the IC and the substrate, and the connection electrode is connected to the substrate electrode of the substrate.
By being pressed in the direction connecting the substrate and the connection electrode,
It is preferable to move in a direction substantially orthogonal to the direction connecting the substrate and the connection electrode and engage with the substrate electrode.

According to a second aspect of the present invention, there is provided a socket board electrically connected to an IC electrode of an IC, the board having a substrate electrode, and the IC electrode and the substrate electrode being electrically connected. An IC socket is provided, and the IC socket provides a socket board having a connection electrode electrically connected to the IC and a housing movably holding the connection electrode.

According to the third aspect of the present invention, the connection electrode is electrically connected to the IC electrode of the IC, and includes a substantially cylindrical device-side electrode, and the edge of the opening of the device-side electrode. And a connection electrode electrically connected to the IC electrode.

According to a fourth aspect of the present invention, a BGA type I
A connection electrode electrically connected to the IC electrode of C, the tip of the IC electrode being housed in the opening of the device-side electrode, and contacting with the peripheral portion of the tip, the IC
Provided is a connection electrode comprising a device-side electrode electrically connected to the electrode.

According to a fifth aspect of the present invention, there is provided a connection electrode manufacturing method for manufacturing a connection electrode electrically connected to an IC, which comprises a preparation step of preparing a conductive plate and winding the conductive plate. And a forming step of forming a device-side electrode electrically connected to the IC electrode of the IC. The preparing step includes a first region having a substantially rectangular shape, a second region having a shape substantially symmetrical to the first region with respect to a straight line that does not pass through the first region substantially parallel to one side of the substantially rectangular shape, 1 area and 2nd
A conductive plate having a shape having a connection area connecting with the area may be prepared. The connection electrode electrically connects the IC and the substrate, and in the forming step, the device-side electrode forming step of forming the device-side electrode is performed by winding the first area, and the substrate is formed by winding the second area. And a substrate-side electrode forming step of forming a substrate-side electrode electrically connected to the substrate electrode. Further, the device-side electrode forming step may form a substantially cylindrical device-side electrode, and the substrate-side electrode forming step may form a substantially cylindrical substrate-side electrode having a substantially same central axis as the device-side electrode. . In the preparing step, a substantially U-shaped conductive plate may be prepared.

The above summary of the invention does not enumerate all the necessary features of the present invention, and a sub-combination of these feature groups can also be the invention.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the claimed invention, and the features described in the embodiments Not all combinations are essential to the solution of the invention.

FIG. 1 is an exploded perspective view of a socket board 500 according to an embodiment of the present invention. In the present embodiment, the socket board 500 is an IC included in the IC 200.
It is electrically connected to the electrodes. Socket board 500
Board 206, IC socket 100, socket guide 20
4, insert 212, and pressure head 210.

The substrate 206 has a substrate electrode. The IC socket 100 electrically connects the IC 200 and the board 206. The IC socket 100 electrically connects the IC electrode and the substrate electrode. The test device for testing the IC 200 and the IC 200 are the substrate 206 and the IC socket 10.
It is electrically connected via 0. IC socket 100
Includes a plurality of connection electrodes 10 arranged based on the terminal arrangement of the IC 200, and an insulating housing 90 holding the plurality of connection electrodes 10. Socket guide 204
Positions the IC socket 100. The socket guide 204 and the IC socket 100 are fixed to the board 206.

The insert 212 also positions and holds the IC 200. Then, the insert 212 holding the IC 200 is fitted while being guided by the socket guide 204. Finally, the pressure head 210 presses the insert 212 perpendicularly to the substrate 206 to uniformly press the IC 200 against the IC socket 100. When the IC 200 is pressed against the IC socket 100, each of the plurality of connection electrodes 10 of the IC socket 100 electrically connects each of the plurality of terminals of the IC 200 and each of the plurality of substrate electrodes 208 of the substrate 206. Connect to.

FIG. 2 shows an example of the outer shape of the IC 200 according to this embodiment. The IC 200 in this example is a BG in which solder bump-shaped IC electrodes 202 are provided on each of the terminals arranged in a grid on the back surface of the package.
It is an A (Ball Grid Array) type IC.

FIG. 3 shows an IC socket 1 according to this embodiment.
An example of 00 is shown. The IC socket 100 is electrically connected to the IC 200 described with reference to FIG. The IC socket 100 has the connection electrode 10 and the housing 90. In this embodiment, the IC socket 100 includes a plurality of connection electrodes (10-1 to 10-4). The connection electrode 10 is electrically connected to the IC 200.

The housing 90 movably holds the connection electrode 10. The housing 90 movably holds the connection electrode 10 in a direction substantially orthogonal to the connection direction in which the IC 200 and the connection electrode 10 are in contact with each other. The housing 90 preferably holds the connection electrode 10 movably in the connection direction. The housing 90 connects the connection electrode 10 to
It may be held rotatably about the connecting direction. The connection direction may be the direction from the IC 200 to the substrate 206. In the present embodiment, the housing 90 holds the plurality of connection electrodes (10-1 to 10-4) independently and movably.

The housing 90 also includes a housing portion 50 and a locking portion. The housing portion 50 houses the connection electrode 10. In the present embodiment, the housing portion 50 includes the housing 9
0 has a device-side housing opening 52 on the surface facing the IC 200. The housing portion 50 is provided on the surface of the housing 90 facing the substrate 206 on the substrate-side housing opening 5
4 is further included.

The connection electrode 10 is connected to the IC through the device-side housing opening 52. The connection electrode 10 is
It preferably projects from the device-side housing opening 52 in the connection direction. Further, the connection electrode 10 projects from the board-side housing opening 54 in the connection direction and is electrically connected to the board electrode of the board 206.

In the present embodiment, the diameter of the device-side housing opening 52 is smaller than the diameter of the figure in which the connection electrode 10 is projected in the connection direction. Device side housing opening 5
The diameter of 2 is smaller than the diameter of the cross section of the accommodating part 50 by the plane orthogonal to the connection direction.

The locking portion locks the connection electrode 10 in the connection direction. In this embodiment, the locking portion includes a device-side locking portion 46 and a board-side locking portion 48. The device-side locking portion 46 extends parallel to the surface of the housing 90 from the edge of the device-side housing opening 52. The device-side locking portion 46 connects the connection electrode 10 from the connection electrode 10 to the IC.
Lock in the direction toward 200. The board-side locking portion 48 extends parallel to the surface of the housing 90 from the edge of the board-side housing opening 54. Board side locking part 44
Locks the connection electrode 10 in the direction from the connection electrode 10 toward the substrate 206.

In the present embodiment, the housing 90
Is a device-side housing 42 and a board-side housing 44.
Is divided into and The housing 90 is preferably divided in the connecting direction. The device-side housing 42 and the board-side housing 44 face each other with the connection electrode 10 interposed therebetween. The board-side housing 44 is the device-side housing 4
It may have substantially the same shape as 2. In this embodiment, I
The C socket 100 is manufactured by joining the device-side housing 42 and the board-side housing 44 with the connection electrode 10 interposed therebetween.

FIG. 4 shows an example of the connection electrode 10 according to this embodiment. FIG. 4A shows a perspective view of the connection electrode 10. The connection electrode 10 is electrically connected to the IC electrode included in the IC. In the present embodiment, the connection electrode 10 is B
It is electrically connected to an IC electrode which is an electrode of a GA type IC. The connection electrode 10 is electrically connected to the substrate electrode included in the substrate 206 described with reference to FIG. The connection electrode 10 is electrically connected to the IC electrode and the substrate electrode that faces the IC electrode with the connection electrode 10 interposed therebetween. The connection electrode 10 includes the device-side electrode 22, the substrate-side electrode 24, and the electrode holder 3.
Has 0.

In this embodiment, the connection electrode 10 has a device-side electrode 22 having a substantially cylindrical shape.
It is electrically connected to the IC electrode at the edge of the second opening. The connection electrode 10 accommodates the tip of the IC electrode in the opening and makes contact with the peripheral portion of the tip, so that the I
It is electrically connected to the C electrode. Further, the connection electrode 10 is
It has a substantially cylindrical substrate-side electrode 24, and is electrically connected to the substrate electrode at the edge of the opening of the substrate-side electrode 24.

In the present embodiment, the connection electrode 10 includes the device-side electrode 22, the substrate-side electrode 24, which are integrally formed,
And an electrode holder 30. The device-side electrode 22 is
The conductive plate having a substantially U-shape having a first end and a second end is formed into a substantially cylindrical shape by winding a portion including the first end. The substrate-side electrode 24 is formed into a substantially cylindrical shape by winding a portion including the second end of the conductive plate. still,
The conductive plate may be a metal plate. The conductive plate may be, for example, BeAu, BeCu, or a brass plate.
The conductive plate may be an insulating plate having a conductive layer on its surface. The insulating plate may be, for example, a plastic plate.

The connection electrode 10 is formed by winding a conductive plate having a first area, a second area, and a connection area. The first region has a substantially rectangular shape. The second region has a shape that is substantially symmetrical to the first region with respect to a straight line that does not pass through the first region that is substantially parallel to one side of the substantially rectangular shape.
The connection area is an area that connects the first area and the second area. The substrate side electrode 24 is formed by winding the first region. The board-side opening 28 is formed by winding the second region. Further, the electrode holding portion 30 is formed from the connection region.

The device side electrode 22 is electrically connected to the IC electrode. In this embodiment, the device-side electrode 2
2 is a substantially cylindrical shape, and a substantially circular device-side opening 26
including. The device-side electrode 22 has a device-side opening 26.
Is electrically connected to the IC electrode at the edge of. The device-side electrode 22 includes a device-side opening 2 at the tip of the IC electrode.
6 and is brought into contact with the peripheral portion of the tip portion to be electrically connected to the IC electrode. In the present embodiment, the device-side electrode 22 is formed into a substantially cylindrical shape by winding a conductive plate. The device-side electrode 22 has a notch that is substantially parallel to the generally cylindrical generatrix. Device side electrode 2
2 has a notch parallel to the connecting direction on the substantially cylindrical side surface. In addition, the conductive plate is half of the side surface of the substantially cylindrical shape.
It is preferable to form a portion of the circumference or more.

The substrate side electrode 24 is electrically connected to the substrate electrode. In the present embodiment, the substrate-side electrode 24 has a substantially cylindrical shape and includes a substantially circular substrate-side opening 28. The substrate side electrode 24 is electrically connected to the substrate electrode at the edge of the substrate side opening 28. The substrate side electrode 24 has substantially the same shape as the device side electrode 22. The central axis of the substrate-side electrode 24 is preferably substantially on the same straight line as the central axis of the device-side electrode 22.

The electrode holder 30 is an elastic body that holds the device-side electrode 22 and the substrate-side electrode 24. The electrode holder 30 elastically holds the device-side electrode 22 and the substrate-side electrode 24. The electrode holding part 30 may have a plate shape. In the present embodiment, one end of the electrode holding portion 30 is joined to the side surface of the device side electrode 22, and the other end of the electrode holding portion 30 is joined to the side surface of the substrate side electrode 24. The electrode holding portion 30 includes a device-side extending portion extending from the device-side electrode 22 in a direction substantially orthogonal to the connecting direction, an intermediate extending portion extending from the device-side extending portion substantially parallel to the connecting direction, and an intermediate extending portion to the substrate. A substrate-side extending portion extending to the side electrode 24 may be included. In addition, in the present embodiment, the electrode holding portion 30
Electrically connects the device-side electrode 22 and the substrate-side electrode 24. In another example, the connection electrode 10 may further include a wiring that electrically connects the device-side electrode 22 and the substrate-side electrode 24.

In this embodiment, the locking portion described with reference to FIG. 3 locks the electrode holding portion 30 in the connecting direction. Device-side locking portion 4 described with reference to FIG.
6 locks the device side extending portion in the connecting direction.
The board-side locking portion 48 locks the board-side extending portion in the connecting direction.

FIG. 4B shows a top view of the connection electrode 10. In the present embodiment, the surface of the plate-shaped electrode holding portion 30 is substantially orthogonal to the side surface of the device-side electrode 22. In another embodiment, the electrode holding part 30 may be substantially in contact with the side surface of the device-side electrode 22.

FIG. 5 shows an example of the operation of the connection electrode 10 according to this embodiment. FIG. 5 shows the case where the connection electrode 10 is pressed by the IC electrode 202 or the substrate electrode 208.
An example of the operation of the connection electrode 10 will be shown. FIG. 5 shows the connection electrode 1 when the connection electrode 10 is viewed from the direction in which the electrode holding portion 30 is on the back side of the device-side electrode 22 and the substrate-side electrode 24.
It is a figure which shows 0. In the present embodiment, the connection electrode 10
Is electrically connected to the IC electrode 202 which is the electrode of the BGA type IC. The connection electrode 10 is electrically connected to a solder bump-shaped substrate electrode 208 included in the substrate 206.

In this embodiment, the IC electrode 202 is
The device-side electrode 22 is pressed toward the substrate-side electrode 24. The substrate electrode 208 presses the substrate-side electrode 24 toward the device-side electrode 22. The electrode holding part 30 is deformed when the device-side electrode 22 or the substrate-side electrode 24 is pressed against the IC electrode 202 or the substrate electrode 208. In the present embodiment, the electrode holding portion 30 bends when pressed. Thereby, the electrode holding unit 30 moves the device-side electrode 22 or the substrate-side electrode 24 in a direction in which the device-side electrode 22 and the substrate-side electrode 24 are brought closer to each other. The electrode holder 30 may move the device-side electrode 22 or the substrate-side electrode 24 in parallel in the direction. The electrode holder 30 may be deformed so that the device-side electrode 22 and the substrate-side electrode 24 are brought closer to each other.

FIG. 6 shows an example of the operation of the plurality of connection electrodes (10-1, 10-2) according to this embodiment. In the present embodiment, the IC 200 includes a plurality of IC electrodes (202-
1, 202-2). The substrate 206 has a plurality of substrate electrodes (208-1, 208-2). Connection electrode 1
0-1 electrically connects the IC electrode 202-1 and the substrate electrode 208-1. The connection electrode 10-2 is the IC electrode 2
02-2 and the substrate electrode 208-2 are electrically connected.
Further, the electrode holding portion 30-1 included in the connection electrode 10-1 is
The device side electrode 22-1 and the substrate side electrode 24-1 are deformed so as to be close to each other. The electrode holding portion 30-2 included in the connection electrode 10-2 is deformed to bring the device-side electrode 22-2 and the substrate-side electrode 24-2 closer to each other.

In this embodiment, the IC electrode 202-2
Is higher than the height of the IC electrode 202-1. I
The C electrode 202-2 may be larger than the IC electrode 202-1 in the connection direction. The substrate electrode 208-1 has substantially the same height as the substrate electrode 208-2. That is, in the present embodiment, the IC electrode 202-2 and the substrate electrode 208
-2 is the distance between the IC electrode 202-1 and the substrate electrode 208.
It is smaller than the distance from -1. In this case, the electrode holder 30
-2 is deformed more than the electrode holding portion 30-1, so that the distance between the device-side electrode 22-2 and the substrate-side electrode 24-2 becomes larger than the device-side electrode 22-1
Keep smaller than distance. That is, in the present embodiment, the electrode holder 30 includes the IC electrode 202 and the substrate electrode 20.
It deforms according to the distance from 8. This allows the IC200
Of the plurality of IC electrodes 202 included in the substrate or the substrate 20
Even when the sizes of the plurality of substrate electrodes 208 included in 6 vary, the IC 200 and the substrate 206 can be properly connected.

FIG. 7 shows another example of the operation of the connection electrode 10 according to this embodiment. FIG. 7 shows an example of the operation of the connection electrode 10 when the central axis of the IC electrode 202 or the substrate electrode 208 is deviated from the central axis of the connection electrode 10.

The central axis of the IC electrode 202 is the connection electrode 10
The device-side electrode 22 is pressed in a state of being displaced from the central axis of the device. In the present embodiment, the IC electrode 202 presses the device-side electrode 22 in the connection direction.

At this time, the IC electrode 202 is the connection electrode 10
And a part of the edge of the device-side opening 26. The IC electrode 202 contacts the connection electrode 10 at a contact point that is a part of the inner circumference of the device-side opening 26, and the connection electrode 10 contacts the device-side opening 26 with the IC electrode 202.
Store the tip of the.

In this case, the IC electrode 202 is the connection electrode 1
The contact point at 0 is pressed in the direction toward the outside of the device-side opening 26. Therefore, when the IC electrode 202 further presses the connection electrode 10, the connection electrode 10 moves in parallel in the horizontal movement direction substantially orthogonal to the connection direction, and the IC electrode 2
02 is stored deeper. That is, the connection electrode 10 is
When pressed by the IC electrode 202 in the connection direction, the IC electrode 202 moves in a direction substantially orthogonal to the connection direction and engages with the IC electrode 202.

Similarly, when the central axis of the substrate electrode 208 is displaced from the central axis of the connection electrode 10, the connection electrode 10
Is pressed by the substrate electrode 208 in the direction connecting the substrate 206 and the connection electrode 10, so that the substrate electrode 208 moves in a direction substantially orthogonal to the direction connecting the substrate 206 and the connection electrode 10 and engages with the substrate electrode 208. .

FIG. 8 shows a connection electrode manufacturing method for manufacturing the connection electrode 10. FIG. 8A is a diagram illustrating the preparation process. The connection electrode manufacturing method includes a preparation step and a formation step. In the preparation step, a conductive plate is prepared. In the present embodiment, the preparation step prepares a metal plate as the conductive plate. In the preparation step, a conductive plate having a first area 62, a second area 64, and a connection area 68 is prepared. First area 62
Has a substantially rectangular shape. The second region 64 has a shape that is substantially symmetrical to the first region 62 with respect to a straight line that does not pass through the first region 62 that is substantially parallel to one side of the substantially rectangular shape. The connection area 68 connects the first area 62 and the second area 64. In the preparing step, a substantially U-shaped conductive plate may be prepared.

FIG. 8B is a diagram for explaining the forming process. In the forming step, the device-side electrode 22 described with reference to FIG. 4 is formed by winding a conductive plate. In the present embodiment, the forming process includes a device-side electrode forming process and a substrate-side electrode forming process. The device side electrode formation process is
The device-side electrode 22 is formed by winding the first region 62. In the device-side electrode forming step, it is preferable to form the substantially cylindrical device-side electrode 22. In the substrate-side electrode forming step, the substrate-side electrode 24 described with reference to FIG. 4 is formed by winding the second region 64. In the substrate side electrode forming step, it is preferable to form a substantially cylindrical substrate side electrode 24 having a central axis substantially the same as that of the device side electrode 22.

In the present embodiment, the connection electrode is formed by winding a metal plate. In addition, the electrode holding portion of the connection electrode is deformed according to the distance between the IC electrode and the substrate electrode to properly connect the IC and the substrate. Therefore, according to the present embodiment, it is possible to provide an IC socket that is low in cost and excellent in contact reliability.

In another embodiment, the housing 90 described with reference to FIG. 3 may be integrally formed.
In this case, the housing 90 starts from the edge of the device-side housing opening 52 described with reference to FIG.
It is preferable to further include an insertion port extending parallel to the 0 surface. In this case, the insertion port allows the electrode holder 30 described with reference to FIG. 4 to pass through. The housing 90 may have an insertion opening including the device-side housing opening 52 and the insertion opening on the surface. The IC socket 100 is manufactured by inserting the connection electrode 10 into the housing 90 from the insertion opening.

FIG. 9 shows another example of the connection electrode 10 according to this embodiment. FIG. 9A shows a perspective view of the connection electrode 10 of this example. In this example, the device-side electrode 22 is formed by spirally winding a conductive plate. In this case, it is preferable that the outer periphery of the spirally wound conductive plate protrudes from the inner periphery in the connecting direction.

FIG. 9B shows a top view of the connection electrode 10 of this example. In this example, the device-side electrode 22 is approximately 2
It has a spiral shape around the circumference. In another example, the device-side electrode 22 may have more turns.

FIG. 9C is a diagram for explaining the method of manufacturing the connection electrode for manufacturing the connection electrode 10 of this example. In this example, the connection electrode 10 is formed of a conductive plate having a first region 62, a second region 64, and a connection region 68. In this example, the first region 62 and the second region 64 each have a substantially trapezoidal shape, and are connected to the connection region 68 at the lower bottom of the substantially trapezoidal shape. Also in this example, it is possible to provide an IC socket that is low in cost and excellent in contact reliability.

FIG. 10 shows a connection electrode 10 according to this embodiment.
Another example of FIG. 10A shows an example of the connection electrode 10 formed of a wire. The connection electrode 10 includes a device-side electrode 22, a substrate-side electrode 24, and an electrode holding portion 30. In this example, the device-side electrode 22, the substrate-side electrode 24, and the electrode holding portion 30 are integrally formed by a tubular wire. The device-side electrode 22 has the cross section of the tube at the end. The device-side electrode 22 has a device-side opening 26 corresponding to the hollow portion of the tube.
Have. The substrate-side electrode 24 has the cross section of the tube at the end. The substrate-side electrode 24 has a substrate-side opening 28 corresponding to the hollow portion of the tube. Also in this case, it is possible to provide an IC socket that is low in cost and excellent in contact reliability.

FIG. 10B shows an example of the connection electrode 10 formed of a plurality of conductive plates. The connection electrode 10 includes a device-side electrode 22, a substrate-side electrode 24, and an electrode holder 30.
Have. In this example, each of the device-side electrode 22, the substrate-side electrode 24, and the electrode holder 30 is formed of a plurality of conductive plates. Each of the plurality of conductive plates forming the device-side electrode 22 has a saw-toothed tip, and the tip is connected to the IC electrode. The plurality of conductive plates forming the device-side electrode 24 each have a saw-toothed tip portion, and the tip portion is connected to the substrate electrode. Also in this case, I which has low cost and excellent contact reliability
A C socket can be provided.

Further, another embodiment of the present invention is, for example,
It may be a performance board electrically connected to a test device for testing the IC. The performance board has a connecting portion and an IC socket. The connection part is electrically connected to the test apparatus. The connection part is the test equipment and IC
Make an electrical connection with the socket. Figure 2 shows the IC socket.
It may have the same or similar function as the IC socket 100 described in relation to. In another example, the performance board may comprise the socket board 500 described in connection with FIG. According to this embodiment, it is possible to provide a performance board including an IC socket that is low in cost and excellent in contact reliability.

Further, another embodiment of the present invention is, for example,
It may be a test device for testing an IC. The test equipment is
A pattern generation unit, a signal input / output unit, and a determination unit are provided.
The pattern generator generates an input pattern signal to be input to the IC. The signal input / output unit supplies an input pattern signal to the IC and receives an output pattern signal output from the IC according to the input pattern signal. In this embodiment,
The signal input / output unit has an IC socket. The IC socket may have the same or similar function as the IC socket 100 described with reference to FIG. The signal input / output unit may be provided in the test head, for example. The determination unit determines the quality of the IC according to the output pattern signal. In another embodiment, the signal input / output unit may include the socket board 500 described with reference to FIG. 1. According to this embodiment, it is possible to provide a test apparatus including an IC socket that is low in cost and has excellent contact reliability.

Although the present invention has been described with reference to the embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. Various changes or improvements can be added to the above-described embodiment. It is also possible to include such modifications or improvements in the technical scope of the present invention.
It is clear from the description of the claims.

[0059]

As is apparent from the above description, according to the present invention, it is possible to provide an IC socket which is low in cost and excellent in contact reliability.

[Brief description of drawings]

FIG. 1 is a socket board 5 according to an embodiment of the present invention.
00 is an exploded perspective view of FIG.

FIG. 2 shows an example of an outer shape of an IC 200 according to this embodiment.

FIG. 3 shows an example of an IC socket 100 according to this embodiment.

FIG. 4 shows an example of a connection electrode 10 according to this embodiment. FIG. 4A shows a perspective view of the connection electrode 10. Figure 4
(B) shows a top view of the connection electrode 10.

FIG. 5 shows an example of the operation of the connection electrode 10 according to the present embodiment.

FIG. 6 shows a plurality of connection electrodes (10-
An example of the operation of 1, 10-2) will be shown.

FIG. 7 shows another example of the operation of the connection electrode 10 according to the present embodiment.

FIG. 8 shows a connection electrode manufacturing method for manufacturing the connection electrode 10. FIG. 8A is a diagram illustrating the preparation process. FIG. 8B is a diagram illustrating the forming process.

FIG. 9 shows another example of the connection electrode 10 according to the present embodiment. FIG. 9A shows a perspective view of the connection electrode 10 of this example. FIG. 9B shows a top view of the connection electrode 10 of this example. FIG. 9C is a diagram illustrating a connection electrode manufacturing method for manufacturing the connection electrode 10 of this example.

FIG. 10 shows another example of the connection electrode 10 according to the present embodiment. FIG. 10A shows an example of the connection electrode 10 formed of a wire. FIG. 10B shows an example of the connection electrode 10 formed of a plurality of conductive plates.

[Explanation of symbols]

10 ... Connection electrodes 10, 22 ... Device-side electrode 2
2, 24 ... Substrate side electrodes 24, 26 ... Device side openings 26, 28 ... Substrate side openings 28, 30 ...
Electrode holder 30, 42 ... Device-side housing 4
2, 44 ... Board side housing 44, 62 ... First
Areas 62, 64 ... Second areas 64, 68 ... Connection areas 68, 90 ... Housing 90, 100 ... IC
Sockets 100, 200 ... IC 200, 202 ...
・ IC electrodes 202, 204 ... Socket guide 20
4, 206 ... Substrate 206, 208 ... Land 20
8, 208 ... Substrate electrodes 208, 210 ... Pressure heads 210, 212 ... Inserts 212, 500 ...
..Socket board 500,

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 2G003 AA07 AD09 AG01 AG08 AG10                       AG12 AH05                 2G011 AA07 AA16 AB01 AB06 AB07                       AC14 AE22 AF02                 5E024 CA18 CB05                 5E063 GA02 GA05

Claims (38)

[Claims] 1. An IC socket electrically connected to an IC, comprising: a connection electrode electrically connected to the IC; and a housing for movably holding the connection electrode. IC socket. 2. The IC socket according to claim 1, further comprising a plurality of the connection electrodes, wherein the housing holds the plurality of the connection electrodes independently of each other. 3. The housing according to claim 1, wherein the housing movably holds the connection electrode in a direction substantially orthogonal to a connection direction in which the IC and the connection electrode are in contact with each other. IC socket. 4. The housing has a housing for housing the connection electrode, the housing includes a device-side housing opening on a surface of the housing facing the IC, and the connection electrode includes: The IC socket according to claim 3, wherein the IC socket is connected to the IC through a device-side housing opening. 5. The IC socket according to claim 4, wherein a diameter of the device-side housing opening is smaller than a diameter of a figure in which the connection electrode is projected in the connection direction. 6. The I according to claim 4, wherein a diameter of the device-side housing opening is smaller than a diameter of a cross section of the accommodating portion formed by a plane orthogonal to the connection direction.
C socket. 7. The IC socket according to claim 4, wherein the connection electrode projects from the device-side housing opening in the connection direction. 8. The IC socket according to claim 4, wherein the housing further has a locking portion that locks the connection electrode in the connection direction. 9. The IC socket electrically connects the IC and a substrate, the housing portion further includes a substrate-side housing opening on a surface of the housing facing the substrate, and the connection electrode is The IC socket according to claim 4, wherein the IC socket protrudes from the board-side housing opening in the connection direction and is electrically connected to a board electrode included in the board. 10. The housing comprises:
The IC socket according to claim 3, wherein the IC socket is divided. 11. The housing comprises:
The IC socket according to claim 3, wherein the connection electrode is movably held. 12. The housing includes the connection electrode,
The IC socket according to claim 3, wherein the IC socket is held rotatably around the connection direction. 13. The connection electrode has an I included in the IC.
The IC socket according to claim 3, wherein when the C electrode is pressed in the connecting direction, the C electrode moves in a direction substantially orthogonal to the connecting direction and engages with the IC electrode. 14. The connection electrode has a substantially cylindrical device-side electrode, and is electrically connected to the IC electrode at an edge of an opening of the device-side electrode. The described IC socket. 15. The IC electrode is a BGA type IC electrode, and the device-side electrode accommodates a tip portion of the IC electrode in an opening of the device-side electrode and contacts a peripheral portion of the tip portion. 15. The IC socket according to claim 14, wherein the IC socket is electrically connected to the IC electrode. 16. The IC socket electrically connects the IC to a substrate, and the connection electrode has a substantially cylindrical substrate-side electrode, and an elastic body that holds the device-side electrode and the substrate-side electrode. 15. The IC socket according to claim 14, further comprising: an electrode holder, which is electrically connected to a substrate electrode of the substrate at an edge of the opening of the substrate-side electrode. 17. The IC socket according to claim 16, wherein the housing further includes a locking portion that locks the electrode holding portion in the connection direction. 18. The IC socket according to claim 16, wherein the central axis of the substrate-side electrode is substantially on the same straight line as the central axis of the device-side electrode. 19. The IC socket according to claim 16, wherein the electrode holding part electrically connects the device-side electrode and the substrate-side electrode. 20. The one end of the electrode holding portion is joined to a side surface of the device side electrode, and the other end of the electrode holding portion is joined to a side surface of the substrate side electrode. IC socket. 21. When the connection electrode is pressed by the IC electrode or the substrate electrode, the electrode holding portion is deformed to bring the device-side electrode and the substrate-side electrode closer to each other. The IC socket according to claim 16. 22. The substrate electrode faces the IC electrode with the connection electrode interposed therebetween.
6. The IC socket according to 6. 23. The IC socket according to claim 16, wherein the device-side electrode, the substrate-side electrode, and the electrode holding portion are integrally formed. 24. The IC socket according to claim 14, wherein the device-side electrode is formed into a substantially cylindrical shape by winding a conductive plate. 25. The IC socket according to claim 24, wherein the conductive plate forms a part of the side surface of the substantially cylindrical shape that is ½ circumference or more. 26. The IC socket electrically connects the IC to a substrate, and the connection electrode further has a substrate-side electrode electrically connected to a substrate electrode of the substrate, The side electrode is formed in the substantially cylindrical shape by winding a portion including the first end of a conductive plate having a substantially U-shape having a first end and a second end, and the substrate side electrode is The IC socket according to claim 14, wherein the IC socket is formed into a substantially cylindrical shape by winding a portion including the second end of the conductive plate having the substantially U-shape. 27. The device-side electrode is formed by spirally winding a conductive plate.
The IC socket according to 4. 28. The IC socket according to claim 27, wherein an outer circumference of the spirally wound conductive plate protrudes from an inner circumference in the connection direction. 29. The IC socket according to claim 14, wherein the device-side electrode has a notch that is substantially parallel to the generally cylindrical generatrix. 30. The IC socket electrically connects the IC and a substrate, and the connection electrode is pressed by a substrate electrode of the substrate in a direction connecting the substrate and the connection electrode. The IC socket according to claim 1, wherein the IC socket moves in a direction substantially orthogonal to a direction connecting the substrate and the connection electrode, and engages with the substrate electrode. 31. A socket board electrically connected to an IC electrode of an IC, comprising: a substrate having a substrate electrode; and an IC electrically connecting the IC electrode and the substrate electrode.
A socket board, comprising: a socket, wherein the IC socket includes a connection electrode electrically connected to the IC, and a housing that movably holds the connection electrode. 32. A connection electrode electrically connected to an IC electrode of an IC, comprising a device-side electrode having a substantially cylindrical shape, and the I-shaped electrode at the edge of the opening of the device-side electrode.
A connection electrode, which is electrically connected to a C electrode. 33. A connection electrode electrically connected to an IC electrode of a BGA type IC, wherein the tip of the IC electrode is housed in an opening of the device-side electrode, and a peripheral portion of the tip is provided. A connection electrode comprising a device-side electrode that is electrically connected to the IC electrode by contacting. 34. A connection electrode manufacturing method for manufacturing a connection electrode electrically connected to an IC, comprising: preparing a conductive plate; and winding the conductive plate to form an IC electrode included in the IC. And a forming step of forming a device-side electrode to be electrically connected. 35. In the preparing step, a first region having a substantially rectangular shape, and a straight line that does not pass through the first region that is substantially parallel to one side of the substantially rectangular shape and is substantially symmetrical to the first region. 35. The method of manufacturing a connection electrode according to claim 34, wherein the conductive plate having a shape having a second region having a region and a connection region connecting the first region and the second region is prepared. 36. The connection electrode electrically connects the IC and the substrate, and the forming step includes a device-side electrode forming step of forming the device-side electrode by winding the first region, 36. The connection electrode manufacturing method according to claim 35, further comprising: a substrate-side electrode forming step of forming a substrate-side electrode electrically connected to a substrate electrode of the substrate by winding the second region. Method. 37. The device-side electrode forming step forms the device-side electrode having a substantially cylindrical shape, and the substrate-side electrode forming step has a substantially cylindrical substrate having a central axis substantially the same as that of the device-side electrode. The method of manufacturing a connection electrode according to claim 36, wherein a side electrode is formed. 38. The method of manufacturing a connection electrode according to claim 34, wherein the preparing step prepares the substantially U-shaped conductive plate.