JP2003275897A - Apparatus for heat-pressing electromagnetic wave shield member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for heat-pressing an electromagnetic wave shield member having electromagnetic wave shield performance, transparency/ nonvisibility, and satisfactory adhesiveness. <P>SOLUTION: The apparatus 1 for heat pressing the electromagnetic wave shield member 2 which is arranged on the front surface of a display is provided with an upper die 11 and a lower die 12, and at least either of the upper die 11 or the lower die 12 consists of a diaphragm. The diaphragm is made of rubber. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic wave shielding member hot pressing apparatus, and more particularly to an electromagnetic wave shielding member hot pressing apparatus for heat pressing an electromagnetic wave shielding member arranged on the front surface of a display with an upper die and a lower die.

[0002]

2. Description of the Related Art With the recent increase in the use of various electric equipments and electronic equipments, electromagnetic noise interference is also increasing. Noise is roughly divided into conducted noise and radiated noise.
There is a method of using a noise filter or the like. On the other hand, as a measure against radiated noise, it is necessary to electromagnetically insulate the space, so the housing is made of a metal body or a highly conductive body, a metal plate is inserted between the circuit boards, or a cable is used. The method such as wrapping with a metal foil is taken. These methods can be expected to have an electromagnetic wave shielding effect for circuits and power supply blocks, but they cannot be applied to electromagnetic wave shielding applications such as CRTs and PDPs that are generated from the front surface of a display because they are opaque.

As a method for achieving both electromagnetic wave shielding properties and transparency, a method of depositing a metal or a metal oxide on a transparent substrate to form a thin film conductive layer (JP-A-1-278800).
Japanese Patent Laid-Open Publication No. 5-323101). On the other hand, an electromagnetic wave shielding material (see JP-A-5-327274 and JP-A-5-269912) in which good conductive fibers are embedded in a transparent substrate, or a conductive resin containing metal powder or the like is directly printed on a transparent substrate. Electromagnetic wave shielding material (Japanese Patent Laid-Open No. 62-57297, Japanese Patent Laid-Open No. 2-52)
In addition, a transparent resin layer is formed on a transparent substrate such as polycarbonate having a thickness of about 2 mm,
An electromagnetic wave shielding material having a copper mesh pattern formed thereon by electroless plating (Japanese Patent Laid-Open No. 5-2883889).
(See Japanese Patent Publication).

As a method for achieving both the electromagnetic wave shielding property and the transparency, JP-A-1-278800 and JP-A-5-78800 are available.
The method of forming a thin film conductive layer by vapor-depositing a metal or a metal oxide on a transparent substrate disclosed in Japanese Patent No. 323101 is a film thickness (several hundred Å to 2, which can achieve transparency).
If it is set to 000Å), the surface resistance of the conductive layer becomes too large, so that a shielding effect of 30 dB or more required at 30 MHz to 1 GHz is required, but it is insufficient at 20 dB or less.

In the electromagnetic wave shield material (Japanese Patent Laid-Open No. 5-327274 and Japanese Patent Laid-Open No. 5-269912) in which a highly conductive fiber is embedded in a transparent substrate, 30 MHz to 1 GHz is used.
Electromagnetic wave shielding effect of 40 to 50 dB is sufficiently large, but in order to regularly arrange the conductive fibers so as to prevent electromagnetic wave leakage, the fiber diameter must be 35 μm or more, and the fibers are visible to the naked eye. (Hereinafter, “visibility”
Therefore, it was not suitable for display applications.

Further, in the case of the electromagnetic wave shielding material in which a conductive resin containing a metal powder or the like is directly printed on a transparent substrate as disclosed in JP-A-62-57297 and JP-A-2-52499, the printing accuracy is similarly improved. From the limit, the minimum line width is
The thickness was around 100 μm and visibility was exhibited, which was not suitable.

Further, a shield having a thickness of about 2 mm, which is described in JP-A-5-283889, is formed on a transparent substrate such as polycarbonate and a transparent resin layer is formed thereon, and a copper mesh pattern is formed thereon by electroless plating. In the material,
In order to secure the adhesion of electroless plating, it is necessary to roughen the surface of the transparent substrate. As the roughening means, generally, a highly toxic oxidizing agent such as chromic acid or permanganic acid must be used, and this method makes it difficult to perform satisfactory roughening with a resin other than ABS. Further, even if the electromagnetic wave shielding property and the transparency can be achieved by this method, it is difficult to reduce the thickness of the transparent substrate,
It was not suitable as a film forming method. Furthermore, if the transparent substrate is thick, it cannot be closely attached to the display, and electromagnetic waves leak from there. Also,
In this method, there is a drawback in that the shield material is bulky because it cannot be made into a scroll or the like in terms of manufacturing, and the manufacturing cost is high because it is not suitable for automation. Regarding the shielding property of electromagnetic waves generated from the front surface of the display, in addition to the electromagnetic wave shielding function of 30 dB or more at 30 MHz to 1 GHz, good visible light transmittance,
In addition to having a high visible light transmittance, it is also necessary to have adhesiveness that can be attached in close contact with the display surface to prevent leakage of electromagnetic waves, and non-visibility that is a characteristic that the presence of a shield material cannot be visually confirmed. To be done.

Regarding the adhesiveness of the shield material, it is necessary that it be easily attached to glass or a general-purpose plastic plate at a relatively low temperature and have good adhesiveness for a long period of time. However, until now, a satisfactory adhesive film has not been obtained as an adhesive film that sufficiently satisfies the properties of electromagnetic wave shielding property, infrared ray shielding property, transparency / non-visibility and adhesiveness.

[0009]

SUMMARY OF THE INVENTION In view of the above problems, the present invention provides an electromagnetic wave shielding member hot pressing apparatus for heat pressing an electromagnetic wave shielding member having electromagnetic wave shielding properties, transparency non-visibility and good adhesive properties. The purpose is to do.

[0010]

SUMMARY OF THE INVENTION The present invention is a device for hot pressing an electromagnetic wave shielding member arranged on the front surface of a display, which has an upper mold and a lower mold, and at least one of the upper mold and the lower mold. Is an electromagnetic wave shielding member hot press device including a diaphragm.

The present invention is also an electromagnetic wave shielding member hot-pressing device, wherein the diaphragm is made of rubber.

The present invention is the electromagnetic wave shielding member hot-pressing apparatus, wherein the non-bonding of the electromagnetic wave shielding member to the frame portion of the rubber diaphragm is 1.0 mm or more.

Further, according to the present invention, when hot pressing,
It is an electromagnetic wave shielding member hot press device which is operated under a vacuum of 0 torr or less.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described.
An example will be described. As shown in FIG. 1, the electromagnetic wave shielding member heat press device 1 of the present embodiment includes an upper mold 11, a lower mold 12, a front mounting table 13, and a rear mounting table 14, and electromagnetic waves arranged in front of the display. Heat press the shielding member. The electromagnetic wave shielding member 2b is sandwiched between the upper mold 11 and the lower mold 12 including a diaphragm, and hot pressing is performed. The diaphragm is made of rubber. The portion of the electromagnetic wave shielding member 2b which is not bonded to the frame portion of the rubber diaphragm is 1.0 mm or more.
The atmosphere for hot pressing is a heating temperature of 90 ° and 150 to
The vacuum is rr or less. An electromagnetic wave shielding member comprising a transparent base material, a transparent base material, a metal mesh formed on the transparent base material and etched, and a transparent heat-pressed laminate of a film with an adhesive overcoated on the metal mesh. Obtainable. The front mounting table 13 and the rear mounting table 14 mount the electromagnetic wave shielding members 2a and 2c before and after the hot press processing, respectively.

FIG. 2 shows an example of a method of manufacturing an electromagnetic wave shielding member to be processed by the electromagnetic wave shielding member hot pressing apparatus of the embodiment.
Will be explained. This manufacturing method includes an etching step of etching a metal foil formed on a transparent base material to form a metal mesh, an overcoat step of overcoating a metal mesh with an adhesive film, a transparent base material, and a metal base material. A hot pressing step of hot pressing a laminate of the mesh and the film with adhesive. First,
The etching process will be described. A 125 μm thick polyethylene terephthalate film (hereinafter “PE
40% MEK solution of polyester resin (Voylon UR1300, manufactured by Toyobo Co., Ltd.) is evenly applied to a T film (abbreviated as “T film”) by a coating machine so as to have a thickness after drying of 15 μm and adhered A transparent base material 31 made of a film was produced. Of the transparent base material 31 and an electrolytic copper foil having a thickness of 10 μm (PBR10, manufactured by Nippon Denki Co., Ltd.) 32 using a roll laminator 41 and a field roll 42.
Laminated at 0 ° C and laminated with a metal clad laminate (hereinafter referred to as "MCF").
33) was obtained. The protective film 34 is attached to the MCF 33 to prepare a laminated body 35 with a protective film, and ordinary photolithography etching (dry film resist attachment,
A grid-like pattern was formed by exposing, developing, etching, removing the dry film resist, and drying (hereinafter, abbreviated as "mesh"). The line width of the grid is 1
The pitch is 0 to 15 μm and the pitch is 250 μm.

Next, the overcoating step and the hot pressing step using the electromagnetic wave shielding member hot pressing apparatus of this embodiment will be described with reference to FIG. 600 mm x 1000 m
An adhesive layer of an adhesive film was laminated on the copper circuit surface of the m-thick mesh, and this was laminated on a PET film having a thickness of 125 μm to obtain a film laminate 2a with an adhesive layer. The film laminate 2a with an adhesive layer was white. The film laminate 2a with an adhesive layer is attached to the diaphragm type vacuum pressurizing continuous press 1 with an upper die (end plate) 11 and a lower die (diaphragm) 12
Then, vacuum pressing was performed to obtain a hot press laminated body 2c. The obtained hot-pressed laminate 2c was transparent and had an atmospheric pressure of 50.
torr, applied pressure: 5 kgf / cm ² , heating temperature: 90
°, heating time: 1 minute and 30 seconds.

A comparative example will be described. An adhesive layer of an adhesive film was laid on a copper circuit surface of a 600 mm × 1000 mm mesh produced in the same manner as in the example, and both sides thereof were sandwiched by a polyethylene film having a thickness of 60 μm, and the outside thereof was a PET film having a thickness of 50 μm. Then, the outside was sandwiched by a mirror-finished stainless steel plate having a thickness of 2 mm to obtain a press composition. 3 sets of the above components were hot-pressed by a general-purpose vacuum press. Atmospheric pressure: 50 torr, Applied pressure: 5 kgf / cm
^{2. The} plate was pressed at a heating plate temperature of 150 ° C. for 30 minutes to make it transparent. It took 4 hours to prepare, heat, cool and take out the material to be pressed.

When hot pressing is performed by the electromagnetic wave shielding member hot pressing apparatus of this embodiment, even if whitening occurs in the etching step, it is possible to easily make it transparent in the subsequent hot pressing step. Further, the processing time can be shortened as compared with the comparative example.

When manufacturing the electromagnetic wave shielding member for a display of the present invention, it is preferable that hot pressing is performed under a vacuum of 150 torr or less. Also, the time for hot pressing is 2
It can be less than a minute. It is also possible to provide the hot pressing step twice or more, and the laminate of the transparent substrate, the metal mesh and the film with adhesive, which is the object to be hot pressed in the final hot pressing step, has a defect of φ2 mm or more. The number of defects is one or more than 6 mm and more than 2 mm and less than 2 mm.

In the present invention, there may be a step of carrying one or both of upper and lower surfaces of a metal mesh overcoated with a film with an adhesive by supporting or sandwiching with a plastic film. At this time, it is preferable that the plastic film is polyethylene terephthalate and the surface roughness Ra thereof is 0.01 μm or more and 0.3 μm or less.

[0021]

According to the present invention, the electromagnetic wave shielding property,
It is possible to obtain an electromagnetic wave shielding member hot-pressing device which heat-presses an electromagnetic wave shielding member having transparency non-visibility and good adhesive properties.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of an electromagnetic wave shielding member hot press device according to an embodiment.

FIG. 2 is an explanatory view of an example of a method of manufacturing an electromagnetic wave shielding member.

[Explanation of symbols]

1 Electromagnetic wave shielding member heat press equipment 11 Upper mold 12 Lower mold 13 Front stand 14 Rear mounting table 2a to 2c electromagnetic wave shielding member 31 Transparent base material 32 copper foil 33 Metal-clad laminate 34 Protective film 35 Laminate with protective film 41 Roll Laminator 42 field roll

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) G09F 9/00 313 G09F 9/00 313 338 338 // H05K 9/00 H05K 9/00 V (72) Invention Person Masayoshi Minagawa 1150 Gozamiya, Shimodate City, Ibaraki Prefecture Goseimiya Works, Hitachi Chemical Co., Ltd. (72) Inventor Hiroaki Takahashi 1150 Gozamiya, Shimodate City, Ibaraki Prefecture F Term, Goseimiya Works, Hitachi Chemical Co., Ltd. (Reference) 4E088 DA07 EA03 EA10 4E090 AA08 AB01 DA08 DB01 HA07 5E321 BB21 BB41 CC16 GG05 GH01 5G435 AA17 GG33 KK05 KK10

Claims (4)

[Claims] 1. An apparatus for hot-pressing an electromagnetic wave shielding member disposed on a front surface of a display, the apparatus having an upper mold and a lower mold, wherein at least one of the upper mold and the lower mold comprises a diaphragm. Electromagnetic wave shielding member heat press device. 2. The electromagnetic wave shielding member heat press device according to claim 1, wherein the diaphragm is made of rubber. 3. The electromagnetic wave shielding member hot pressing apparatus according to claim 1, wherein the electromagnetic wave shielding member has a non-adhesion to the frame portion of the rubber diaphragm of 1.0 mm or more. 4. The electromagnetic wave shielding member hot pressing apparatus according to claim 1, wherein the hot pressing is performed under a vacuum of 150 torr or less.