JP2003258170A5 - - Google Patents

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Publication number
JP2003258170A5
JP2003258170A5 JP2002101927A JP2002101927A JP2003258170A5 JP 2003258170 A5 JP2003258170 A5 JP 2003258170A5 JP 2002101927 A JP2002101927 A JP 2002101927A JP 2002101927 A JP2002101927 A JP 2002101927A JP 2003258170 A5 JP2003258170 A5 JP 2003258170A5
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JP
Japan
Prior art keywords
fin
heat sink
base
sink according
integrally
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002101927A
Other languages
English (en)
Japanese (ja)
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JP2003258170A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002101927A priority Critical patent/JP2003258170A/ja
Priority claimed from JP2002101927A external-priority patent/JP2003258170A/ja
Publication of JP2003258170A publication Critical patent/JP2003258170A/ja
Publication of JP2003258170A5 publication Critical patent/JP2003258170A5/ja
Pending legal-status Critical Current

Links

JP2002101927A 2002-02-26 2002-02-26 ヒートシンク Pending JP2003258170A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002101927A JP2003258170A (ja) 2002-02-26 2002-02-26 ヒートシンク

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002101927A JP2003258170A (ja) 2002-02-26 2002-02-26 ヒートシンク

Publications (2)

Publication Number Publication Date
JP2003258170A JP2003258170A (ja) 2003-09-12
JP2003258170A5 true JP2003258170A5 (fr) 2005-08-25

Family

ID=28672163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002101927A Pending JP2003258170A (ja) 2002-02-26 2002-02-26 ヒートシンク

Country Status (1)

Country Link
JP (1) JP2003258170A (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7306027B2 (en) * 2004-07-01 2007-12-11 Aavid Thermalloy, Llc Fluid-containing cooling plate for an electronic component
US7772036B2 (en) * 2006-04-06 2010-08-10 Freescale Semiconductor, Inc. Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing
JP2010167454A (ja) * 2009-01-22 2010-08-05 Welcon:Kk 熱交換器及びその製造方法
JP5549958B2 (ja) 2012-09-21 2014-07-16 三菱マテリアル株式会社 アルミニウム部材と銅部材との接合構造
KR102146589B1 (ko) * 2012-10-16 2020-08-20 미쓰비시 마테리알 가부시키가이샤 히트싱크가 부착된 파워 모듈용 기판, 히트싱크가 부착된 파워 모듈, 및 히트싱크가 부착된 파워 모듈용 기판의 제조 방법
JP7334214B2 (ja) 2021-07-14 2023-08-28 プライムプラネットエナジー＆ソリューションズ株式会社 端子部品、該端子部品の製造方法、および二次電池

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