JP2003255123A - Apparatus and method for film manufacture, apparatus and method for device manufacture, and device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To decrease a peak current value with a simple circuit constitution. <P>SOLUTION: Piezoelectric elements PZ are arranged corresponding to a plurality of nozzles 11, which spout functional liquid according to a driving waveform supplied to the piezoelectric elements PZ. Also provided are: a waveform generation part 15 which generates a group of waveforms consisting of a plurality of driving waveforms which are set with time differences; and a wavelength selection part 13 which selects the specified driving waveform from the group of generated waveform and supplies the selected waveform to the piezoelectric elements PZ. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film forming apparatus and a film forming method, a device manufacturing apparatus, a device manufacturing method, and a device.

[0002]

2. Description of the Related Art With the development of electronic equipment such as computers and portable information equipment terminals, the use of liquid crystal display devices, especially color liquid crystal display devices, has been increasing. This type of liquid crystal display device uses a color filter for colorizing a display image. The color filter has a substrate on which R (red), G (green), and B are provided.
Some are formed by supplying (red) ink in a predetermined pattern. As a method of supplying ink to such a substrate, for example, an inkjet type film forming apparatus is adopted.

When the ink jet system is adopted, in the film forming apparatus, a predetermined amount of ink is ejected and supplied from the ink jet head to the substrate. In this case, for example, the substrate is a Y stage (a stage movable in the Y direction). ), And the inkjet head is mounted on an X stage (a stage that is movable in the X direction). Then, after the inkjet head is positioned at a predetermined position by driving the X stage, ink is ejected while the substrate is moved relative to the inkjet head by driving the Y stage, so that the ink from the inkjet head is moved to a predetermined position on the substrate. Can be supplied to.

In the above ink jet head, as a means for ejecting ink, a plurality of nozzle openings are formed on the wall surface of the ink tank, and piezoelectric elements are arranged so that the expansion and contraction directions are aligned so as to face each nozzle opening. Many of the things that have been set up are used. As this type of piezoelectric element, for example, as disclosed in Japanese Patent Laid-Open No. 63-295269, there is provided one in which electrodes and piezoelectric materials are alternately laminated in a sandwich shape.

[0005]

However, the above-mentioned conventional techniques have the following problems.
When a plurality of piezoelectric elements are driven at the same time, a large peak current is required and the amount of heat generated becomes large. In particular, a large peak current when the piezoelectric element expands or contracts causes a significant voltage drop due to wiring resistance or the like, so that so-called crosstalk occurs in which a drive signal varies depending on the number of selected piezoelectric elements. This crosstalk affects the flight characteristics of ink droplets and deteriorates film forming quality.

As a measure against such a problem, for example, JP-A-5-84902 and JP-A-2000-238261.
No. publication is provided. The technique disclosed in Japanese Unexamined Patent Publication No. 5-84902 reduces the maximum peak current value required for driving all piezoelectric elements by dividing the piezoelectric element into a plurality of blocks and driving them in a time division manner. Further, the technique disclosed in Japanese Patent Application Laid-Open No. 2000-238261 includes a plurality of drive voltage generation circuits for piezoelectric elements, and outputs of the drive voltage generation circuits are connected to the piezoelectric elements via analog switches, respectively. The drive voltage generating circuit of an inkjet head having many nozzles can be divided into a plurality of parts.

However, in these techniques, in addition to the problem that the control becomes complicated and the mechanical design load increases, there also arises the problem that the number of circuit parts increases and the cost increases.

The present invention has been made in consideration of the above points, and a film forming apparatus and a film forming method capable of reducing a peak current value with a simple circuit structure, a device manufacturing apparatus, a device manufacturing method, and a device. The purpose is to provide.

[0009]

In order to achieve the above object, the present invention employs the following constitutions. A film forming apparatus of the present invention is a film forming apparatus in which a piezoelectric element is arranged corresponding to a plurality of nozzles, and a functional liquid is ejected from the nozzle according to a drive waveform supplied to the piezoelectric element. It has a waveform generation unit that generates a waveform group including a plurality of set drive waveforms, and a waveform selection unit that selects a predetermined drive waveform from the generated waveform group and supplies it to the piezoelectric element. Is.

Therefore, in the present invention, by selecting the drive waveform so that the piezoelectric element is driven with a time difference, the drive current when the piezoelectric element is driven can be dispersed and the peak current value can be reduced. At this time, since the drive waveform is generated by one waveform generation unit, it is not necessary to provide a waveform generation circuit or element for each piezoelectric element, and the circuit configuration can be simplified. The functional liquid in the present specification includes ink having a relatively low viscosity for printing (film formation), high viscosity liquid such as lubricating oil and resin.

It is preferable that the group of waveforms includes a discharge waveform for discharging the functional liquid from the nozzle and a vibration waveform for vibrating the meniscus without discharging the functional liquid from the nozzle.

As a result, according to the present invention, the functional liquid can be ejected from the nozzle corresponding to the piezoelectric element whose ejection waveform is selected from the waveform group, and the piezoelectric element whose oscillation waveform is selected can be ejected. The functional liquid of the nozzle can be forcibly stirred to prevent thickening and deterioration of physical properties.

Further, it is preferable that the waveform group includes a plurality of substantially identical ejection waveforms.

Thus, according to the present invention, when the piezoelectric element is driven with the ejection waveform, it is possible to eject substantially the same amount of the functional liquid from each nozzle even if the ejection timing is shifted.

Further, it is also possible to adopt a configuration in which the drive waveforms selected by the waveform selection section are different for the adjacent nozzles.

As a result, in the present invention, it is possible to reduce the influence of crosstalk that occurs when the functional liquid is simultaneously ejected from the adjacent nozzles.

The device manufacturing apparatus of the present invention is a device manufacturing apparatus having a film forming apparatus for supplying a functional liquid ejected from a plurality of nozzles to a substrate and performing a film forming process on the substrate. Is characterized in that the above film forming apparatus is used.

As a result, according to the present invention, the peak current value can be reduced with a simplified circuit structure in the film forming apparatus, so that it is possible to prevent an increase in cost associated with device manufacturing and deterioration of film forming quality.

The device of the present invention is characterized by being manufactured by the above device manufacturing apparatus.

As a result, according to the present invention, it is possible to prevent an increase in device manufacturing cost and deterioration of film forming quality.

On the other hand, the film forming method of the present invention is a film forming method in which a piezoelectric element is arranged corresponding to a plurality of nozzles, and a functional liquid is ejected from the nozzle in accordance with a drive waveform supplied to the piezoelectric element. And a waveform generation step of generating a waveform group including a plurality of drive waveforms set with a time difference, and a waveform selection step of selecting a predetermined drive waveform from the generated waveform group and supplying the selected drive waveform to the piezoelectric element. Is characterized by.

Thus, in the present invention, by selecting the drive waveform so that the piezoelectric element is driven with a time difference, the drive current when the piezoelectric element is driven can be dispersed and the peak current value can be reduced. At this time, since the drive waveform is generated by one waveform generation unit, it is not necessary to provide a waveform generation circuit or element for each piezoelectric element, and the circuit configuration can be simplified.

It is preferable that the group of waveforms includes a discharge waveform for discharging the functional liquid from the nozzle and a vibration waveform for vibrating the meniscus without discharging the functional liquid from the nozzle.

Thus, in the present invention, the functional liquid can be ejected from the nozzle corresponding to the piezoelectric element whose ejection waveform is selected from the waveform group, and the vibration element corresponds to the selected piezoelectric element. The functional liquid in the nozzle is forcibly agitated without being ejected, whereby thickening and deterioration of physical properties can be prevented.

Further, it is preferable that the waveform group includes a plurality of substantially identical ejection waveforms.

Thus, in the present invention, when the piezoelectric element is driven with the ejection waveform, it is possible to eject substantially the same amount of the functional liquid from each nozzle even if the ejection timing is shifted.

Further, it is also possible to adopt a structure in which the drive waveforms selected by the waveform selection section are different for the adjacent nozzles.

As a result, in the present invention, it is possible to reduce the influence of crosstalk that occurs when the functional liquid is ejected simultaneously from the adjacent nozzles.

The device manufacturing method of the present invention is a device manufacturing method including a film forming process for supplying a functional liquid ejected from a plurality of nozzles to a substrate and forming a film on the substrate. The method is characterized in that the film forming process is performed using the film forming method.

As a result, according to the present invention, the peak current value can be reduced with a simplified circuit structure in the film forming process, so that it is possible to prevent an increase in the cost for manufacturing the device and a deterioration in the film forming quality.

[0031]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a film forming apparatus and a film forming method, a device manufacturing apparatus, a device manufacturing method, and a device of the present invention will be described below with reference to FIGS. 1 to 7. Here, the film forming apparatus of the present invention will be described as being applied to a filter manufacturing apparatus for manufacturing a color filter or the like used for a liquid crystal display device using ink as a functional liquid, for example.

FIG. 1 shows a film forming apparatus (inkjet apparatus) 10 which constitutes a filter manufacturing apparatus (device manufacturing apparatus).
2 is a schematic external perspective view of FIG. This filter manufacturing apparatus includes three film forming apparatuses 10 having substantially the same structure, and each of the film forming apparatuses 10 has R (red) and G, respectively.
The ink of each color (green) and B (blue) is ejected onto the filter substrate.

The film forming apparatus 10 includes a base 12, a first moving means 14, a second moving means 16, an electronic balance (weight measuring means) not shown, and an ink jet head 2 as a discharging means.
0, a capping unit 22, a cleaning unit 24 and the like. On the base 12, a first moving means 14, an electronic balance, a capping unit 22, a cleaning unit 24 and a second moving means 16 are installed.

The first moving means 14 is preferably the base 1.
The first moving means 14 is directly installed on the upper surface of the second position 2, and is positioned along the Y-axis direction. On the other hand, the second moving means 16 is vertically attached to the base 12 by using the columns 16A and 16A, and the second moving means 16 is attached to the rear portion 12A of the base 12. The X-axis direction of the second moving means 16 is a direction orthogonal to the Y-axis direction of the first moving means 14. The Y-axis is an axis along the front portion 12B and the rear portion 12A of the base 12. On the other hand, the X axis is an axis along the left-right direction of the base 12 and is horizontal.

The first moving means 14 includes a guide rail 40,
40, and the first moving means 14 can adopt, for example, a linear motor. The slider 42 of the linear motor type first moving means 14 can be moved along the guide rail 40 in the Y-axis direction for positioning.

The slider 42 has a θ-axis motor 44. The motor 44 is, for example, a direct drive motor, and the rotor of the motor 44 is a table 46.
It is fixed to. As a result, by energizing the motor 44, the rotor and the table 46 can rotate in the θ direction to index the table 46 (rotational index).

The table 46 positions and holds the substrate 48. Also, the table 46
Has a suction holding means 50, and the suction holding means 50
Is operated, the substrate 48 can be sucked and held on the table 46 through the hole 46A of the table 46. The table 46 is provided with a preliminary ejection area 52 for the ink-jet head 20 to discard ink or perform trial ejection (preliminary ejection).

The second moving means 16 includes columns 16A and 16A.
It has a column 16B fixed to
6B has a linear motor type second moving means 16. The slider 60 is movable along the guide rail 62A in the X-axis direction and can be positioned.
0 is an inkjet head 2 as an ink ejecting means
It has 0.

The ink jet head 20 has motors 62, 64, 66 and 68 as swing positioning means. When the motor 62 is operated, the inkjet head 20 can move up and down along the Z axis and be positioned.
The Z axis is a direction (vertical direction) orthogonal to the X axis and the Y axis. When the motor 64 is operated, the inkjet head 20 can be positioned by swinging along the β direction around the Y axis. When the motor 66 is operated, the inkjet head 20 can be positioned by swinging in the γ direction around the X axis. When the motor 68 is operated, the inkjet head 20 can be positioned by swinging in the α direction around the Z axis.

As described above, the inkjet head 20 of FIG. 1 can be positioned by linearly moving in the Z-axis direction on the slider 60 and can be positioned by swinging along α, β and γ. The ink ejection surface 20P of 20 can accurately control the position or orientation with respect to the substrate 48 on the table 46 side.
The ink ejection surface 20P of the inkjet head 20
Is provided with a plurality of (here, for example, 120) nozzles (ejection ports) each ejecting ink.

The ink jet head 20 is a head using a piezo element as a piezoelectric element, and the piezo element is provided for each of a plurality of nozzles. Then, a drive signal is applied to each piezo element to expand or contract the ink chamber for each nozzle, so that ink ejection from the nozzle can be controlled.

FIG. 2 shows a control system relating to ink ejection of the ink jet head 20. In this inkjet head 20, each nozzle 11 (nozzle numbers # 1, # 2,
...) corresponding to the piezo element PZ (PZ1, PZ
2, ...) are provided. A waveform selection unit 13 is connected to each piezo element PZ,
These waveform selection units 13 are connected to the waveform generation unit 15.

The waveform generator 15 generates a drive waveform (hereinafter simply referred to as a waveform) of a voltage applied to drive the piezo element PZ.
As shown in (a), a waveform group P composed of a plurality (here, four) of waveforms 0 to 3 set (defined) with a time difference.
Is generated. Here, the waveform 0 is set to a size such that ink is not ejected from the nozzle 11. That is, this waveform 0 indicates that the drive voltage is the piezo element P.
When applied to Z, the meniscus has a vibration waveform set to a magnitude that slightly vibrates so that the meniscus repeatedly moves away from and approaches the nozzle surface. Further, the waveforms 1 to 3 are ejection waveforms that are set to a size in which the ink chamber is contracted / pressurized to eject a predetermined amount of ink when the drive voltage is applied to the piezo element PZ. The waveforms 1 to 3 are substantially the same ejection waveform, and the nozzles 11 corresponding to the piezo elements PZ to which the waveforms are applied eject almost the same amount of ink.

The waveform selecting unit 13 selects a waveform from the waveform group P generated by the waveform generating unit 15 according to the film forming processing state and the nozzle position (nozzle number) to select the piezo element. It is supplied to the PZ. Specifically, FIG.
As shown in (b), four waveforms are controlled by 2-bit data, and waveforms 0, “0” are set by the selector value “00”.
The waveform 1 is selected by 1 ”, the waveform 2 is selected by“ 10 ”, and the waveform 3 is selected by“ 11 ”.

Returning to FIG. 1, the electronic balance measures, for example, the weight of one ink droplet ejected from the nozzle of the ink jet head 20, and, for example, the amount of 5000 droplets from the nozzle of the ink jet head 20. Receive ink drops. The electronic balance can almost accurately measure the weight of one ink drop by dividing the weight of the 5000 ink drops by 5000. The amount of ink droplets ejected from the inkjet head 20 can be optimally controlled based on the measured amount of ink droplets.

The cleaning unit 24 can perform cleaning of the nozzles of the ink jet head 20 periodically or at any time during the filter manufacturing process or during standby. The capping unit 22 prevents the ink in the nozzles of the inkjet head 20 from drying, so that the ink ejection surface 20P is not exposed to the outside air during standby when the filter is not manufactured.

The driving of the ink jet head 20 in the film forming apparatus 10 having the above structure will be described. As described above, the waveform generation unit 15 generates the waveform group P consisting of the preset waveforms 0 to 3 (waveform generation process), but the waveform selection unit 13 does not perform the process in which ink is ejected, such as during maintenance or standby. The vibration waveform 0 is selected (waveform selection step) and supplied to the piezo element PZ. Then, the piezo element PZ is driven (expands and contracts) with a size that does not eject ink, and the ink vibrates slightly in the inkjet head 20. This allows
The ink is agitated, and it is possible to suppress thickening and deterioration of physical properties of the ink even when it is not ejected.

On the other hand, when ejecting ink, the waveform selecting section 13 selects one of the waveforms 1 to 3 according to the nozzle number (waveform selecting step) and supplies it to the piezo element PZ. Specifically, as shown in FIG. 4, a plurality of nozzles 11 arranged in a line.
Are groups of nozzle numbers # 1, # 4, # 7 ... Which select waveform 1, nozzle numbers # 2, # 5, # which select waveform 2
Nozzle number # for selecting group 8 and waveform 3 #
Are divided into groups of 3, # 6, # 9. It should be noted that this grouping is performed by adjoining nozzles (for example, # 1
And # 2 or # 2 and # 3) are set so that different waveforms are selected. As a result, ink is ejected from adjacent nozzles with a time difference, and it is possible to reduce the influence of crosstalk that occurs when ink is ejected at the same time.

Next, the film forming process will be described.
When an operator supplies the substrate 48 onto the table 46 of the first moving means 14 from the front end side of the table 46, the substrate 4
8 is suction-held and positioned with respect to the table 46. Then, the motor 44 operates to set the end surface of the substrate 48 so as to be parallel to the Y-axis direction.

Next, the ink jet head 20 moves along the X-axis direction and is positioned above the electronic balance. Then, the specified number of drops (the specified number of ink drops) is ejected. Thereby, the electronic balance measures the weight of, for example, 5000 drops of ink, and calculates the weight per ink drop. Then, it is determined whether or not the weight per ink drop is within a predetermined appropriate range, and if it is out of the appropriate range, the applied voltage to the piezo element is adjusted, and the like. Properly store the weight per hit.

When the weight of each ink drop is appropriate, the substrate 48 is appropriately moved and positioned in the Y-axis direction by the first moving means 14, and the ink jet head 20 is moved by the second moving means 16. With this, it is appropriately moved and positioned in the X-axis direction. And the inkjet head 2
0 preliminarily ejects ink from all the nozzles to the preliminary ejection area 52 (absorbent material 54), and then moves relative to the substrate 48 in the Y-axis direction (actually, the substrate 48 is moved to the inkjet head 20 In contrast, it moves in the Y direction), and ink is ejected with a predetermined width from a predetermined nozzle onto a predetermined region on the substrate 48. Inkjet head 20 and substrate 48
When the one relative movement is completed, the inkjet head 20 moves in a predetermined amount in the X-axis direction with respect to the substrate 48, and then ejects ink while the substrate 48 moves with respect to the inkjet head 20. Then, by repeating this operation a plurality of times, it is possible to eject the ink to the entire film formation region to form a film.

Next, an example of manufacturing a color filter by a film forming process will be described with reference to FIGS.

The substrate 48 shown in FIG. 5 is a transparent substrate having a suitable mechanical strength and a high light transmittance. Board 4
As 8, a transparent glass substrate, an acrylic glass, a plastic substrate, a plastic film, a surface-treated product thereof, or the like can be applied.

For example, as shown in FIG. 6, a plurality of color filter regions 105 are formed in a matrix on a rectangular substrate 48 from the viewpoint of improving productivity. These color filter regions 105 can be used as color filters suitable for a liquid crystal display device by cutting the glass 48 later.

In the color filter area 105, for example, as shown in FIG. 6, R ink, G ink and B ink are formed and arranged in a predetermined pattern. As the formation pattern, as shown in the figure, in addition to the conventionally known stripe type, there are a mosaic type, a delta type, a square type, and the like. In particular, when the nozzle pitch is made to correspond to the arrangement pitch of the pixel portions by inclining the head 20, the stripe type is effective because the number of nozzles that can be ejected at once is large.

FIG. 5 shows an example of a process of forming the color filter region 105 on the substrate 48.

In FIG. 5A, the black matrix 110 is formed on one surface of the transparent substrate 48. A resin (preferably black) having a non-light-transmitting property is formed on the substrate 48 serving as the base of the color filter to have a predetermined thickness (for example, about 2 μm) by a method such as spin coating.
Then, the black matrix 110 is provided in a matrix by a method such as a photolithography method. The minimum display element surrounded by the lattice of the black matrix 110 is a filter element, and is, for example, a window having a width of 30 μm in the X-axis direction and a length of 100 μm in the Y-axis direction.

After the black matrix 110 is formed, for example, heat is applied by a heater so that the substrate 4
Bake the resin above 8.

As shown in FIG. 5B, the ink droplet 99
Are supplied to the filter element 112. The amount of the ink droplet 99 is a sufficient amount in consideration of the volume reduction of the ink in the heating process.

In the heating step of FIG. 5C, when all the filter elements 112 on the color filter are filled with the ink droplets 99, a heating process is performed using a heater. The substrate 48 is heated to a predetermined temperature (for example, about 70 ° C.). The evaporation of the ink solvent reduces the volume of the ink. When the volume is drastically reduced, the ink discharging step and the heating step are repeated until a sufficient thickness of the ink film for the color filter is obtained. By this treatment, the solvent of the ink evaporates, and finally only the solid content of the ink remains to form a film.

In the protective film forming step of FIG. 5D, in order to completely dry the ink droplet 99, heating is performed at a predetermined temperature for a predetermined time. When the drying is completed, the protective film 120 is formed to protect the color filter substrate 48 having the ink film formed thereon and to flatten the filter surface. This protective film 1
A method such as a spin coating method, a roll coating method, or a ripping method can be adopted for forming 20.

In the transparent electrode forming step of FIG. 5E, the transparent electrode 130 is formed by using a recipe such as a sputtering method or a vacuum evaporation method.
Are formed over the entire surface of the protective film 120.

In the patterning step of FIG. 5F, the transparent electrode 130 is further patterned into pixel electrodes corresponding to the openings of the filter element 112.

A TFT (Thin F) is used to drive the liquid crystal.
This patterning is unnecessary when using an ilm Transistor or the like. In addition, during the film forming process, the ink ejection surface 20P of the inkjet head 20 is regularly or occasionally used by using the cleaning unit 24.
It is desirable to wipe.

As described above, in the present embodiment, since the piezo elements PZ are divided into three groups and driven at different timings, the maximum peak current value required during driving can be reduced to about 1/3. In addition, the drive waveforms supplied to all the piezo elements PZ are generated by the single waveform generation unit 15, so that simplification of the circuit configuration is realized without providing an individual waveform generation circuit. . As a result, the weight of the device can be reduced, the number of analog circuit components such as transistors can be reduced, and the cost can be reduced.

Further, in this embodiment, by driving the piezo element PZ with the vibration waveform 0, the ink jet head 20 is slightly vibrated even when the ink ejection operation is stopped.
Since the ink inside can be agitated, the viscosity of the ink and the deterioration of the physical properties of the ink can be suppressed. Therefore, it is possible to prevent ink ejection failure, variation in ejection weight, and the like even after the ink ejection operation is restarted, and it is possible to prevent reduction in throughput and wasteful ink consumption.

Further, in this embodiment, the drive waveforms 1 to
By setting 3 to have substantially the same waveform, it is possible to make the ink ejection amounts substantially the same between the groups, and it is possible to prevent deterioration of film forming quality due to variations in the ink ejection amount between the nozzles. Further, in the present embodiment, since a time difference is provided for ink ejection between adjacent nozzles, it is possible to reduce the influence of crosstalk that occurs when ink is ejected at the same time.

In the above embodiment, the waveform selection section is provided for each piezo element, but the present invention is not limited to this. For example, the waveform selection section may be provided for each group. Further, in the above embodiment, the description has been made assuming that three ejection waveforms are set, but if there is a time difference in ink ejection between adjacent nozzles, two ejection waveforms are set as shown in FIG. Alternatively, the configuration may be divided into two groups.

Further, in the above-mentioned embodiment, the film forming apparatus is applied to the filter manufacturing apparatus, but the invention is not limited to this. For example, a printer (plotter) for printing / filming on paper or the like may be used. Applicable.

The present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the claims. For example, in the above embodiment, first, R (red) Perform pattern formation, then G (green)
However, the pattern formation of B (blue) is performed at the end, and the pattern formation of B (blue) is not limited to this, and the pattern formation may be performed in another order as necessary. Further, the device manufacturing apparatus of the present invention is not limited to the manufacture of color filters for liquid crystal display devices, but can be applied to EL (electroluminescence) display devices, for example. The EL display device is
A thin film containing a fluorescent inorganic and organic compound is sandwiched between a cathode and an anode, and electrons and holes are injected into the thin film to recombine to generate excitons. The element emits light by utilizing the emission of light (fluorescence / phosphorescence) when the exciton is deactivated. Among the fluorescent materials used for such EL display devices, the materials exhibiting the respective red, green and blue emission colors, that is, the material for forming the light emitting layer and the material for forming the hole injecting / electron transporting layer are used as inks, and each of the present invention By patterning on an element substrate such as a TFT using the device manufacturing apparatus described in (1), a self-luminous full-color EL device can be manufactured. Such a EL device is included in the scope of the device in the present invention. In this case, for example,
Similar to the black matrix of the above color filter, a partition wall for partitioning each pixel is formed by using a resin resist, and the partition wall is formed so that the discharged droplets are easily attached to the surface of the lower layer. In order to prevent the ejected droplets from being repelled and mixed with the droplets in the adjacent compartments, a surface treatment such as plasma treatment, UV treatment, or coupling is performed on the substrate as a pre-process of ejecting the droplets. Thereafter, it is manufactured through a first film forming step of supplying a material for forming a hole injecting / electron transporting layer as droplets to form a film, and a second film forming step of similarly forming a light emitting layer. . The EL device manufactured in this way can be applied to segment information, still image display with full-surface simultaneous emission, application in the field of low information such as pictures, characters, labels, or dots / lines / lines.
It can also be used as a light source having a surface shape. Furthermore, by using a passive drive display element and an active element such as a TFT for driving, it is possible to obtain a full-color display device having high brightness and excellent responsiveness. Further, when a metal material or an insulating material is provided to the film forming apparatus of the present invention, direct fine patterning of metal wiring, an insulating film or the like becomes possible, and it can be applied to the production of a novel high-performance device. It should be noted that, in the above embodiment, for convenience, "inkjet device" and "inkjet head" are used.
However, the ejected substance ejected from the inkjet head is not limited to so-called ink, and may be ejected as a droplet from the head. It goes without saying that various materials such as the above-mentioned EL device material, metal material, insulating material, or semiconductor material are included.

Further, the film forming apparatus of the present invention is not limited to the use for forming a specific pattern on an object, but also for the purpose of covering the entire object, such as forming a resist film in a semiconductor device manufacturing process. It is possible. In addition, the inkjet head 20 of the illustrated film forming apparatus is R (red).
G (green). Although one type of ink of B (blue) can be ejected, it is of course possible to eject two or three types of ink among them. In addition, the first moving means 14 and the second moving means 14 of the film forming apparatus 10
Although the moving means 16 uses a linear motor, it is not limited to this and other types of motors and actuators can be used. In the embodiment, the vibration waveform 0 is applied to the non-ejection nozzle. However, this is not always necessary, and when the functional liquid causes a change in physical properties due to vibration, the voltage is not applied during non-ejection. A drive voltage that does not fluctuate may be applied.

[0072]

As described above, according to the present invention, the maximum peak current value required at the time of driving can be reduced, the circuit configuration can be simplified, and the weight and cost of the device can be reduced. The effect is obtained. Further, according to the present invention, it is possible to obtain the effect of preventing the deterioration of the throughput and the unnecessary consumption, the deterioration of the film forming quality, and the effect of the crosstalk. Furthermore, the amount of heat generation is suppressed, and the temperature characteristics of the head are improved, so that the effect of increasing ejection stability is also obtained.

[Brief description of drawings]

FIG. 1 is a schematic external perspective view of a film forming apparatus that constitutes a filter manufacturing apparatus of the present invention.

FIG. 2 is a diagram showing a control system relating to ink ejection of an inkjet head.

FIG. 3A is a diagram of a waveform group generated by a waveform generation unit, and FIG. 3B is a diagram showing a relationship between a selector value and a waveform.

FIG. 4 is a chart showing the relationship between nozzle numbers and waveforms.

5A to 5F are diagrams showing an example of a procedure for manufacturing a color filter using a substrate.

FIG. 6 is a diagram showing a substrate and a part of a color filter region on the substrate.

FIG. 7 is a chart showing the relationship between nozzle numbers and waveforms in another form.

[Explanation of symbols]

P waveform group PZ piezo element (piezoelectric element) 0 drive waveform (waveform for vibration) 1-3 drive waveform (waveform for ejection) 10 Film forming device (inkjet device) 11 nozzles 13 Waveform selection section 15 Waveform generator 48 substrates

Claims (11)

[Claims] 1. A film forming apparatus in which a piezoelectric element is arranged corresponding to a plurality of nozzles, and a functional liquid is ejected from the nozzle according to a drive waveform supplied to the piezoelectric element, the setting being performed with a time difference. A waveform generation unit that generates a waveform group including the plurality of generated drive waveforms, and a waveform selection unit that selects the predetermined drive waveform from the generated waveform group and supplies the selected drive waveform to the piezoelectric element. Film forming equipment. 2. The film forming apparatus according to claim 1, wherein the waveform group vibrates without ejecting the functional liquid from the nozzle, and the functional liquid ejects from the nozzle. A film forming apparatus including a vibration waveform. 3. The film forming apparatus according to claim 2, wherein the waveform group includes a plurality of substantially identical ejection waveforms. 4. The film forming apparatus according to claim 1, wherein the waveform selecting unit changes the drive waveform selected for the adjacent nozzles. . 5. A device manufacturing apparatus having a device for supplying a functional liquid ejected from a plurality of nozzles to a substrate and performing a film-forming process on the substrate, wherein the film-forming device is a device according to claim 1. 4. A device manufacturing apparatus, characterized in that the film forming apparatus described in any one of 4) is used. 6. A device manufactured by the device manufacturing apparatus according to claim 5. 7. A film forming method in which a piezoelectric element is arranged corresponding to a plurality of nozzles, and a functional liquid is ejected from the nozzle according to a drive waveform supplied to the piezoelectric element, the method being set with a time difference. A waveform generation step of generating a waveform group including the plurality of generated drive waveforms, and a waveform selection step of selecting the predetermined drive waveform from the generated waveform group and supplying the selected drive waveform to the piezoelectric element. And a film forming method. 8. The film forming method according to claim 7, wherein the waveform group vibrates without ejecting the functional liquid from the nozzle, and the functional liquid is ejected from the nozzle. A film forming method comprising a vibration waveform. 9. The film forming method according to claim 8, wherein the waveform group includes a plurality of substantially identical ejection waveforms. 10. The film forming method according to claim 7, wherein the selected drive waveform is different for the adjacent nozzles. 11. A device manufacturing method including a film forming process for supplying a functional liquid ejected from a plurality of nozzles to a substrate and performing a film forming process on the substrate, wherein: 2. A device manufacturing method, wherein the film forming process is performed using the film forming method described in 1 above.