JP4013596B2 - Film forming apparatus, film forming method, device manufacturing apparatus, device manufacturing method, and device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a film forming apparatus, a film forming method, a device manufacturing apparatus, a device manufacturing method, and a device.
[0002]
[Prior art]
With the development of electronic devices such as computers and portable information device terminals, the use of liquid crystal display devices, particularly color liquid crystal display devices, is increasing. This type of liquid crystal display device uses a color filter to colorize a display image. Some color filters have a substrate and are formed by supplying R (red), G (green), and B (red) ink in a predetermined pattern to the substrate. As a method for supplying ink to such a substrate, for example, an ink jet type film forming apparatus is employed.
[0003]
When the ink jet method is adopted, the film forming apparatus discharges and supplies a predetermined amount of ink from the ink jet head to the substrate. In this case, for example, the substrate is mounted on a Y stage (a stage movable in the Y direction). The inkjet head is mounted on an X stage (a stage movable in the X direction). After the ink jet head is positioned at a predetermined position by driving the X stage, the ink from the ink jet head is discharged to a predetermined position on the substrate by discharging the ink while moving the substrate relative to the ink jet head by driving the Y stage. Can be supplied.
[0004]
In the above-described inkjet head, as a means for ejecting ink, a plurality of nozzle openings are formed on the wall surface constituting the ink tank, and piezoelectric elements are arranged so that the expansion and contraction directions coincide with each nozzle opening. Is often used. As this type of piezoelectric element, as disclosed in, for example, Japanese Patent Application Laid-Open No. 63-295269, an element in which electrodes and piezoelectric materials are alternately stacked is provided.
[0005]
[Problems to be solved by the invention]
However, the following problems exist in the conventional technology as described above. When a plurality of piezoelectric elements are driven at the same time, a large peak current is required and the amount of heat generated is large. In particular, a large peak current at the time of expansion / contraction of the piezoelectric element causes a significant voltage drop due to wiring resistance or the like, so that a so-called crosstalk occurs in which drive signals differ depending on the number of selected piezoelectric elements. This crosstalk affects the flight characteristics of the ink droplets and degrades the film forming quality.
[0006]
As countermeasures against such problems, for example, Japanese Patent Laid-Open Nos. 5-84902 and 2000-238261 are provided. The technique disclosed in Japanese Patent Laid-Open No. 5-84902 reduces the maximum peak current value required for driving all piezoelectric elements by dividing the piezoelectric element into a plurality of blocks and time-division driving. In addition, the technique disclosed in Japanese Patent Laid-Open No. 2000-238261 includes a plurality of drive voltage generation circuits for piezoelectric elements, and the output of each drive voltage generation circuit is connected to the piezoelectric elements via analog switches, respectively. The drive voltage generation circuit of an ink jet head having many nozzles can be divided into a plurality of parts.
[0007]
However, in these techniques, in addition to the problem that the control is complicated and the mechanical design load is increased, there is a problem that the number of circuit parts is increased and the cost is increased.
[0008]
The present invention has been made in view of the above points, and provides a film forming apparatus and a film forming method, a device manufacturing apparatus, a device manufacturing method, and a device capable of reducing a peak current value with a simple circuit configuration. For the purpose.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, the present invention employs the following configuration.
The film forming apparatus of the present invention is a film forming apparatus in which piezoelectric elements are arranged corresponding to a plurality of nozzles, and a functional liquid is discharged from the nozzles according to a driving waveform supplied to the piezoelectric elements. A waveform generation unit that generates a waveform group including a plurality of set drive waveforms, and a waveform selection unit that selects a predetermined drive waveform from the generated waveform group according to the film forming process state and supplies the selected drive waveform to the piezoelectric element; It is characterized by having.
[0010]
Therefore, in the present invention, by selecting a drive waveform so that the piezoelectric elements are driven with a time difference, the drive current at the time of driving the piezoelectric elements can be dispersed and the peak current value can be reduced. At this time, since the drive waveform is generated from one waveform generation unit, it is not necessary to provide a waveform generation circuit or element for each piezoelectric element, and the circuit configuration can be simplified. In addition, the functional liquid in the present specification includes inks with relatively low viscosity for printing (film formation), and high-viscosity liquids such as lubricating oils and resins.
[0011]
The waveform group preferably includes a discharge waveform in which the functional liquid is discharged from the nozzle and a vibration waveform that vibrates the meniscus without discharging the functional liquid from the nozzle.
[0012]
Accordingly, in the present invention, the functional liquid can be ejected from the nozzle corresponding to the piezoelectric element for which the waveform for ejection is selected from the waveform group, and the function of the nozzle corresponding to the piezoelectric element for which the waveform for vibration is selected. The viscous liquid can be prevented from thickening and deterioration of physical properties by being forcibly stirred.
[0013]
The waveform group preferably includes a plurality of substantially the same ejection waveforms.
[0014]
Accordingly, in the present invention, when the piezoelectric element is driven with the waveform for ejection, it is possible to eject substantially the same amount of functional liquid from each nozzle even if the ejection timing is shifted.
[0015]
In addition, a configuration in which the drive waveform to be selected is different for the nozzles adjacent to each other by the waveform selection unit can be employed.
[0016]
Thereby, in this invention, the influence of the crosstalk which arises when a functional liquid is discharged from an adjacent nozzle simultaneously can be reduced.
[0017]
The device manufacturing apparatus of the present invention is a device manufacturing apparatus having a film forming apparatus that supplies a functional liquid ejected from a plurality of nozzles to a substrate and performs film forming on the substrate. A film forming apparatus is used.
[0018]
Thereby, in this invention, since a peak electric current value can be reduced with the circuit structure simplified in the film forming apparatus, the cost increase which concerns on device manufacture, and deterioration of film forming quality can be prevented.
[0019]
A device of the present invention is manufactured by the above-described device manufacturing apparatus.
[0020]
Thereby, in the present invention, it is possible to prevent an increase in cost and film formation quality related to device manufacture.
[0021]
On the other hand, the film forming method of the present invention is a film forming method in which piezoelectric elements are arranged corresponding to a plurality of nozzles, and functional liquid is discharged from the nozzles according to a driving waveform supplied to the piezoelectric elements, A waveform generation process for generating a waveform group composed of a plurality of drive waveforms set with a time difference, and a waveform selection for supplying a piezoelectric element by selecting a predetermined drive waveform from the generated waveform group according to the film forming process state And a process.
[0022]
Accordingly, in the present invention, the drive current at the time of driving the piezoelectric element can be dispersed by selecting the drive waveform so that the piezoelectric element is driven with a time difference, and the peak current value can be reduced. At this time, since the drive waveform is generated from one waveform generation unit, it is not necessary to provide a waveform generation circuit or element for each piezoelectric element, and the circuit configuration can be simplified.
[0023]
The waveform group preferably includes a discharge waveform in which the functional liquid is discharged from the nozzle and a vibration waveform that vibrates the meniscus without discharging the functional liquid from the nozzle.
[0024]
Accordingly, in the present invention, the functional liquid can be ejected from the nozzle corresponding to the piezoelectric element for which the waveform for ejection is selected from the waveform group, and the function of the nozzle corresponding to the piezoelectric element for which the waveform for vibration is selected. When the liquid is forcibly stirred without being discharged, thickening and deterioration of physical properties can be prevented.
[0025]
The waveform group preferably includes a plurality of substantially the same ejection waveforms.
[0026]
Accordingly, in the present invention, when the piezoelectric element is driven with the waveform for ejection, it is possible to eject substantially the same amount of functional liquid from each nozzle even if the ejection timing is shifted.
[0027]
In addition, a configuration in which the drive waveform to be selected is different for the nozzles adjacent to each other by the waveform selection unit can be employed.
[0028]
Thereby, in this invention, the influence of the crosstalk which arises when a functional liquid is discharged from an adjacent nozzle simultaneously can be reduced.
[0029]
The device manufacturing method of the present invention is a device manufacturing method including a film forming process for supplying a functional liquid ejected from a plurality of nozzles to a substrate and performing a film forming process on the substrate. The film forming process is performed using
[0030]
Thereby, in this invention, since a peak electric current value can be reduced with the circuit structure simplified in the film forming process, the cost increase which concerns on device manufacture, and deterioration of film forming quality can be prevented.
[0031]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a film forming apparatus and a film forming method, a device manufacturing apparatus, a device manufacturing method, and a device according to the present invention will be described below with reference to FIGS. Here, the film forming apparatus of the present invention is described as being applied to a filter manufacturing apparatus for manufacturing a color filter or the like used for a liquid crystal display device using, for example, ink as a functional liquid.
[0032]
FIG. 1 is a schematic external perspective view of a film forming apparatus (inkjet apparatus) 10 constituting a filter manufacturing apparatus (device manufacturing apparatus). This filter manufacturing apparatus includes three film forming apparatuses 10 having substantially the same structure, and each film forming apparatus 10 has an ink of each color of R (red), G (green), and B (blue). Is discharged onto the filter substrate.
[0033]
The film forming apparatus 10 includes a base 12, a first moving unit 14, a second moving unit 16, an electronic balance (weight measuring unit) (not shown), an inkjet head 20 as a discharge unit, a capping unit 22, a cleaning unit 24, and the like. ing. On the base 12, a first moving means 14, an electronic balance, a capping unit 22, a cleaning unit 24, and a second moving means 16 are installed.
[0034]
The first moving means 14 is preferably installed directly on the base 12, and the first moving means 14 is positioned along the Y-axis direction. On the other hand, the second moving means 16 is attached upright with respect to the base 12 using the support posts 16A and 16A, and the second moving means 16 is attached at the rear portion 12A of the base 12. The X-axis direction of the second moving means 16 is a direction orthogonal to the Y-axis direction of the first moving means 14. The Y axis is an axis along the front 12B and rear 12A directions of the base 12. On the other hand, the X axis is an axis along the left-right direction of the base 12 and is horizontal.
[0035]
The 1st moving means 14 has the guide rails 40 and 40, and the 1st moving means 14 can employ | adopt a linear motor, for example. The slider 42 of the first moving means 14 of this linear motor type can be positioned by moving in the Y-axis direction along the guide rail 40.
[0036]
The slider 42 includes a motor 44 for the θ axis. The motor 44 is, for example, a direct drive motor, and the rotor of the motor 44 is fixed to the table 46. Accordingly, when the motor 44 is energized, the rotor and the table 46 can rotate along the θ direction to index the table 46 (rotation index).
[0037]
The table 46 positions and holds the substrate 48. Further, the table 46 has suction holding means 50, and the suction holding means 50 is operated, whereby the substrate 48 can be sucked and held on the table 46 through the hole 46 </ b> A of the table 46. The table 46 is provided with a preliminary ejection area 52 for the ink jet head 20 to discard ink or perform trial ejection (preliminary ejection).
[0038]
The second moving means 16 has a column 16B fixed to the columns 16A, 16A, and this column 16B has a linear motor type second moving means 16. The slider 60 can be positioned by moving in the X-axis direction along the guide rail 62A, and the slider 60 includes the inkjet head 20 as ink ejection means.
[0039]
The ink jet head 20 has motors 62, 64, 66, and 68 as swing positioning means. If the motor 62 is operated, the inkjet head 20 can be positioned by moving up and down along the Z-axis. The Z axis is a direction (vertical direction) orthogonal to the X axis and the Y axis. When the motor 64 is operated, the inkjet head 20 can be positioned by swinging along the β direction around the Y axis. When the motor 66 is operated, the inkjet head 20 can be positioned by swinging in the γ direction around the X axis. When the motor 68 is operated, the inkjet head 20 can be positioned by swinging in the α direction around the Z axis.
[0040]
1 can be positioned by linearly moving in the Z-axis direction in the slider 60, and can be positioned by swinging along α, β, and γ. The discharge surface 20P can accurately control the position or posture with respect to the substrate 48 on the table 46 side. Note that a plurality of (here, 120, for example) nozzles (ejection ports) each ejecting ink are provided on the ink ejection surface 20P of the inkjet head 20.
[0041]
The ink jet head 20 is a head using a piezoelectric element as a piezoelectric element, and this piezoelectric element is provided for each of a plurality of nozzles. A drive signal is applied to each piezo element, and the ink chamber is enlarged or reduced for each nozzle so that ink ejection from the nozzle can be controlled.
[0042]
FIG. 2 shows a control system related to ink ejection of the inkjet head 20.
In the inkjet head 20, piezoelectric elements PZ (indicated by PZ1, PZ2,...) Are provided corresponding to the respective nozzles 11 (nozzle numbers are indicated by # 1, # 2,...). Each piezoelectric element PZ is connected to a waveform selection unit 13, and these waveform selection units 13 are connected to a waveform generation unit 15.
[0043]
The waveform generator 15 generates a drive waveform (hereinafter simply referred to as a waveform) of a voltage applied to drive the piezo element PZ. In this embodiment, as shown in FIG. A waveform group P composed of a plurality (four in this case) of waveforms 0 to 3 set (defined) with a time difference is generated. Here, the waveform 0 is set to a size at which ink is not ejected from the nozzle 11. That is, the waveform 0 is a vibration waveform set to a magnitude that causes a slight vibration so that the meniscus repeats separation and approach with respect to the nozzle surface when a drive voltage is applied to the piezo element PZ. Waveforms 1 to 3 are ejection waveforms set to a size that causes the ink chamber to be reduced and pressurized to eject a predetermined amount of ink when a drive voltage is applied to the piezo element PZ. Waveforms 1 to 3 are substantially the same ejection waveforms, and the nozzles 11 corresponding to the piezo elements PZ to which the waveforms are applied are configured to eject substantially the same amount of ink.
[0044]
The waveform selection unit 13 selects a waveform according to the film forming process state and the nozzle position (nozzle number) from the waveform group P generated by the waveform generation unit 15 and supplies the selected waveform to the piezo element PZ. To do. Specifically, as shown in FIG. 3B, the four waveforms are controlled by 2-bit data, the waveform is 0 with the selector value “00”, the waveform 1 is “01”, and the waveform is “10”. Waveform 3 is selected by waveform 2 and “11”.
[0045]
Returning to FIG. 1, in order to measure and manage the weight of one ink droplet ejected from the nozzle of the inkjet head 20, the electronic balance, for example, applies 5000 ink droplets from the nozzle of the inkjet head 20. receive. The electronic balance can measure the weight of one ink drop almost accurately by dividing the weight of the 5000 ink drops by 5000. Based on the measured amount of ink droplets, the amount of ink droplets ejected from the inkjet head 20 can be optimally controlled.
[0046]
The cleaning unit 24 can perform cleaning of the nozzles of the inkjet head 20 periodically or at any time during the filter manufacturing process or during standby. The capping unit 22 prevents the ink discharge surface 20P from being exposed to the outside air during the standby time when the filter is not manufactured in order to prevent the ink in the nozzles of the inkjet head 20 from drying.
[0047]
The driving of the inkjet head 20 in the film forming apparatus 10 having the above configuration will be described.
As described above, the waveform generation unit 15 generates the waveform group P including the preset waveforms 0 to 3 (waveform generation step), but the waveform selection unit 13 does not discharge ink during maintenance or standby, for example. The vibration waveform 0 is selected (waveform selection step) and supplied to the piezo element PZ. The piezo element PZ is driven (expanded / contracted) in such a size that the ink does not discharge, and the ink vibrates slightly in the inkjet head 20. As a result, the ink is agitated, and ink thickening and physical property deterioration are suppressed even during non-ejection.
[0048]
On the other hand, when ejecting ink, the waveform selection unit 13 selects one of the waveforms 1 to 3 in accordance with the nozzle number (waveform selection step) and supplies it to the piezo element PZ. Specifically, as shown in FIG. 4, the plurality of nozzles 11 arranged in a line are composed of nozzle numbers # 1, # 4, # 7... For selecting waveform 1, nozzle number # 2 for selecting waveform 2, The nozzles are divided into groups of # 5, # 8... And nozzle numbers # 3, # 6, # 9... For selecting the waveform 3, and each group ejects substantially the same amount of ink almost simultaneously. This grouping is set so that different waveforms are selected for adjacent nozzles (for example, # 1 and # 2 and # 2 and # 3). As a result, ink is ejected from adjacent nozzles with a time difference, and the influence of crosstalk that occurs when ink is ejected at the same time can be reduced.
[0049]
Next, the film forming process will be described.
When an operator supplies the substrate 48 onto the table 46 of the first moving means 14 from the front end side of the table 46, the substrate 48 is attracted and held with respect to the table 46 and positioned. Then, the motor 44 is operated to set the end surface of the substrate 48 in parallel with the Y-axis direction.
[0050]
Next, the inkjet head 20 moves along the X-axis direction and is positioned on the top of the electronic balance. Then, the specified number of droplets (specified number of ink droplets) is ejected. Accordingly, the electronic balance measures the weight of, for example, 5000 drops of ink and calculates the weight per drop of ink. Then, it is determined whether or not the weight of each ink drop is within a predetermined appropriate range. If the weight is outside the appropriate range, the applied voltage to the piezo element is adjusted, and one ink drop Fit the weight per hit properly.
[0051]
When the weight per ink droplet is appropriate, the substrate 48 is appropriately moved and positioned in the Y-axis direction by the first moving means 14 and the inkjet head 20 is moved by the second moving means 16 to the X-axis. It is positioned by moving appropriately in the direction. The ink jet head 20 preliminarily ejects ink from all the nozzles to the preliminary ejection area 52 (absorbing material 54), and then moves relative to the substrate 48 in the Y-axis direction (actually, the substrate 48 is The ink is ejected with a predetermined width from a predetermined nozzle to a predetermined region on the substrate 48. When the relative movement of the inkjet head 20 and the substrate 48 is completed once, the inkjet head 20 is moved by a predetermined amount in the X-axis direction with respect to the substrate 48, and then the substrate 48 is moved with respect to the inkjet head 20. Eject ink. Then, by repeating this operation a plurality of times, it is possible to form a film by ejecting ink over the entire film forming region.
[0052]
Next, an example of manufacturing a color filter by a film forming process will be described with reference to FIGS. 5 and 6.
[0053]
The substrate 48 in FIG. 5 is a transparent substrate and has a high light transmittance as well as an appropriate mechanical strength. As the substrate 48, for example, a transparent glass substrate, an acrylic glass, a plastic substrate, a plastic film, and a surface-treated product thereof can be applied.
[0054]
For example, as shown in FIG. 6, a plurality of color filter regions 105 are formed in a matrix on a rectangular substrate 48 from the viewpoint of increasing productivity. These color filter regions 105 can be used as color filters suitable for a liquid crystal display device by cutting the glass 48 later.
[0055]
In the color filter region 105, for example, as shown in FIG. 6, R ink, G ink, and B ink are formed and arranged in a predetermined pattern. As the formation pattern, there are a mosaic type, a delta type, a square type and the like in addition to a conventionally known stripe type as shown in the figure. Particularly, when the nozzle interval is made to correspond to the arrangement pitch of the pixel portions by tilting the head 20, the stripe type is effective because the number of nozzles that can be ejected at a time is large.
[0056]
FIG. 5 shows an example of a process for forming the color filter region 105 on the substrate 48.
[0057]
In FIG. 5A, the black matrix 110 is formed on one surface of the transparent substrate 48. A non-light-transmitting resin (preferably black) is applied to a predetermined thickness (for example, about 2 μm) by a method such as spin coating on the substrate 48 that is the basis of the color filter, and a photolithography method The black matrix 110 is provided in a matrix by a method such as that described above. The smallest display element surrounded by the grid of the black matrix 110 is a filter element, for example, a window having a width of about 30 μm in the X-axis direction and a length of about 100 μm in the Y-axis direction.
[0058]
After the black matrix 110 is formed, the resin on the substrate 48 is baked by applying heat with a heater, for example.
[0059]
As shown in FIG. 5B, the ink droplet 99 is supplied to the filter element 112. The amount of the ink droplet 99 is a sufficient amount considering the decrease in the volume of the ink in the heating process.
[0060]
In the heating process of FIG. 5C, when ink droplets 99 are filled in all the filter elements 112 on the color filter, a heating process is performed using a heater. The substrate 48 is heated to a predetermined temperature (for example, about 70 ° C.). As the ink solvent evaporates, the ink volume decreases. When the volume reduction is severe, the ink ejection process and the heating process are repeated until a sufficient ink film thickness is obtained for the color filter. By this treatment, the ink solvent evaporates and finally only the solid content of the ink remains to form a film.
[0061]
In the protective film forming step of FIG. 5D, heating is performed for a predetermined time at a predetermined temperature in order to completely dry the ink droplets 99. When the drying is completed, a protective film 120 is formed to protect the substrate 48 of the color filter on which the ink film is formed and to flatten the filter surface. For forming the protective film 120, for example, a spin coating method, a roll coating method, a ripping method, or the like can be employed.
[0062]
In the transparent electrode forming step of FIG. 5E, the transparent electrode 130 is formed over the entire surface of the protective film 120 using a prescription such as sputtering or vacuum deposition.
[0063]
In the patterning step of FIG. 5F, the transparent electrode 130 is further patterned into a pixel electrode corresponding to the opening of the filter element 112.
[0064]
It should be noted that this patterning is unnecessary when a TFT (Thin Film Transistor) or the like is used for driving the liquid crystal. In addition, during the film forming process, it is desirable to wipe the ink discharge surface 20P of the inkjet head 20 using the cleaning unit 24 periodically or as needed.
[0065]
As described above, in the present embodiment, since the piezo elements PZ are divided into three groups and driven at different timings, in addition to being able to reduce the maximum peak current value required for driving to approximately ３. By generating the drive waveform supplied to all the piezo elements PZ by one waveform generation unit 15, the circuit configuration is simplified without providing a circuit for waveform generation individually. As a result, the weight of the device can be reduced, and analog circuit components such as transistors can be reduced, thereby realizing cost reduction.
[0066]
Further, in this embodiment, by driving the piezo element PZ with the vibration waveform 0, the ink in the inkjet head 20 can be agitated by slight vibration even when the ink ejection operation is stopped. And deterioration of ink physical properties can be suppressed. For this reason, it is possible to prevent ink ejection failure and fluctuation in ejection weight even after resuming the ink ejection operation, and it is possible to prevent a decrease in throughput and wasteful ink consumption.
[0067]
Furthermore, in the present embodiment, by making the drive waveforms 1 to 3 substantially the same waveform, the ink discharge amount can be made substantially the same between the groups, and the film forming quality due to the variation in the ink discharge amount between the nozzles. Can be prevented. Further, in this embodiment, since a time difference is provided in the ink ejection between the adjacent nozzles, it is possible to reduce the influence of crosstalk that occurs when ink is ejected at the same time.
[0068]
In the above embodiment, the waveform selection unit is provided for each piezo element. However, the present invention is not limited to this. For example, the waveform selection unit may be provided for each group. In the above embodiment, three ejection waveforms are set. However, if there is a time difference in ink ejection between adjacent nozzles, two ejection waveforms are set as shown in FIG. It may be configured to be divided into two groups.
[0069]
In the above embodiment, the film forming apparatus is applied to the filter manufacturing apparatus. However, the present invention is not limited to this. For example, the film forming apparatus can be applied to a printer (plotter) that prints and forms a film on paper. is there.
[0070]
The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the claims. For example, in the above-described embodiment, the R (red) pattern is first formed. Then, the G (green) pattern is formed, and finally the B (blue) pattern is formed. However, the present invention is not limited to this, and the patterns may be formed in other orders as necessary.
Moreover, the device manufacturing apparatus of this invention is not limited to manufacture of the color filter for liquid crystal display devices, for example, For example, it can apply to an EL (electroluminescence) display device. The EL display device has a structure in which a thin film containing a fluorescent inorganic and organic compound is sandwiched between a cathode and an anode, and excitons are injected by recombining the thin film by injecting electrons and holes. It is an element that generates (exciton) and emits light by utilizing light emission (fluorescence / phosphorescence) when the exciton is deactivated. Of the fluorescent materials used in such EL display elements, materials exhibiting red, green and blue emission colors, that is, a light emitting layer forming material and a material forming a hole injection / electron transport layer are used as inks, and each of the present invention is used in the present invention. A self-luminous full color EL device can be manufactured by patterning on an element substrate such as a TFT using the device manufacturing apparatus. The range of the device in the present invention includes such an EL device.
In this case, for example, as in the black matrix of the above-described color filter, a resin partition is used to form partition walls that are partitioned for each pixel, and droplets discharged on the surface of the lower layer are easily attached. In addition, in order to prevent the droplets ejected from the partition wall from being mixed with the droplets in the adjacent section, the surface of the substrate, such as plasma, UV treatment, coupling, etc., as a pre-process for ejecting the droplets Process. Thereafter, it is manufactured through a first film forming process in which a material for forming the hole injection / electron transport layer is supplied as droplets to form a film, and a second film forming process in which a light emitting layer is similarly formed. .
The EL device manufactured in this way can be used as a segment display or still image display with simultaneous light emission, for example, a low information field such as a picture, text, label, etc., or as a light source with a dot, line, or surface shape. Can do. Further, by using an active element such as a TFT as well as a passively driven display element for driving, it is possible to obtain a full color display device with high brightness and excellent responsiveness.
Further, if a metal material or an insulating material is provided for the film forming apparatus of the present invention, direct fine patterning of a metal wiring, an insulating film or the like becomes possible, and it can be applied to manufacture of a new high-performance device.
In the above embodiment, for convenience, they are referred to as “inkjet device” and “inkjet head”, and the ejected ejected matter has been described as “ink”. However, the ejected matter ejected from the inkjet head is a so-called ink. It is not limited to this, and any material may be used as long as it is adjusted so that it can be ejected as droplets from the head. For example, various materials such as the above-mentioned EL device material, metal material, insulating material, or semiconductor material are included. Needless to say.
[0071]
In addition, the film forming apparatus according to the present invention is not limited to a use for forming a specific pattern on an object, but can be applied to an application for covering the entire object, for example, forming a resist film in a manufacturing process of a semiconductor device. .
In addition, the inkjet head 20 of the illustrated film forming apparatus has R (red). G (green). One type of ink of B (blue) can be ejected. Of course, two or three of these inks can be ejected simultaneously. Moreover, although the 1st moving means 14 and the 2nd moving means 16 of the film forming apparatus 10 use a linear motor, not only this but another kind of motor and actuator can also be used.
In the embodiment, the vibration waveform 0 is applied to the non-ejection nozzle. However, this is not always necessary, and when the functional liquid causes a change in physical properties due to the vibration, the voltage is not discharged. A drive voltage without fluctuation may be applied.
[0072]
【The invention's effect】
As described above, according to the present invention, the maximum peak current value required for driving can be reduced, and the circuit configuration can be simplified, thereby contributing to the weight reduction and cost reduction of the device. . Further, according to the present invention, it is possible to prevent the decrease in throughput and wasteful consumption, as well as the effects of preventing the deterioration of film forming quality and reducing the influence of crosstalk. Furthermore, the amount of heat generation is suppressed, and the temperature characteristics of the head are improved, so that the effect of increasing the ejection stability can be obtained.
[Brief description of the drawings]
FIG. 1 is a schematic external perspective view of a film forming apparatus constituting a filter manufacturing apparatus of the present invention.
FIG. 2 is a diagram illustrating a control system related to ink ejection of an inkjet head.
FIG. 3A is a diagram of a waveform group generated by a waveform generation unit, and FIG. 3B is a diagram showing a relationship between a selector value and a waveform.
FIG. 4 is a chart showing the relationship between nozzle numbers and waveforms.
FIGS. 5A to 5F are diagrams illustrating an example of a procedure for manufacturing a color filter using a substrate. FIGS.
FIG. 6 is a diagram illustrating a substrate and a part of a color filter region on the substrate.
FIG. 7 is a chart showing the relationship between nozzle numbers and waveforms in another form.
[Explanation of symbols]
P Waveform group PZ Piezo element (piezoelectric element)
0 Drive waveform (waveform for vibration)
1-3 Drive waveform (discharge waveform)
10 Film-forming device (inkjet device)
11 Nozzle 13 Waveform Selection Unit 15 Waveform Generation Unit 48 Substrate

Claims (11)

Piezoelectric elements are arranged corresponding to a plurality of nozzles, and a film forming apparatus that discharges functional liquid from the nozzles according to a driving waveform supplied to the piezoelectric elements,
A waveform generation unit for generating a waveform group including a plurality of the drive waveforms set with a time difference;
A film forming apparatus comprising: a waveform selecting unit that selects a predetermined driving waveform from the generated waveform group according to a film forming process state and supplies the selected driving waveform to the piezoelectric element. The film forming apparatus according to claim 1,
The waveform group includes a discharge waveform in which the functional liquid is discharged from the nozzle;
A film forming apparatus, comprising: a vibration waveform in which the functional liquid vibrates without being discharged from the nozzle. The film forming apparatus according to claim 2, wherein
The film forming apparatus, wherein the waveform group includes a plurality of substantially the same discharge waveforms. In the film forming apparatus according to any one of claims 1 to 3,
The film selection apparatus, wherein the waveform selection unit varies the drive waveform selected for the adjacent nozzles. A device manufacturing apparatus having an apparatus for supplying a functional liquid discharged from a plurality of nozzles to a substrate and performing a film forming process on the substrate,
A device manufacturing apparatus, wherein the film forming apparatus according to claim 1 is used as the film forming apparatus.   A device manufactured by the device manufacturing apparatus according to claim 5. Piezoelectric elements are arranged corresponding to a plurality of nozzles, and a film forming method for discharging a functional liquid from the nozzles according to a driving waveform supplied to the piezoelectric elements,
A waveform generation step of generating a waveform group consisting of a plurality of the drive waveforms set with a time difference;
And a waveform selecting step of selecting a predetermined drive waveform from the generated waveform group and supplying the selected waveform to the piezoelectric element according to a film forming process state . In the film forming method according to claim 7,
The waveform group includes a discharge waveform in which the functional liquid is discharged from the nozzle;
A film forming method comprising: a vibration waveform in which the functional liquid vibrates without being discharged from the nozzle. In the film forming method of Claim 8,
The film forming method, wherein the waveform group includes a plurality of substantially the same discharge waveforms. In the film forming method according to any one of claims 7 to 9,
The film forming method, wherein the drive waveform to be selected is different for the adjacent nozzles. A device manufacturing method including a film forming process for supplying a functional liquid discharged from a plurality of nozzles to a substrate and performing a film forming process on the substrate,
A device manufacturing method, wherein the film forming process is performed using the film forming method according to any one of claims 7 to 10.

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