JP2003248143A - Optical module and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical module which is easily manufactured and which has a sabsfactory high intensity light resistance characteristic. <P>SOLUTION: The optical module comprises an optical fiber array 1 (1b) as an optical component having a connecting end face 16b, an optical waveguide circuit component 30 having a connecting end face 26b oppositely disposed to the end face 16b of the array 1, and another optical fiber array provided at the connecting end face side of the component 30 at the opposite side to the array 1 (1b) so that the corresponding end faces are connected by using an adhesive 50. The module further comprises an adhesive nonfilled part 8, in which the adhesive 50 is not provided in a light passing region, is provided at least one of the adhesive connecting parts. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical module used for optical communication and the like and a method for manufacturing the same. The present invention mainly relates to an optical passive module, and in particular, an arrayed waveguide diffraction grating that functions as a pumping light source multiplexer used in an optical amplifier, an optical wavelength multiplexer / demultiplexer used in wavelength division multiplexing communication, and the like. The present invention relates to an optical waveguide circuit module and the like having the circuit of.

[0002]

BACKGROUND ART Currently, in the field of optical communication, an optical waveguide circuit (PLC; Planar Light) formed by forming an optical waveguide circuit on a silicon substrate or a quartz substrate in view of cost reduction and high integration.
Practical application of the htwave Circuit parts is progressing. In addition, with the multi-functionalization of optical waveguide circuit components, the degree of integration of optical waveguide circuits to be arrayed and the size of optical waveguide circuit components are increasing.

The optical waveguide circuit component is generally connected to an optical fiber array formed by arranging optical fibers to be modularized and used. As shown in FIG. 16, for example, this optical waveguide circuit module includes an optical fiber array 1 (1b, 1b) on the input side and output side of the optical waveguide circuit component 30.
It is formed by connecting a).

The optical waveguide circuit component 30 is formed by forming a waveguide forming region having the optical waveguide circuit 10 on a substrate 11 for forming an optical waveguide. The waveguide formation region has a clad made of a silica-based material and a core made of a silica-based material having a refractive index higher than that of the clad.
0 is formed. The optical waveguide circuit 10 shown in FIG.
It has one optical input waveguide 2, and this optical input waveguide 2 is branched via the branching portion 17, and eight optical output waveguides 6 are formed.

This optical waveguide circuit 10 has one optical input section 4
A splitter that splits the light input from 1 (the input side of the optical input waveguide 2) and outputs it from eight optical output sections (the output side of the optical output waveguide 6 and not shown in FIG. 16). Type optical waveguide circuit (1 × 8 splitter). Note that FIG.
, The connection end surfaces 26b of the optical waveguide circuit component 30,
Upper plates 43 and 44 made of glass are provided on the side of 26a.

Each of the optical fiber arrays 1 (1a, 1b) has a guide substrate 23 (23a, 23b) and a pressing plate 24 (24a, 24b).

Although not shown in FIG. 16, one or more optical fiber array guide grooves are formed in each of the guide substrates 23 (23a, 23b), and each optical fiber array guide groove is formed. The optical fiber 7 is inserted and fixed in the. The optical fiber array guide groove is usually formed in a V groove (V-shaped groove), and is used as a guide substrate 23 (23a, 2).
3b) and the optical fiber 7 is fixed by the pressing plate 24 (24a, 24b), an adhesive (not shown) is usually used.

In the optical waveguide circuit module shown in FIG. 16, one optical fiber 7 is fixed to the optical fiber array 1 (1b) on the input side and connected to the optical input waveguide 2 of the optical waveguide circuit component 30. ing. The optical fiber 7 is pulled out from the optical fiber core wire 22 and inserted into the optical fiber array guide groove in a state where the coating on the connection end face side is removed. Optical fiber 7 inserted in optical fiber array guide groove
Are held by the holding plate 24 (24b).

Further, the output side optical fiber array 1 (1
In a), eight optical fibers 7 are arranged and fixed at an equal arrangement pitch. These optical fibers 7 are drawn out from the optical fiber ribbon 21, and are inserted into the optical fiber array guide grooves in a state where the coating of the connection end surface is removed, and are pressed by the pressing plate 24 (24a). There is.

These optical fibers 7 are connected to the corresponding optical output waveguides 6 of the optical waveguide circuit component 30. The optical fiber tape core wire 21 is formed by arranging the optical fibers 7 in a row at a pitch of 250 μm, which is approximately twice the diameter.

The arrangement pitch of the optical fiber arrangement guide grooves formed on the guide substrate 23 of the optical fiber array 1 is
Generally, it is formed to 250 μm, which is equal to the arrangement pitch of the optical fibers 7 in the optical fiber ribbon 21. In some cases, the arrangement pitch of the optical fiber arrangement guide grooves is 127 μm, which is almost equal to the diameter of the optical fiber 7. In the case where the arrangement pitch of the optical fiber arrangement guide grooves is set to an arrangement pitch substantially equal to the diameter of the optical fibers 7, the optical fibers 7 can be arranged with almost no space.

In the optical waveguide circuit module as shown in FIG. 16, the connection end faces 16a and 16b of the optical fiber array 1 (1a, 1b) and the connection end faces 26a and 26b of the optical waveguide circuit component 30 are polished respectively. After that, the optical fiber array 1 (1b) and the input side end surface of the optical waveguide circuit component 30 are arranged to face each other, and the optical fiber array 1 (1a) and the output side end surface of the optical waveguide circuit component 30 are arranged to face each other.

The optical fiber array 1 (1a, 1
The optical fibers 7 arranged in b) and the connection end faces of the optical waveguides (in the case of FIG. 16, the optical input waveguide 2 and the optical output waveguide 6) arranged in the optical waveguide circuit component 30 are arranged to face each other. ing. Further, the optical fiber array 1 (1a, 1b) is connected at a position (alignment position) where the axial deviation (positional deviation) between the corresponding connection end surface of the optical fiber 7 and the connection end surface 16a, 16b of the optical waveguide is minimized. The end face and the connection end faces 26a and 26b of the optical waveguide circuit component 30 are bonded and fixed by an ultraviolet (UV) curing adhesive or the like.

In FIG. 16, the connection end faces 16a and 16b of the optical fiber array 1 (1a, 1b) and the connection end faces 26a and 26b of the optical waveguide circuit component 30 are the optical fibers 7.
And a surface orthogonal to the optical axis of the optical waveguide, these connecting end surfaces 16a, 16b, 26a, 26b are generally shown.
Is formed diagonally. In this way, the connection end face 16
When the a, 16b, 26a, and 26b are formed obliquely, it is possible to prevent the adverse effect of the reflected light reflected by the connection end faces 16a, 16b, 26a, and 26b.

Also, in order to stabilize the adhesive strength, the connecting end surfaces 16a and 16b of the optical fiber array 1 (1a, 1b) are usually arranged so that the thickness of the adhesive layer has a constant value of, for example, about 5 μm. The connection end face of the optical waveguide circuit component 30 and 26a and 26b are positioned and bonded.

Various examples of the configuration of the optical waveguide circuit component 30 are known. In addition to the splitter, for example, FIG.
7 is an arrayed waveguide diffraction grating (AWG; Arr).
Ayed Waveguide Grating) is widely known.

This arrayed waveguide diffraction grating plays the role of a wavelength multiplexer / demultiplexer in wavelength division multiplexing transmission. The wavelength division multiplex transmission is, for example, a method in which a plurality of lights having different wavelengths are multiplexed and transmitted by one optical fiber, and the transmission amount can be dramatically improved.

Optical Waveguide Circuit 10 of Arrayed Waveguide Grating
Is connected to the output side of at least one optical input waveguide 2 by the first
Slab waveguide 3 is connected to the output side of the first slab waveguide 3, and an array waveguide 4 composed of a plurality of channel waveguides 4 a arranged in parallel is connected to the output side of the first slab waveguide 3. Two slab waveguides 5 are connected, and a plurality of optical output waveguides 6 arranged in parallel are formed on the output side of the second slab waveguide 5.

The arrayed waveguides 4 propagate the light derived from the first slab waveguides 3, are formed to have different lengths, and the lengths of the adjacent channel waveguides 4a are different from each other by ΔL. ing.

The optical output waveguides 6 are provided so as to correspond to the numbers of signal lights having different wavelengths which are demultiplexed or combined by the arrayed waveguide diffraction grating, and the channel waveguides 4a are Usually, a large number such as 100 is provided, but in FIG. 17, the number of each of the optical output waveguide 6, the channel waveguide 4a and the optical input waveguide 2 is simplified for simplification of the drawing. It is shown in the figure.

An optical fiber (not shown) on the transmission side, for example, is connected to the optical input waveguide 2 so that wavelength-multiplexed light is introduced into one optical input waveguide 2. The light introduced into the first slab waveguide 3 through the input waveguide 2 spreads due to its diffraction effect, enters the array waveguide 4, and propagates in the array waveguide 4.

The light propagated through the arrayed waveguide 4 is
Of the arrayed waveguide 4, the adjacent channel waveguides 4 a of the arrayed waveguide 4 have different lengths from each other by a set amount. After propagating through 4, the phase of each light is shifted, the wavefront of the focused light is tilted according to this shift amount, and the tilt angle determines the position where light is focused.

Therefore, the condensing positions of lights having different wavelengths are different from each other, and by forming the optical output waveguides 6 at the positions, light having different wavelengths (demultiplexed light) is made different for each wavelength. It can be output from the optical output waveguide 6.

That is, the arrayed-waveguide type diffraction grating splits the light of one or more wavelengths from the multiplexed light having a plurality of different wavelengths inputted from the optical input waveguide 2 to each optical output waveguide. 6 has an optical demultiplexing function, and the central wavelength of the demultiplexed light is the difference in length (ΔL) between the adjacent channel waveguides 4a of the array waveguide 4 and the effective wavelength of the array waveguide 4. It is proportional to the refractive index (equivalent refractive index) n _c .

Further, FIG. 18 shows an optical waveguide circuit component 30.
Another configuration example of is shown. This optical waveguide circuit component 30
The optical waveguide circuit 10 is an optical wavelength multiplexing / demultiplexing circuit used for multiplexing the pumping light of the optical amplifier, for example, and is formed by connecting a plurality of Mach-Zehnder optical interferometer circuits 15 in multiple stages.

Each Mach-Zehnder optical interferometer circuit 1
5, the first optical waveguide 18 and the second optical waveguide 12 are arranged in parallel with each other with a space therebetween, and the first and second optical waveguides 1 and 2 are arranged.
Directional coupling portions 13 formed by adjoining 8 and 12 are arranged at intervals in the longitudinal direction of the optical waveguide.

As shown in FIG. 18, the multistage connection circuit of the Mach-Zehnder interferometer circuit 15 has, for example, wavelengths λ1, λ2, λ3 inputted from the respective optical input waveguides 2,
It is possible to combine lights of four different wavelengths such as λ4. In this case, the combined light is output from the optical output waveguide 6. Further, the circuit shown in FIG.
For example, wavelength-multiplexed light having four different wavelengths such as wavelengths λ1, λ2, λ3, and λ4 can be demultiplexed into lights of respective wavelengths.

In the circuit in which the Mach-Zehnder optical interferometer circuit 15 of this kind is connected in multiple stages, the number of connecting stages of the Mach-Zehnder optical interferometer circuit 15 is 1 as compared with the circuit shown in FIG.
By increasing the number of stages, it is possible to perform multiplexing / demultiplexing of light of 8 wavelengths, and by increasing the number of connection stages of the Mach-Zehnder interferometer circuit 15 by 2, it is possible to perform multiplexing / demultiplexing of light of 16 wavelengths.

A circuit formed by connecting the Mach-Zehnder interferometer circuits 15 in multiple stages as described above is used, for example, as a wavelength multiplexer that multiplexes the excitation light of an optical amplifier. Currently, in the optical communication field, an erbium-doped fiber amplifier (E
DFA) is widely applied, and in order to put this EDFA into an excited state, the wavelength is 1480 nm or 980 n.
It is necessary to inject light near m.

The higher the intensity of the light, the greater the amplification factor of the optical fiber. Therefore, in order to increase the amplification factor of the optical amplifier, it is necessary to increase the intensity of the pumping light. However, since the intensity of light emitted from a semiconductor laser diode (LD) used as a light source for excitation is limited, a method of increasing the power of light input to an EDFA by using a plurality of semiconductor laser diodes is adopted. Has been.

At this time, light emitted from a plurality of semiconductor laser diodes is emitted by combining lights having different polarization states (polarization combining) and further combining lights having slightly different wavelengths (wavelength combining). A method of efficiently bundling light is adopted. The circuit in which the Mach-Zehnder interferometer circuit 15 shown in FIG. 18 is connected in multiple stages is used to perform such wavelength synthesis of the excitation light.

Optical components used for the above-mentioned applications are required to have durability against light in addition to durability against environment such as temperature and humidity. That is, in a wavelength multiplexer that multiplexes and outputs the emitted light from a plurality of laser diodes, the optical power that passes through the optical output waveguide 6 of the optical waveguide circuit component 30 becomes several hundred mW, and this There is a demand for an optical module having a connection structure capable of withstanding intense light.

[0033]

However, as shown in FIG.
The corresponding optical fiber array 1 (1a, 1a) is provided on each end of the optical waveguide circuit component 30 having the circuit configuration shown in FIG.
When b) is provided and connected by an adhesive to form an optical module, there is a problem that the optical module has poor durability against light.

That is, since the output light (wavelength-multiplexed light) in the circuit configuration of FIG. 18 has a high intensity, if an adhesive is present at the connection between the output side of the optical waveguide circuit component 30 and the optical fiber array 1, the adhesive will be applied. Absorbs the high-intensity light, and the high-intensity light causes deterioration of the adhesive, or the adhesive absorbs light and the temperature rises, which causes the deterioration of the adhesive. It was

For example, when light of 500 mW is passed through an optical module in which the optical waveguide circuit component 30 having the circuit configuration of FIG. 18 and the optical fiber array 1 (1a, 1b) are connected by an adhesive, it takes about 1000 hours There was a problem that the insertion loss increased by 1 dB.

Therefore, in the above-mentioned optical module that transmits high-intensity light, a technique for connecting the optical output side of the optical waveguide circuit component 30 and the optical fiber array 1 without using an adhesive is applied. It became so.

In this type of optical module, for example, as shown in FIG. 19, an optical connector 32 having an MT connector shape is fitted to the output end side of the optical waveguide circuit component 30, and the output end side of the optical waveguide circuit component 30 is fitted. Optical fiber array connected to MT
The optical connector 33 has a connector shape. Also, FIG.
The optical module shown in FIG. 9 has a configuration in which the optical connectors 32 and 33 are connected to the guide pins 34 via the clamp springs 35.

Further, in the optical module shown in FIG. 19, the connection end face of the optical fiber 7 is configured to slightly protrude from the connection end face of the optical connector 33, whereby the optical fiber 7 of the optical waveguide circuit component 30 is formed. The optical waveguide is designed so that it can be contacted and connected.

In FIG. 20, the light of wavelengths λ1, λ2, ... λn emitted from the semiconductor laser diode 37 is input to the input side of the optical module shown in FIG. 19 and the lights of different wavelengths are combined. An example of a wavy structure is shown. Figure 2
At 0, the light having the wavelength λ1 is polarization-combined by the polarization combining module 36, before being wavelength-multiplexed, two lights having different polarization states (TE-mode light and TM-mode light).

As described above, by applying polarization combining using the polarization combining module 36, it is possible to combine lights from a larger number of laser diode light sources. Also, FIG.
In the optical module 0, the output end side of the optical waveguide circuit component 30 and the optical fiber 7 provided on the output end side of the optical waveguide circuit component 30 are connected without using an adhesive. Even if high-intensity light passes for a long time, it is possible to suppress deterioration of characteristics due to deterioration of the adhesive.

However, the optical module having the connection structure as shown in FIGS. 19 and 20 is more complicated than the optical module in which the optical waveguide circuit component 30 and the optical fiber array are connected by using an adhesive. There was a problem that it became expensive.

Further, with the development of optical communication, the transmission distance becomes longer, and studies are being made to improve the amplification factor of an optical amplifier applied to optical communication. Further, it is required that the power of pumping light to be injected into the optical amplifier is also larger. For example, a laser diode for pumping capable of transmitting high intensity light of 300 to 500 mW per laser diode has been developed,
It has been put to practical use.

Therefore, in the optical module, not only on the optical output end side of the optical waveguide circuit component 30 but also on the optical input end side,
It will be necessary to apply a connection configuration that does not use adhesive,
When a plurality of optical waveguides of the optical waveguide circuit component 30 and the multi-core optical fiber 7 are connected by using the optical connectors 32 and 33 having the MT connector shape as shown in FIGS. Is required. In that case, the optical module becomes more expensive, and the incidence of connection failure increases.

Further, the high intensity optical performance of passing light is required not only for the optical wavelength multiplexer / demultiplexer used in the optical amplifier but also for various optical wavelength multiplexers / demultiplexers. An optical module that can withstand is required.

For example, the number of wavelength multiplexes has increased due to the development and progress of wavelength multiplex communication, and in recent years, wavelength multiplex communication for multiplexing and communicating 64 to 128 wavelengths has been developed and put to practical use. In addition, the light intensity of laser diodes used as signal light (communication light) is increasing (increasing output power), and the output light per laser diode is 10 m.
Those exceeding W have been put to practical use. Furthermore, 4
A laser diode for transmitting a signal light exceeding 0 mW is also being developed.

When the laser diode as described above is used as a signal light source, if the number of wavelength multiplexes is small, the light intensity after being multiplexed does not increase so much, and therefore there is a problem even in the connection using a conventional adhesive. Although it did not occur, when the number of wavelength multiplexes increases, the light intensity after the multiplexing increases, and the adhesive deterioration due to light becomes a problem. For example, when the light intensity of the laser diode is 10 mWth and the wavelength multiplexing number is 64 waves, the combined light intensity is 300 mW even if the insertion loss of an optical wavelength multiplexer such as an arrayed waveguide diffraction grating is subtracted. Cross over.

Then, the optical module formed by connecting the optical waveguide circuit component 30 having the arrayed waveguide diffraction grating circuit and the optical fiber 7 also needs to be constructed so as to withstand high intensity light.

However, when the optical waveguide circuit component 30 having the arrayed-waveguide diffraction grating circuit and the optical fiber array 1 in which the optical fibers 7 are arranged are connected using an adhesive as in the conventional case, the adhesive is deteriorated. Occurs. Moreover, since the circuit of the arrayed waveguide diffraction grating is large, it is very difficult to apply the connection configuration shown in FIG.

In the future, since individual signal lights tend to have higher light intensity and the number of wavelengths to be combined tends to increase, the light intensity after combining will be higher intensity light. is expected. Therefore, in the future, there will be a need for an optical module having a connection structure that can withstand even higher intensity light.

Further, the high-strength optical performance of optical components is required not only for the above-mentioned optical waveguide module but also for any type of optical module in which optical components are connected to each other. In various optical modules, adhesives are used to connect optical components, and all have the same problems as described above. Therefore, there has been a demand for an optical module that is easy to manufacture and has excellent high-strength optical characteristics.

The optical modules shown in FIGS. 21 and 22 are filter type optical modules using a dielectric multilayer film filter. These optical modules include a sleeve (ferrule) 38 that holds an optical fiber (not shown), a lens (green lens) 39, and a dielectric multilayer filter 40.
And are connected using an adhesive 50. The dielectric multilayer filter 40 is formed by forming a dielectric multilayer 42 on a substrate 51.

These optical modules are disclosed in Japanese Patent Laid-Open No. 2001-
91789, Japanese Patent Laid-Open No. 11-337765, US Patent US
No. 6,084,994, etc., and a detailed description of these principles and functions is omitted.

Further, FIG. 23 shows an example of an optical module for polarization combination. These optical modules are 2
The two prisms 45a and 45b are bonded together using an adhesive 50. An optical film 48 is formed on the connection end surface of the prism 45a, and this optical film 48 forms a light reflecting surface. This polarization combiner module is disclosed in U.S. Pat.
The details are disclosed in S5740288, and detailed description will be omitted.

The prisms 45a and 45b are connected to the optical fiber 7 via a ferrule 46 and a collimator (lens) 47 as shown in FIG. Adhesive 5 is applied to the connection end surfaces of the ferrule 46 and the collimator (lens) 47, respectively.
0 is provided.

21 to 23, the thickness of the adhesive 50 is shown thick for the sake of easy understanding, but the thickness of the adhesive 50 is actually several μm to several tens of μm. It is an order. In addition, examples of the optical module similar to the above are described in US Patents US6169626 B1 and US6.
It is also shown in 0234542 and the like.

[0056]

The present invention has the following constitution as means for solving the problems. That is, the optical module of the first invention has one or more adhesive connection parts in which the connection end faces of the optical parts are arranged to face each other and the optical parts are connected to each other by using an adhesive. At least one of them has a constitution having an adhesive non-filled portion in which an adhesive is not provided in the light passage region as means for solving the problem.

In addition to the structure of the first invention, the optical module of the second invention has at least one connection end face of the optical component at the peripheral portion of the adhesive non-filled portion and at the light passage region. The structure in which the groove for suppressing the filling of the adhesive is formed is a means for solving the problem.

Further, in the optical module of the third invention, in addition to the configuration of the first or second invention, at least one connection end face of the optical component has a recess formed in the adhesive non-filling portion. The existing structure is used as a means to solve the problem.

Further, in the optical module of the fourth invention, in addition to the constitution of the first, second or third invention, at least one of the adhesive non-filled portions is filled with a refractive index matching agent. The existing structure is used as a means to solve the problem.

Further, in the optical module of the fifth invention, in addition to the structure of any one of the first to fourth inventions, an optical component connected by the adhesive connection portion is housed in a package, and the package A structure in which a refractive index matching agent is filled is provided as means for solving the problem.

Further, in the optical module of the sixth invention, in addition to the constitution of the fourth or fifth invention, the refractive index matching agent has a constitution mainly composed of silicone as means for solving the problem.

Further, in the optical module of the seventh invention, in addition to the structure of the sixth invention, the refractive index matching agent is made of silicone oil as means for solving the problem.

Furthermore, the optical module of the eighth invention is, in addition to the structure of any one of the first to seventh inventions, among the optical parts connected by the connecting portion having the adhesive non-filling portion, At least one is an optical waveguide circuit component and at least one is an optical fiber array as means for solving the problem.

Further, in the optical module of the ninth invention, in addition to the structure of the eighth invention, a groove for suppressing the filling of the light passage region with the adhesive is formed in the connection end face of the optical fiber array. The structure has been adopted as a means for solving the problem.

Furthermore, the optical module of the tenth invention is
In addition to the configuration of any one of the first to ninth inventions,
The optical component connected by the connection portion having the adhesive non-filled portion has a structure having at least one of a dielectric multilayer filter, an optical crystal, a lens and a prism, as means for solving the problem.

Further, the optical module of the eleventh invention is
In addition to the structure according to any one of the first to tenth aspects of the invention, the adhesive has a structure in which the viscosity is 10,000 cps or less as means for solving the problem.

Further, the twelfth invention of manufacturing an optical module is the method of manufacturing an optical module of any one of the first to eleventh inventions, wherein the connecting end surfaces of the optical components to be connected are brought into contact with each other. In this state, the adhesive is poured into a region of the connecting portion of the optical component excluding the non-adhesive filling portion, and the adhesive is cured to fix the optical components to each other.

[0068]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In the description of the present embodiment, the same names as those in the conventional example will be denoted by the same reference numerals, and duplicate description thereof will be omitted or simplified.

FIG. 1 shows the configuration of the essential parts of a first embodiment of the optical module according to the present invention, omitting some optical components. 1A is a plan view and FIG. 1B is a side view. The optical module of the present embodiment example is formed by connecting the optical waveguide circuit component 30 and the optical fiber array 1 (1a, 1b), like the optical module shown in FIG.
FIG. 1 shows a connecting portion between the optical fiber array 1 (1b) and the optical waveguide circuit component 30 and a peripheral region thereof.

Although the detailed configuration of the optical waveguide circuit 10 of the optical waveguide circuit component 30 is not shown in FIG. 1, in the optical module of the present embodiment, the optical waveguide circuit component 30 receives light from the optical input end. The optical waveguide circuit 10 has a linear waveguide formed linearly to the output end. The left end side of FIG. 1 is the optical output side of the optical module, and one optical output waveguide 6 formed in the optical waveguide circuit component 30 is the optical fiber array 1 (1
It is connected to the optical fiber 7 of b).

Although not shown in FIG. 1, the incident side of the optical module of this embodiment has the same structure as the emitting side.

FIG. 2 shows the optical waveguide circuit component 30 and the optical fiber array 1 (1b) in a state before they are connected. Also in FIG. 2, the circuit configuration of the optical waveguide circuit component 30 is omitted. Shows.

As shown in FIG. 1 and FIG. 2, this embodiment example has a connection end face 26 of an optical waveguide circuit component 30 as an optical component.
b and the connection end surface 16b of the optical fiber array 1 (1b) as an optical component are arranged opposite to each other and have an adhesive connection portion connected by using an adhesive 50.

As shown in FIG. 1B, the connection end face 26b of the optical waveguide circuit component 30 and the optical fiber array 1 (1b).
Each of the connection end surfaces 16b is formed as an inclined surface inclined by an angle θ (θ is about 8 degrees) with respect to a surface R orthogonal to the optical axis of the optical fiber 7. Also, the optical fiber array 1 (1a)
Similarly, the connection end face 16a and the connection end face 26a of the optical waveguide circuit component 30 opposed to the connection end face 16a are also formed as slopes.

Thus, the connection end faces 26a, 26b, 1
By forming the slopes 6a and 16b having the above angles, the influence of the reflected light at the connection portion is suppressed as much as possible.
In addition, in FIG. 2 and each drawing used in the following description, for simplification of the drawing, the connection end surfaces 26a and 26b of the optical waveguide circuit component 30 and the optical fiber array 1 (1a and 1b) are illustrated.
The connection end surfaces 16a and 16b of are shown on the surface orthogonal to the optical axis of the optical fiber 7, not on the inclined surface.

The feature of this embodiment is that at least one of the above-mentioned adhesive joints (here, the joint between the optical waveguide circuit component 30 and the optical fiber array 1a and the optical waveguide circuit component 3).
0 and the connection portion between the optical fiber array 1b) has the adhesive non-filled portion 8 in which the adhesive 50 is not provided in the light passage region.

In FIG. 3, the optical fiber array 1 (1
b, 1a) on the connection end face 16b side or the connection end face 16a side is shown. As shown in FIGS. 1 to 3, in this embodiment, at least one of the optical components (here, an optical fiber array) is used. 1a and the connection end surfaces 16a and 16b of the optical fiber array 1b), the groove 1 for suppressing the filling of the adhesive 50 into the light passage region is provided around the adhesive-unfilled portion 8.
4 are formed.

The groove 14 is formed in a rectangular shape by using, for example, a dicing saw. The groove 14 may be formed in advance in the guide substrate 23 and the pressing plate 24, or the optical fiber array 1 (1a, 1b) is assembled and the connection end face 16 is formed.
It may be formed after polishing a and 16b.

Incidentally, FIG. 3A shows the optical fiber array 1
FIG. 3B is a perspective view of the connection end surfaces 16a and 16b of (1a, 1b), and FIG. 3B shows the optical fiber array 1a or 1b.
3 is a plan view of the connection end surface 16a or 16b side of FIG. 3, and FIG. (A) of FIG.
The adhesive 50 is provided in the shaded area shown in (c). The adhesive 50 is an ultraviolet curable adhesive having a viscosity of 10,000 cps or less.

Further, the connection end face 1 of the optical fiber array 1b
The distance between 6b and the connection end face 26b of the optical waveguide circuit component 30 is about 5 μm, and the distance between the connection end face 16b of the optical fiber array 1a and the connection end face 26a of the optical waveguide circuit component 30 is also about 5 μm. ing.

In the present embodiment, the optical fiber array 1 (1b) and the optical waveguide circuit component 30 are connected as follows, whereby the optical fiber array 1 (1b) and the optical waveguide circuit component 30 are connected. The adhesive non-filled portion 8 is formed at the connection portion with the circuit component 30.

That is, in this embodiment, the connection end face 16b of the optical fiber array 1 (1b) and the optical waveguide circuit component 30 are used.
The optical fiber array 1 at the position (centering position) where the passing light becomes maximum in a state where the connecting end face 26b of the optical waveguide circuit 30 is brought closer to pass the light from the optical waveguide of the optical waveguide circuit component 30 to the optical fiber 7.
(1b) and the optical waveguide circuit component 30 are fixed.

At this time, the optical fiber array 1 (1) is brought into contact with the connecting end surface 16b of the optical fiber array 1 (1b) and the connecting end surface 26b of the optical waveguide circuit component 30 at the centering position.
b) and the adhesive-unfilled portion 8 at the connection portion of the optical waveguide circuit component 30
The adhesive 50 is poured into the area excluding. Then, the adhesive 50 is cured by, for example, ultraviolet rays to fix the optical fiber array 1 (1b) and the optical waveguide circuit component 30.

The pouring of the adhesive 50 into the connecting portion between the optical fiber array 1 (1b) and the optical waveguide circuit component 30 is performed by utilizing the capillary phenomenon, and the viscosity of the adhesive 50 is set to 1
By setting it to 0000 cps or less, this capillary phenomenon can be utilized.

The adhesive 50 that has been poured in is the groove 1 formed in the connection end face 16b of the optical fiber array 1 (1b).
It stops at the point of 4 and does not flow further into it, so 2
The adhesive 50 does not flow into the light passage region sandwiched between the two grooves 14, and the adhesive 5 is applied to a region of the connection portion between the optical fiber array 1 (1b) and the optical waveguide circuit component 30 except the non-adhesive portion 8.
0 can be poured. Optical fiber array 1 (1
Also in a), the optical waveguide component 30 was connected using the same method.

The insertion loss of the optical module thus manufactured was measured and found to be 0.9 dB. Since it is known that the insertion loss of the optical waveguide component 30 itself is about 0.3 dB, the optical fiber connection loss of this optical module is about 0.3 dB per unit.

Actually, the optical module of the present embodiment has one
W high intensity light was passed through. FIG. 4 shows the result of monitoring the change in insertion loss at this time. It was confirmed that the minute changes were due to the instability of the measurement system, and the optical characteristics including insertion loss did not deteriorate even after 500 hours or more, and were very stable.

Further, unlike the optical module of the connector connection shown in FIG. 19, the optical module of the present embodiment has a very simple structure using the adhesive 50, so that an inexpensive optical module can be realized.

5 and 6, in the present embodiment, the connection end face 1 of the optical fiber array 1 (1a, 1b) is shown.
Another example of the form of the groove 14 formed in 6a and 16b is shown, and the groove 1 for suppressing the filling of the adhesive 50 into the light passage region.
4 can be formed in the peripheral portion of the adhesive non-filling portion 8 in various forms including the form shown in FIGS. 5 and 6. Note that the adhesive 50 is provided in the hatched portions shown in FIGS. 5 and 6A and 6B.

In this embodiment, the connected optical fiber array 1 (1a, 1b) and the optical waveguide circuit component 30 are housed in a package (not shown), and the refractive index matching agent is contained in the package. May be filled, and the refractive index matching agent may be filled in the adhesive-unfilled portion 8.

The refractive index matching agent is a silicone oil containing silicone as a main component, and is made of OF- manufactured by Shin-Etsu Chemical Co., Ltd.
38E. This silicone oil has a viscosity of 100.
The refractive index is 0 cps, which is substantially equal to the refractive indexes of the optical waveguide of the optical waveguide circuit component 30 and the optical fiber 7.

As described above, by providing the refractive index matching agent in the adhesive non-filling portion 8, the optical waveguide (here, the optical input waveguide 2 and the optical output waveguide 6) of the optical waveguide circuit component 30 and the optical fiber 7 are provided. Since the refractive index is present in the light passing region, the optical connection loss between the optical waveguide of the optical waveguide circuit component 30 and the optical fiber 7 can be further reduced.

Since silicone oil is very stable chemically and thermally, it hardly deteriorates even when high intensity light is input. Further, even if the silicone oil is likely to deteriorate, the filled silicone oil is fluid and does not stay in one place, so that it hardly deteriorates. Moreover, since new silicone oil constantly flows into the adhesive non-filled portion 8, it is possible to avoid the temperature rise in the light passage region.

Therefore, in the optical module of this embodiment, for example, the circuit of the optical waveguide circuit component 30 multiplexes the excitation light of the laser diode, and even if the intensity of the combined light increases, this light passes through. By doing so, there is no concern that the connection between the optical waveguide circuit component 30 and the optical fiber array 1 (1a, 1b) will deteriorate, and an optical module with high reliability can be realized.

As shown in FIG. 6, when the groove 14 is formed so as to surround the connection end surface of the optical fiber 7, as shown in FIG. When the array 1 (1b) is communicated with the upper surface, the bottom surface, or the side surface, it is easy to fill the adhesive non-filling portion 8 with the refractive index matching agent as in the above embodiment.

Next, a second embodiment of the optical module according to the present invention will be described. In the second embodiment, the same names as those in the first embodiment will be designated by the same reference numerals, and duplicate description thereof will be omitted or simplified.

The second embodiment is similar to the first embodiment, and the optical waveguide circuit component 30 and the optical fiber array 1 (1
a, 1b) are connected using an adhesive 50, and FIG. 7 shows a connection configuration between the optical waveguide circuit component 30 of this optical module and the optical fiber array 1 (1a).
It is shown in its pre-connection state.

In the second embodiment, the optical waveguide circuit component 30 is an optical device in which the number of connection stages of the Mach-Zehnder optical interferometer circuit 15 is larger than that of the multi-stage connection circuit of the Mach-Zehnder optical interferometer circuit 15 shown in FIG. It has a wave circuit 10.

That is, although the detailed configuration of the optical waveguide circuit 10 is omitted in FIG. 7, the optical waveguide circuit component 30 applied to the second embodiment is similar to the optical input conductors of FIG. A Mach-Zehnder optical interferometer circuit 15 is connected to each of the waveguides 2 and has a circuit capable of multiplexing lights of eight different wavelengths.

In the second embodiment, the connection configuration of the optical waveguide circuit component 30 and the optical fiber array 1 (1b) is the same as that of the first embodiment.

Further, in the second embodiment, the optical fiber array 1 (1a) and the optical waveguide circuit component 30 are fixed by the adhesive 50 in a state of being brought into contact with each other at the centering position.
By adjusting the pouring amount of the adhesive 50, the adhesive 50 is provided in the shaded portion of FIG. 8, the adhesive 50 is suppressed from flowing into the light passage region, and the adhesive non-filling portion 8 is formed.

Further, as shown in FIGS. 7 and 8, in the second embodiment, a recess 27 is formed in the adhesive non-filled portion 8 on the connection end face 16a of the optical fiber array 1 (1a). The depth of the depression 27 is about 20 μm.

The shape, size, depth, etc. of the depression 27 are not particularly limited. For example, the depression 27 having a shape as shown in FIG. 9 is formed, and the adhesive 50 is applied to the shaded portion in FIG. It may be provided. Alternatively, the light passage region may be recessed while leaving a region surrounding the light passage region (a region where the optical fiber 7 is provided), and the depression 27 may be formed in various shapes.

Also in the second embodiment, the connected optical waveguide circuit component 30 and the optical fiber array 1 (1a, 1b) are placed in a package 1 (not shown) filled with silicone oil which is a refractive index matching agent. Stored and not filled with adhesive 8
Is filled with silicone oil.

The second embodiment is constructed as described above, and the second embodiment can also achieve the same effects as the first embodiment. Also in the second embodiment, the silicone oil may not be used as in the first embodiment.

Further, in the second embodiment, even when the light intensity of the laser diode used as the excitation light source exceeds 300 mW, the adhesive 50 is not deteriorated at the connection portion and stable against high intensity light. It is possible to realize a more reliable optical module.

The present invention is not limited to the above-mentioned embodiments, but can take various modes. For example, in the second embodiment, the optical fiber array 1 (1a)
Although the depression 27 is formed in the connection end face 16a of the optical fiber array 1 (1a), the groove 14 for suppressing the filling of the adhesive 50 into the light passage region is formed in the connection end face 16a of the optical fiber array 1 (1a). May be formed.

In this case, the adhesive 50 is provided in the shaded portions shown in FIGS. 10B and 11A, and the connecting end face 26a between the optical fiber array 1 (1a) and the optical waveguide circuit component 30 is provided. Even when they are connected by the adhesive 50, the same effects as those of the second embodiment can be obtained, and an optical module with high reliability can be realized.

Further, in each of the above embodiments, the grooves 14 and the depressions 27 are provided in the connection end surfaces 16a and 16b of the optical fiber array 1 (1a, 1b), but the grooves 14 and the depressions 27 are formed in the optical waveguide circuit component 30. The connection end faces 26a and 26b may be provided, or the connection end faces 16a and 16b of the optical fiber array 1 (1a and 1b) and the connection end face 26 of the optical waveguide circuit component 30.
It may be provided on both a and 26b.

The optical fiber array 1 (1a, 1b)
When the groove 14 or the depression 27 is provided on the connection end surfaces 16a, 16b of the above and the connection end surfaces 26a, 26b of the optical waveguide circuit component 30, either one of the groove 14 and the depression 27 may be provided, or both of them may be provided. .

Further, in the first embodiment, the groove 14 is used.
Was formed into a rectangular shape by a dicing saw, but the shape of the groove 14 is not particularly limited and is appropriately set. That is, the groove 14 may be any groove as long as it can suppress the adhesive 50 from flowing into the light passage region due to the capillary phenomenon, and can be formed in various shapes such as a U shape and a V shape. The depth and size of the groove 14 are not particularly limited and may be set appropriately.

Further, in each of the above embodiments, the adhesive 5
0 was an adhesive with a viscosity of about 10,000 cps or less,
The adhesive 50 does not necessarily have a viscosity of about 10,000 cps or less.

In this case, as in the first embodiment, for example, the adhesive agent 50 cannot be poured into the space between the connection end faces of the optical component by utilizing the capillary phenomenon, but the connection end faces of the optical components are bonded in advance. An adhesive may be applied to the area excluding the agent-unfilled portion 8 to bond the optical components together. This method can also be applied to the case where an adhesive having a low viscosity is used.

Furthermore, in each of the above-described embodiments, the optical fiber array 1 (1a, 1b) has the guide substrate 23 (23a,
The configuration of the optical fiber array 1 (1a, 1b) is not particularly limited and may be appropriately set. For example, the optical fiber 7 can be inserted and fixed in an optical fiber ferrule having an insertion hole for the optical fiber 7 to form an optical fiber array.

Further, in each of the above embodiments, the groove 14 and the depression 27 are provided in the connection end faces 16a and 16b of the optical fiber array 1 (1a, 1b), but as shown in FIG. 1a, 1b) and optical waveguide circuit component 30
The connecting end surface of the optical part such as is a flat surface, and the adhesive 50 may be provided around the connecting part of the optical component (here, the optical fiber array 1 (1a) and the optical waveguide circuit component 30).

In the optical module shown in FIG. 12, as the adhesive 50, an adhesive having high viscosity is applied.
Does not flow between the connection end faces of the optical fiber array 1 (1a) and the optical waveguide circuit component 30. Therefore, the configuration shown in FIG. 12 is also a configuration having the adhesive non-filling portion in the adhesive connection portion. The optical fiber array 1 (1a) and the optical waveguide circuit component 30 are connected at the centering position.

Further, in each of the above embodiments, the optical component is packaged with silicone oil (not shown).
However, the package is not always filled with a refractive index matching agent such as silicone oil.

Further, in each of the above embodiments, the adhesive non-filled portion 8 is filled with silicone oil. However, the adhesive non-filled portion 8 is made of rubber silicone RTV or silicone gel instead of silicone oil. Such a refractive index matching agent may be filled.

Further, the non-adhesive filling portion 8 may be configured not to be filled with the refractive index matching agent. In this case, for example, if the distance between the connection end faces of the optical component is large, the light emitted from the optical waveguide, the optical fiber 7 or the like may spread and the connection loss may increase. Is effective.

That is, the width and height of the optical waveguide core of the optical waveguide circuit component 30 and the core of the optical fiber 7 are set to the connection end face 16,
It should be slightly widened around 26. In this case, the spread of the light emitted from the core is reduced, the cores can be connected with each other with a small loss, and an optical module with a small loss can be realized.

Furthermore, the circuit configuration formed in the optical waveguide circuit component 30 is not particularly limited and may be set appropriately. In other words, the optical module of the present invention is, for example, as shown in FIG.
The optical module can be formed by applying various configurations such as a splitter type circuit as shown in FIG. 6 and an arrayed waveguide diffraction grating circuit as shown in FIG.

Further, the optical parts constituting the optical module of the present invention are not particularly limited and may be set appropriately. For example, the optical component can be an optical component having at least one of a dielectric multilayer filter, an optical crystal, a lens and a prism.

FIG. 14 shows an optical module having a dielectric multilayer filter 40 as in the optical module shown in FIG. 21, and the optical module shown in FIG. 14 has a sleeve 38 and a lens 39 connected to each other. The adhesive 50 is provided at the connecting portion between the portion and the lens 39 and the dielectric multilayer filter 40, and the adhesive non-filling portion 8 is provided at the light passage region, whereby the adhesive 50 is easily assembled. In addition, it is possible to realize an excellent optical module having high-strength optical performance.

Further, FIG. 15 shows an optical module having prisms 45a and 45b similar to the optical module shown in FIG. 23. The optical module shown in FIG. 15 has a connecting portion between the prisms 45a and 45b. By providing the adhesive 50 on the optical fiber and the adhesive non-filling portion 8 in the light passage region, an excellent optical module that is easily assembled using the adhesive 50 and has high-strength optical performance can be provided. realizable.

The optical module shown in FIGS. 14 and 15 has the groove 14 formed as in the first embodiment, but the formation mode of the groove 14 is not necessarily the one shown in these figures. Does not necessarily mean. For example, in FIG.
The groove 14 may be provided in the sleeve 38 or the dielectric multilayer filter 40, and the shape of the groove 14 and the like may be appropriately set.

Also in these examples, when the connected optical parts are dipped in a refractive index matching agent such as silicone oil as in the first and second embodiments, the optical parts can be connected with lower loss. .

Further, in each of the above examples, the adhesive non-filling portion 8 of two or more light passage areas is provided, but the optical module of the present invention has at least one area such as an area through which high intensity light passes.
It can be formed by providing the adhesive non-filling portion 8 in one light passage region.

[0128]

According to the optical module of the present invention, optical components to be connected can be easily assembled with each other by using an adhesive, and at least one light passage region (for example, high-intensity light) of the adhesive connection portion can be assembled. By providing the adhesive non-filled portion in the passage area), it is possible to realize an excellent optical module having a high strength optical performance.

Further, in the optical module of the present invention, at least one connection end face of the optical component is provided with a groove for suppressing the filling of the light passing region with the adhesive in the peripheral portion of the adhesive non-filling portion. According to the configuration, the groove can suppress the filling of the light-transmissive region with the adhesive, so that the non-adhesive-filled portion can be accurately formed, and the above effect can be reliably achieved with a simple configuration.

Furthermore, in the optical module of the present invention,
According to the configuration in which at least one connection end surface of the optical component has a recess formed in the adhesive non-filling portion, the formation of the recess can suppress the filling of the adhesive into the light passage region.
The adhesive non-filled portion can be accurately formed, and the above effect can be reliably achieved with a simple configuration.

Furthermore, in the optical module of the present invention,
According to the configuration in which at least one of the adhesive non-filled portions is filled with the refractive index matching agent, the connection loss between the optical components can be reduced by the effect of the refractive index matching agent.

Furthermore, in the optical module of the present invention,
According to the configuration in which the optical components connected by the connecting portion are housed in the package and the package is filled with the refractive index matching agent, for example, the adhesive non-filling portion can be easily filled with the refractive index matching agent. The connection loss between optical components can be reduced.

Furthermore, in the optical module of the present invention,
According to the composition of which the refractive index matching agent is mainly composed of silicone, the refractive index matching agent which is easy to obtain and handle is applied,
The above effect can be easily exhibited.

Furthermore, in the optical module of the present invention,
According to the configuration in which the refractive index matching agent is silicone oil,
The above effect can be easily exhibited by applying, to the refractive index matching agent, a silicone oil that is easy to obtain and handle and can be easily filled in the package.

Further, among the optical components connected by the connection portion having the adhesive non-filled portion, at least one is an optical waveguide circuit component and at least one is an optical fiber array. An optical waveguide circuit module having various functions can be formed by appropriately setting the circuit configuration formed in the circuit component, and this optical waveguide circuit module can be realized by the optical module having the above-described excellent effects.

Furthermore, in the optical module of the present invention,
According to the configuration in which the groove that suppresses the filling of the adhesive into the light passage region is formed on the connection end surface of the optical fiber array,
It is possible to more easily process the groove, and it is possible to form an optical waveguide circuit module having the above-described excellent effects.

Furthermore, in the optical module of the present invention,
According to the configuration in which the optical component connected by the connection portion having the adhesive non-filled portion has at least one of the dielectric multilayer filter, the optical crystal, the lens, and the prism, It can be realized by an optical module that exhibits excellent effects.

Furthermore, in the optical module of the present invention,
If the adhesive has a viscosity of 10,000 cps or less, the adhesive can be poured into the space between the connection end faces of the optical component by using, for example, a capillary phenomenon, and the work of applying the adhesive to the connection end face of the optical component can be performed. It is also possible to realize an optical module with even better manufacturing workability.

Further, according to the method of manufacturing an optical module of the present invention, an adhesive is poured into a region of the connecting portion of the optical component except the adhesive non-filling portion in a state where the connecting end surfaces of the optical components to be connected are in contact with each other. By curing the adhesive to fix the optical components to each other, it is possible to very easily manufacture the optical module having the above effects.

[Brief description of drawings]

FIG. 1 is a main part configuration diagram showing an example of a first embodiment of an optical module according to the present invention.

FIG. 2 is an explanatory diagram showing a disassembled state of the main configuration of the first embodiment.

FIG. 3 is an explanatory diagram of an optical fiber array applied to the first embodiment example.

FIG. 4 is a graph showing changes in insertion loss when high-intensity light is passed through the optical module of the first embodiment.

FIG. 5 is an explanatory view showing a connection end face side in another example of the optical fiber array applied to the optical module of the present invention by a front view (a) and a side view (b).

FIG. 6 is an explanatory diagram showing a connection end face configuration in still another example of the optical fiber array applied to the optical module of the present invention.

FIG. 7 is an explanatory diagram showing a main configuration of a second embodiment of an optical module according to the present invention.

FIG. 8 is a perspective explanatory view showing a configuration of an optical fiber array applied to the second embodiment example.

FIG. 9 is a perspective explanatory view showing still another example of the optical fiber array applied to the optical module of the present invention.

FIG. 10 is an explanatory view showing a connection end face side in still another example of the optical fiber array applied to the optical module of the present invention by a plan view (a) and a front view (b).

FIG. 11 is an explanatory view showing a connection end face side in still another example of the optical fiber array applied to the optical module of the present invention by a front view (a) and a side view (b).

FIG. 12 is an explanatory plan view showing a connecting portion in another embodiment of the optical module according to the present invention.

FIG. 13 is a cross-sectional explanatory view schematically showing a connecting portion in still another embodiment of the optical module according to the present invention.

FIG. 14 is an explanatory diagram showing still another embodiment of the optical module according to the present invention.

FIG. 15 is a plan view showing still another embodiment of the optical module according to the present invention.

FIG. 16 is an explanatory diagram showing an example of a conventional optical module.

FIG. 17 is an explanatory diagram showing a configuration example of an arrayed waveguide diffraction grating.

FIG. 18 is an explanatory diagram showing a configuration example of an optical waveguide circuit component having a multistage connection circuit of a Mach-Zehnder optical interferometer circuit.

FIG. 19 is an explanatory diagram showing a connection configuration using an optical waveguide circuit component and an MT connector of an optical fiber array.

20 is an explanatory diagram showing an example in which the optical module to which the configuration of FIG. 19 is applied is applied to an optical multiplexer / demultiplexer.

FIG. 21 is an explanatory diagram showing another example of a conventional optical module.

FIG. 22 is an explanatory diagram showing still another example of a conventional optical module.

FIG. 23 is an explanatory diagram showing still another example of a conventional optical module.

[Explanation of symbols]

1 1a, 1b Optical Fiber Array 2 Optical Input Waveguide 6 Optical Output Waveguide 7 Optical Fiber 8 Adhesive Non-Filled Part 14 Grooves 16, 16a, 16b, 26, 26a, 26b Connection End Face 27 Recess 30 Optical Waveguide Circuit Component 50 Adhesion Agent

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Junichi Hasegawa             2-6-1, Marunouchi, Chiyoda-ku, Tokyo             Kawa Electric Industry Co., Ltd. F-term (reference) 2H036 JA02 LA03 LA07 LA08 PA13                 2H037 AA01 BA24 BA31 DA02 DA04                       DA12

Claims (12)

[Claims] 1. An adhesive connection portion in which connecting end faces of optical components are arranged to face each other and the optical components are connected to each other with an adhesive.
An optical module having one or more adhesive-connecting portions, and at least one of the adhesive-connecting portions has an adhesive-unfilled portion in which no adhesive is provided in the light passage region. 2. A groove for suppressing the filling of the light-passing region with the adhesive is formed in the peripheral portion of the adhesive-unfilled portion on at least one connection end face of the optical component. Item 1. The optical module according to item 1. 3. The optical module according to claim 1, wherein at least one connection end face of the optical component has a recess formed in the adhesive non-filling portion. 4. The refractive index matching agent is filled in at least one of the non-adhesive filling portions.
Alternatively, the optical module according to claim 2 or claim 3. 5. The optical component connected by an adhesive connection portion is housed in a package, and a refractive index matching agent is filled in the package, according to any one of claims 1 to 4. The optical module described in one. 6. The optical module according to claim 4, wherein the refractive index matching agent contains silicone as a main component. 7. The optical module according to claim 6, wherein the refractive index matching agent is silicone oil. 8. An optical component connected at a connection portion having an adhesive non-filled portion, at least one of which is an optical waveguide circuit component, and at least one of which is an optical fiber array. The optical module according to claim 7. 9. The optical module according to claim 8, wherein the connection end face of the optical fiber array is provided with a groove for suppressing the filling of the adhesive into the light passage region. 10. The optical component connected by a connecting portion having an adhesive non-filled portion has at least one of a dielectric multilayer filter, an optical crystal, a lens, and a prism. 9. The optical module according to any one of 9. 11. The optical module according to claim 1, wherein the adhesive has a viscosity of 10,000 cps or less. 12. The method of manufacturing an optical module according to claim 1, wherein the connecting parts of the optical parts are connected in a state where the connecting end faces of the connecting optical parts are in contact with each other. Pour the adhesive into the area excluding the area not filled with the adhesive,
A method for manufacturing an optical module, characterized in that the adhesive is cured to fix the optical components to each other.