JP2003288559A - Rf-id media and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily form the gap of a fixed quantity between a base material and an IC module and to prevent an insulating film formed on the lower surface of the IC module from being broken and a circuit part in the IC module from coming into contact with an antenna to short-circuit even when an external force is applied to the IC module. <P>SOLUTION: In an area where neither a connection terminal 114 nor the antenna 112 is provided between the IC module 111 and a resin sheet 115, a spacer 113 is interposed which is thicker than the antenna 112 and thinner than the sum of the thickness of the antenna 112 and the length of the connection terminal 114. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an RF-ID medium capable of writing and reading information in a non-contact state, and a manufacturing method thereof.

[0002]

2. Description of the Related Art In recent years, with the development of an information-oriented society, information is recorded on a card, and information management and payment using the card are performed. In addition, information is recorded on labels and tags attached to products and the like, and products and the like are managed using these labels and tags.

In the information management using such a card, label or tag, an IC equipped with an IC capable of writing and reading information to and from the card, label or tag in a non-contact state is mounted. A contact type IC card, a non-contact type IC label, and a non-contact type IC tag are rapidly spreading due to their excellent convenience.

FIG. 6 is a view showing an example of the structure of a general non-contact type IC tag, and FIG. 6 (a) is a view showing the internal structure,
(B) is a cross-sectional view taken along the line AA ′ shown in (a).

The non-contact type IC tag in this conventional example is shown in FIG.
As shown in FIG. 5, an IC module 511 capable of writing and reading information from the outside on the resin sheet 515.
Is mounted via an adhesive 516, is connected to the IC module 511 via a connection terminal 514, and a current is supplied to the IC module 511 by electromagnetic induction from an external information writing / reading device (not shown). Supply IC
An inlet 510 having a conductive antenna 512 for writing and reading information to and from the module 511 in a non-contact state, and an I of the inlet 510
The IC module 511 and the antenna 5 are stacked on the surface on which the C module 511 is mounted via an adhesive layer 550.
12 and a surface sheet 520 on which information is printed.

In the non-contact type IC tag 500 constructed as described above, the antenna 512 is moved from the antenna 512 by electromagnetic induction from the information writing / reading device when it is brought close to the information writing / reading device provided outside. IC module 51
1 to supply current, so that in the non-contact state,
The information writing / reading device writes information to the IC module 511, and the information writing / reading device reads the information written in the IC module 511.

A method of manufacturing the non-contact type IC tag 500 as described above will be described below.

FIG. 7 shows the non-contact type IC tag 5 shown in FIG.
It is a figure for demonstrating the manufacturing method of 00.

First, a coil-shaped antenna 512 is formed on a resin sheet 515 by etching, printing or the like (FIG. 7A).

Next, the IC module 5 of the antenna 512
11 is connected to the connection terminal 5 of the IC module 511.
Adhesive 51 containing conductive particles so that 14 abuts
The IC module 511 is mounted on the resin sheet 515 via 6 (FIG. 7B).

Next, by heating the IC module 511 while applying a predetermined pressure, the IC module 511 and the resin sheet 515 are bonded by the adhesive 516 and the connection provided on the back surface of the IC module 511 is performed. The antenna 512 and the IC module 511 are electrically connected via the terminal 514, and the inlet 510
Is completed (FIG. 7 (c)). Here, the adhesive 516 contains minute conductive particles, and the adhesive 516 alone does not have conductivity, and only those that come into contact with each other through the conductive particles are conductive. Therefore, the antenna 512 and the connection terminal 514 are electrically connected.

Then, the adhesive layer 5 is formed on the inlet 510.
Non-contact type IC by stacking the top sheet 520 via 50
The tag 500 is completed (FIG. 7D).

[0013]

Generally, like the above-mentioned non-contact type IC tag, an IC module is mounted on a resin sheet on which an antenna is formed so as to be connected to the antenna through a connection terminal. In the RF-ID medium, when the antenna and the lower surface of the IC module come into contact with each other, the insulating film provided on the lower surface of the IC module is destroyed or the circuit portion in the IC module comes into contact with the antenna and short-circuits. There is a risk that it will end up. Therefore, when mounting the IC module on the resin sheet,
It is necessary to form a predetermined gap between the IC module and the resin sheet.

In the conventional method for manufacturing a non-contact type IC tag as described above, the pressure applied to the IC module to connect the IC module and the antenna is controlled to control the IC module and the resin sheet. A predetermined amount of space is formed between them, but in that case, the pressure applied to the IC module is several tens of grams to
There is a problem that pressure control is difficult because the pressure is as small as several hundred grams. For example, an IC is mounted using a mounting head that applies a predetermined pressure to the IC module from the surface opposite to the surface of the IC module that faces the resin sheet.
When connecting the module and the antenna, it is necessary to control the pressure in consideration of the frictional resistance of the driving portion of the mounting head. Here, when a pressure exceeding a predetermined value is applied to the IC module, a gap may not be formed between the IC module and the resin sheet, and the IC module may be broken.

The connection terminals of the IC module are IC
The shape of the module is displaced so that it collapses when pressure is applied to the module and it is connected to the antenna.
Since the heights and shapes of the connection terminals vary from C module to C module, the amount of the gap formed between the IC module and the resin sheet can be made constant only by keeping the pressure control of the IC module constant. However, there is a possibility that mounting defects may occur.

Further, there is also a manufacturing method in which a predetermined amount of gap is formed between the IC module and the resin sheet by controlling the stop position of the mounting head when applying pressure to the IC module using the mounting head. Used,
In the manufacturing method, when the flatness of the base plate on which the resin sheet is mounted when manufacturing the RF-ID medium is not excellent, the interval between the mounting head stop position and the base plate varies, and as a result, However, the amount of the gap formed between the IC module and the resin sheet cannot be made constant, and there is a risk that mounting defects will occur.

Further, even when a predetermined amount of gap is formed between the IC module and the resin sheet, an external force is applied on the IC module so that the antenna and the lower surface of the IC module come into contact with each other and the IC module lowers. There is a possibility that the insulating film provided on the lower surface may be destroyed, or a circuit portion in the IC module may come into contact with the antenna and short-circuit.

The present invention has been made in view of the problems of the above-described conventional technique, and is designed to be connected to an antenna via a connection terminal on a base substrate on which an antenna is formed. RF with IC module mounted on
In the ID medium, a certain amount of gap can be easily formed between the base material and the IC module, and the insulation provided on the lower surface of the IC module even when an external force is applied to the IC module. An object of the present invention is to provide an RF-ID medium and a method for manufacturing the same, which can prevent the film from being broken or the circuit part in the IC module from coming into contact with the antenna to cause a short circuit.

[0019]

In order to achieve the above-mentioned object, the present invention has a conductive antenna formed on a base sheet, and a connection terminal for connecting with the antenna, An IC module capable of writing and reading information includes at least a base substrate mounted on the base sheet so as to be connected to the antenna by the connection terminal, and the IC module is connected to the IC module via the antenna. In an RF-ID medium in which writing and reading of information are performed in a non-contact state, it is interposed between the IC module and the base sheet in a region where the connection terminal and the antenna are not provided, Has a thickness greater than the thickness and less than the sum of the thickness of the antenna and the length of the connection terminal. Characterized in that it comprises a regulating member.

Further, the IC module is adhered to the base sheet with an adhesive having conductive particles, and the regulating member has a thickness larger than the sum of the thickness of the antenna and the diameter of the conductive particles. Is characterized by.

Further, the regulating member is shaped so as to cover the entire area of the base sheet on which the IC module is mounted and where the antenna is not provided.

Also, in the method for manufacturing the RF-ID medium, the step of attaching the regulating member to the mounting surface of the IC module on the base sheet, and the IC module having the regulating member attached to the base sheet. And a step of connecting the connecting member and the antenna by applying pressure to the IC module mounted on the base sheet in a direction toward the base sheet. And

Also, in the method of manufacturing the RF-ID medium, the step of mounting the regulating member on the mounting surface of the IC module of the base sheet, and the IC on the base sheet on which the regulating member is mounted. Module mounting process and the IC mounted on the base sheet
Connecting the connection member and the antenna by applying pressure to the module in a direction toward the base sheet.

The step of attaching the regulation member to the mounting surface of the IC module with respect to the base sheet,
A wafer in which a plurality of the IC modules are arranged, and a regulation member sheet having an opening such that the connection terminal is exposed when the wafer is attached to a surface of the wafer on which the connection terminal is provided It is characterized in that the bonding is performed on the surface provided with the connection terminal, and the bonded wafer sheet and regulation member sheet are cut into each of the IC modules.

(Operation) In the present invention configured as described above, the IC module is connected to the connecting member of the IC module mounted on the base sheet and the antenna formed on the base sheet. When pressure is applied in the direction toward the base sheet, the shape of the connection terminal is deformed, and the gap between the IC module and the base sheet becomes narrower accordingly, but between the IC module and the base sheet, In a region where the connection terminal and the antenna are not provided, a regulation member having a thickness larger than the thickness of the antenna and smaller than the sum of the thickness of the antenna and the length of the connection terminal is interposed. The distance between the base sheet and the base sheet is set to a constant distance such that the connecting member and the antenna are connected and the IC module and the antenna do not contact each other. It is.

Further, when an external force is applied to the IC module, the displacement of the IC module toward the base sheet side is regulated by the regulation member. Therefore, even when an external force is applied to the IC module, The insulating film provided on the bottom surface may be destroyed, or the IC
The circuit part in the module is prevented from coming into contact with the antenna and short-circuiting.

Further, when the IC module is adhered to the base sheet with an adhesive having conductive particles, the thickness of the regulating member may be thicker than the sum of the thickness of the antenna and the diameter of the conductive particles. For example, even when the conductive particles enter between the IC module and the base sheet, the circuit in the IC module and the antenna are not short-circuited.

If the regulating member is shaped so as to cover the entire area of the base sheet where the IC module is not mounted, where the antenna is not provided, the IC module is damaged or the circuit is short-circuited. Is more reliably prevented.

Further, when the attachment of the regulating member to the mounting surface of the base sheet of the IC module as described above is performed on the wafer on which a plurality of IC modules are arranged and the surface on which the connection terminals of the wafer are provided, A regulation member sheet having an opening through which the connection terminal is exposed is attached to the surface provided with the connection terminal, and the attached wafer and the regulation member sheet are cut into individual IC modules. For example, the regulation member can be easily attached to the IC module.

[0030]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a diagram showing an example of a non-contact type IC tag which is an embodiment of the RF-ID medium of the present invention. (A) is a diagram showing an internal structure, and (b) is (a). 3 is a sectional view taken along line AA ′ in FIG.

In this embodiment, as shown in FIG. 1, an IC module 111 capable of writing and reading information from the outside is mounted on a resin sheet 115 which is a base sheet via an adhesive 116, and is connected. A current is supplied to the IC module 111 by electromagnetic induction from an information writing / reading device (not shown) provided outside and connected to the IC module 111 via a terminal 114, and writing and reading of information to and from the IC module 111. And an inlet 1 which is a base material on which a conductive antenna 112 for performing the contactless operation is formed.
The IC module 111 and the IC sheet 111 are laminated on the surface on which the IC module 111 is mounted via an adhesive layer 150 to protect the IC module 111 and the antenna 112, and a surface sheet 120 on which information is printed. Further, on the surface of the IC module 111 facing the resin sheet 115, in a region where the connection terminals 114 are not provided and when the IC module 111 is mounted on the resin sheet 115, a region that does not face the antenna 112, IC
A spacer 113, which is a regulating member that regulates the distance between the module 111 and the resin sheet 115, is provided. By contacting the spacer 113 with the surface of the resin sheet 115, the distance between the IC module 111 and the resin sheet 115 is increased. It is regulated.

In the non-contact type IC tag 100 configured as described above, the antenna 112 is moved from the antenna 112 by electromagnetic induction from the information writing / reading device when it is brought close to the information writing / reading device provided outside. IC module 11
1 to supply current, so that in the non-contact state,
The information writing / reading device writes information to the IC module 111, and the information writing / reading device reads the information written in the IC module 111.

The method of manufacturing the non-contact type IC tag 100 as described above will be described below.

FIG. 2 shows the non-contact type IC tag 1 shown in FIG.
It is a figure for demonstrating an example of the manufacturing method of 00.

First, the coil-shaped antenna 112 is formed on the resin sheet 115 by etching or printing (FIG. 2A).

Next, the IC module 1 of the antenna 112
The connection terminal 1 of the IC module 111 at the connection portion with 11.
Adhesive 11 containing conductive particles so that 14 abuts
The IC module 111 is mounted on the resin sheet 115 via 6 (FIG. 2B).

Here, the IC module 111 is constructed by cutting a wafer composed of a plurality of IC modules 111, and the IC module 1
Spacer 1 provided on the surface facing the resin sheet 11
13 is attached to the IC module 111 in the previous step of cutting the IC module 111 from the wafer.

FIG. 3 shows the IC module 11 shown in FIG.
2A and 2B are views for explaining a step of attaching the spacer 113 to the substrate No. 1, wherein FIG. 7A is a diagram showing a wafer composed of a plurality of IC modules 111, and FIG. 7B is a spacer sheet attached to the wafer shown in FIG. The figure shows (c) the state where the spacer sheet shown in (b) is attached to the wafer shown in (a), and (d) the wafer shown in (c) is cut for each IC module 111. FIG.

In this embodiment, first, the wafer 1 including a plurality of IC modules 111 as shown in FIG.
No. 01 connection terminal 114 is provided on the surface of FIG.
A spacer sheet 103 as shown in (b) is attached.
Here, in the spacer sheet 103, the wafer 10
The opening 104 is formed so that the connection terminal 114 is exposed when it is affixed to FIG.
When the spacer sheet 103 as shown in FIG. 3B is attached to the surface of the wafer 101 on which the connection terminals 114 are provided as shown in FIG. 3A, as shown in FIG. The provided connection terminal 114 comes to be exposed from the opening 104 of the spacer sheet 103.

After that, when the wafer 101 to which the spacer sheet 103 is attached is cut by a dicing cutter or the like for each IC module 111, the connection terminals are formed on the surface provided with the connection terminals 114 as shown in FIG. 3D. 114
The IC module 111 is completed in which the spacers 113 are attached to the regions where the is not provided.

Next, in the heated state, the IC module 1
When pressure is applied to 11, the IC module 11
The shape of the connection terminal 114 provided on the back surface of the No. 1 is displaced, the antenna 112 and the IC module 111 are electrically connected through the connection terminal 114, and the IC module 111 and the resin sheet 115 are connected. And are bonded by the adhesive agent 116, and the inlet 110 is completed (FIG. 2C). Here, when pressure is applied to the IC module 111, the gap between the IC module 111 and the resin sheet 115 becomes narrower as the shape of the connection terminal 114 is displaced. After that, the IC module 11
The spacer 113 attached to the back surface of the resin sheet 11 is
5 and the pressing force on the IC module 111 reaches a predetermined value, the pressing on the IC chip 111 is terminated. As a result, the distance between the IC module 111 and the resin sheet 115 is regulated by the thickness of the spacer 113.

The spacer 113 is shaped so that its thickness is thicker than the thickness of the antenna 112 and thinner than the sum of the thickness of the antenna 112 and the length of the connection terminal 114. Therefore, the distance between the IC module 111 and the resin sheet 115 regulated by the spacer 113 is such that the lower surface of the IC module 111 is the antenna 112.
And the connection terminal 114 is not in contact with the antenna 1
There will be an interval that can be connected with 12. The material of the spacer 113 is preferably a polyimide film or the like that does not adversely affect the dicing cutter or the like when the spacer sheet 103 is cut and has neither thermal expansion nor thermoplasticity.

Further, the adhesive agent 116 contains fine conductive particles, and the adhesive agent 116 alone does not have conductivity, but only those which are in contact with each other through the conductive particles are conductive. Therefore, the antenna 112 and the connection terminal 114 are electrically connected. Therefore, when conductive particles enter between the lower surface of the IC module 111 and the antenna 112, the IC module 11
There is a possibility that the circuit in 1 and the antenna 112 may be short-circuited. Therefore, the thickness of the spacer 113 is set to the antenna 11
If the thickness is larger than the sum of the thickness of 2 and the diameter of the conductive particles, the IC
Even when conductive particles enter between the lower surface of the module 111 and the antenna 112, the IC module 11
The circuit in 1 and the antenna 112 will not be short-circuited. As the conductive particles, for example, particles having a diameter of 5 μm are used. In this case, the spacer 113 is used.
May be thicker than the thickness of the antenna 112 plus 5 μm.

Then, the adhesive layer 1 is formed on the inlet 110.
Non-contact type IC by laminating the topsheet 120 via 50
The tag 100 is completed (FIG. 2 (d)).

In the non-contact type IC tag 100 manufactured by the above-mentioned manufacturing method, the thickness thereof is thicker than the thickness of the antenna 112, and the thickness of the antenna 112 and the length of the connection terminal 114 are larger than the sum of the thickness of the antenna 112 and the length of the connection terminal 114. The spacer 113, which has a thin shape, regulates the distance between the IC module 111 and the resin sheet 115. Therefore, the distance between the IC module 111 and the resin sheet 115 does not depend on the pressing force on the IC module 111. It becomes constant, and depending on the height and shape of the connection terminal 114 of the IC module 111, the IC module 111 and the resin sheet 1
The distance from 15 does not vary.

Further, depending on the thickness of the spacer 113, the IC
Since the distance between the module 111 and the resin sheet 115 is regulated, even if the flatness of the base plate (not shown) on which the resin sheet 115 is mounted is not excellent, the IC module 111 and the resin sheet 115 are The intervals can be constant.

When an external force is applied to the IC module 111, the resin sheet 1 of the IC module 111
The displacement to the 15 side is restricted by the spacer 113, so that even when an external force is applied to the IC module 111, the insulating film provided on the lower surface of the IC module 111 is destroyed or the IC module 111 is broken.
It is possible to prevent the internal circuit portion from coming into contact with the antenna 112 and causing a short circuit.

In the manufacturing method described above, the IC
The spacer 113 is pasted on the back surface of the module 111, and the IC module 111 to which the spacer 113 is pasted
Is mounted on the resin sheet 115.
15 after mounting the spacer 113 on the spacer 11,
IC module 1 on the resin sheet 115 on which 3 is mounted.
It is also possible to mount 11.

FIG. 4 shows the non-contact type IC tag 1 shown in FIG.
It is a figure for demonstrating the other example of the manufacturing method of 00.

First, the coil-shaped antenna 112 is formed on the resin sheet 115 by etching or printing (FIG. 4A).

Next, on the resin sheet 115, the IC
The spacer 113 is mounted in the area where the module 111 is mounted and in the area where the antenna 112 is not formed via the adhesive 116 containing conductive particles (FIG. 4).
(B)).

Next, the IC module 1 of the antenna 112
The connection terminal 1 of the IC module 111 at the connection portion with 11.
The IC module 111 is mounted on the resin sheet 115 so that the 14 contacts (FIG. 4C).

Next, in the heated state, the IC module 1
When pressure is applied to 11, the IC module 11
The shape of the connection terminal 114 provided on the back surface of the No. 1 is displaced, the antenna 112 and the IC module 111 are electrically connected through the connection terminal 114, and the IC module 111 and the resin sheet 115 are connected. And are adhered by the adhesive 116 to complete the inlet 110 (FIG. 4D). Here, when pressure is applied to the IC module 111, the gap between the IC module 111 and the resin sheet 115 becomes narrower as the shape of the connection terminal 114 is displaced. After that, when the spacer 113 mounted on the resin sheet 115 comes into contact with the lower surface of the IC module 111 and the pressing force on the IC module 111 reaches a predetermined value, the pressing on the IC chip 111 is terminated. As a result, the distance between the IC module 111 and the resin sheet 115 is regulated by the thickness of the spacer 113.

The spacer 113 is shaped so that its thickness is thicker than the thickness of the antenna 112 and thinner than the sum of the thickness of the antenna 112 and the length of the connection terminal 114. Therefore, the distance between the IC module 111 and the resin sheet 115 regulated by the spacer 113 is such that the lower surface of the IC module 111 is the antenna 112.
And the connection terminal 114 is not in contact with the antenna 1
There will be an interval that can be connected with 12.

Then, the adhesive layer 1 is formed on the inlet 110.
Non-contact type IC by laminating the topsheet 120 via 50
The tag 100 is completed (FIG. 4 (e)).

Also in the non-contact type IC tag 100 manufactured by the above-described manufacturing method, the thickness thereof is thicker than the thickness of the antenna 112, and more than the sum of the thickness of the antenna 112 and the length of the connection terminal 114. The spacer 113, which has a thin shape, regulates the distance between the IC module 111 and the resin sheet 115. Therefore, the distance between the IC module 111 and the resin sheet 115 does not depend on the pressing force on the IC module 111. It becomes constant, and depending on the height and shape of the connection terminal 114 of the IC module 111, the IC module 111 and the resin sheet 1
The distance from 15 does not vary.

Further, depending on the thickness of the spacer 113, the IC
Since the distance between the module 111 and the resin sheet 115 is regulated, even if the flatness of the base plate (not shown) on which the resin sheet 115 is mounted is not excellent, the IC module 111 and the resin sheet 115 are The intervals can be constant.

When an external force is applied to the IC module 111, the resin sheet 1 of the IC module 111
The displacement to the 15 side is restricted by the spacer 113, so that even when an external force is applied to the IC module 111, the insulating film provided on the lower surface of the IC module 111 is destroyed or the IC module 111 is broken.
It is possible to prevent the internal circuit portion from coming into contact with the antenna 112 and causing a short circuit.

(Other Embodiments) FIG. 5 shows the RF of the present invention.
-A diagram showing an example of a non-contact type IC tag which is another embodiment of the ID medium, wherein (a) is a diagram showing an internal structure,
(B) is an AA 'sectional view shown in (a).

In this embodiment, as shown in FIG. 5, an IC module 211 capable of writing and reading information from the outside is mounted on a resin sheet 215 which is a base sheet via an adhesive 216 and is connected. A current is supplied to the IC module 211 by electromagnetic induction from an information writing / reading device (not shown) provided externally, which is connected to the IC module 211 via a terminal 214 to write and read information to and from the IC module 211. And an inlet 2 which is a base material on which a conductive antenna 212 for performing the contactless state is formed.
The IC module 211 is laminated on the surface on which the IC module 211 is mounted via an adhesive layer 250 to protect the IC module 211 and the antenna 212, and a surface sheet 220 on which information is printed. Further, on the surface of the IC module 211 that faces the resin sheet 215, the entire area that is not provided with the connection terminals 214 and does not face the antenna 212 when the IC module 211 is mounted on the resin sheet 215. ,
A spacer 213, which is a regulating member that regulates the distance between the IC module 211 and the resin sheet 215, is provided. By contacting the spacer 213 with the surface of the resin sheet 215, the IC module 211 and the resin sheet 2 are provided.
The distance from 15 is regulated. In addition, the spacer 213
In the above, the shape is such that the thickness thereof is thicker than the thickness of the antenna 212 and thinner than the sum of the thickness of the antenna 212 and the length of the connection terminal 214.

In the non-contact type IC tag 200 configured as described above, the antenna 212 is moved from the antenna 212 by electromagnetic induction from the information writing / reading device when it is brought close to the information writing / reading device provided outside. IC module 21
1 to supply current, so that in the non-contact state,
The information writing / reading device writes information to the IC module 211, and the information writing / reading device reads the information written in the IC module 211.

Since the non-contact type IC tag 200 in this embodiment is also manufactured by the manufacturing method having the steps shown in FIG. 2 or 4, its thickness is thicker than the thickness of the antenna 212, and The distance between the IC module 211 and the resin sheet 215 is regulated by the spacer 213 having a shape that is thinner than the sum of the thickness of the antenna 212 and the length of the connection terminal 214. And resin sheet 215
Is constant regardless of the pressing force applied to the IC module 211, and the connection terminal 21 of the IC module 211 is
Due to the height and shape of No. 4, the distance between the IC module 211 and the resin sheet 215 does not vary.

Further, depending on the thickness of the spacer 213, the IC
Since the distance between the module 211 and the resin sheet 215 is regulated, even if the flatness of the base plate (not shown) on which the resin sheet 215 is mounted is not excellent, the IC module 211 and the resin sheet 215 are The intervals can be constant.

When an external force is applied to the IC module 211, the resin sheet 2 of the IC module 211
Since the displacement toward the 15 side is restricted by the spacer 213, even when an external force is applied to the IC module 211, the insulating film provided on the lower surface of the IC module 211 may be destroyed or the IC module 211 may be destroyed.
It is possible to prevent the internal circuit portion from coming into contact with the antenna 212 and causing a short circuit.

The above-mentioned IC modules 111 and 211
In the adhesives 116 and 216 for bonding the resin sheet 115 and the resin sheets 115 and 215, the spacers 113 and 21 are used.
3 and the resin sheets 115 and 215 need to be adhered to each other, and therefore, those having excellent adhesiveness to the spacers 113 and 213 are preferable.

Further, the regions of the resin sheets 115, 215 which are in contact with the spacers 113, 213, or the spacers 1
If at least one, preferably a plurality of fine holes are formed on the surface of the resin sheet 11 or 213 that is in contact with the resin sheets 115 and 215, the spacers 113 and 213 will be formed on the resin sheet 11 respectively.
5, when mounted on the spacers 113, 21
The adhesives 116 and 216 interposed between the resin sheet 115 and 215 and the resin sheets 115 and 215 are guided to the holes, whereby the adhesion between the spacers 113 and 213 and the resin sheets 115 and 215 can be enhanced.

It should be noted that in the above-described embodiment, the RF capable of writing and reading information in the non-contact state is used.
-The non-contact type IC tag has been described as an example of the ID medium, but the present invention is not limited to the non-contact type IC tag, and the IC module such as a non-contact type IC label or a non-contact type IC card has a connection terminal. Any structure can be applied as long as it includes an inlet mounted so as to be connected to the antenna via.

[0069]

As described above, in the present invention,
A conductive antenna is formed on a base sheet, and an IC module that has a connection terminal for connecting to the antenna and is capable of writing and reading information is connected to the antenna by the connection terminal. RF including at least a base substrate mounted on a base sheet, and writing and reading information to and from an IC module via an antenna in a non-contact state
-In the ID medium, a region between the IC module and the base sheet where the connection terminal and the antenna are not provided is thicker than the thickness of the antenna and thinner than the sum of the thickness of the antenna and the length of the connection terminal. Since the regulation member having a thickness is interposed, the distance between the IC module and the base sheet is regulated so that the connection member and the antenna are connected and the IC module and the antenna are not in contact with each other. As a result, the distance between the IC module and the base sheet can be made constant irrespective of the pressing force applied to the IC module, and even when an external force is applied to the IC module, it is provided on the lower surface of the IC module. If the insulating film is damaged, the circuit inside the IC module may come into contact with the antenna and short-circuit. It is possible to prevent that benefit.

Further, in the case where the IC module is adhered to the base sheet with an adhesive containing conductive particles and the thickness of the regulating member is made larger than the sum of the thickness of the antenna and the diameter of the conductive particles, the IC module Even if conductive particles enter between the base sheet and the base sheet, the circuit in the IC module and the antenna are not short-circuited.

Further, in the case where the regulating member is shaped so as to cover the entire area of the base sheet where the IC module is mounted and where the antenna is not provided, damage to the IC module and circuit A short circuit can be prevented more reliably.

In addition, when the regulation member is attached to the mounting surface of the base sheet of the IC module as described above, the regulation member is attached to the wafer on which a plurality of IC modules are arranged and the surface provided with the connection terminals of the wafer. This is performed by bonding a regulation member sheet having an opening through which the connection terminal is exposed on the surface provided with the connection terminal, and cutting the bonded wafer and regulation member sheet for each IC module. In the case of a product, the regulation member can be easily attached to the IC module.

[Brief description of drawings]

FIG. 1 is a diagram showing an example of a non-contact type IC tag which is an embodiment of an RF-ID medium of the present invention, (a) showing an internal structure, and (b) showing (a). It is the AA 'sectional view.

FIG. 2 is a diagram for explaining an example of a method for manufacturing the non-contact type IC tag shown in FIG.

3A and 3B are diagrams for explaining a step of attaching spacers to the IC module shown in FIG. 1, where FIG. 3A is a diagram showing a wafer composed of a plurality of IC modules, and FIG. 3B is a diagram shown in FIG. The figure which shows the spacer sheet stuck on a wafer, (c) the figure which shows the state which stuck the spacer sheet shown to (b) to the wafer shown to (a), (d) shows the wafer shown to (c). It is a figure which shows the state cut | disconnected for every IC module.

FIG. 4 is a diagram for explaining another example of the method for manufacturing the non-contact type IC tag shown in FIG.

FIG. 5 is a diagram showing an example of a non-contact type IC tag as another embodiment of the RF-ID medium of the present invention, (a)
Is a diagram showing the internal structure, (b) is AA ′ shown in (a).
FIG.

6A and 6B are diagrams showing an example of the structure of a general non-contact type IC tag, in which FIG. 6A is a diagram showing the internal structure, and FIG.
3 is a cross-sectional view taken along the line AA ′ shown in FIG.

FIG. 7 is a diagram for explaining a method of manufacturing the non-contact type IC tag shown in FIG.

[Explanation of symbols]

101 wafers 103 spacer sheet 104 opening 100,200 Non-contact IC tag 110,210 inlet 111,211 IC module 112,212 antenna 113,213 spacer 114, 214 connection terminals 115,215 Resin sheet 116,216 adhesive 120,220 Top sheet 150,250 Adhesive layer

Claims (6)

[Claims] 1. An IC module in which an antenna having conductivity is formed on a base sheet and a connection terminal for connecting to the antenna is provided, and information can be written and read, is the connection terminal. An RF-, which comprises at least a base substrate mounted on the base sheet so as to be connected to the antenna by means of which writing and reading of information to and from the IC module are performed in a non-contact state via the antenna. In the ID medium, it is interposed between the IC module and the base sheet in a region where the connection terminal and the antenna are not provided, and is thicker than the thickness of the antenna, and the thickness of the antenna and the connection terminal. RF-I, comprising a regulating member having a thickness smaller than the sum of the lengths of
D media. 2. The RF-ID medium according to claim 1, wherein the IC module is adhered to the base sheet with an adhesive having conductive particles, and the regulating member includes the thickness of the antenna and the conductive particles. RF characterized by having a thickness greater than the sum of the diameter
-ID media. 3. The RF- according to claim 1 or 2.
In the ID medium, the restricting member has a shape that covers the entire area of the base sheet where the IC module is mounted and where the antenna is not provided. 4. The method for manufacturing the RF-ID medium according to claim 1, wherein the regulation member is attached to a mounting surface of the IC module with respect to the base sheet, A step of mounting an IC module to which a regulation member is attached on the base sheet; and a pressure applied to the IC module mounted on the base sheet in a direction toward the base sheet, and the connection member and the A method of manufacturing an RF-ID medium, comprising the step of connecting to an antenna. 5. The method of manufacturing the RF-ID medium according to claim 1, further comprising: mounting the regulating member on a mounting surface of the IC module of the base sheet. Mounting the IC module on a base sheet on which a regulating member is mounted, and applying pressure to the IC module mounted on the base sheet in a direction toward the base sheet, and the connecting member and the A method of manufacturing an RF-ID medium, comprising the step of connecting to an antenna. 6. The method for manufacturing an RF-ID medium according to claim 4, wherein the step of attaching the regulation member to the mounting surface of the IC module with respect to the base sheet is a wafer in which a plurality of the IC modules are arranged. And a regulation member sheet having an opening so that the connection terminal is exposed when the wafer is attached to the surface of the wafer on which the connection terminal is provided. The wafer sheet and the regulating member sheet which are laminated and bonded together are the IC
A method of manufacturing an RF-ID medium, which is performed by cutting each module.