JP2003266710A - Manufacturing method for ink-jet head, apparatus used for the method, ink-jet head and ink-jet recording apparatus, color filter manufacturing apparatus and manufacturing method therefor, and electric field light emitting substrate manufacturing apparatus and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for an ink-jet head with a small number of parts in a simple structure, capable of miniaturizing and achieving a light weight of a head with high design freedom. <P>SOLUTION: The method for manufacturing a linear ink-jet head by bonding with an adhesive the side surfaces of a plurality of chips 100 each comprising a nozzle actuator, comprises a chip manufacturing step of manufacturing a plurality of the chips 100 each comprising the nozzle actuator, an adhesive applying step of applying the adhesive 99 on the side surfaces of the manufactured chips, a positioning step of positioning a chip with the adhesive applied and another chip, and a pressuring step of contacting and pressuring the side surfaces of the positioned chips with each other. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an ink jet head having a plurality of nozzles in a printing row direction, an apparatus used for the method, an ink jet head, a color filter manufacturing apparatus and method, and an electroluminescent substrate. The present invention relates to a manufacturing device and a manufacturing method thereof.

[0002]

2. Description of the Related Art In recent years, recording devices have been required to print at high speed. However, in the conventional method of scanning the head in the print line direction, when the number of recording elements is large, the mass of the head also increases, so the load on the head scanning mechanism also increases, and there is a limit to increasing the number of recording elements. . Therefore, a so-called line type inkjet head has been devised in which a large number of recording elements are arranged in the print row direction at the same intervals as the printing resolution and printing is performed by a fixed head.

In such a line head, an extremely large number of recording elements obtained by dividing the print width by the print resolution is required. However, it is difficult to form a large number of recording elements with a single head in terms of yield. In addition, it is difficult to configure a large number of recording elements with a single head in terms of equipment cost of the manufacturing line. That is, since high resolution printing is desired, photolithography technology, which is an application of semiconductor technology, is used for manufacturing the head. And
The equipment cost of the production line using photolithography becomes extremely high as the substrate size increases.

Therefore, it has been devised to assemble a long head by connecting a plurality of head chips having a relatively small number of recording elements in a line. As an example of such a line type inkjet, for example, Japanese Patent Laid-Open No. 11-2
There is an inkjet recording head disclosed in Japanese Patent No. 0168. In the ink jet head of the publication, a plurality of element substrates, each having an energy generating element, are arranged in a line on a base plate as a base made of metal or the like and fixed with an adhesive or the like. A long grooved member in which a groove forming a path is formed is joined. That is, in the same publication, from the viewpoint of the yield of the element substrates, the element substrates are not integrally manufactured, but a plurality of small element substrates are formed and the element substrates are arranged and fixed on the base plate. .

[0005]

In the above structure, it is assumed that only the element substrate is manufactured independently, this is attached to the base plate, and the grooved member forming the ink flow path is also single. There is. Therefore, the manufacturing concept is to manufacture a grooved member with the target dimension line head length, determine the specifications of the element substrate in accordance with this, and further support a plurality of element substrates in line. It is to adhere to the base plate.

The above-mentioned prior art is based on the idea that only the element substrate having the highest yield problem among the components constituting one line head is separately manufactured. In such an idea, the degree of freedom in design is increased. Low. In addition to the nozzle actuators forming the inkjet head, a base plate for assembling them side by side is required separately. Therefore, there is a problem that the number of parts increases and the head becomes heavy.

Further, in the publication, it is difficult to surely fix the adjacent element substrates in close contact with each other and it is difficult to fix them. In other words, the publication does not mention anything about a technique for securely adhering adjacent element substrates to each other.

The present invention has been made to solve the above problems, and has a small number of parts, has a simple structure, and can be made compact and lightweight, and also has a high degree of freedom in design. It is intended to provide a way. Moreover, it aims at providing the apparatus used for the manufacturing method of this inkjet head. Another object is to provide an inkjet head manufactured by the method for manufacturing an inkjet head. Another object of the present invention is to obtain a recording apparatus using the inkjet head and a manufacturing method thereof, a color filter manufacturing apparatus and a manufacturing method thereof, and an electroluminescent substrate manufacturing apparatus and a manufacturing method thereof.

[0009]

(1) In a method for manufacturing an ink jet head according to one aspect of the present invention, a plurality of chips, which independently constitute a nozzle actuator, are joined to each other by an adhesive to form a line-shaped ink jet. A method for manufacturing a head, comprising: a chip manufacturing process for independently manufacturing a plurality of chips constituting a nozzle actuator; an adhesive applying process for applying an adhesive to the side surfaces of the manufactured chips; and an adhesive applying process. The positioning step of aligning the chip with the other chips and the pressing step of bringing the side surfaces of the positioned chips into contact with each other to press them are provided. In the present invention, since the side surfaces of the plurality of chips that individually constitute the nozzle actuator are bonded to form a line, a substrate for bonding the chips is not required. As a result, the structure is simplified, the head is downsized, and the weight is reduced.

(2) An ink jet head manufacturing method according to another aspect of the present invention is characterized in that, in the chip manufacturing process of the ink jet head manufacturing method described in (1) above, an adhesive is applied to the side surface of the nozzle plate where the nozzle holes are formed. This includes the step of providing a cutout portion that serves as a reservoir. By providing this cutout portion, the adhesive does not run off to the nozzle forming surface when the chips are joined, so that it is possible to prevent problems due to the runoff of the adhesive.

(3) An ink jet head manufacturing method according to another aspect of the present invention is the ink jet head manufacturing method according to the above (2), in which the notch is formed by patterning a nozzle plate and performing photolithography. It is a thing.

(4) In the method of manufacturing an ink jet head according to another aspect of the present invention, in the method of manufacturing an ink jet head described in (2) above, the notch is formed by obliquely dicing the side surface of the nozzle plate. It is a thing.

(5) An ink jet head manufacturing method according to another aspect of the present invention is characterized in that in the positioning step of the ink jet head manufacturing method according to the above (1) to (4),
The method includes a temporary fixing step of mounting the chip in a positioned state on a mounting table and temporarily fixing the chip in a movable state by drawing a vacuum from the lower surface of the chip. Here, “temporarily fixing in a movable state” means that it is not displaced by a slight vibration or the like, but it is in a slightly movable state when the side surface of the chip is pressed with a force of a certain level or more.

(6) An apparatus for manufacturing an ink jet head according to an aspect of the present invention forms a line by bonding the side surfaces of a plurality of chips, which independently constitute a nozzle actuator, with an adhesive. A mounting table for mounting the chips in a positionable state, a temporary fixing means for temporarily fixing the chips mounted on the mounting table in a movable state, and pressing a plurality of chips mounted on the mounting table And a pressing means.

(7) An apparatus for manufacturing an ink jet head according to another aspect of the present invention is the apparatus described in (6) above, wherein the mounting table portion is provided with an escape area for the adhesive that has run off to escape. .

(8) An apparatus for manufacturing an ink jet head according to another aspect of the present invention is the apparatus according to (6) or (7) above, wherein the mounting base is formed on the main body and abuts on one end side in the longitudinal direction. It is characterized in that it is a substantially V-shaped groove portion having a surface.

(9) An apparatus for manufacturing an ink jet head according to another aspect of the present invention is the apparatus according to any one of the above (6) to (8), wherein the temporary fixing means is mounted on the mounting table part. The chip is vacuum-adsorbed from the lower surface side.

(10) An apparatus for manufacturing an inkjet head according to another aspect of the present invention is the apparatus described in any one of (6) to (9) above, wherein the pressing means is a chip mounted on a mounting table. It is characterized in that it is provided so as to be able to move forward and backward with respect to the side surface and presses the side surface of the chip.

(11) An inkjet head according to one aspect of the present invention is characterized by being manufactured by the inkjet head manufacturing method described in any one of (1) to (5) above.

(12) An ink jet recording apparatus according to one aspect of the present invention is characterized by mounting the ink jet head described in (11) above. In the present invention, printing can be performed by merely feeding the recording paper without moving the inkjet head in the width direction of the recording paper, so that the printing speed can be extremely increased.

(13) The method for manufacturing an ink jet recording apparatus according to one aspect of the present invention is the above (1) to (5).
An inkjet head is manufactured by the inkjet head manufacturing method described in any one of 1 to 3, and the inkjet head is mounted.

(14) An apparatus for manufacturing a color filter according to one aspect of the present invention is characterized in that the ink jet head described in (11) above is mounted.

(15) A method of manufacturing a color filter manufacturing apparatus according to one aspect of the present invention is the above (1) to (5).
An ink jet head is manufactured by the method for manufacturing an ink jet head according to any one of 1 to 3, and the ink jet head is mounted.

(16) An electroluminescent substrate manufacturing apparatus according to one aspect of the present invention is characterized by mounting the ink jet head described in (11) above.

(17) In a method of manufacturing an electroluminescent substrate manufacturing apparatus according to one aspect of the present invention, an inkjet head is manufactured by the inkjet head manufacturing method described in (1) to (5) above, and the inkjet head is mounted. It is characterized by having done.

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1. (Regarding Configuration) First, the configuration of an inkjet head manufactured by the inkjet manufacturing method of the present invention will be described. FIG. 2 is an overall configuration of this ink jet head, and FIG. 1 is an enlarged view of a portion surrounded by a circle in FIG. The ink jet head shown in the present embodiment is provided with a notch portion, which serves as a reservoir for the adhesive agent, on the side surfaces of a plurality of head chips that independently constitute the nozzle actuator, and the side surfaces are joined by the adhesive agent to form a line shape. It was done. By thus joining the side surfaces of the plurality of chips that constitute the nozzle actuator independently, a base body such as a base plate is not required, and the structure is simplified, the head is downsized, and the weight is reduced.

In this embodiment, the standard resolution of a commercial printer is 360 dpi (dot per inc).
In h), six head chips 100 having 256 nozzles per head are arranged in parallel to form a line head unit having 1536 nozzles and 4.3 inches.

First, the main part of the ink jet head will be described with reference to FIG. Each head chip 100 has a structure in which a flow path substrate 1, an electrode glass substrate 2, and a nozzle plate 3 are laminated, and each head chip 100 independently constitutes a nozzle actuator. Here, that the nozzle actuator is configured independently means that a mechanical configuration for functioning as an inkjet head, that is, a structure for storing ink, a mechanism for providing energy for ejecting ink, a mechanism for ejecting ink This means that it is equipped with nozzles and the like.

As shown in FIG. 1, the bonding portions of the adjacent head chips 100 are filled with an adhesive 99 to firmly fix the side surfaces of the head chips 100 to each other. Further, an inclined surface 3a is formed on the joint side surface of the nozzle plate 3 of each head chip 100 so as to incline toward the end from the upper surface to the lower surface. By forming the inclined surface 3a, when the head chips 100 are joined, the groove portion 3b serving as a reservoir for the adhesive is formed between the adjacent inclined surfaces 3a.

By forming the groove portions 3b in this manner, when the head chips 100 are joined, excess adhesive is collected in the groove portions 3b and does not extend to the front surface side of the nozzle plate 3. Here, a description will be given of what kind of trouble occurs when the adhesive 99 runs off the surface of the nozzle plate 3. If the adhesive sticks out to the nozzle surface,
The adhesive may cause a problem in capping of the inkjet head that is applied for the purpose of suppressing ink drying. Capping is a mechanism required to prevent nozzle hole clogging due to nozzle surface drying and to perform a recovery operation when detecting bubbles. Therefore, if capping cannot be performed normally due to the adhesive squeezing out, clogging of the nozzle holes and recovery operation at the time of bubble detection become impossible.

Further, in the ink jet head, it is necessary to keep the nozzle surface in a water repellent state in order to secure the straightness of the ink droplet. However, if there is an adhesive that squeezes out between the nozzle holes, the water repellent quality of the nozzle surface will partly vary, and the straightness will deteriorate.

As described above, when the adhesive is squeezed out to the surface side of the nozzle plate 3, the performance of the ink jet head is greatly affected, but the structure of the present embodiment can prevent the squeeze out of the adhesive. Therefore, the adverse effect of the adhesive squeezing out can be avoided.

Here, details of the inclined surface formed on the nozzle plate 3 will be described with reference to FIG. 3 which is an enlarged view of a part of FIG. As shown in FIG. 3, the nozzle plate 3
The inclination angle θ of tan ⁻¹ (2a / b) <θ <90 °
(However, a is the thickness of the nozzle plate 3 and b is the distance between the adjacent nozzle holes 4 of the adjacent chips 100). As a specific example, a = 180 μm and b =
70 μm.

Next, the structure and operation principle of each head chip 100 which constitutes the above-mentioned ink jet head will be described. FIG. 4 is an exploded perspective view showing a cross section of a part of the head chip 100 of the first embodiment. In the present embodiment, a face type inkjet head that ejects ink droplets from nozzle holes provided in the surface portion of the substrate will be described as an example. 5 is a sectional side view of the assembled whole device, and FIG. 6 is a view taken along the line AA of FIG.

As shown in FIGS. 4 and 5, each head chip 100 has a flow path substrate 1 made of silicon single crystal,
This is a structure in which an electrode glass substrate 2 made of borosilicate glass and a nozzle plate 3 are laminated. The configuration of each substrate will be described below.

The flow path substrate 1 is made of a silicon substrate having a crystal plane orientation (110), and the silicon substrate has a concave portion 12 which constitutes a discharge chamber 6 having a diaphragm 5 as a bottom wall.
A narrow groove 1 provided at the rear of the recess 12 for inflowing ink
3 and a recess 14 which constitutes a common ink reservoir 8 for supplying ink to each ejection chamber 6.

The electrode glass substrate 2 bonded to the lower surface of the flow path substrate 1 is made of Pyrex (registered trademark) glass,
A recess 25 for mounting the electrode 21 is formed.
By providing the recess 25, a gap G (see FIG. 5) is formed between the first substrate and the diaphragm 5 when the first substrate is bonded. The electrode 2 is provided inside the recess 25.
1, the lead portion 22 and the terminal portion 23 are attached.

The electrode 21 is made of ITO having a thickness of 0.1 μm in the recess 25.
m is sputtered to form an ITO pattern, and gold is sputtered only on the terminal portion 23 for bonding.

Nozzle holes 4 are provided on the surface of the nozzle plate 3 joined to the upper surface of the flow path substrate 1 so as to communicate with the respective recesses 12 of the flow path substrate 1.

Next, an outline of the operation of the ink jet head configured as described above will be described (see FIG. 5). When a pulse voltage is applied to the electrode 21 by the drive circuit 102 and the surface of the electrode 21 is positively charged, the lower surface of the corresponding diaphragm 5 is negatively charged. Therefore, the diaphragm 5 is bent toward the electrode 21 by the electrostatic attraction.

Next, when the electrode 21 is turned off, the diaphragm 5
Restore. Therefore, the pressure in the ejection chamber 6 rapidly rises, and the ink droplets 104 are ejected from the nozzle holes 4 toward the recording paper 105. Next, the vibration plate 5 bends downward again, so that the ink 106 is replenished from the ink reservoir 8 into the ejection chamber 6 through the narrow groove 13. Thus, the vibrating plate 5 and the electrode 21 function as a pressure generating element that gives a pressure change that causes ink droplets to fly to the ejection chamber 6, and more generally, as an energy generating element that gives ejection energy to the ink in the ejection chamber. It is functioning.

In the ink jet head configured as described above, a plurality of head chips 100 that independently constitute a nozzle actuator are provided with cutouts which serve as a reservoir of adhesive, and the side surfaces are joined together with an adhesive. Since it is formed in a line, the base plate and other bases are unnecessary, and the structure is simplified, the head is downsized, and the weight is reduced. In addition, since the adhesive does not squeeze out on the nozzle forming surface, problems due to the squeeze-out of the adhesive do not occur.

Further, the head chip 100 independently functions as a nozzle actuator, and since a required number of line heads can be joined according to the required length of the line head, the degree of freedom in design is extremely high. That is, if the head chip 100 is manufactured as a common component, then it is possible to freely manufacture from a relatively short line head to a long line head simply by freely determining the number of them to be joined.

(Manufacturing Method) Next, a method of manufacturing the ink jet head having the above-described structure will be described. As described above, the inkjet head is formed by joining a plurality of head chips in a line shape, and each head chip is manufactured by joining the three substrates constituting the head chip. The manufacturing method of will be described.

FIG. 7 is an explanatory view of a method of manufacturing the flow path substrate 1. A thermal oxide film 33 is formed by wet oxidation on a substrate 31 made of a single crystal silicon wafer having a plane orientation (110) and a thickness of 140 μm (FIG. 7A), and both surfaces of the substrate are thermally oxidized with an aqueous hydrofluoric acid solution by photolithography. The film 33 is etched to form the ejection chamber 6, the ink reservoir 8, and the narrow groove 13.
Each shape is patterned (FIG. 7B).

When this substrate 31 is etched with a 35% aqueous potassium hydroxide solution at 80 ° C., the partition wall is vertically etched due to the anisotropy of the etching of the silicon single crystal, and the discharge chamber 6, the ink reservoir 8 and the narrow groove 13 are etched. Are formed (FIG. 7C).

After the etching is completed, a thermal oxide film 33 is formed with a thickness of about 0.1 μm. Since the thermal oxide film 33 formed on the flow path surface is hydrophilic, it serves to improve the filling property of the ink into the flow path (FIG. 7D).

Next, a method of manufacturing the electrode glass substrate 2 will be described with reference to FIG. Glass substrate 3 by sputtering chromium and gold
A film is formed on 5 to serve as an etching mask. Then, etching is performed with hydrofluoric acid to form a recess 25 that becomes a gap (FIG. 8A). Next, about 0.1% ITO is placed in the recess 25.
The electrode 21 is formed by forming an ITO pattern by sputtering with μm, and chromium and gold for bonding are sequentially sputtered only on the terminal portion 23 (FIG. 8B).

Finally, a method of manufacturing the nozzle plate 3 will be described with reference to FIG. A thermal oxide film 39 is formed on a substrate 37 made of a single crystal silicon wafer by wet oxidation (FIG. 9).
(A)), the thermal oxide film 39 is etched on both surfaces of the substrate by photolithography with an aqueous solution of hydrofluoric acid to form the discharge holes 4
Is patterned (FIG. 9B). The ejection hole 4 is formed by anisotropically etching this substrate (FIG. 9C).

Next, the process of forming the head chip 100 after forming the three substrates as described above will be described with reference to FIG.
It will be described based on. The flow path substrate 1 and the electrode glass substrate 2 are heated to 380 ° C., silicon (flow path substrate 1) is connected to the anode, and the glass substrate (electrode glass substrate 2) is connected to the cathode, and 800 V is applied.
Anodic bonding is carried out by applying the voltage (Fig. 10 (a)).
After bonding the flow path substrate 1 and the electrode glass substrate 2, the nozzle plate 3 is arranged on the flow path substrate 1 for positioning, and the flow path substrate 1 and the nozzle plate 3 are bonded (FIG. 10).
(B)).

When the joining of the three substrates is completed as described above, the drive circuit 102 is connected between the flow path substrate 1 and the terminal portion 23 of the electrode glass substrate 2 by the wiring 101. Then, dicing is performed on each chip constituting the line head to form the head chip 100. After dicing, the quality of each head chip is determined, and a good quality head chip is selected. Then, the inclined surface 3a is formed by obliquely dicing the nozzle plate 3 on the bonding surface of the good quality head chip 100 (FIG. 10C). After forming the inclined surface 3a, the head chip 100 is joined in a line shape. The process of joining in a line will be described below.

The head chip 100 formed by joining three substrates as described above is extremely thin, and the side faces of the thin substrates are joined together so that the nozzle positions of adjacent substrates do not shift. In order to do so, a certain amount of ingenuity is required. The device will be described below. Figure 11
Is a set jig (corresponding to an inkjet head manufacturing apparatus shown in the claims) used for joining the head chips 100 to each other. First, the setting jig will be described.

As shown in FIG. 11, the setting jig 41 is provided with a substantially V-shaped groove 43 extending from one side of the rectangular main body 42 to the center thereof. The head chip 100 is placed. Each of the substantially V-shaped side planes of the groove portion 43 is finely formed, and the head chip 10
It guarantees the accuracy of 0 connection. A substantially V-shaped deep groove 45, which is deeper by a certain width, is formed at the end of the groove 43 near the center. In addition, a plurality of suction holes 47 for sucking the mounted head chip 100 are provided near the bottom of the groove 43. A suction pipe 49 communicating with the suction hole 47 is provided so as to project from one side surface of the main body 42. Further, on the side surface of the main body 42 where the groove portion 43 is formed,
A pressing bar 51 for pressing the head chip 100 placed in the groove 43 is provided along the groove 43. The pressing bar 51 is screwed with the main body 42, and the pressing bar 51 is moved back and forth along the groove 43 by turning the handle 51a.

In the set jig 41 constructed as described above, the head chip 1 is provided on one side of the substantially V-shaped groove portion 43.
00 will be placed and joined, the details of which will be described below.

A good head chip 100 manufactured by the method described above is placed in the groove portion 43 of the setting jig. At this time, the rear side surface of the head chip 100 is brought into contact with the central wall of the groove 43, and the lower side surface of the head chip 100 is brought into contact with the bottom of the groove 43. As a result, the head chip 100 is positioned at a predetermined position. In this state, the position is fixed by operating the vacuum pump connected to the pipe 49 to perform vacuum suction.

Head chip 1 mounted on the setting jig 41
An adhesive is applied to the side surface of the other head chip 100 to be bonded to 00. The method of applying the adhesive is shown in FIG.
As shown in (d), first, the adhesive 56 is thinly applied onto the transfer plate 55. A transfer film 57 is attached to the thinly applied adhesive 56, and the adhesive 56 is transferred to the film 57 by peeling it off. The adhesive 56 is retransferred from the film 57 to the head chip 100 by bringing the adhesive surface 100a of the head chip 100 into contact with the film 57 to which the adhesive 56 has been transferred.

The head chip 100 to which the adhesive has been retransferred is placed next to the head chip 100 previously placed in the groove portion 43 of the setting jig 41 and temporarily fixed by vacuum suction. At this time, the lower end surface of the head chip 100 is provided with the groove portion 43.
Head chip 10 to be joined by abutting on the bottom surface of
Positions of 0s can be accurately aligned, and the linearity of the nozzles of the head chips 100 to be bonded can be secured.

With the head chip 100 to be joined placed, the knob 51a of the pressing bar 51 is turned to press the side surface of the head chip 100 placed later. At this time,
The head chip 100 is temporarily fixed by vacuum suction, and by pressing the side surface of the head chip 100 with a certain force or more, the head chip 100 placed later can be pressed against the head chip 100 placed earlier. it can. At this time, the excess adhesive collects in the groove 3b formed by the nozzle plate 3 of the adjacent head chip 100, and does not overflow to the nozzle plate surface. Further, it is conceivable that the adhesive may squeeze out on the lower surface of the head chip 100 (the lower surface of the electrode glass substrate).
Since it can escape to No. 5, the mounting surface of the head chip 100 is not polluted.

While the head chips 100 are pressed against each other, pressure is maintained until the adhesive is hardened, and after the adhesive is hardened, the pressure and vacuum suction are released to complete the joining.

As described above, in the manufacturing method of the present embodiment, since the connection is performed while fixing the position with the delicate V-shaped surface, the side surface of the thin head chip 100 can be accurately joined. In addition, as a result of enabling high-precision connection,
A high-definition line head can be formed, and as a result, high-precision printing is possible.

In the above embodiment, the setting jig 41 is used.
Although the groove 43 is relatively short, when the length of the line head to be formed is long, the length of the groove 43 may be increased accordingly. Further, by attaching a face material capable of widely pressing the side surface of the head chip 100 to the tip portion of the pressing rod 51, the head chip 100 can be pressed stably.

In the above embodiment, the so-called face type ink jet head in which the nozzle holes 4 are provided in the surface portion of the substrate is shown. However, the present invention is not limited to this, and can also be applied to a so-called edge type inkjet head in which nozzle holes are provided in the edge portion of the substrate. As for the driving method for ejecting ink, in addition to the electrostatic driving method according to the present embodiment, a piezoelectric driving method for driving a vibrating plate with a piezoelectric element, ink is ejected by a pressure generated by heating ink to generate bubbles. Including those of the type.

Further, in the above-described embodiment, the example in which the inclined surface 3a is provided by dicing as an example of the adhesive reservoir on the joint surface of each head chip 100 has been shown. However, the present invention is not limited to this, and in the step of forming the nozzle hole in the nozzle plate 3, a stepped portion serving as a reservoir for the adhesive may be formed on the joint side surface of the nozzle plate 3 by photolithography.

A method of forming the step by the photolithography will be described with reference to FIG. Note that FIG.
In FIG. 3, the nozzle surface (the surface that comes to the upper side when the head chip is assembled) is shown as the lower side. A thermal oxide film 63 is formed by wet oxidation on a substrate 61 made of a single crystal silicon wafer (FIG. 13A), and a photoresist film 65 is formed on one surface (upper surface in the drawing) of the substrate (FIG. 13).
(B)), the thermal oxide film 63 is etched with a hydrofluoric acid aqueous solution by photolithography to pattern the ejection holes (FIG. 13C). This substrate is anisotropically dry-etched to form a depth about half that of the ejection hole 4 (FIG. 13D).

Next, after forming a photoresist film 67 on the nozzle surface (FIG. 13E), the thermal oxide film 63 is etched with a hydrofluoric acid aqueous solution by photolithography,
The ejection hole and the stepped portion serving as a reservoir for the adhesive are patterned (FIG. 13F). Then, the discharge hole 4 and the step portion 69 penetrating therethrough are formed by wet etching this (FIG. 13G).

By forming the step portion 69 serving as a reservoir of the adhesive by photolithography, it is possible to form the step portion with high accuracy.

Embodiment 2. (Printing Device) FIG. 14 is an external perspective view of the printing device according to the second embodiment of the present invention. Further, FIG. 15 shows a schematic configuration of main components of the printing apparatus shown in FIG. The line inkjet head 151 described in the first embodiment is mounted on the printing apparatus 150.

The configuration of the printing device 150 will be described. The printing device 150 includes a line inkjet head 151 arranged so as to include a recording range, and the recording paper 6 via a recording position by the line inkjet head 151.
4, a feed mechanism 155 including a paper pressing roller 153 that presses the recording paper 64, and an ink supply mechanism 157 including an ink pipe 156 that supplies ink to the line inkjet head 151. (Mainly refer to FIG. 15).

The ink supply mechanism 157 includes an ink tank for containing ink, an ink circulation pump mechanism for collecting the ink at the same time as sending it to the line ink jet head 151, an ink tank, and the ink circulation pump mechanism and the line ink jet head 151. And an ink pipe 156 connected to the ink supply mechanism 15
No. 7 is accommodated in the accommodating portion 158 (see FIG. 14).

The printing apparatus 150 has a configuration including a control circuit portion in addition to the above configuration. The control circuit portion drives and controls the line inkjet head 151, the transport mechanism 155, and the ink supply mechanism 157, and also controls the scanner and
It sends and receives data to and from higher-level devices such as networks.

In the printing apparatus 150 configured as described above, ink droplets are ejected from the line ink jet head 155 at appropriate times in accordance with the transport speed of the recording paper 64 to print characters or images on the recording paper 64. . That is, the transport mechanism 15
The rotation angle and speed of the feed roller 154 are detected by a detection mechanism (not shown) attached to the ink jet printer 5, and the control unit controls the drive timing of the head in accordance with the detected transport speed, and the ink is fed from the line inkjet head. Is discharged to perform printing. As a result, clear printing can be performed at high speed.

According to the present embodiment, printing can be performed only by feeding the recording paper 64 without moving the ink jet head in the recording paper width direction, so that the printing speed can be extremely increased. Moreover, the structure of the apparatus can be simplified, the manufacturing can be simplified, and high-speed printing can be realized without complicating the drive circuit.

Third Embodiment As a third embodiment of the present invention, an apparatus for manufacturing a color filter equipped with the ink jet head shown in the first embodiment will be described.

When the ink jet head shown in the first embodiment is applied to a color filter manufacturing apparatus, the ink jet head is formed on a color filter substrate in order to match the resolution of the ink jet head and the pixel pitch of the color filter. The pixels are arranged diagonally with respect to each other, and the pixel pitches are used together, which will be described with reference to FIG.

FIG. 16 is a top view showing how the pixels of the color filter are colored by the ink jet head, and for the ink jet head, only the positions of the nozzle rows are shown. In addition, a state in which a portion to be colored red in the determined pattern is colored is shown. In addition, R, which is drawn in each pixel in FIG.
The letters G and B indicate that each pixel is colored red (R), green (G), and blue (B).

The nozzle row 310 is formed in the ink jet head, and ink is ejected from this to form ink dots on the substrate. The pixel (filter element) 311 of the color filter is a portion where ink dots are formed on the substrate.

In the example of FIG. 16, since the pixel spacing P1 of the color filter and the nozzle spacing P2 of the ink jet head do not match, the heads are tilted by the angle θ and the heads of the same color lined up every three in the Y direction. Coloring the inside of a pixel by matching the position of the pixel with the position of the ink ejected from every five nozzles and forming an ink dot in the pixel 311 while moving the inkjet head relatively in the X direction in the figure. To do. This is performed by an inkjet head that ejects red, green, and blue inks to manufacture a color filter. Therefore, in the inkjet head for coloring the red pixels shown in this figure, the second, seventh, and twelfth nozzles counting from the lower right perform ejection, and the other nozzles do not eject.

In this example, as the ink jet head, a general ink jet type head having a nozzle pitch of 360 dpi (70.5 μm) is used. In addition, as the color filter, an interval of 100 μm between pixels is shown.

When the color filter is used as an optical element for full-color display, R, G, and B of 3 are used.
One pixel is formed by using the color filter element as one unit. The array of the filter element is, for example, the stripe array shown in FIG. 17A, the mosaic array shown in FIG. The delta arrangement | sequence etc. which are shown by (c) are known. The stripe arrangement is a color arrangement in which all the columns of the matrix have the same color. The mosaic array is a color arrangement in which any three filter elements arranged in a vertical and horizontal straight line have three colors of R, G, and B.
The delta arrangement is a color arrangement in which the filter elements are arranged differently and three adjacent filter elements have three colors of R, G, and B.

FIG. 18 is a diagram showing an outline of a color filter manufacturing apparatus equipped with the ink jet head of the above-described embodiment. The calculation unit 400 generates and outputs a drawing image (arrangement pattern of pixels of the color filter) 401 and a nozzle switching signal 402. The drawing image (color filter pixel array pattern) 401 is printed on the substrate 5.
No. 00 is data indicating the relative positional relationship of each ink dot to be formed on the ink. The nozzle switching signal 402 instructs switching of the nozzle corresponding to each point of the pixel of the color filter. A concrete method of switching the nozzle group will be described with reference to FIG.
Assuming that the 7th and 12th nozzle groups are used, the 3rd, 8th and 13th nozzle groups are next, and then 4th,
It is easy to sequentially feed the nozzle groups of the 9th and 14th nozzles, but other methods may be used.

Further, the switching of the nozzle group is to be sequentially performed when the life of the nozzle currently in use has expired.
The life of the nozzle is determined, for example, based on the usage time of one nozzle group, and when the usage time of one nozzle group reaches a predetermined time, it is determined that the life has expired.

The drawing data generator 403 associates each pixel on the substrate with the nozzle in accordance with the nozzle switching signal 402 to generate drawing data which is the absolute position data of each ink dot on the substrate. At this time, when the nozzles are switched, the change in the positions of the nozzles before and after the switching is calculated from the known data regarding the nozzle arrangement, and the position of the stage 408 at the time of forming each ink dot before and after the nozzle switching is correspondingly changed. Change.

The driver 404 follows the drawing data
Inkjet head 405, feeding devices 406 and 407
Are driven to form ink dots on the substrate 500 according to the drawing data. Inkjet head 405
Includes a red head 405a for ejecting red ink, a green head 405b for ejecting green ink, and a blue head 405c for ejecting blue ink. The feeding devices 406 and 407 move the position of the stage 408 in the X direction and the Y direction, respectively, in response to a signal from the driver 404. The stage 408 holds the substrate 500 to be colored. With the above configuration, the drawing image 40 is formed on the substrate 500.
A drawing pattern corresponding to 1 is generated.

In this embodiment, the change in the positional relationship between the substrate and the drawing head, which corresponds to the nozzle position shift amount due to the nozzle switching, is estimated from known data regarding the nozzle arrangement of the nozzles. The positional relationship of the ink dots actually formed by each nozzle may be measured by a device or the like.

FIG. 19 is a diagram schematically showing the process of manufacturing a color filter by the color filter manufacturing apparatus of the above-described third embodiment in the order of steps.

(1) First, as shown in FIG. 19A, the partition walls 506 are formed on the surface of the mother substrate 512 with a non-light-transmitting resin material in a grid pattern as viewed in the direction of arrow B. The lattice hole portion 507 of the lattice pattern is a region where the filter element 503 is formed, that is, a filter element region. The planar dimension of each filter element region 507 formed by the partition wall 506 when viewed in the direction of arrow C is, for example, 30 μm × 1.
It is formed to have a thickness of about 00 μm.

The partition wall 506 is formed in the filter element region 5
It also has the function of blocking the flow of the filter element material supplied to No. 07 and the function of the black matrix. Further, the partition wall 506 is formed by an arbitrary patterning method, for example, a photolithography method, and further heated by a heater and fired if necessary.

(2) After formation of the partition wall 506, FIG.
As shown in FIG.
Each filter element region 507 is filled with the filter element material 513 by supplying 8 to each filter element region 507. In FIG. 19B, reference numeral 513R indicates a filter element material having an R (red) color, reference numeral 513G indicates a filter element material having a G (green) color, and reference numeral 513B indicates B.
Figure 3 shows a filter element material with a (blue) color.

(3) When each filter element region 507 is filled with a predetermined amount of filter element material, the heater heats the mother substrate 512 to, for example, about 70 ° C. to evaporate the solvent of the filter element material. Due to this evaporation, the volume of the filter element material 513 is reduced and flattened as shown in FIG. When the volume is drastically reduced, the supply of droplets of the filter element material and the heating of the droplets are repeated until a sufficient film thickness is obtained for the color filter. By the above processing, only the solid content of the filter element material remains and is finally formed into a film, whereby each desired color filter element 503 is formed.

(4) With the above, the filter element 5
After 03 is formed, a heating process is performed at a predetermined temperature for a predetermined time in order to completely dry the filaments 503. After that, the protective film 504 is formed as shown in FIG. 19D by using an appropriate method such as a spin coating method, a roll coating method, a ripping method, or an inkjet method. This protective film 504 is
It is formed to protect the filter element 503 and the like and to planarize the surface of the color filter 501.

As described above, according to the third embodiment, it is possible to apply the color filter materials of the three additive primary colors at one time in the process, and the color filter material is discharged directly to the filter element. It is not wasted. Therefore, the yield can be improved, and a color filter manufacturing apparatus with good cost performance can be obtained. In particular, since it can be produced at a cost much lower than that of the conventional method, it is possible to obtain a color filter having good cost performance in consideration of the cost of the inkjet head. Further, the color filter material is not wasted, which is good for the environment.

Fourth Embodiment In the fourth embodiment, a procedure for producing an organic EL substrate by the organic EL substrate manufacturing apparatus using the inkjet head described in the above-described embodiments will be described. Since the organic EL substrate manufacturing apparatus in this case can apply most of the configuration of the color filter manufacturing apparatus (FIG. 18) described in the third embodiment, the configuration is not shown.

FIG. 20 is a diagram showing the main steps of the method for manufacturing an EL device according to the fourth embodiment and the main sectional structure of the EL device finally obtained. The EL device 601 is shown in FIG.
0 (d), the pixel electrode 602 is formed on the transparent substrate 604, and the bank 60 is provided between the pixel electrodes 602.
5 are formed in a grid shape when viewed from the direction of arrow G, and the hole injection layer 620 is formed in these grid-shaped recesses so that a predetermined array such as a stripe array is formed when viewed from the direction of arrow G. Light-emitting layer 603R, G-color light-emitting layer 603G and B
The color light emitting layer 603B is formed in each lattice-shaped recess, and the counter electrode 613 is further formed thereon.

When the pixel electrode 602 is driven by a two-terminal active element such as a TFD (thin film diode) element, the counter electrode 613 is formed in a stripe shape when viewed from the arrow G direction. When the pixel electrode 602 is driven by a three-terminal active element such as a TFT (thin film transistor), the counter electrode 613 is formed as a single surface electrode.

A region sandwiched by each pixel electrode 602 and each counter electrode 613 becomes one pixel pixel, and R,
G and B pixel pixels of three colors become one unit 1
Form two pixels. By controlling the current flowing through each picture element pixel, a desired one of the plurality of picture element pixels is selectively caused to emit light, whereby a desired full-color image can be displayed in the arrow H direction.

The EL device 601 described above is manufactured, for example, as follows. (1) As shown in FIG. 20A, the transparent substrate 604
An active element such as a TFD element or a TFT element is formed on the surface of, and a pixel electrode 602 is further formed. As a forming method, for example, a photolithography method, a vacuum deposition method, a sputtering method, a pyrosol method or the like can be used. As a material for the pixel electrode, ITO (Indium Tin O
xide), tin oxide, a composite oxide of indium oxide and zinc oxide, or the like can be used.

Next, partition walls, that is, banks 605 are formed by using a well-known patterning method, for example, a photolithography method, and the transparent electrodes 60 are formed by the banks 605.
Fill the space between 2. As a result, it is possible to improve the contrast, prevent color mixture of the light emitting material, and prevent light leakage between pixels. The material of the bank 605 is not particularly limited as long as it has durability against the solvent of the EL material, but can be made into Teflon (registered trademark) by fluorocarbon gas plasma treatment, for example,
Organic materials such as acrylic resin, epoxy resin, and photosensitive polyimide are preferable.

Immediately before the ink for the hole injection layer is applied, the substrate 604 is subjected to continuous plasma treatment with oxygen gas and fluorocarbon gas plasma. As a result, the polyimide surface is rendered water repellent and the ITO surface is rendered hydrophilic, and the wettability on the substrate side for fine patterning of inkjet droplets can be controlled. As an apparatus for generating plasma, an apparatus for generating plasma in vacuum or an apparatus for generating plasma in the atmosphere can be used as well.

Next, the hole injecting layer ink is ejected from the ink jet head to perform patterning coating on each pixel electrode 602. Then, the hole injection layer 620 which is incompatible with the light emitting layer ink is formed by heat treatment in the air at 20 ° C. (on a hot plate) for 10 minutes. The film thickness is 4
It is about 0 nm.

(2) Next, as shown in FIG. 20 (b), the ink for the R light emitting layer and the ink for the G light emitting layer are formed on the hole injection layer 620 in each filter element region by an ink jet method. Apply. Here again, the thickness of each light emitting layer ink can be changed by changing the solid content concentration and the discharge amount of the ink composition discharged from the inkjet head.

After applying the ink for the light emitting layer, a vacuum (1 torr)
In R), the solvent is removed under the conditions of room temperature, 20 minutes, etc. (process P58), and subsequently, heat treatment is performed in a nitrogen atmosphere at 150 ° C. for 4 hours to conjugate the R color emitting layer 603R and the G color emitting layer 603G. To form. The film thickness is about 50 nm. The luminescent layer conjugated by heat treatment is insoluble in the solvent. Here, the R color light emitting layer 603R has, for example, PPV (polyparaphenylene vinylene) doped with rhodamine B.
Xylene solution is used. In addition, the G color light emitting layer 603
For G, for example, a xylene solution of MEH · PPV is used. For the B-color light emitting layer 603B, for example, a coumarin-doped PPV xylene solution is used.

The hole injection layer 6 is formed before the light emitting layer is formed.
20 may be subjected to continuous plasma treatment with oxygen gas and fluorocarbon gas plasma. Thereby, the hole injection layer 6
A fluorinated layer is formed on 20 to increase the ionization potential, so that the hole injection efficiency is increased, and an organic EL device having high luminous efficiency can be provided.

(3) Next, as shown in FIG. 20C, the B color light emitting layer 603B is changed to the R color light emitting layer 603R, the G color light emitting layer 603G and the hole injection layer 620 in each pixel pixel.
Overlaid on top of. As a result, not only the three primary colors of R, G, and B can be formed, but also the level difference between the R color light emitting layer 603R and the G color light emitting layer 603G and the bank 605 can be filled and planarized. As a result, it is possible to reliably prevent a short circuit between the upper and lower electrodes. By adjusting the film thickness of the B-color light emitting layer 603B, the B-color light emitting layer 603B becomes the R-color light emitting layer 6
In the laminated structure with the 03R and G color light emitting layers 603G,
It acts as an electron injecting and transporting layer and does not emit B color.

As a method of forming the B color light emitting layer 603B as described above, for example, a general spin coating method as a wet method can be adopted, or the R color light emitting layer 6 can be used.
An inkjet method similar to the method of forming the 03R and G color light emitting layers 603G can also be adopted.

(4) Thereafter, as shown in FIG. 20D, the counter electrode 613 is formed to manufacture the target EL device 601. When the counter electrode 613 is a surface electrode, for example, Mg, Ag, Al, L
It can be formed using a film forming method such as a vapor deposition method or a sputtering method using i or the like as a material. In the case where the counter electrode 613 is a stripe electrode, the formed electrode layer can be formed by a patterning method such as a photolithography method.

In the manufacturing method of the EL device described above, as a method of controlling the ink jet head,
The hole injection layer 620 and the light emitting layers 603R, 603G, and 603B for each color of R, G, and B in each pixel of FIG.
In addition, the hole injection layer and / or the light emitting layer of each color in one pixel pixel is overlapped n times, for example, 4 times by a plurality of nozzles, instead of being formed by one main scan X of the inkjet head. A predetermined film thickness may be formed by receiving ink ejection. By doing so, even if there is a variation in the ink ejection amount between the plurality of nozzles, it is possible to prevent the variation in the film thickness between the plurality of pixel pixels, and therefore, the light emitting surface of the EL device. It is possible to make the light emission distribution characteristics of 2) uniform in a plane. This means that in the EL device 601 of FIG. 20D, a clear color display without color unevenness can be obtained.

As described above, according to the manufacturing method of the EL device of the present embodiment, the R, G, B color pixel pixels are formed by the ink ejection using the ink jet head, and therefore the photolithography method is used. There is no need to go through complicated steps such as the method, and no material is wasted.

Further, as a method of forming a light emitting layer or the like in an EL device, conventionally, for example, a method of depositing a metal dye or the like on the light emitting layer is adopted, but when an organic EL substrate is manufactured by an ink jet method, Application and patterning of a high molecular weight organic compound to be an electroluminescent device can be performed at once. Moreover, since the liquid is directly discharged to the target position, it is only necessary to discharge the minimum necessary amount without wasting the organic compound that becomes the electroluminescent element.

In addition, the R, G, and B light emitting layers 603R, 6
There are various kinds of organic compounds and solutions used for 03G and 603B, and thus the organic compounds and the solutions may not be those shown above. Further, a material that develops an intermediate color may be used. However, since the weight, viscosity, etc. vary depending on the respective materials, it is necessary to adjust the ink weight and the ink speed according to the material to be ejected.

[0110]

As described above, according to the present invention, since a plurality of head chips that independently constitute the nozzle actuator are joined together by an adhesive to form a line, a base plate or other base is not required. Thus, the structure can be simplified, the head can be downsized, and the weight can be reduced, and the degree of freedom in design can be increased.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a main part of an inkjet head shown in a first embodiment of the present invention.

FIG. 2 is an explanatory diagram of the overall configuration of the inkjet head shown in the first embodiment of the present invention.

FIG. 3 is a partially enlarged view of FIG.

FIG. 4 is an exploded perspective view of the inkjet head according to the first embodiment of the present invention.

5 is a cross-sectional side view of FIG.

6 is a view taken along the line AA of FIG.

FIG. 7 is an explanatory diagram of a method of manufacturing the flow path substrate that constitutes the inkjet head shown in the first embodiment of the present invention.

FIG. 8 is an explanatory diagram of a method for manufacturing the electrode glass substrate that constitutes the inkjet head shown in the first embodiment of the present invention.

FIG. 9 is an explanatory diagram of a method for manufacturing the nozzle plate that constitutes the inkjet head shown in the first embodiment of the present invention.

FIG. 10 is an explanatory diagram of an inkjet head assembling process according to the first embodiment of the present invention.

FIG. 11 is an explanatory diagram of a jig used for assembling the inkjet head according to the first embodiment of the present invention.

FIG. 12 is an explanatory diagram of an inkjet head assembling process according to the first embodiment of the present invention.

FIG. 13 is an explanatory diagram of another method for manufacturing the nozzle plate that forms the inkjet head according to the first embodiment of the present invention.

FIG. 14 is an external perspective view of the printing apparatus according to the second embodiment of the present invention.

15 is an explanatory diagram of a configuration of main components of the printing apparatus illustrated in FIG.

FIG. 16 is a diagram showing a state in which pixels of a color filter are colored by an inkjet head, as viewed from above.

FIG. 17 is an explanatory diagram showing an arrangement example of filter elements of a color filter.

FIG. 18 is a diagram showing an outline of a color filter manufacturing apparatus according to a third embodiment of the present invention.

FIG. 19 is a diagram schematically showing the process of manufacturing a color filter by the color filter manufacturing apparatus of FIG. 18 in process order.

FIG. 20 is a diagram showing main steps of a method for manufacturing an EL device according to a fourth embodiment of the present invention and a main cross-sectional structure of an EL device finally obtained.

[Explanation of symbols]

1 flow path substrate 2 Glass electrode substrate 3 nozzle plate 3a inclined surface 3b hangout 100 head chips

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 2C057 AF93 AJ10 AN07 AP13 AP21                       AP22 AP25 AP71 AP77                 2H048 BA64 BB02 BB07 BB08 BB24                       BB47    (54) [Title of Invention] Inkjet head manufacturing method, apparatus used in the method, and inkjet head and ink jet head                     Jet recording apparatus, color filter manufacturing apparatus and manufacturing method thereof, and electroluminescent substrate manufacturing apparatus                     And its manufacturing method

Claims (17)

[Claims] 1. A method of manufacturing a line-shaped ink jet head by bonding side surfaces of a plurality of chips that independently constitute a nozzle actuator with an adhesive, and manufacturing a plurality of chips that independently constitute a nozzle actuator. Chip manufacturing step, an adhesive applying step of applying an adhesive to the side surface of the manufactured chip, a positioning step of aligning the chip to which the adhesive is applied with another chip, and positioning chips A method of manufacturing an inkjet head, comprising a pressing step of bringing the side surfaces into contact with each other and pressing the same. 2. The method of manufacturing an ink jet head according to claim 1, wherein the chip manufacturing step includes a step of providing a notch portion on the side surface of the nozzle plate in which the nozzle hole is formed, which serves as a reservoir for the adhesive. . 3. The method for manufacturing an ink jet head according to claim 2, wherein the cutout portion is formed by patterning a nozzle plate and performing photolithography. 4. The method of manufacturing an ink jet head according to claim 2, wherein the cutout portion is formed by obliquely dicing the side surface of the nozzle plate. 5. The positioning step includes a temporary fixing step of mounting the chip on a mounting table in a positioned state and temporarily fixing the chip in a movable state by drawing a vacuum from the lower surface of the chip. Item 5. A method for manufacturing an inkjet head according to any one of Items 1 to 4. 6. A manufacturing apparatus of an inkjet head, wherein side surfaces of a plurality of chips, which independently constitute a nozzle actuator, are bonded to each other with an adhesive to form a line shape, and the mounting table mounts the chips in a positionable state. Inkjet, comprising: a portion, a temporary fixing means for temporarily fixing a chip mounted on the mounting table in a movable state, and a pressing means for pressing a plurality of chips mounted on the mounting table. Head manufacturing equipment. 7. The apparatus for manufacturing an ink jet head according to claim 6, wherein the mounting table includes an escape area for the adhesive that has run off to escape. 8. The inkjet head manufacturing apparatus according to claim 6, wherein the mounting table is a substantially V-shaped groove formed on the main body and having a contact surface at one end in the longitudinal direction. 9. The inkjet head manufacturing apparatus according to claim 6, wherein the temporary fixing means vacuum-adsorbs the chip mounted on the mounting table from the lower surface side. 10. The pressing means is provided so as to be capable of advancing and retreating with respect to the side surface of the chip mounted on the mounting table, and presses the side surface of the chip. Inkjet head manufacturing equipment. 11. An inkjet head manufactured by the inkjet head manufacturing method according to claim 1. 12. An inkjet recording apparatus comprising the inkjet head according to claim 11. 13. A method for manufacturing an inkjet recording apparatus, comprising manufacturing an inkjet head by the method for manufacturing an inkjet head according to claim 1, and mounting the inkjet head. 14. A color filter manufacturing apparatus comprising the ink jet head according to claim 11. 15. A method of manufacturing a color filter manufacturing apparatus, comprising manufacturing an inkjet head by the method of manufacturing an inkjet head according to claim 1, and mounting the inkjet head. 16. An electroluminescent substrate manufacturing apparatus comprising the inkjet head according to claim 11. 17. A method for manufacturing an electroluminescent substrate manufacturing apparatus, comprising manufacturing an inkjet head by the method for manufacturing an inkjet head according to claim 1, and mounting the inkjet head.