JP2003297804A5 - - Google Patents

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Publication number
JP2003297804A5
JP2003297804A5 JP2002330039A JP2002330039A JP2003297804A5 JP 2003297804 A5 JP2003297804 A5 JP 2003297804A5 JP 2002330039 A JP2002330039 A JP 2002330039A JP 2002330039 A JP2002330039 A JP 2002330039A JP 2003297804 A5 JP2003297804 A5 JP 2003297804A5
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JP
Japan
Prior art keywords
substrate
electrode
processing
electrolytic
chemical mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002330039A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003297804A (ja
JP4076430B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2002330039A external-priority patent/JP4076430B2/ja
Priority to JP2002330039A priority Critical patent/JP4076430B2/ja
Priority to TW092102098A priority patent/TWI275436B/zh
Priority to PCT/JP2003/001024 priority patent/WO2003065432A1/en
Priority to US10/484,452 priority patent/US20040206634A1/en
Priority to EP03703132A priority patent/EP1470576A4/en
Publication of JP2003297804A publication Critical patent/JP2003297804A/ja
Publication of JP2003297804A5 publication Critical patent/JP2003297804A5/ja
Priority to US11/723,934 priority patent/US7569135B2/en
Publication of JP4076430B2 publication Critical patent/JP4076430B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002330039A 2002-01-31 2002-11-13 基板処理装置 Expired - Fee Related JP4076430B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2002330039A JP4076430B2 (ja) 2002-01-31 2002-11-13 基板処理装置
TW092102098A TWI275436B (en) 2002-01-31 2003-01-30 Electrochemical machining device, and substrate processing apparatus and method
EP03703132A EP1470576A4 (en) 2002-01-31 2003-01-31 ELECTROLYTIC PROCESSING APPARATUS AND APPARATUS AND METHOD FOR PROCESSING A SUBSTRATE
US10/484,452 US20040206634A1 (en) 2002-01-31 2003-01-31 Electrolytic processing apparatus and substrate processing apparatus and method
PCT/JP2003/001024 WO2003065432A1 (en) 2002-01-31 2003-01-31 Electrolytic processing apparatus and substrate processing apparatus and method
US11/723,934 US7569135B2 (en) 2002-01-31 2007-03-22 Electrolytic processing apparatus and substrate processing apparatus and method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002-23785 2002-01-31
JP2002023785 2002-01-31
JP2002330039A JP4076430B2 (ja) 2002-01-31 2002-11-13 基板処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007332475A Division JP2008160134A (ja) 2002-01-31 2007-12-25 基板処理方法

Publications (3)

Publication Number Publication Date
JP2003297804A JP2003297804A (ja) 2003-10-17
JP2003297804A5 true JP2003297804A5 (ko) 2005-08-25
JP4076430B2 JP4076430B2 (ja) 2008-04-16

Family

ID=29404788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002330039A Expired - Fee Related JP4076430B2 (ja) 2002-01-31 2002-11-13 基板処理装置

Country Status (1)

Country Link
JP (1) JP4076430B2 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005281753A (ja) * 2004-03-29 2005-10-13 Ebara Corp 電解加工装置
US7655565B2 (en) * 2005-01-26 2010-02-02 Applied Materials, Inc. Electroprocessing profile control
WO2020044927A1 (ja) * 2018-08-31 2020-03-05 東邦エンジニアリング株式会社 触媒基準装置

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