JP2003248316A5 - - Google Patents

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Publication number
JP2003248316A5
JP2003248316A5 JP2002049963A JP2002049963A JP2003248316A5 JP 2003248316 A5 JP2003248316 A5 JP 2003248316A5 JP 2002049963 A JP2002049963 A JP 2002049963A JP 2002049963 A JP2002049963 A JP 2002049963A JP 2003248316 A5 JP2003248316 A5 JP 2003248316A5
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JP
Japan
Prior art keywords
hydrogen atom
fluorine atom
group
atom
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002049963A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003248316A (ja
JP3841400B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002049963A priority Critical patent/JP3841400B2/ja
Priority claimed from JP2002049963A external-priority patent/JP3841400B2/ja
Priority to US10/372,240 priority patent/US6811947B2/en
Publication of JP2003248316A publication Critical patent/JP2003248316A/ja
Publication of JP2003248316A5 publication Critical patent/JP2003248316A5/ja
Application granted granted Critical
Publication of JP3841400B2 publication Critical patent/JP3841400B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002049963A 2002-02-26 2002-02-26 ポジ型レジスト組成物 Expired - Fee Related JP3841400B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002049963A JP3841400B2 (ja) 2002-02-26 2002-02-26 ポジ型レジスト組成物
US10/372,240 US6811947B2 (en) 2002-02-26 2003-02-25 Positive resist composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002049963A JP3841400B2 (ja) 2002-02-26 2002-02-26 ポジ型レジスト組成物

Publications (3)

Publication Number Publication Date
JP2003248316A JP2003248316A (ja) 2003-09-05
JP2003248316A5 true JP2003248316A5 (enExample) 2005-04-07
JP3841400B2 JP3841400B2 (ja) 2006-11-01

Family

ID=28662342

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002049963A Expired - Fee Related JP3841400B2 (ja) 2002-02-26 2002-02-26 ポジ型レジスト組成物

Country Status (2)

Country Link
US (1) US6811947B2 (enExample)
JP (1) JP3841400B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7160666B2 (en) * 2002-03-06 2007-01-09 Fuji Photo Film Co., Ltd. Photosensitive resin composition
AU2005316833B2 (en) * 2004-12-17 2012-03-08 Bionovo, Inc. Estrogenic extracts of Morus alba and uses thereof
JP4505357B2 (ja) * 2005-03-16 2010-07-21 富士フイルム株式会社 感光性組成物、該感光性組成物に用いる化合物及び該感光性組成物を用いたパターン形成方法
WO2013119134A1 (en) * 2012-10-16 2013-08-15 Eugen Pavel Photoresist with rare-earth sensitizers
US11820735B2 (en) * 2018-04-12 2023-11-21 Sumitomo Chemical Company, Limited Salt, acid generator, resist composition and method for producing resist pattern
JP7407586B2 (ja) * 2019-12-19 2024-01-04 東京応化工業株式会社 レジスト組成物、レジストパターン形成方法及び酸拡散制御剤
US20230087992A1 (en) * 2021-07-30 2023-03-23 Taiwan Semiconductor Manufacturing Company, Ltd. Photosensitive material for photoresist and lithography

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5258257A (en) * 1991-09-23 1993-11-02 Shipley Company Inc. Radiation sensitive compositions comprising polymer having acid labile groups
JPH06202334A (ja) * 1993-01-04 1994-07-22 Japan Synthetic Rubber Co Ltd 感放射線性樹脂組成物
JPH08101508A (ja) * 1994-09-30 1996-04-16 Nippon Zeon Co Ltd レジスト組成物
TWI250379B (en) * 1998-08-07 2006-03-01 Az Electronic Materials Japan Chemical amplified radiation-sensitive composition which contains onium salt and generator
EP1131677B1 (en) 1998-09-23 2005-08-03 E.I. Dupont De Nemours And Company Photoresists, polymers and processes for microlithography
EP1087260A4 (en) * 1999-02-15 2002-01-16 Clariant Finance Bvi Ltd PHOTO SENSITIVE RESIN COMPOSITION
KR20020012206A (ko) 1999-05-04 2002-02-15 메리 이. 보울러 플루오르화 중합체, 포토레지스트 및 마이크로리소그래피방법
US6468712B1 (en) 2000-02-25 2002-10-22 Massachusetts Institute Of Technology Resist materials for 157-nm lithography
JP4838437B2 (ja) * 2000-06-16 2011-12-14 Jsr株式会社 感放射線性樹脂組成物
US6749986B2 (en) * 2000-09-08 2004-06-15 Shipley Company, L.L.C. Polymers and photoresist compositions for short wavelength imaging
US20020155376A1 (en) * 2000-09-11 2002-10-24 Kazuhiko Hashimoto Positive resist composition
JP4190167B2 (ja) * 2000-09-26 2008-12-03 富士フイルム株式会社 ポジ型レジスト組成物
KR100845394B1 (ko) 2000-10-31 2008-07-09 다이셀 가가꾸 고교 가부시끼가이샤 전자 흡인성기 함유 단량체 및 그의 제조법
JP4034538B2 (ja) 2000-10-31 2008-01-16 株式会社東芝 フォトレジスト用高分子化合物、単量体化合物、感光性樹脂組成物、これを用いたパターン形成方法、および電子部品の製造方法
US6794109B2 (en) * 2001-02-23 2004-09-21 Massachusetts Institute Of Technology Low abosorbing resists for 157 nm lithography
US6610456B2 (en) * 2001-02-26 2003-08-26 International Business Machines Corporation Fluorine-containing styrene acrylate copolymers and use thereof in lithographic photoresist compositions
JP4418606B2 (ja) * 2001-04-11 2010-02-17 パナソニック株式会社 パターン形成材料及びパターン形成方法

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