JP2003282350A - Laminated ceramic electronic component and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated ceramic electronic component which can maintain stable electrical characteristics, even when a metal foil is used as a conductor layer. <P>SOLUTION: Since parts for sandwiching metal foils 3-1 in a ceramic chip 7 are combined with each other through holes 3a and notches 3a' in metal foils 3-1, adhesion in the interface between the metal foil 3-1 and the ceramic can be maintained. Herewith, delamination or cracks are prevented from occurring in the interface between the metal foil and the ceramic due to electrical or thermal behavior of the capacitor itself, after being mounted and deterioration in electrical characteristics occurs due to the infiltration of moisture from the separated part or cracks, to maintain stable electrical characteristics. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a monolithic ceramic electronic component such as a monolithic ceramic capacitor and a method for manufacturing the monolithic ceramic electronic component.

[0002]

2. Description of the Related Art A monolithic ceramic capacitor known as a typical example of a monolithic ceramic electronic component is generally a first sheet obtained by forming an unfired ceramic layer on a base film, and an unfired ceramic layer of the first sheet. A step of preparing a second sheet obtained by forming an unsintered conductor layer having a predetermined shape in a predetermined array on the base, and pressing the unsintered ceramic layer of the first sheet onto the unsintered ceramic layer of the first sheet to form a base The operation of peeling the film is repeated a plurality of times, and the operation of peeling the base film by pressure-bonding the unfired conductor layer and the unfired ceramic layer of the second sheet to the uppermost unfired ceramic layer is repeated a plurality of times. The process of pressing the unfired ceramic layer of the first sheet onto the unfired ceramic layer and peeling the base film is repeated a plurality of times to obtain an unfired laminate. And a step of dividing the unfired laminate into a predetermined chip size to obtain an unfired laminated chip having an unfired conductor layer embedded therein, a step of removing the organic binder from the unfired laminated chip, and a step of removing the binder after the removal. It is manufactured through a process of firing an unfired laminated chip to obtain a ceramic chip containing a conductor layer and a process of forming an external electrode on the ceramic chip.

For the unfired ceramic layer, a ceramic slurry prepared by mixing a ceramic powder, an organic binder, an organic solvent, a plasticizer and a dispersant in an appropriate weight ratio is prepared by using a doctor blade, a reverse roll or a die coater. It is formed by coating on a base film and drying. Further, the unfired conductor layer is a conductive paste prepared by mixing metal powder, an organic binder, an organic solvent and various additives in an appropriate weight ratio by a thick film method such as screen printing or gravure printing. It is formed by printing on a fired ceramic layer and drying.

By the way, in response to the demand for miniaturization and large capacity of multilayer ceramic capacitors in recent years, there has been a demand for thinning of the unfired ceramic layer and the unfired conductor layer, and recently, the unfired ceramic layer has a thickness of 10 μm.
The thickness of the unfired conductor layer should be 5 or less.
It has become technically possible to form the film with a thickness of μm or less.

However, in the method of forming the unsintered conductor layer made of the conductive paste on the unsintered ceramic layer by the thick film method, the unsintered ceramic layer formed on the unsintered ceramic layer becomes thinner as the unsintered ceramic layer becomes thinner. The metal powder contained in the fired conductor layer easily penetrates into the unfired ceramic layer together with the organic solvent, which may cause a short circuit in the adjacent conductor layer in the fired ceramic chip.

[0006]

In order to solve the above-mentioned problems, Japanese Patent Laid-Open No. 2001-297936 proposes using nickel foil instead of the unsintered conductor layer made of the above-mentioned conductive paste, specifically, A manufacturing method has been proposed in which a nickel foil is processed into a predetermined shape and the nickel foil is pressed onto the unfired ceramic layer.

However, since the nickel foil is less familiar with the unfired ceramic layer than the unfired conductor layer made of the conductive paste, the difference in the thermal behavior between the unfired ceramic layer and the metal foil in the firing process may result. , Structural defects such as delamination easily occur at the interface between the nickel foil and the ceramic after firing.

Further, in the manufactured monolithic ceramic capacitor, the adhesion between the metal foil of the ceramic chip and the metal foil is low, so that the electrical and thermal behavior of the capacitor after mounting causes the metal foil to be separated from the metal foil. Peeling or cracks occur at the interface with the ceramic, and the infiltration of water from there tends to reduce the electrical characteristics.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a laminated ceramic electronic component capable of maintaining stable electric characteristics even when a metal foil is used as a conductor layer, and a metal as a conductor layer. It is an object of the present invention to provide a method for manufacturing a monolithic ceramic electronic component that does not cause structural defects even when a foil is used.

[0010]

In order to achieve the above object, a laminated ceramic electronic component according to the present invention has a conductor layer for forming a component circuit in a ceramic chip obtained by firing an unfired laminated chip. A monolithic ceramic electronic component comprising at least one conductor layer, wherein at least one conductor layer is provided.
It is characterized in that it comprises a metal foil having one hole or notch, and the portions of the ceramic chip sandwiching the metal foil are connected to each other through the hole or notch of the metal foil.

According to this laminated ceramic electronic component, the portions of the ceramic chip sandwiching the metal foil are connected to each other through the holes or the notches in the metal foil, so that the adhesion between the metal foil and the ceramic can be secured. It is possible to suppress the occurrence of peeling or cracking at the interface between the metal foil and the ceramic due to the electrical and thermal behavior of the capacitor itself after mounting, and the deterioration of the electrical characteristics due to the infiltration of water from there.

Further, the method for producing a laminated ceramic electronic component according to the present invention comprises a step of obtaining an unfired laminate in which a metal foil having a prescribed shape is interposed in a prescribed arrangement between at least one of the unfired ceramic layers. And a step of dividing the unfired laminate into a predetermined chip size to obtain an unfired laminated chip containing a metal foil, and a step of firing the unfired laminated chip to obtain a ceramic chip containing a metal foil. A method of manufacturing a laminated ceramic electronic component, wherein a metal foil having at least one hole or notch is used as a metal foil in the step of obtaining the unfired laminate, and a portion of the unfired ceramic layer sandwiching the metal foil is a metal foil. At least one hole or notch remains in the metal foil in the unfired laminated chip in the step of joining the unfired laminated chips with each other through the holes or notches. Not fired laminate was divided, to bond together portions sandwiching the metal foil of the ceramic chip through-out hole or notch in the metal foil in the step of obtaining the ceramic chip, and its characterized by the.

According to this method for producing a monolithic ceramic electronic component, the monolithic ceramic electronic component can be produced accurately and stably. Also, in the laminating process, the portions of the unfired ceramic layer that sandwich the metal foil are joined together through the holes or notches in the metal foil, and in the firing process, the portions of the ceramic chip that sandwich the metal foil are joined together through the holes or notches in the metal foil. Since it can be made, the metal foil and the unfired ceramic layer are unfamiliar with each other, and even if there is a difference in thermal behavior between the unfired ceramic layer and the metal foil in the firing step, the metal foil after firing is not Problems such as delamination at the interface with ceramics can be eliminated.

The above and other objects, constitutional features, and operational effects of the present invention will become apparent from the following description and the accompanying drawings.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment in which the present invention is applied to a monolithic ceramic capacitor will be described below with reference to FIGS.

In manufacturing, first, a first sheet S1 shown in FIG. 1 (A) and a second sheet S2 shown in FIG. 1 (B) are prepared.

The first sheet S1 shown in FIG.
It is obtained by forming the unsintered ceramic layer 2 with a predetermined size and thickness on a base film 1 having a predetermined size made of a resin film such as ET. The base film 1 has a thickness of about 50 μm, and the unfired ceramic layer 2 has a thickness of 0.5 to 10 μm.

The first sheet S1 is formed by applying a ceramic slurry onto a base film 1 having a predetermined size by using a doctor blade, a reverse roll, a die coater or the like, and drying it to form an unfired ceramic layer 2. Has been created. Incidentally, as the ceramic slurry, one prepared by mixing ceramic powder, an organic binder, an organic solvent, a plasticizer and a dispersant in an appropriate weight ratio is used. Of course, in the first sheet S1, after the ceramic slurry is continuously applied on the tape-shaped base film and dried to form the unfired ceramic layer 2, the base film and the unfired ceramic layer are cut into predetermined dimensions. It can also be created by

On the other hand, the second sheet S2 shown in FIG.
Is obtained by forming the metal foil 3 having a predetermined shape and thickness in a predetermined array (m × n matrix) on the unfired ceramic layer 2 of the first sheet S1. The metal foil 3 includes one or more alloys selected from precious metals such as gold, silver and palladium, one or more alloys selected from base metals such as nickel, copper and iron, and precious metals and base metals. And an alloy having a thickness of 0.1 to 3 μm. As will be described later, the metal foil 3 is composed of either a "thin film" formed by a metal coating method or a "foil" formed by a metal rolling method. Figure 1
As can be seen from (B), the group of metal foils 3 formed in a predetermined array on the unfired ceramic layer 2 of the second sheet S2 is
In the subsequent laminating step, the second sheet S2 is formed so as to be biased to one side of the unfired ceramic layer 2 because the second sheets S2 are alternately turned 180 degrees and stacked.

This second sheet S2 is a transfer in which a metal foil 3 of a predetermined shape is formed in a predetermined array (m × n matrix) on a carrier sheet 4 of a predetermined size made of a resin film such as PET or a metal thin plate of copper or the like. A sheet S3 (see FIG. 2 (A)) is prepared in advance, and as shown in FIGS. 3 (A) and 3 (B), a metal foil is formed on the unfired ceramic layer 2 of the first sheet S1. The transfer sheets S3 are stacked so as to be in contact with each other and pressure-bonded or thermocompression-bonded, and after the pressure-bonding, only the carrier sheet 4 is peeled off and the metal foil 3 is transferred onto the unfired ceramic layer 2.

Each metal foil 3 formed on the transfer sheet S3 has three circular holes 3a as shown in FIG. 2B, and when the metal foil 3 is pressure-bonded to the unfired ceramic layer 2, As shown in FIG. 3 (B), the entire metal foil 3 slightly sunk into the unfired ceramic layer 2 and each hole 3a
The unfired ceramic layer 2 partially enters the inside.

By the way, as a method for forming the metal foil 3 having a predetermined shape in a predetermined arrangement on the carrier sheet 4 constituting the transfer sheet S3, a carrier having a predetermined arrangement of holes corresponding to the shape of the metal foil 3 is used as a carrier. A method of depositing on the sheet 4 a metal thin film having a similar shape to the mask holes in a predetermined arrangement on the carrier sheet 4 by a metal coating method such as a cathode sputtering method, a vapor deposition method or a vapor phase plating method, or rolling a metal. It is possible to adopt a method in which the foil thus obtained is cut into a predetermined shape and is attached to the carrier sheet 4 in a predetermined arrangement.

Next, as shown in FIGS. 4 (A) and 4 (B), the first sheet S1 is superposed on the unsintered ceramic layer 2 of the first sheet S1 so that the unsintered ceramic layer 2 is in contact therewith. The base film 1 is peeled off after pressure bonding or heat pressure bonding, and the unfired ceramic layer 2 is transferred onto the lower unfired ceramic layer 2. This transfer operation is repeated a plurality of times to form a lower protective layer portion.

Next, as shown in FIGS. 5 (A) and 5 (B), the metal foil 3 and the unfired ceramic layer 2 are in contact with each other on the uppermost unfired ceramic layer 2 of the lower protective layer. Second
The sheets S2 are stacked and pressure-bonded or heat-pressure bonded, and after pressure bonding, only the base film 1 is peeled off to transfer the metal foil 3 and the unfired ceramic layer 2 onto the lower unfired ceramic layer 2,
Then, a second layer is formed so that the metal foil 3 and the unfired ceramic layer 2 are in contact with the transferred uppermost unfired ceramic layer 2.
The sheets S2 are stacked in a state of being turned by 180 degrees and pressure-bonded or thermo-compressed, and after pressure-bonding, only the base film 1 is peeled off to transfer the metal foil 3 and the unfired ceramic layer 2 to the lower unfired ceramic layer 2. . This transfer operation is repeated a plurality of times to form a portion in which the metal foil 4 is sandwiched between the unfired ceramic layers 2.

When the metal foil 3 and the unfired ceramic layer 2 are pressure-bonded onto the uppermost unfired ceramic layer 2, as shown in FIG.
As shown in (B), the upper unfired ceramic layer 2 adheres to the lower unfired ceramic layer 2 and each metal foil 3
The whole of which is slightly sunk into the lower unfired ceramic layer 2 and the lower unfired ceramic layer 2 is in each hole 3a.
Is partially invaded. That is, the portions of the unfired ceramic layer 2 that sandwich the metal foil 3 are the holes 3 of the metal foil 3.
Bonded to each other through a.

Next, a metal foil 4 is provided between the unfired ceramic layers 2.
The first sheet S1 such that the unfired ceramic layer 2 is in contact with the uppermost unfired ceramic layer 2 in the portion where the
Are stacked and pressure-bonded or heat-pressed, and after pressure-bonding, only the base film 1 is peeled off to transfer the unfired ceramic layer 2 onto the lower unfired ceramic layer 2. This transfer operation is repeated a plurality of times to form an upper protective layer portion.

After the upper protective layer is formed, the whole is pressed or heated and pressed in the stacking direction to increase the degree of pressure bonding, and thus the unsintered laminate having the predetermined number of unsintered ceramic layers 2 and metal foils 3 is formed. Object 5 (see FIG. 6) is formed.

Next, as shown in FIG. 6, grid-shaped dividing lines DL1 and DL2 corresponding to the position of the inner metal foil 3 are set on the unfired laminate 5 on the image data in the image processing apparatus. By cutting the unbaked laminate 5 along the dividing lines DL1 and DL2 using a cutting device such as a dicing device, the unbaked laminate 5 is cut into a predetermined chip size and the unbaked laminated chip 6 (see FIG. 7 (B)).

FIG. 7A is a diagram showing the positional relationship of the unfired laminate 5 as viewed from above the metal foil 3 and the positional relationship of the cutting lines DL1 and DL2 with respect to the metal foil 3 as viewed from above. As can be seen from the figure, the metal foils 3 between the unfired ceramic layers 2 are in a state of being alternately displaced in the longitudinal direction when viewed from above, and the amount of this displacement is less than 1/2 of the longitudinal length of the metal foil 3. Slightly larger. By the way, in the illustrated example, the shift amount is set such that the center in the longitudinal direction of one of the upper and lower metal foils 3 adjacent to each other in the stacking direction is located at the center of the longitudinal gap between the other two upper and lower metal foils 3. Has been done. In addition, one division line DL that determines the length dimension of the unfired laminated chip 6
2 is set so as to pass through the longitudinal center of one of the upper and lower metal foils 3 adjacent to each other in the stacking direction and the longitudinal center of the other upper and lower metal foils 3, which determines the width dimension of the unfired laminated chip 6. The dividing line DL1 is set adjacent to the side in the lateral direction of the metal foil 3.

As shown in FIG. 7B, the unfired laminate 5
Unfired laminated chip 6 obtained by dividing the
Each of the metal foils 3-1 in the inside has one edge of the unfired laminated chip 6
Are alternately exposed at one end face and the other end face in the longitudinal direction. Also, each metal foil 3-1 has one hole 3 in its inner part.
a, the holes 3a are alternately displaced in the longitudinal direction of the metal foil 3-1 when viewed from above. Further, in the illustrated example, one of the dividing lines DL2 that determines the length dimension of the unfired laminated chip 6 passes through the center of the hole 3a in the center of the metal foil 3, so that the exposed end of each metal foil 3-1 is exposed. There is a substantially semicircular cutout 3a 'at the edge.

Next, the unfired laminated chip 6 is put into a heating furnace and heated to remove the organic binder contained in the unfired laminated chip 6, and the unfired laminated chip 6 after debindering is heated in the heating furnace. The ceramic chips 7 (see FIG. 8A) are obtained by charging into a heating furnace having different heating conditions and firing. Of course, the debindering process and the firing process can be performed by a single heating furnace.

FIG. 8B is a diagram showing a partially enlarged vertical section of the ceramic chip 7 obtained by performing the firing treatment. As can be seen from the drawing, the metal foil 3-1 of the ceramic chip 7 is shown.
The part that sandwiches is the hole 3a and the notch 3a 'in the metal foil 3-1.
Are bound to each other through.

Next, as shown in FIG. 9, the external electrodes 8 connected to the exposed edges of the metal foils 3-1 in the ceramic chip 7 are formed at both ends of the ceramic chip 7 in the longitudinal direction. The external electrodes 8 are formed by applying a conductive paste to both end portions of the ceramic chip 7 in the longitudinal direction and baking the conductive paste. On the surface of the external electrodes 8, a metal film of another kind or a solder film is formed by a metal coating method as needed. Is formed. Incidentally, as the conductive paste, one prepared by mixing metal powder, an organic binder, an organic solvent and various additives in an appropriate weight ratio is used.

As described above, a laminated ceramic capacitor having the required number of internal electrodes (metal foil 3-1) for forming a capacitor circuit in the ceramic chip 7 is manufactured.

According to the above-mentioned manufacturing method, the portions of the unfired ceramic layer 2 sandwiching the metal foil 3 are bonded to each other through the holes 3a of the metal foil 3 in the laminating step, and the metal foil 3-1 of the ceramic chip 7 is fired in the firing step. Since the portions sandwiching the metal foil can be connected to each other through the hole 3a and the notch 3a 'of the metal foil 3-1, the metal foil 3-1 and the unfired ceramic layer 2 are not well-adapted to each other and are not fired in the firing process. Even if a difference in thermal behavior occurs between the ceramic layer 2 and the metal foil 3-1, problems such as delamination at the interface between the metal foil 3-1 and the ceramic after firing are eliminated, and structural defects are eliminated. It is possible to obtain a high-quality monolithic ceramic capacitor without

The holes 3a and the notches 3 are formed in the metal foil 3-1.
When a'is absent, a phenomenon may occur in which the thickness of the metal foil 3-1 becomes thicker than the initial thickness when the metal foil 3-1 contracts after being thermally expanded in the firing step, but the ceramic chip 7
Since the portions sandwiching the metal foil 3-1 can be connected to each other through the hole 3a and the notch 3a 'of the metal foil 3-1, the phenomenon is effectively suppressed and the dimension of the laminated ceramic capacitor in the laminating direction is increased. Can be prevented.

On the other hand, according to the monolithic ceramic capacitor manufactured by the manufacturing method described above, the ceramic chip 7
Of the metal foil 3-1 are connected to each other through the hole 3a and the notch 3a 'of the metal foil 3-1.
Since it is possible to secure the adhesion between and
Stable electrical identification is achieved by suppressing peeling and cracking at the interface between the metal foil and ceramic due to the electrical and thermal behavior of the capacitor itself after mounting and deterioration of electrical characteristics due to moisture infiltration from there. Can be maintained.

FIG. 10A to FIG. 10F are the same as FIG.
Metal foil 3-1 in the ceramic chip 7 shown in (A)
Each of the modified examples is shown.

The metal foil 3-2 shown in FIG.
The metal foil 3-1 is formed by removing the substantially semicircular notch 3a 'existing on the exposed edge of the metal foil 3-1 shown in (A), and the metal foil 3-2 has only one hole 3b. By the way, this metal foil 3
-2 can be obtained by using the metal foil 3 shown in FIG. 2 (B) without the central hole 3a. In the case of this metal foil 3-2, since the notch 3a 'does not exist in the exposed edge, there is an advantage that the area of the exposed edge can be enlarged and the bonding area with the external electrode can be increased.

The metal foil 3-3 shown in FIG.
The position of one hole 3c existing in the metal foil 3-2 shown in 0 (A) is aligned in the stacking direction. This metal foil 3-3
In the case, there is an advantage that the facing area of each metal foil 3-3 can be enlarged as compared with that of FIG. 10A to increase the capacitance.

The metal foil 3-4 shown in FIG.
The substantially semicircular notch 3a ′ existing on the exposed edge of the metal foil 3-1 shown in (A) is removed, and a hole 3d having a diameter smaller than that of the metal foil 3-1 is formed in each metal foil 3-4. 2 or more (6 in the figure)
It is provided. In the case of this metal foil 3-4, the portion of the unfired ceramic layer 2 where the metal foil 3-4 is sandwiched is shown in FIG.
Since it can be bonded at multiple points as compared with the case of (A), there is an advantage that delamination during firing can be more accurately prevented.

The metal foil 3-5 shown in FIG.
Two or more holes 3e existing in the metal foil 3-4 shown in 0 (C)
The positions are matched in the stacking direction. In the case of this metal foil 3-3, the facing area of each metal foil 3-5 is shown in FIG.
There is an advantage that the capacitance can be increased to increase the capacitance as compared with the one described above.

The metal foil 3-6 shown in FIG.
The substantially semicircular notch 3a ′ existing at the exposed edge of the metal foil 3-1 shown in (A) is removed, and a pair of rectangular notches 3f is provided instead of the hole 3a. The side edges of 3-6 are provided symmetrically or asymmetrically, and the notches 3f are alternately displaced in the longitudinal direction of the metal foil 3-6. In the case of this metal foil 3-6, there is an advantage that delamination that may occur at the side edge portion of the metal foil 3-6 can be suppressed.

The metal foil 3-7 shown in FIG.
The positions of the notches 3g existing in the metal foil 3-6 shown in 0 (E) are aligned in the stacking direction. In the case of this metal foil 3-7, there is an advantage that the facing area of each metal foil 3-7 can be enlarged as compared with that of FIG.

The metal foil 3-8 shown in FIG.
The substantially semicircular notch 3a ′ existing on the exposed edge of the metal foil 3-1 shown in FIG. 10A is removed, and the notch 3h smaller than the metal foil 3f shown in FIG. Each metal foil 3-8
2 or more pairs (2 pairs in the figure) are provided. In the case of this metal foil 3-8, the portions of the unfired ceramic layer 2 sandwiching the metal foil 3-8 can be joined at multiple points compared to those in FIG. 10 (E), so that delamination during firing is more likely to occur. There is an advantage that it can be accurately prevented.

The metal foil 3-9 shown in FIG.
The positions of two or more pairs of notches 3i in the metal foil 3-8 shown in 0 (G) are aligned in the stacking direction. In the case of this metal foil 3-9, the facing area of each metal foil 3-9 is shown in FIG.
There is an advantage that the capacitance can be increased by enlarging as compared with that of (G).

Of course, FIGS. 8A and 10A to 10
An appropriate combination of the holes or notches shown in (H) may be used as the metal foil incorporated in the ceramic chip 7.

In the embodiment described with reference to FIGS. 1 to 9, the transfer sheet S3 is placed on the unfired ceramic layer 2 of the first sheet S1 so that the metal foil 3 is in contact therewith, and the transfer sheet S3 is pressed or heat-pressed. Although the second sheet S2 is prepared by peeling only the carrier sheet 4 after the pressure bonding and transferring the metal foil 3 onto the unfired ceramic layer 2, the second sheet S2 is shown on the unfired ceramic layer 2 of the first sheet S1. A mask having holes in a predetermined arrangement corresponding to the shape of the metal foil 3 is placed on the unfired ceramic layer 2 by a metal coating method such as a cathode sputtering method, a vapor deposition method, or a vapor phase plating method, and a metal having a shape similar to the mask holes is formed. A method of directly forming a thin film in a predetermined arrangement, or cutting a foil obtained by rolling a metal into a predetermined shape, and cutting the foil in a predetermined arrangement on the unfired ceramic layer 2 of the first sheet S1. It may be creating a second sheet S2 by the contact paste method.

In the embodiment described with reference to FIGS. 1 to 9, the metal foil 3 having a predetermined shape is formed on the unfired ceramic layer 2.
The second sheet S2 was formed by a predetermined array (m × n matrix), but the second sheet S2 was formed by alternately arranging the columns of the metal foil 3 row by row as shown in FIG. 11 (S
2 ') is used as the second sheet, and the second sheet is alternately turned 180 degrees to be stacked, whereby the same unfired laminate 5 can be obtained.

Further, in the embodiment described with reference to FIGS. 1 to 9, the first sheet S1 and the second sheet S2 are used,
Pressing and film peeling are repeated until the unfired ceramic layer 2 reaches a predetermined number of layers, and then pressure bonding and film peeling are repeated until the unfired ceramic layer 2 having the metal foil 3 reaches the predetermined number of layers, then the unfired ceramic layer 2 Although the unbaked laminate 5 is obtained by repeating pressure bonding and film peeling until the number of layers reaches a predetermined number, both sheets in the laminating step are caused by the thin thicknesses of the first sheet S1 and the second sheet S2. When the handling of S1 and S2 is hindered, the first laminated sheet S shown in FIG.
4 and the second laminated sheet S5 shown in FIG. 12 (B) may be used to obtain the unfired laminated product 5.

The first laminated sheet S4 is prepared by repeating the operation of forming the unfired ceramic layer 2 on the base film 1 by coating a plurality of times as shown in FIG.
On the other hand, in the second laminated sheet S5, as shown in FIG. 12 (B), the unfired ceramic layer 2 is formed on the base film 1 by coating, and the metal foil 3 in a predetermined array is formed thereon a plurality of times. It is created repeatedly. Metal foil here 3
Either of the transfer method using the above-mentioned transfer sheet S3 and the method of forming the metal foil 3 by direct film formation or attachment can be adopted for the formation of.

At the time of stacking, as shown in FIG. 12C, the second laminated sheet S is placed so that the unfired ceramic layer 2 contacts the uppermost unfired ceramic layer 2 of the first laminated sheet S4.
The operation of peeling the base film 1 by stacking 5 and press-bonding or thermo-compressing the base film 1 is repeated one or more times, and the first laminated sheet S4 is stacked so that the unfired ceramic layer 2 is in contact with the uppermost unfired ceramic layer 2. The base film is peeled off by pressure bonding or heat pressure bonding, and the whole body is pressed or heat pressed to increase the pressure bonding degree to obtain the unbaked laminate 5. Of course, the first laminated sheet S
The unbaked laminate 5 may be obtained by appropriately stacking the base film 1 peeled from 4 and the base film 1 peeled from the second laminated sheet S5.

Further, in the embodiment described with reference to FIGS. 1 to 9, the unfired ceramic layer 2 is formed on the base film 1.
Is used as the first sheet S1, and the metal foil 3 having a predetermined shape is formed on the unfired ceramic layer 2 of the first sheet S1.
The second sheet S2 having a predetermined arrangement was used as the second sheet S2. As shown in FIGS. 13 (A) and 13 (B), the metal foil 3 having a predetermined shape was formed on the base film 1 in a predetermined arrangement. The one on which the unfired ceramic layer 2 is formed (S
6) is used as the second sheet, and the second sheet S6 is alternately turned 180 [deg.] To be stacked to obtain the unbaked laminate 5 similar to the above.

In the second sheet S6, a mask having a predetermined arrangement of holes corresponding to the shape of the metal foil 3 is placed on a base film 1 having a predetermined size made of a resin film such as PET, and a cathode sputtering method, a vapor deposition method, or the like. A method of directly depositing a metal thin film having a similar shape to the mask holes in a predetermined arrangement on the unfired ceramic layer 2 by a metal coating method such as a vapor plating method, or a foil obtained by rolling a metal into a predetermined shape. The base film 1 is cut by a method in which the base film 1 is directly attached to the base film 1 in a predetermined arrangement.
By forming a metal foil 3 of a predetermined shape in a predetermined arrangement on the top, applying a ceramic slurry on this using a doctor blade, a reverse roll, a die coater, etc. and drying it to form an unfired ceramic layer 2. Has been created.
As shown in FIG. 13C, the second sheet S6 is placed on the uppermost unfired ceramic layer 2 of the lower protective layer so that the unfired ceramic layer 2 is in contact with the second sheet S6, and the second sheet S6 is pressure-bonded or thermocompression-bonded. If the film 1 is peeled off, the laminating step can be carried out in the same manner as the embodiment described with reference to FIGS.

When the handling of both the sheets S1 and S6 in the laminating step is hindered due to the small thickness of the first sheet S1 and the second sheet S6,
Similarly to the laminating method described with reference to FIGS. 12A to 12C, the first laminated sheet S shown in FIG. 14A.
7 and the second laminated sheet S8 shown in FIG. 14 (B) may be used to obtain the unfired laminated product 5.

The first laminated sheet S7 is prepared by repeating the process of forming the unfired ceramic layer 2 on the base film 1 by coating a plurality of times as shown in FIG.
On the other hand, in the second laminated sheet S5, as shown in FIG. 14 (B), the metal foil 3 of a predetermined arrangement is formed on the base film 1 and the unfired ceramic layer 2 is formed thereon by coating a plurality of times. It is created repeatedly. Metal foil here 3
Either of the transfer method using the above-mentioned transfer sheet S3 and the method of forming the metal foil 3 by direct film formation or attachment can be adopted for the formation of.

At the time of stacking, as shown in FIG. 14C, the second laminated sheet S is placed so that the unfired ceramic layer 2 is in contact with the uppermost unfired ceramic layer 2 of the first laminated sheet S7.
The operation of peeling off the base film 1 by stacking 8 and press-bonding or thermo-compressing is repeated one or more times, and the first laminated sheet S7 is stacked so that the unfired ceramic layer 2 is in contact with the uppermost unfired ceramic layer 2. Then, the base film is peeled off by pressure bonding or heat pressure bonding, and the whole body is pressed or heat pressed to increase the pressure bonding degree to obtain the unfired laminate 5. Of course, the first laminated sheet S7
The unbaked laminate 5 may be obtained by appropriately stacking the base film 1 peeled from the second laminated sheet S8 and the base film 1 peeled from the second laminated sheet S8.

In the above description, the embodiment in which the present invention is applied to the monolithic ceramic capacitor has been shown. However, the monolithic ceramic electronic component other than the monolithic ceramic capacitor, for example, the monolithic chip inductor, the monolithic chip LC filter, the monolithic ceramic capacitor array, etc. Also, the present invention can be applied and the same effect as the above can be obtained.

[0059]

As described in detail above, according to the monolithic ceramic electronic component of the present invention, peeling or cracking occurs at the interface between the metal foil and the ceramic due to the electrical and thermal behavior of the capacitor itself after mounting. It is possible to suppress the deterioration of the electrical characteristics due to the intrusion of water and the intrusion of water therefrom, and to maintain stable electrical identification.

Further, according to the method for producing a monolithic ceramic electronic component according to the present invention, the monolithic ceramic electronic component can be produced accurately and stably, and the metal foil and the unfired ceramic layer are less familiar with each other. In addition, even if a difference in thermal behavior between the unfired ceramic layer and the metal foil occurs in the firing step, problems such as delamination occurring at the interface between the metal foil and the ceramic after firing are eliminated, and the structure is improved. It is possible to obtain a high quality multilayer ceramic electronic component having no defects.

[Brief description of drawings]

FIG. 1 is a top view of a first sheet and a top view of a second sheet.

FIG. 2 is a top view of a transfer sheet and an enlarged top view of a metal foil formed on the transfer sheet.

FIG. 3 is an explanatory diagram of a method for creating a second sheet.

FIG. 4 is an explanatory diagram of a laminating process.

FIG. 5 is an explanatory diagram of a laminating process.

FIG. 6 is a perspective view showing an unfired laminate and a dividing line.

FIG. 7 is a diagram showing the positional relationship of the unfired laminate seen from above the metal foil and the positional relationship seen from above the cutting line with respect to the metal foil, and a top view of the unfired laminated chip after the cutting.

FIG. 8 is a top view of the ceramic chip and a partially enlarged vertical sectional view of the ceramic chip.

FIG. 9 is a top view of the manufactured monolithic ceramic capacitor.

FIG. 10 is a diagram showing a modification of the metal foil in the ceramic chip.

FIG. 11 is a top view showing a modified example of the second sheet shown in FIG. 1 (B).

FIG. 12 is a partial vertical cross-sectional view of a first laminated sheet, a partial vertical cross-sectional view of a second laminated sheet, and an explanatory view of the laminating method showing a modification of the laminating method.

FIG. 13 is a top view showing another modified example of the second sheet shown in FIG. 1B, a partially enlarged cross-sectional view thereof, and an explanatory view of a stacking method.

FIG. 14 is a partial vertical cross-sectional view of a first laminated sheet and a partial vertical cross-sectional view of a second laminated sheet, showing another modification of the laminating method.
Illustration of stacking method

[Explanation of symbols]

S1 ... First sheet, S2 ... Second sheet, 2 ... Unfired ceramic layer, 3 ... Metal foil before cutting, 3a ... Hole, 5 ... Unfired laminated product, 6 ... Unfired laminated chip, 3-1 ... Cutting Rear metal foil, 3a '... Notch, 7 ... Ceramic chip, 3-2 to 3
-9 ... Metal foil after cutting, 3b to 3e ... Holes, 3f to 3i ... Notches, S2 '... Second sheet, S4 ... First laminated sheet, S
5 ... 2nd laminated sheet, S6 ... 2nd sheet, S7 ... 1st laminated sheet, S8 ... 2nd laminated sheet.

Claims (2)

[Claims] 1. A laminated ceramic electronic component having at least one conductor layer for forming a component circuit in a ceramic chip obtained by firing an unfired laminated chip, wherein the conductor layer has at least one hole. Alternatively, the multilayer ceramic electronic component is made of a metal foil having a notch, and the portions of the ceramic chip sandwiching the metal foil are connected to each other through the holes or the notches of the metal foil. 2. A step of obtaining an unfired laminate comprising metal foils of a prescribed shape interposed in a prescribed arrangement between at least one layer of the unfired ceramic layer, and dividing the unfired laminate into a prescribed chip size. A method of manufacturing a monolithic ceramic electronic component, comprising: a step of obtaining an unfired laminated chip with a built-in metal foil; and a step of firing the unfired laminated chip to obtain a ceramic chip with a built-in metal foil. In the step of obtaining the unfired laminate, a metal foil having at least one hole or notch is used, and the portions of the unfired ceramic layer sandwiching the metal foil are bonded to each other through the holes or notches of the metal foil. In the step of obtaining the fired laminated chip, the non-fired laminated body is divided so that at least one hole or notch remains in the metal foil in the non-fired laminated chip to obtain the ceramic chip. In the step of manufacturing, a method for manufacturing a monolithic ceramic electronic component is characterized in that the portions of the ceramic chip that sandwich the metal foil are bonded to each other through the holes or notches in the metal foil.