JP2003277719A - Jointing body having uniform thickness and method for jointing uniformly in thickness - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a jointing body having a uniform thickness which can form an adhesive layer having a uniform thickness with a simplified method and a good precision, as well as to provide a method for jointing uniformly in thickness. <P>SOLUTION: The jointing body is provided with a first and a second jointing members 21 and 22 each of which possesses a jointing face of an arbitrarily curved surface including a plane, an adhesive layer 23 which is coated between the first and the second jointing members 21 and 22 and attaches to each jointing face 21a and 22a, and a glass bead 24 which is disposed between each jointing face of the jointing members 21 and 22 and which is uniform in the diameter and globular and serves as a thickness uniforming material. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a uniform-thickness bonded body having an adhesive layer having a uniform thickness and a uniform-thickness bonding method in bonding between respective bonding members.

[0002]

2. Description of the Related Art Conventionally, this type of joining method has been described in order to realize the joining with an adhesive layer having a uniform thickness between the joining members.
A method has been used in which a press having a uniform and precise press surface accuracy is performed, and an adhesive layer is uniformly printed by screen printing, or an adhesive sheet is used. In this case, the above joining methods all required surface pressing.

[0003]

However, the above-described conventional bonding method has the following problems. (1) Due to the difference in the amount of the adhesive 103 applied between the respective members (thin plates 101, 102), the gap between them becomes non-uniform (h1 ≠ h2) (see FIG. 6). (2) There is a bonded portion and a non-bonded portion on the joint surface between the respective members, which reduces the reliability of the adhesiveness. (3) In the case of screen printing, it is not possible to control the adhesive layer if the thickness of the screen sheet is less than that. (4) When an adhesive sheet is used, air bubbles may be mixed between each member. (5) In the case of press bonding, the edges of the bonding surface tend to be thin and the central part tends to be thick.

An object of the present invention is to provide a uniform-thickness bonded body and a uniform-thickness bonding method capable of accurately forming an adhesive layer having a uniform thickness with a simple method.

[0005]

In order to solve the above-mentioned problems, the invention of claim 1 provides first and second joining members each having a joining surface having an arbitrary curved surface shape including a flat surface, and the first and second joining members. An adhesive layer which is applied between the second joining members and adheres the joining surfaces to each other, and a uniform thickness spherical member having a uniform diameter disposed between the joining surfaces of the first and second joining members. And a uniform thickness bonded body including.

A second aspect of the present invention is the uniform-thickness joined body according to the first aspect, wherein the thickness equalizing member is glass beads. According to a third aspect of the present invention, in the uniform thickness joined body according to the first aspect, the thickness equalizing member is formed into a spherical shape by the same adhesive as the adhesive of the adhesive layer. It is a uniform thickness bonded body.

According to a fourth aspect of the present invention, there is provided a uniform-thickness joining method for joining first and second joining members each having a joining surface having an arbitrary curved surface shape including a flat surface, wherein the first and second joining members are joined. An adhesive application step of applying an adhesive having a uniform diameter and a spherical thickness equalizing member between the respective joining surfaces, and pressing each of the first and second joining members to join each of the joining members. It is a uniform thickness bonding method including a thickness leveling step of leveling the distance between the surfaces to the diameter of the thickness leveling member and a curing step of curing the adhesive.

According to a fifth aspect of the invention, in the uniform thickness bonding method according to the fourth aspect, in the thickness leveling step, pressure is applied while leveling with a pressure roller to remove excess adhesive and air bubbles. Is a uniform thickness bonding method. The invention of claim 6 is the uniform thickness bonding method according to claim 4 or 5, further comprising a vacuuming step for removing bubbles contained in the adhesive.

The invention of claim 7 is from claim 4 to claim 6.
In the uniform thickness bonding method according to any one of
A uniform thickness bonding method, comprising: a thickness uniforming member forming step of forming the thickness uniforming member into a spherical shape with the same adhesive as the adhesive of the adhesive layer.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, referring to the drawings, etc.,
The embodiment of the present invention will be described in more detail.
1 and 2 are views showing a printer head of an inkjet device using an embodiment of a uniform thickness bonded body according to the present invention. As shown in FIGS. 1 and 2, the printer head 10 includes a housing 11, a first flow channel plate 12, and a second flow channel plate 1.
3, a FPC 14, a piezo element 15, a manifold 16, a cavity 17, an orifice 18, and the like.

The housing 11 has a main body 11a made of SUS or nickel, and a hole 11b forming the ink reservoir space A and a flow path 11c communicating with the hole 11b. To supply.

The first flow path plate 12 is joined to the housing 11,
Openings 12b and 12c are formed in a plate material 12a such as SUS to form an ink flow path B. The second flow path plate 13 is the first
It is joined to the flow path plate 12 and the opening 1 is formed in the plate material 13a such as SUS.
3b is formed, forming a pumping chamber C.

The FPC 14 is joined to the second flow path plate 13, and the wiring 14 such as copper foil is provided on the base material 14a such as polyimide.
b is formed. This FPC 14 is a piezo element 1
It supplies electric power to the pump 5, and also serves as a lid of the pumping chamber C of the second flow path plate 13. The piezo element 15 is an electromechanical conversion element in which an electrode 15b such as gold is formed on the piezoelectric plate 15a, and the electrode 15b is the FPC1.
4 wiring 14b.

As shown in FIG. 1 (A), the manifold 16 is a member for guiding the ink supplied from the housing 11 to the cavity 17. For example, the plate material 16a such as SUS has a hole diameter φ = 260 μm. 128 holes 16b, 2
Formed in rows. The cavity 17 stores the ink that has passed through the manifold 16 into the holes 1 of the orifice 18.
A member for guiding to 8b, for example, a plate material 17a such as SUS has 128 slits 17b having a width of 200 μm, and 2
Formed in rows. The orifice 18 is a member that serves as an ink ejection port, and is, for example, a plate material 18 such as SUS.
256 holes 18b having a diameter of 80 μm are formed in a row in a row.

Although not shown in the drawing, on the left side of the housing 11 as well, at the position shown by the chain double-dashed line in FIG.
A structure including a flow path plate 12, a second flow path plate 13, an FPC 14 and a piezo element 15 is provided. Piezo element 15
Cannot divide the electrode 15b into too small,
By providing the structure from the flow path plate 12 to the piezo element 15 on the opposite side, sandwiching the housing 11 from both sides, and arranging the flow paths in a nested manner, the print density per unit area can be doubled. .

In the printer head 10, the ink is
As shown in FIG. 1B, from the ink reservoir A of the housing 11 passes through the flow path B of the first flow path plate 12, the pumping chamber C of the second flow path plate 13, and again of the housing 11. Channel D
Then, the vehicle is led to the manifold 16 (see arrow E).

Since the FPC 14 serves as a lid for the pumping chamber C of the second flow path plate 13, the piezo element 15 is provided.
When is displaced by receiving the print command signal, the ink is pushed through the FPC 14. That is, the displacement of the piezo element 15 causes the FPC 14 to expand and contract, so that the second flow path plate 13
The channel of the pumping chamber C becomes narrower and the ink is pushed out.

Pumping chamber C of the second flow path plate 13
Corresponds to the hole (ejection port) 18b of the orifice 18, and in the example of FIG. 2, there are four ejection ports. The printer head 10 is driven and controlled by one piezo element 15 with respect to the plurality of ejection openings 18b. Therefore, the piezo element 15 has an advantage that it can be easily positioned with the pumping chamber C.

3 and 4 are schematic diagrams for explaining the adhesive application step and the thickness leveling step of the uniform thickness joining method according to the present embodiment, and FIG. 5 is a schematic diagram showing the uniform thickness joined body according to the present embodiment. Is. The uniform-thickness bonded body 20 of this embodiment has a spherical bead having a uniform diameter (uniform thickness) between the first bonding member 21 having the bonding surface 21a and the second bonding member 22 having the bonded surface 22a. It is formed by sandwiching the materialized member) 24 and joining it with the adhesive 23. In the case of the printer head 10 described above, the first and second joining members 21 and 22 can be considered by applying the first flow path plate 12 and the second flow path plate 13.

In the case of the printer head 10 described above,
First, a cross-sectional view of a desired three-dimensional shape is designed, and the first and second flow path plates (thin plates) 12, 1 are designed according to the cross-sectional view.
Etching 3 is performed. First and second flow path plates 12, 13
SUS304, SUS430, 42 alloy and the like are preferably used. At this time, the first and second flow path plates 12,
13 is preferably subjected to surface treatment such as copper plating, nickel plating or gold plating. Then, the first and second flow path plates 12 and 13 are subjected to surface treatment, then positioned by positioning pins, and temporarily fixed by arc welding or the like.

Between the first and second flow path plates 12 and 13,
The adhesive 23 is applied (adhesive applying step). Spherical glass beads 24 having a diameter of 20 μm and a high roundness are mixed in advance with the adhesive 23.

Next, as shown in FIG. 3, the first and second flow path plates 12 and 13 are pressure-bonded from above and below (see arrow P) (pressurizing step). After that, as shown in FIG. 4, the pressure roller 30 uniformly presses the entire surfaces of the bonded first and second flow path plates 12 and 13 to uniformly press the first and second flow path plates 12. The glass beads 24 are brought into close contact with each other to make the thickness uniform (thickness equalizing step). In this step, the excess adhesive 23A that has accumulated is removed from the gap and also plays the role of pushing out the air bubbles mixed between the first and second flow path plates 12 and 13.

As a result, as shown in FIG.
By mixing the glass beads 24 into the first and second
The flow path plates 12 and 13 are adhered in parallel at a distance of 20 μm, which is the diameter of the glass beads 24, and the thickness of the adhesive 23 is uniform, so that the bonded body 20 with good adhesion accuracy can be obtained.

The piezo element 15 is, in the example of FIG.
The electrode 15b is provided at 256 positions, and when the same voltage is applied to the electrode 15b at the 256 positions, the FPC1
4 and the piezo element 15 are not evenly bonded, there is a problem that the same amount of ink is not ejected from the ejection port 18b even if the same voltage is applied to the piezo element 15 and the print quality is deteriorated. To do. Therefore, in the present embodiment, the FPC 14 and the piezo element 15 are joined in the same manner. When the glass beads 24 are joined to the piezo element 15, the glass beads 24 are more effective because they have good impedance matching with respect to the mechanical force in the direction perpendicular to the joining surface.

The present invention is not limited to the embodiments described above, and various modifications and changes can be made, which are also within the scope of the present invention. (1) The first and second joining members 21 and 22 are the first flow channel plate 12, the second flow channel plate 13, the FPC 14, and the piezo element 1.
Although the case where 5 is joined has been described as an example, the same can be applied to joining the housing 11 and the first flow channel plate 12 and the second flow channel plate 13 and the FPC 14.

(2) In the present embodiment, glass beads have been described as an example of the thickness uniformizing member, but a spherical uniformizing member may be prepared with an adhesive and then mixed with the same adhesive. Good. By doing so, the uniformity of the adhesive layer is better. An adhesive such as a thermosetting type or a UV curing type does not deform even if it is mixed once with the same adhesive once it is cured.

(3) Although the joint surface of each joint member has been described as an example in which the joint surface is flat, each joint member may be a curved surface. (4) Although an example of applying pressure by the pressure roller 30 has been described, other methods may be used as long as the adhesive can be extruded to even out the thickness. At this time, if a vacuum is drawn, the bubbles mixed in the adhesive can be removed.

[0028]

As described above, according to the present invention,
Since the spherical uniform thickness member having a uniform diameter is arranged between the joint surfaces of the joint members, there is an effect that the adhesive layer of each joint member has a uniform thickness and the joint accuracy is improved.

[Brief description of drawings]

FIG. 1 is a diagram showing a printer head of an inkjet device using an embodiment of a uniform thickness bonded body according to the present invention.

FIG. 2 is an exploded perspective view showing a printer head of an inkjet device using an embodiment of a uniform thickness bonded body according to the present invention.

FIG. 3 is a schematic diagram illustrating an embodiment (adhesive coating step) of the uniform thickness bonding method according to the present invention.

FIG. 4 is a schematic view illustrating an embodiment (thickness leveling step) of the uniform thickness bonding method according to the present invention.

FIG. 5 is a schematic view showing an embodiment of a uniform thickness bonded body according to the present invention.

FIG. 6 is a schematic diagram illustrating a problem of a conventional bonded body.

[Explanation of symbols]

10 Printer head 11 housing 12 First channel plate 13 Second channel plate 14 FPC 15 Piezo element 16 Manifold 17 cavities 18 orifice 20 Uniform thickness joint 21,22 First and second joining members 23 Adhesive 24 glass beads

Continued front page    (72) Inventor Kei Kato             1-1-1, Ichigaya-Kagacho, Shinjuku-ku, Tokyo             Dai Nippon Printing Co., Ltd. F-term (reference) 4F100 AB03A AB03C AT00A AT00C                       BA03 BA10A BA10C CB00B                       DE04B DE04H EC182 EH461                       EJ082 EJ192 GB90                 4J040 HA346 JB02 JB08 KA03                       PA35 PA37

Claims (7)

[Claims] 1. A first and second joining member each having a joining surface having an arbitrary curved surface shape including a flat surface, and an adhesive applied between the first and second joining members to bond the joining surfaces to each other. A uniform-thickness joined body comprising a layer and a uniform thickness spherical member having a uniform diameter and arranged between the respective joining surfaces of the first and second joining members. 2. The uniform thickness bonded body according to claim 1, wherein the thickness uniformizing member is glass beads. 3. The uniform thickness bonded body according to claim 1, wherein the thickness uniformizing member is formed into a spherical shape by the same adhesive as the adhesive of the adhesive layer. Thick joint. 4. A uniform-thickness joining method for joining first and second joining members each having a joining surface having an arbitrary curved surface shape including a flat surface, wherein the joining surfaces of the first and second joining members are joined together. An adhesive application step of applying an adhesive having a uniform diameter and a spherical thickness uniformizing member, and applying pressure to the first and second joining members to provide the thickness between the joining surfaces. A uniform-thickness joining method comprising: a thickness-uniforming step of equalizing the diameter of the uniformizing member; and a curing step of curing the adhesive. 5. The uniform thickness bonding method according to claim 4, wherein in the thickness leveling step, excess adhesive is removed and air bubbles are pushed out by applying pressure while leveling with a pressure roller. Characteristic uniform thickness bonding method. 6. The uniform thickness bonding method according to claim 4 or 5, further comprising a vacuuming step of removing bubbles contained in the adhesive. 7. Any one of claims 4 to 6
In the uniform thickness bonding method according to the item, there is provided a thickness uniforming member forming step of forming the thickness uniformizing member into a spherical shape by the same adhesive as the adhesive of the adhesive layer, .