JP2003289033A - Substrate treatment device and substrate treatment method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate treatment device and a substrate treatment method capable of reducing the consumption of a treatment solution. <P>SOLUTION: Rinse solution feeding nozzles 41a to 41g are disposed in parallel while being separated of almost equal intervals along a treatment solution feeding direction (scanning direction A) from one edge side SE to the other edge side EE of the substrate W at the time of supplying a rinse solution on the substrate W held by a substrate holding part. The rinse solution feeding nozzles 41a to 41g are respectively provided with discharge ports 43a to 43g each of whose discharge widths is almost equal to the width of the substrate W at each feeding position. Thus, it is possible to reduce the discharge of the rinse solution outside the substrate W at each feeding position, and to reduce the consumption of the rinse solution. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for supplying a processing liquid to a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display panel, a glass substrate for a plasma display panel or the like.

[0002]

2. Description of the Related Art When applying a treatment liquid to a substrate, scan coating for supplying the treatment liquid to the substrate by scanning with a slit nozzle for ejecting the treatment liquid tends to be generalized.

In particular, there is known a device for stopping the development by applying a developing solution to an exposed resist film on a substrate and then scanning the substrate while supplying the rinsing solution onto the substrate from a rinse nozzle which is a slit nozzle. Has been.

FIG. 8 is an explanatory view for explaining scanning by a developing nozzle and a rinse nozzle according to a conventional technique.

In this conventional apparatus, the developer is discharged from the slit nozzle from one end (start end) side to the other end (end end) side of the substrate W, and is moved on the substrate W in the direction of the arrow AR. Is coated on the substrate W, and after that, a predetermined developing time is maintained, and then a rinse liquid such as pure water is supplied. There is known a device that scans the rinse nozzle 91 from the same start end side to the end end at the same speed as the scanning speed of the developing nozzle.

[0006]

However, in the above-mentioned conventional apparatus, the rinse nozzle 9 for scanning as shown in FIG. 8 is used.
Since the lengthwise dimension of 1 is approximately the same as or slightly longer than the diameter of the substrate W, the slit 91a of the rinse nozzle 91 is located at the nozzle position (eg, the dotted line position in FIG. 8) close to the start end or end end of the substrate W. Since it protrudes from above the substrate W,
The rinse liquid discharged from the protruding portion of the rinse nozzle 91 is not supplied onto the substrate W and is wasted, and the consumption amount of the rinse liquid is large.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of reducing the amount of processing liquid consumed.

[0008]

In order to achieve the above-mentioned object, the invention of claim 1 is a substrate processing apparatus for supplying a processing liquid from one end side to the other end side of a substantially circular substrate. A substrate holding means for holding, a plurality of processing liquid supply nozzles for ejecting a processing liquid, and the processing liquid supply nozzles on the substrate held by the substrate holding means from one end side to the other end side of the substrate. Along the process liquid supply direction toward
Parallel arrangement means for arranging in parallel is provided, and each of the processing liquid supply nozzles has an ejection port having an ejection width corresponding to a width dimension of the substrate at an arrangement position of each nozzle during a processing liquid ejection operation. is doing.

According to a second aspect of the invention, there is provided the substrate processing apparatus according to the first aspect, wherein the processing liquid supply nozzle discharges a rinse liquid.

Further, the invention of claim 3 is a substrate processing method for supplying a processing liquid from one end side to the other end side of a substantially circular substrate, wherein the processing liquid is directed from one end side to the other end side of the substrate. A plurality of processing liquid discharge lines that are substantially orthogonal to the processing liquid supply direction are set in parallel along the supply direction, and each processing liquid discharge line corresponds to the width dimension of the substrate in the processing liquid discharge line. The processing liquid is discharged in a width.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings.

To explain the schematic structure of the present invention, this substrate processing apparatus has a plurality of processing liquid supply nozzles.
On the substrate, the processing liquid supply nozzles are arranged in parallel along the processing liquid supply direction from one end side to the other end side of the substrate, and each processing liquid supply nozzle corresponds to the width dimension of the substrate at each position to be arranged. It has a discharge port with a discharge width of

{1. First Embodiment} <1A. Apparatus Configuration> The substrate processing apparatus according to the first embodiment of the present invention will be described below. In the first embodiment, the plurality of processing liquid supply nozzles move substantially parallel (horizontal) to the main surface of the substrate between the supply position and the standby position,
Substrate processing apparatuses that are arranged side by side in the horizontal direction at the standby position will be described.

FIG. 1 is a plan view showing a schematic structure of a substrate processing apparatus 1 according to a first embodiment of the present invention, and FIG. 2 is a sectional view taken along line II-II of FIG. In addition, in order to clarify the directional relationship between them, FIGS. 1 and 2 and subsequent figures are provided with an XYZ orthogonal coordinate system in which the Z-axis direction is the vertical direction and the XY plane is the horizontal plane as necessary. .

The substrate processing apparatus 1 is an apparatus for supplying a developing solution to the exposed substrate W to perform a developing process. The substrate holding unit 10 for holding the substrate W and the main surface of the substrate W are developed. A developing solution supply means 20 for supplying a solution, a rinse solution supply means 40 for supplying a rinse solution to the main surface of the substrate W, and a controller 50 for controlling the operation of the entire apparatus are provided.

The substrate holding unit 10 holds a substantially circular substrate W in a substantially horizontal posture.

Specifically, the substrate holding portion 10 includes a support shaft portion 11 arranged in a substantially vertical position at a substantially central portion of the apparatus body 5.
And a holding table 12 fixedly provided on the upper end of the supporting shaft portion 11.
It has and. The holding table 12 is configured to be capable of sucking and holding the substrate W in a substantially horizontal posture. Note that the holding table 12 is not limited to the structure that sucks and holds the substrate W, and may have a structure that holds the peripheral portion of the substrate W.

A circular inner cup 6 is provided around the substrate holder 10 so as to surround the substrate W, and a substantially square outer cup 7 is provided around the outer circumference of the inner cup 6.
Is provided. Further, on both sides of the outer cup 7, standby pots 8a and 8b for the developer supply nozzle 21 to stand by are provided. Further, a standby pot 9 for rinsing rinse liquid supply nozzles 41a to 41g described later is provided on the side of the standby pot 8b on the X negative side.

The developing solution supply means 20 supplies the developing solution from one end side to the other end side of the main surface of the substrate W. Specifically, the developing solution supply unit 20 includes a developing solution supply nozzle 21 and
Developer supply nozzle moving mechanism 22 and developer supply system mechanism 2
6 and.

The developer supply system mechanism 26 includes a developer supply source and an opening / closing valve (both not shown), and the controller 5
The developing solution is supplied from the developing solution supply source to the developing solution supply nozzle 21 at a predetermined timing to be described later according to the opening / closing timing of the opening / closing valve by 0.

The developing solution supply nozzle 21 has a slit-shaped discharge port 2 having a width dimension substantially the same as the diameter dimension of the substrate W.
3 (see FIG. 2). The developing solution supplied from the developing solution supply system mechanism 26 is discharged from the entire width of the discharge port 21a. The width dimension of the ejection port may be larger than the width dimension of the substrate W.

The developing solution supply nozzle moving mechanism 22 comprises a guide rail 51, a horizontal drive section 24, and a support arm section 25. The guide rail 51 is laid on the upper surface side of the apparatus main body 5 and laterally of the substrate holding portion 10 along the horizontal direction. The horizontal drive unit 24 uses the guide rail 51.
Along the horizontal direction, a predetermined scanning direction A (X direction) and the opposite direction (X negative direction) can be horizontally moved. The support arm 25 is cantilevered by the horizontal drive unit 24 so as to extend toward the substrate holding unit 10, and the developer supply nozzle 21 is provided on the free end side thereof in a direction orthogonal to the scanning direction A. It is supported in a substantially horizontal position along.

By driving the horizontal drive unit 24, the developer supply nozzle 21 can be moved above the main surface of the substrate W from one end side to the other end side. When the developing solution supply nozzle 21 moves above the substrate W, by ejecting the developing solution from the developing solution supply nozzle 21, the developing solution is supplied to the entire main surface of the substrate W.

The rinse liquid supply means 40 supplies the rinse liquid to the main surface of the substrate W.

Specifically, the rinse liquid supply means 40 includes rinse liquid supply nozzles 41a to 41g, rinse liquid supply nozzle moving mechanisms 42a to 42g, and a rinse liquid supply system mechanism 46.
And the rinsing liquid is supplied by the same configuration and operation as the developing liquid supplying means 20. Note that each of the rinse liquid supply nozzles 41a to 41g is provided in a corresponding one of the rinse liquid supply nozzle moving mechanisms 42a to 42g. In this way, in each member of the rinse liquid supply means 40 and the like, the alphabets included in the reference numerals are assigned corresponding to each other.

The rinse liquid supply system mechanism 46 has the same structure as the developing solution supply system mechanism 26. That is, the rinse liquid supply source (not shown) and the rinse liquid supply nozzle 41.
a to 41 g, a plurality of pipes for supplying a rinse liquid,
Further, each of these pipes is provided with an opening / closing valve (not shown), and by the opening / closing control of the opening / closing valve by the control unit 50, the rinse liquid is individually supplied to each of the rinse liquid supply nozzles 41a to 41g at a predetermined timing described later. . From the rinse liquid supply system mechanism 46, a liquid that can stop the development on the substrate W and wash away particles and the like to be sufficiently washed is supplied as the rinse liquid. That is, the rinse liquid used in this embodiment functions as a development stop liquid and a cleaning liquid. Normally, pure water is used as the rinse liquid.

Plural rinse liquid supply nozzles 41a to 41g
Is a slit-shaped discharge port (supply port) 43 in which at least adjacent rinse liquid supply nozzles have different width dimensions.
a to 43 g.

FIG. 3 shows the rinse liquid supply nozzles 41a to 41g.
FIG. 7 is a diagram showing a planar arrangement when the rinse liquid is supplied onto the substrate W of FIG. Further, FIG. 4 is a schematic view showing the horizontal arrangement, postures and operations of the developing solution supply nozzle 21 and the rinse solution supply nozzles 41a to 41g at each stage of substrate processing.

As shown in FIGS. 3 and 4C, the rinse liquid supply nozzles 41a to 41g are arranged so that one end of the rinse liquid supply nozzle 41a to 41g (starting when the rinse liquid is supplied onto the substrate W held by the substrate holder 10). Along the processing liquid supply direction (scanning direction A) from the end side SE to the other end side (end end) EE, they are arranged in parallel at substantially equal intervals. In other words, when the rinse liquid is supplied onto the substrate W, each rinse liquid supply nozzle 41a.
The discharge ports 43a to 43g of ~ 41g form a plurality of processing liquid discharge lines substantially parallel to the processing liquid supply direction in parallel. The arrangement of the rinse liquid supply nozzles 41a to 41g at the time of supplying the rinse liquid, that is, the position where each of the rinse liquid supply nozzles 41a to 41g is arranged on the substrate W held by the substrate holding means is hereinafter referred to as " Called "supply position". On the contrary, the position where each of the rinse liquid supply nozzles 41a to 41g is arranged on the standby pot 9 for standby is called a "standby position".

Then, rinse liquid supply nozzles 41a to 41
Each g has ejection ports 43a to 43g having ejection widths (substantially equal) corresponding to the width dimension of the substrate W at each supply position. That is, in each processing liquid ejection line, the processing liquid is ejected in a width corresponding to the width dimension of the substrate W in the processing liquid ejection line.

The discharge ports 43a to 43g may have a discharge width larger than that of the substrate W at each supply position.

Rinsing liquid supply nozzle moving mechanisms 42a to 42
g has the same structure as that of the developing solution supply nozzle moving mechanism 22, that is, the horizontal drive units 44a to 44g corresponding to the horizontal drive unit 24 and the support arm corresponding to the support arm unit 25. Parts 45a to 45g.

Further, as shown in FIG. 4, the rinse liquid supply nozzles 41a to 41g are slightly moved in the vertical direction (Z direction) so that the discharge ports 43a to 43g are slightly opposite to the scanning direction A. The support arm portions 45 are provided with inclination.
a to 45g. Note that, as shown in FIG. 4, the developer supply nozzle 21 also has a slight inclination with respect to the vertical direction so that the ejection port 23 faces slightly in the direction opposite to the scanning direction A, and has a supporting arm. It is attached to the part 25.

Then, as shown in FIG. 4 (c), the rinse liquid supply nozzles 41a to 41g are arranged on the substrate W at predetermined intervals by the drive of the horizontal drive unit 44,
By sequentially discharging the rinse liquid in the discharge direction RD from the rinse liquid supply nozzles 41a to 41g, the rinse liquid is supplied to the entire main surface of the substrate W.

In the initial standby state of the substrate processing apparatus 1, the developing solution supply nozzle 21 and the rinse solution supply nozzles 41a to 41a in the direction opposite to the predetermined scanning direction A (X negative direction).
They are arranged in the order of 1 g. Then, the developing solution supply nozzle 21 and each of the rinse solution supply nozzles 41a to 41g.
Are configured so that they can be moved above the substrate W in that order. That is, after the developing solution supply nozzle 21 has passed over the substrate W in the scanning direction A, each rinse solution supply nozzle 41a.
˜41 g can be sequentially moved onto the substrate W.

Further, in the present embodiment, the developing solution supply nozzle moving mechanism 22 and the rinse solution supply nozzle moving mechanism 42a.
Although ~ 42g is configured to move on the common guide rail 51, these may move along completely different guide members, and the moving mechanism is not limited to the above. Absent.

The control unit 50 controls the entire apparatus, and includes a CPU, a ROM, a RAM and the like, and is constituted by a general microcomputer which performs a predetermined arithmetic operation by a software program stored in advance. There is.

The control unit 50 includes a spin motor 13, a horizontal drive unit 24, a developer supply system mechanism 26, and a horizontal drive unit 44.
a to 44 g, each portion of the rinse liquid supply system mechanism 46 and the like are communicably connected, and a series of operations described below are controlled through control of these portions, at least from the rinse liquid supply means 40 to the substrate W. The operation of each part is controlled when the rinse liquid is supplied to the main surface of the.

<1B. Processing Operation> Next, the processing operation of the substrate processing apparatus 1 will be described with reference to FIG. The operation of each unit described below is performed under the control of the control unit 50.

In the initial standby state, the substrate W is held by the substrate holding unit 1.
0 is supported in a horizontal position in a stationary state, and the developer supply nozzle 21 and the rinse solution supply nozzles 41a to 41g are respectively placed on the standby pot 8b and the standby pot 9 (standby position) as shown in FIG. positioned.

After the processing is started, first, as shown in FIG. 4A, a developing solution supplying step is executed. Specifically, the developing solution supply nozzle 21 is driven by the horizontal driving unit 24 above the main surface of the substrate W in the scanning direction A, that is, one end side S of the substrate W.
It moves from E toward the other end EE. When the developing solution supply nozzle 21 moves above the main surface of the substrate W, the developing solution sent from the developing solution supply system mechanism 26 is discharged from the developing solution supply nozzle 21, and the developing solution is spread over the entire main surface of the substrate W. Supplied.
At that time, the control unit 50 controls the horizontal drive unit 24 and the developing solution supply system mechanism 26. As a result, the main surface of the substrate W is developed. As described above, since the developing solution supply nozzle 21 is in a posture in which the ejection port 23 is slightly oriented in the opposite direction to the scanning direction A, the developing solution is ejected mainly in the opposite direction to the developing direction while developing. The liquid supply nozzle 21 moves on the substrate W.

Next, as shown in FIG. 4B, a rinse liquid supply nozzle arrangement step is performed. Specifically, the developing solution supply nozzle 21 is retracted onto the standby pot 8a by driving the horizontal driving unit 24, and the rinsing liquid supply nozzles 41a to 41g are respectively supplied on the substrate W by driving the horizontal driving units 44a to 44g. Move to position and be placed.

Next, as shown in FIG. 4C, a rinse liquid supply step is performed. More specifically, first, a rinse liquid is supplied to stop development. Specifically, the rinse liquid is supplied from the rinse liquid supply system mechanism 46 to each rinse liquid supply nozzle 41.
a to 41 g, and is discharged from the discharge ports 43 a to 43 g onto the main surface of the substrate W which is stationary in a horizontal posture.

However, each rinse liquid supply nozzle 41a-4
The timing of starting the supply of the rinse liquid is different for each 1 g.
Specifically, in the developing solution supply process, after the developing solution supply nozzle 21 passes above the main surface of the substrate W while ejecting the developing solution, a predetermined time necessary for the development reaction on the substrate W is adjusted to the timing. Then, the supply of the rinse liquid is sequentially started from the one end side SE of the position where the substrate W is held to the other end side EE, more specifically, in the scanning direction A order. The timing control for starting the discharge of the rinse liquid is also performed by the control unit 5.
0 controls the timing of the liquid sending operation of the rinse liquid supply system mechanism 46. Here, the interval between the rinse liquid supply nozzles 41a to 41g at the time of supplying the rinse liquid is adjusted so that the development reaction is not significantly affected at positions immediately below the nozzles 41a to 41g adjacent to each other. . As described above, the developing time can be made substantially the same on the entire main surface of the substrate W. In each of the rinse liquid supply nozzles 41a to 41g, after the rinse liquid is discharged at each of the above timings, a sufficient amount of rinse liquid is discharged to stop the development reaction on the substrate W at each position, and then the rinse liquid is discharged. May be stopped, or discharge of the rinse liquid may be continued.

Further, as described above, the rinse liquid supply nozzle 4
1a to 41g are configured such that the ejection ports 43a to 43g are slightly oriented in the direction opposite to the scanning direction A,
At the time of supplying the rinse liquid, the rinse liquid is supplied in the discharge direction RD, that is, in the direction opposite to the scanning direction A, so that the rinse liquid supplied first is an area on the substrate W to be supplied thereafter,
That is, the developing time can be made uniform in each part of the substrate W without reaching the positive side (downstream side) in the scanning direction A from the rinse liquid supply nozzle that started the supply.

When supplying the rinse liquid, the rinse liquid supply nozzles 41a to 41g respectively supply the rinse liquid from the discharge ports 43a to 43g having discharge widths corresponding to (approximately equal to) the width dimension of the substrate W at each supply position. Since the liquid is discharged, the rinse liquid is not wastefully supplied to the outside of the width dimension of the substrate W at each supply position.

Thus, the rinse liquid supply nozzles 41a to 41a
When the discharge of the rinse liquid from 1 g reaches the other end side (scanning direction A side) of the substrate W, the rinse liquid is supplied to the entire main surface of the substrate W, and the rinse liquid supply for stopping the development is completed. .

As described above, after the rinse liquid is discharged onto the entire main surface of the substrate W, the rinse liquid as the cleaning liquid for the substrate is continuously discharged from the rinse liquid supply nozzles 41a to 41g. Good. In this case, the substrate W may be rotated in order to enhance the cleaning effect.

Finally, as shown in FIG. 4D, a rinse liquid supply nozzle retracting step is executed. Specifically, the rinse liquid supply nozzle 4 is driven by driving the horizontal drive units 44a to 44g.
1a to 41g retract to the standby position. At this time, as described above, at the standby position, the rinse liquid supply nozzles 41a to 41g are arranged close to each other with a small interval in the arrangement direction (X negative direction). This completes the development and cleaning processing operations.

According to the substrate processing apparatus configured as described above, the rinse liquid supply nozzles 41a to 41g are on the substrate W held by the substrate holding unit 10 and the substrate W
Of the rinse liquid supply nozzle 41a. The rinse liquid supply nozzle moving mechanisms 42a to 42g are arranged in parallel along the processing liquid supply direction (scanning direction A) from one end side to the other end side.
˜41 g are discharge ports 43 a having a discharge width corresponding to the width dimension of the substrate W at each position to be arranged on the substrate W.
To 43 g, the rinse liquid supply nozzles 41 a to 4
Since 1 g does not discharge the rinse liquid outside the substrate W at each position to be arranged on the substrate W, the consumption amount of the rinse liquid can be reduced.

Second Embodiment FIG. 5 is a schematic configuration and operation of a rinse liquid supply means 140 of a substrate processing apparatus according to a second embodiment of the present invention and a rinse liquid supply nozzle 41a.
It is a figure which shows arrangement | positioning of -41g. The same components as those of the device according to the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

In the second embodiment, the processing liquid supply nozzles are arranged in a row along the vertical direction at the standby position.

Specifically, in the second embodiment, the first
A supporting arm portion (not shown) similar to that of the above embodiment is supported by the rinse liquid supply nozzle moving mechanism 142 in a cantilever manner so as to extend toward the substrate holding portion 10 side (Y direction).
When the rinse liquid supply nozzles 41a to 41g are on the substrate W, the rinse liquid supply nozzle moving mechanism 142 can move the support arm along the scanning direction A, and
The rinse liquid supply nozzles 41a to 41g are configured to be movable up and down on the side of the substrate W on the X negative side (near the standby position). That is, the rinse liquid supply nozzle moving mechanism 142 can move the support arm portion in an L shape in the XZ plane. Therefore, as shown by the solid line in FIG. 5, at the standby position, the rinse liquid supply nozzles 41a to 41g can be arranged vertically along the vertical direction. Also,
At that time, adjacent rinse liquid supply nozzles are arranged close to each other.

Further, as shown by the dotted line in FIG.
The rinse liquid supply nozzle moving mechanism 142 arranges the rinse liquid supply nozzles 41a to 41g at the same supply position as in the first embodiment. In addition, the rinse liquid supply nozzles 41a to 41g
Is the same as that of the first embodiment, and it is also the same as having a discharge port having a discharge width corresponding to the width dimension of the substrate W at each supply position. Further, although not shown, the other configurations such as the configuration of the rinse solution supply system mechanism and the developing solution supply means are similar to those of the first embodiment. Furthermore, the developing solution supply operation and the rinse solution supply operation, and particularly the control of the rinse solution supply timing at the supply position, are the same as in the first embodiment.

According to the second embodiment, the same effect as that of the first embodiment is obtained, and at the standby position, the rinse liquid supply nozzles are arranged in a row in the vertical direction, so that at the standby position. The nozzle occupies a small area, and the area occupied by the entire apparatus can be suppressed.

{Third Embodiment} FIG. 6 is a schematic configuration and operation of a rinse liquid supply means 240 of a substrate processing apparatus according to a third embodiment of the present invention and a rinse liquid supply nozzle 41a.
It is a figure which shows arrangement | positioning of -41g. The same components as those of the device according to the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

In the third embodiment, the plurality of treatment liquid supply nozzles form a plurality of treatment liquid supply nozzle groups at the standby position, and the plurality of treatment liquid supply nozzle groups are arranged while being stacked. The processing liquid supply nozzles adjacent to each other in each processing liquid supply nozzle group are arranged in parallel in a stepwise manner.

Specifically, in the third embodiment, the first
A supporting arm portion (not shown) similar to that in the above embodiment is supported by the rinse liquid supply nozzle moving mechanism 242 in a cantilever manner so as to extend toward the substrate holding portion 10 side (Y direction).
Then, while the rinse liquid supply nozzles 41a to 41g are on the substrate W, the rinse liquid supply nozzle moving mechanism 242 can move the support arm portion along the scanning direction A, and the rinse liquid supply nozzles 41a to 41g are the substrate. In the state of being on the side of W on the X negative side (in the vicinity of the standby position), it is configured to be movable diagonally upward in the X negative direction. for that reason,
As shown by the solid line in FIG. 6, at the standby position, the rinse liquid supply nozzles 41a to 41c are arranged in parallel in a stepwise manner to form the rinse liquid supply nozzle group NG1, and the rinse liquid supply nozzles 41d to 41g are arranged in parallel in a stepwise manner. Then, the rinse liquid supply nozzle group NG2 is arranged such that the rinse liquid supply nozzle group NG1 is stacked on the rinse liquid supply nozzle group NG2.
At that time, adjacent rinse liquid supply nozzles are arranged close to each other.

Further, as shown by the dotted line in FIG.
The rinse liquid supply nozzle moving mechanism 242 arranges the nozzles at the same supply position as in the first embodiment. Since the rinse liquid supply nozzles 41a to 41g are the same as those in the first embodiment, it is also the same that the rinse liquid supply nozzles 41a to 41g have discharge ports each having a discharge width corresponding to the width dimension of the substrate W at each supply position. Also,
Although not shown, other configurations such as the configuration of the rinse liquid supply system mechanism and the developing solution supply means are the same as those in the first embodiment. Further, the developing solution supply operation and the rinse solution supply operation, particularly, the control of the rinse solution supply timing at the supply position is also the same as in the first embodiment.

According to the third embodiment, the same effects as those of the first embodiment are obtained, and the plurality of rinse liquid supply nozzles 41a to 41g are arranged in the standby position at the plurality of rinse liquid supply nozzle groups NG1. , NG2 are formed, and the plurality of rinse liquid supply nozzle groups NG1 and NG2 are stacked and arranged on each other, and each rinse liquid supply nozzle group N is formed.
Since the rinse liquid supply nozzles adjacent to each other in G1 and NG2 are arranged in parallel in a stepwise manner, the area occupied by the device can be made smaller than that in the first embodiment in which all of them are arranged in parallel, and at the same time, the second embodiment can The height of the device can be made lower than the vertical arrangement in the vertical direction as in the configuration, and the device can be made compact.

{Fourth Embodiment} FIG. 7 is a schematic configuration and operation of a rinse liquid supply means 340 of a substrate processing apparatus according to a fourth embodiment of the present invention and a rinse liquid supply nozzle 41a.
It is a figure which shows arrangement | positioning of -41g. The same components as those of the device according to the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

In the fourth embodiment, the substrate processing apparatus is
Nozzle holding means for integrally holding the plurality of processing liquid supply nozzles in a state of being arranged in parallel at the supply position, and a holding surface of the nozzle holding means for holding the plurality of processing liquid supply nozzles are parallel to the main surface of the substrate. A plurality of nozzle drive means for moving the nozzle holding means between a supply attitude and a standby attitude in which the holding surface of the nozzle holding means is perpendicular to the main surface of the substrate outside the occupied area of the substrate. The processing liquid supply nozzle is integrally configured so as to be movable between the supply position and the standby position.

Specifically, in the fourth embodiment, each of the rinse liquid supply nozzles 41a to 41g is a holding surface 3 which is one side of a nozzle holding body 347 as a flat plate nozzle holding means.
47a is integrally fixed to the supply position in parallel at the supply position (indicated by a dotted line in FIG. 7), and the rinse liquid supply nozzle moving mechanism 342 moves the nozzle holder 347 to the X side of the substrate W in the Y direction. The rotation mechanism is capable of rotating 90 degrees about the rotation shaft 342a. Then, the rinse liquid supply nozzle moving mechanism 342 moves the nozzle holder 347 to the rotary shaft 342a.
When the nozzle holder 347 is in the horizontal plane (XY plane) and the rinse liquid supply nozzles 41a to 41g are arranged at the supply position by rotating the nozzle holder 347 by 90 degrees in the direction of the arrow B (FIG. 7). And the nozzle holder 347 is upright in the YZ plane and the rinse liquid supply nozzle 41a.
It is possible to integrally move the rinse liquid supply nozzles 41a to 41g between the state in which the nozzles 41 to 41g are arranged at the standby position (the solid line in FIG. 7).

Since the treatment liquid supply nozzle is the same as that in the first embodiment, it is also the same as having a discharge port having a discharge width corresponding to the width dimension of the substrate W at each supply position. Further, although not shown, the other configurations such as the configuration of the rinse solution supply system mechanism and the developing solution supply means are similar to those of the first embodiment. Further, the developing solution supply operation and the rinse solution supply operation, particularly, the control of the rinse solution supply timing at the supply position is also the same as in the first embodiment.

According to the fourth embodiment, the same effect as that of the first embodiment is obtained, and the substrate processing apparatus has the plurality of rinse liquid supply nozzles 41a to 41g arranged in parallel at the supply position. In a state where the nozzle holding body 347 and the holding surface 347a holding the plurality of processing liquid supply nozzles in the nozzle holding body 347 are parallel to the main surface of the substrate W, and the occupation area of the substrate W The nozzle holder 3 is held between the holding surface 347a of the nozzle holder 347 and the standby position in which the holding surface 347a is perpendicular to the main surface of the substrate W.
Since the rinsing liquid supply nozzle moving mechanism 342 for moving 47 is provided, the rinsing liquid supply nozzle 41a at the standby position is provided.
The occupation area of about 41 g is small, and the occupation area of the entire apparatus can be suppressed.

{Modification} The embodiment of the present invention has been described above, but the present invention is not limited to the above example. For example, although the rinse liquid supply nozzles 41a to 41g for supplying the rinse liquid are shown as the processing liquid supply nozzles of the present invention in each of the above-described embodiments, the present invention is applied to the developing liquid supply nozzles using the developing liquid as the processing liquid. The present invention can also be applied to a nozzle that supplies a processing liquid in other substrate processing such as a photoresist liquid.

Further, rinse liquid supply nozzles 41a to 41g
Is a one-fluid type in which pure water is usually used as the rinse liquid, but a two-fluid type nozzle using a liquid in which a gas and a liquid (for example, pure water) are mixed may be used.

[0068]

According to the first and second aspects of the invention configured as described above, the processing liquid supply nozzles are provided on the substrate held by the substrate holding means from one end side of the substrate. A parallel arrangement means for arranging in parallel is provided along the processing liquid supply direction toward the other end side, and each processing liquid supply nozzle corresponds to the width dimension of the substrate at each position to be arranged on the substrate. Since the processing liquid supply nozzle has a discharge port having a discharge width, the processing liquid supply nozzle rarely discharges the processing liquid outside the width dimension of the substrate at each position to be arranged on the substrate. Can be reduced.

Further, according to the second aspect of the invention, since the treatment liquid supply nozzle discharges the rinse liquid, the consumption amount of the rinse liquid can be particularly reduced.

According to the third aspect of the present invention, a plurality of processing liquid discharge lines that are substantially orthogonal to the processing liquid supply direction are set in parallel, and in each processing liquid discharge line, the substrate in the processing liquid discharge line is set. Since the processing liquid is discharged in a width corresponding to the width dimension of the processing liquid, the processing liquid is less likely to be discharged outside the width corresponding to the width dimension of the substrate in the processing liquid discharge line, so that the consumption amount of the processing liquid is reduced. be able to.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing a substrate processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II of FIG.

FIG. 3 is a diagram showing a planar arrangement of a rinse liquid supply nozzle when supplying a rinse liquid onto a substrate.

FIG. 4 is a schematic diagram showing a horizontal arrangement, postures, and operations of a developer supply nozzle and a rinse solution supply nozzle at each stage of substrate processing.

FIG. 5 is a diagram showing a schematic configuration and operation of a rinse liquid supply means and an arrangement of a rinse liquid supply nozzle of a substrate processing apparatus according to a second embodiment of the present invention.

FIG. 6 is a diagram showing a schematic configuration and operation of a rinse liquid supply means and an arrangement of a rinse liquid supply nozzle of a substrate processing apparatus according to a third embodiment of the present invention.

FIG. 7 is a diagram showing a schematic configuration and operation of a rinse liquid supply means and an arrangement of a rinse liquid supply nozzle of a substrate processing apparatus according to a fourth embodiment of the present invention.

FIG. 8 is an explanatory diagram for explaining scanning by a developing nozzle and a rinse nozzle according to a conventional technique.

[Explanation of symbols]

1 Substrate Processing Device 10 Substrate Holding Unit (Substrate Holding Unit) 41a to 41g Rinse Liquid Supply Nozzles 42a to 42g Rinse Liquid Supply Nozzle Moving Mechanism (Parallel Arrangement Means) 43a to 43g Discharge Port A Scanning Direction W Substrate

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Masahiko Harumoto             4-chome Tenjin, which runs up to Teranouchi, Horikawa-dori, Kamigyo-ku, Kyoto             1 Kitamachi No. 1 Dai Nippon Screen Manufacturing Co., Ltd.             Inside the company F-term (reference) 2H096 AA25 AA27 GA17 GA21                 5F046 LA14 LA19

Claims (3)

[Claims] 1. A substrate processing apparatus for supplying a processing liquid from one end side to the other end side of a substantially circular shape, the substrate holding means for holding a substrate, a plurality of processing liquid supply nozzles for discharging the processing liquid, Parallel arrangement means for arranging the processing liquid supply nozzles in parallel on the substrate held by the substrate holding means along the processing liquid supply direction from one end side to the other end side of the substrate. The substrate processing apparatus, wherein each of the processing liquid supply nozzles has a discharge port having a discharge width corresponding to a width dimension of the substrate at a position where each nozzle is arranged during a discharge operation of the processing liquid. 2. The substrate processing apparatus according to claim 1, wherein the processing liquid supply nozzle discharges a rinse liquid. 3. A substrate processing method for supplying a processing liquid from one end side to the other end side of a substantially circular substrate, wherein the processing liquid is supplied along the processing liquid supply direction from one end side to the other end side of the substrate. A plurality of processing liquid discharge lines that are substantially orthogonal to the processing liquid supply direction are set in parallel, and in each processing liquid discharge line, the processing liquid is discharged in a width corresponding to the width dimension of the substrate in the processing liquid discharge line. A substrate processing method characterized by the above.