JP2005250115A - Optical waveguide module - Google Patents

Optical waveguide module Download PDF

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Publication number
JP2005250115A
JP2005250115A JP2004060596A JP2004060596A JP2005250115A JP 2005250115 A JP2005250115 A JP 2005250115A JP 2004060596 A JP2004060596 A JP 2004060596A JP 2004060596 A JP2004060596 A JP 2004060596A JP 2005250115 A JP2005250115 A JP 2005250115A
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optical
adhesive
optical fiber
optical waveguide
waveguide
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Katsumi Sawada
克巳 澤田
Shibun Ishikawa
紫文 石川
Tetsuo Nozawa
哲郎 野澤
Hideyuki Hosoya
英行 細谷
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Fujikura Ltd
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Fujikura Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical waveguide module reliable and excellent in durability against intense incident light. <P>SOLUTION: This is an optical waveguide module equipped with an optical waveguide connected to optical fibers, and it uses an adhesive 12 whose modulus of light absorption is 90% or less at the junctions of the optical waveguide and optical fibers 5, 6 (This modulus of light absorption of the adhesive is for the light within the wavelength range used in this optical waveguide when the adhesive is 1 mm thick). <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、高強度入射光に対する耐久性に優れた基板型光導波路モジュールに関する。   The present invention relates to a substrate type optical waveguide module excellent in durability against high intensity incident light.

従来より、基板型光導波路に光ファイバまたは光ファイバアレイを光結合可能に接合して作られた光導波路モジュールが知られている（例えば、非特許文献１，２参照。）。
図１は光導波路モジュールの一例として基板導波路型スプリッタモジュールの構成を示す斜視図である。この基板導波路型スプリッタモジュール１は、中央の基板型導波路２と、その長手方向一端面に接着固定された光ファイバアレイ３と、基板型導波路２の長手方向他端面に接着固定された光ファイバアレイ４とを備えて構成されている。本例示において、一方の光ファイバアレイ３には１心の光ファイバ５が接続され、他方の光ファイバアレイ４には８心の光ファイバ６が接続されている。基板型導波路２とそれぞれの光ファイバアレイ３，４とは、接着剤７で接着固定されている。従来、この接着剤７としては、紫外線硬化型や熱硬化型のエポキシ接着剤、アクリル接着剤などが用いられている。
また、基板型導波路２と光ファイバ５，６との接合は、レーザ接合が用いられる場合もある。
１９９６年電子情報通信学会エレクトロニクスソサエティ大会、Ｃ−１５９、石英系導波路型１×８光スプリッタの架空実フィールド試験 石英系プレーナ光波回路（ＰＬＣ）における実装技術、回路実装学会誌第１０巻５号、１９９５年 2. Description of the Related Art Conventionally, there has been known an optical waveguide module made by joining an optical fiber or an optical fiber array to a substrate type optical waveguide so as to be optically coupled (see, for example, Non-Patent Documents 1 and 2).
FIG. 1 is a perspective view showing a configuration of a substrate waveguide type splitter module as an example of an optical waveguide module. The substrate waveguide type splitter module 1 includes a central substrate type waveguide 2, an optical fiber array 3 bonded and fixed to one longitudinal end surface thereof, and an adhesive fixed to the other longitudinal end surface of the substrate type waveguide 2. And an optical fiber array 4. In this example, one optical fiber 5 is connected to one optical fiber array 3, and eight optical fibers 6 are connected to the other optical fiber array 4. The substrate-type waveguide 2 and the respective optical fiber arrays 3 and 4 are bonded and fixed with an adhesive 7. Conventionally, an ultraviolet curable or thermosetting epoxy adhesive, an acrylic adhesive, or the like is used as the adhesive 7.
Further, laser bonding may be used for bonding the substrate-type waveguide 2 and the optical fibers 5 and 6.
1996 IEICE Electronics Society Conference, C-159, Fictive Field Test of Silica-based Waveguide Type 1 × 8 Optical Splitter Mounting technology in quartz planar lightwave circuit (PLC), Journal of Circuit Packaging Society, Vol. 10, No. 5, 1995

近年、高増幅率の光ファイバアンプの出現などにより、光通信に用いられる光は映像伝送用などを中心に高強度化している。光通信に用いられる基板型光導波路モジュールでは、一般に光ファイバと導波路との接続に有機材料の接着剤を用いている。このため、従来の光導波路モジュールに高強度光を入射した場合、モジュール内部での発熱があると、光ファイバと導波路を固定している接着剤が劣化し、モジュールの長期信頼性を低下させる問題がある。   In recent years, with the advent of high-amplification optical fiber amplifiers, etc., the light used for optical communication has been strengthened mainly for video transmission. In a substrate type optical waveguide module used for optical communication, an organic material adhesive is generally used for connection between an optical fiber and a waveguide. For this reason, when high-intensity light is incident on a conventional optical waveguide module, if there is heat generated inside the module, the adhesive that fixes the optical fiber and the waveguide deteriorates, reducing the long-term reliability of the module. There's a problem.

本発明者らは、光導波路モジュールに高強度光を入射した場合に、接続部が高温になる原因を調査した。その結果、接続部に使用する接着剤の光吸収だけでなく、周囲の接着剤の光吸収も大きく影響していることが分かった。基板型光導波路と光ファイバの接続点では、光ファイバのコアと基板型光導波路のコアとの軸ズレや端面間ギャップにより光が漏れる。この漏れ光は、接続面の周囲を覆う接着剤に吸収され温度を上昇させる原因となる。図２は、光導波路モジュールの接続部における漏れ光発生及び温度上昇のメカニズムを説明するための図であり、図２（ａ）は基板導波路型スプリッタモジュール１の斜視図、（ｂ）は（ａ）中の接続部の拡大断面図である。図２（ｂ）に示すように、この接続部は導波路コア９とその周囲の導波路クラッド８からなる導波路側と、光ファイバコア１１とその周囲の光ファイバクラッド１０からなる光ファイバ側とが、それぞれのコア９，１１の端面を接近させた状態で接合されている。それぞれのコア９，１１の軸ズレ等により、導波路側からの光が光ファイバコア１１に入射されず、光ファイバクラッド１０を透過して外部に漏れ出す。図２（ａ）に示すように、光ファイバアレイ４の光ファイバ６外に出た漏れ光は、周囲の接着剤７に吸収され、温度上昇を起こす。   The inventors investigated the cause of the high temperature of the connection part when high-intensity light is incident on the optical waveguide module. As a result, it was found that not only the light absorption of the adhesive used for the connection portion but also the light absorption of the surrounding adhesive greatly affected. At the connection point between the substrate type optical waveguide and the optical fiber, light leaks due to an axial shift between the core of the optical fiber and the core of the substrate type optical waveguide or a gap between the end faces. This leakage light is absorbed by the adhesive covering the periphery of the connection surface and causes the temperature to rise. 2A and 2B are diagrams for explaining the mechanism of leakage light generation and temperature rise in the connection portion of the optical waveguide module. FIG. 2A is a perspective view of the substrate waveguide type splitter module 1, and FIG. It is an expanded sectional view of the connection part in a). As shown in FIG. 2 (b), the connecting portions are a waveguide side composed of the waveguide core 9 and the surrounding waveguide cladding 8, and an optical fiber side composed of the optical fiber core 11 and the surrounding optical fiber cladding 10. Are joined in a state in which the end faces of the respective cores 9 and 11 are brought close to each other. Due to axial misalignment of the cores 9 and 11, light from the waveguide side is not incident on the optical fiber core 11, but passes through the optical fiber cladding 10 and leaks outside. As shown in FIG. 2A, the leaked light that has come out of the optical fiber 6 of the optical fiber array 4 is absorbed by the surrounding adhesive 7 and causes a temperature rise.

基板型光導波路モジュールの基本的な光学特性の一つである挿入損失をできるだけ小さくするため、従来から光ファイバと基板型光導波路間の接続には、光の吸収が小さい接着剤を選定して使用している。しかし、その他の部分に用いる接着剤は光学特性に影響を及ぼさないため、光の吸収率については考慮されていなかった。   In order to minimize the insertion loss, which is one of the basic optical characteristics of substrate-type optical waveguide modules, an adhesive that absorbs less light has been selected for connection between optical fibers and substrate-type optical waveguides. I use it. However, since the adhesive used for the other portions does not affect the optical characteristics, the light absorption rate has not been considered.

本発明は前記事情に鑑みてなされ、高強度入射光に対する耐久性に優れ、信頼性の高い光導波路モジュールの提供を目的とする。   The present invention has been made in view of the above circumstances, and an object thereof is to provide an optical waveguide module that is excellent in durability against high-intensity incident light and has high reliability.

前記目的を達成するため、本発明は、光導波路とそれに接合された光ファイバとを備えた光導波路モジュールであって、光導波路と光ファイバとの接合部周辺に、光吸収率（ただし、この光吸収率は、接着剤の厚さを１ｍｍとし、その光導波路モジュールの使用波長範囲の光に対する接着剤の光吸収率である。）が９０％以下の接着剤を用いたことを特徴とする光導波路モジュールを提供する。
本発明の光導波路モジュールにおいて、光ファイバの先端に光ファイバアレイが形成され、該光ファイバアレイと光導波路とが、光吸収率が９０％以下の前記接着剤を用いて接合された構成とすることができる。
また、光ファイバアレイのＶ溝基板と光ファイバ裸線、あるいはＶ溝基板と光ファイバ裸線及び光ファイバアレイの接合に光吸収率が９０％以下の前記接着剤を用いた構成とすることができる。
また、光ファイバアレイのＶ溝基板テラス部に光吸収率が９０％以下の前記接着剤を用いた構成とすることができる。
また、光導波路と光ファイバアレイをケース内に収め、ケース内に光吸収率が９０％以下の充填剤を設けた構成とすることができる。
本発明の光導波路モジュールにおいて、固定部材上の光導波路に光ファイバがレーザ接合されてなり、その接合部近傍の光ファイバの一部が固定部材に、光吸収率が９０％以下の前記接着剤を用いて接着固定された構成としてもよい。 In order to achieve the above object, the present invention provides an optical waveguide module comprising an optical waveguide and an optical fiber bonded to the optical waveguide. The optical absorptance is defined as the adhesive having a thickness of 1 mm and the optical absorptivity of the adhesive with respect to light in the wavelength range of use of the optical waveguide module. An optical waveguide module is provided.
In the optical waveguide module of the present invention, an optical fiber array is formed at the tip of an optical fiber, and the optical fiber array and the optical waveguide are bonded using the adhesive having a light absorption rate of 90% or less. be able to.
Further, the adhesive having an optical absorptance of 90% or less may be used for joining the V-groove substrate and the bare optical fiber of the optical fiber array, or joining the V-groove substrate and the bare optical fiber and the optical fiber array. it can.
Moreover, it can be set as the structure which used the said adhesive agent whose light absorptivity is 90% or less for the V-groove board | substrate terrace part of an optical fiber array.
Further, the optical waveguide and the optical fiber array can be housed in a case, and a filler having a light absorption rate of 90% or less can be provided in the case.
In the optical waveguide module of the present invention, an optical fiber is laser-bonded to an optical waveguide on a fixing member, a part of the optical fiber in the vicinity of the bonding portion is fixed to the fixing member, and the adhesive has a light absorption rate of 90% or less. It is good also as a structure fixed by adhesion using.

本発明の光導波路モジュールは、光導波路と光ファイバとの接合部周辺に、光吸収率９０％以下の接着剤を用いた構成としたので、接合部からの漏れ光が接着剤に吸収され難く、漏れ光の吸収による接着剤の温度上昇を低く抑えることができ、高強度入射光に対する耐久性に優れ、信頼性の高い光導波路モジュールを提供することができる。   Since the optical waveguide module of the present invention uses an adhesive having a light absorption rate of 90% or less around the joint between the optical waveguide and the optical fiber, light leaked from the joint is hardly absorbed by the adhesive. In addition, an increase in the temperature of the adhesive due to absorption of leakage light can be suppressed to a low level, and an optical waveguide module having excellent durability against high-intensity incident light and high reliability can be provided.

以下、図面を参照して本発明の実施形態を説明する。
図３は本発明の光導波路モジュールの第１実施形態を示す斜視図であり、図３中、符号１は光導波路モジュールの一例である基板導波路型スプリッタモジュール、２は光導波路の一例である基板型導波路（詳しくは、８分岐スプリッタ）、３及び４は光ファイバアレイ、５及び６は光ファイバ、１２は接着剤である。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 3 is a perspective view showing a first embodiment of the optical waveguide module of the present invention. In FIG. 3, reference numeral 1 denotes a substrate waveguide type splitter module which is an example of the optical waveguide module, and 2 is an example of the optical waveguide. A substrate-type waveguide (specifically, an 8-branch splitter), 3 and 4 are optical fiber arrays, 5 and 6 are optical fibers, and 12 is an adhesive.

この基板導波路型スプリッタモジュール１は、中央の基板型導波路２と、その長手方向一端面に接着固定された光ファイバアレイ３と、基板型導波路２の長手方向他端面に接着固定された光ファイバアレイ４とを備えて構成されている。本例示において、一方の光ファイバアレイ３には１心の光ファイバ５が接続され、他方の光ファイバアレイ４には８心の光ファイバ６（光ファイバテープ心線）が接続されている。基板型導波路２とそれぞれの光ファイバアレイ３，４とは、光吸収率（ただし、この光吸収率は、接着剤の厚さを１ｍｍとし、その光導波路モジュールの使用波長範囲の光に対する接着剤の光吸収率である。）が９０％以下の接着剤１２を用いて接着固定されている。   The substrate waveguide type splitter module 1 includes a central substrate type waveguide 2, an optical fiber array 3 bonded and fixed to one longitudinal end surface thereof, and an adhesive fixed to the other longitudinal end surface of the substrate type waveguide 2. And an optical fiber array 4. In this example, one optical fiber 5 is connected to one optical fiber array 3, and eight optical fibers 6 (optical fiber tape cores) are connected to the other optical fiber array 4. The substrate-type waveguide 2 and the respective optical fiber arrays 3 and 4 have an optical absorptivity (however, this optical absorptivity has an adhesive thickness of 1 mm and adheres to light in the wavelength range of use of the optical waveguide module) The light absorptivity of the agent is adhesively fixed using an adhesive 12 having a 90% or less.

接着剤１２は、前記光吸収率が９０％以下であればよく、各種の接着剤１２の中から適宜選択して使用できる。前記接着剤１２の光吸収率が９０％を超えると、基板型導波路２と光ファイバアレイ３，４との接合部から発生した漏れ光が接着剤に吸収される割合が多くなり、この基板導波路型スプリッタモジュール１に光通信で使用されるハイパワー光（数百ｍＷ〜１Ｗ程度）を送り、接合部の過剰損失が１〜２ｄＢ程度である場合、接着剤の温度がその耐熱温度を超え、接着剤の劣化が促進される可能性があるので好ましくない。   The adhesive 12 only needs to have a light absorption rate of 90% or less, and can be appropriately selected from various adhesives 12 and used. If the optical absorptance of the adhesive 12 exceeds 90%, the ratio of the leakage light generated from the joint between the substrate-type waveguide 2 and the optical fiber arrays 3 and 4 being absorbed by the adhesive increases. When high power light (several hundred mW to 1 W) used for optical communication is sent to the waveguide splitter module 1 and the excess loss of the junction is about 1 to 2 dB, the temperature of the adhesive is set to the heat resistant temperature. This is not preferable because deterioration of the adhesive may be promoted.

基板導波路型スプリッタモジュール１は、基板型導波路２と光ファイバアレイ３，４との接合部周辺に、光吸収率９０％以下の接着剤１２を用いた構成としたので、接合部からの漏れ光が接着剤１２に吸収され難く、漏れ光の吸収による接着剤の温度上昇を低く抑えることができ、高強度入射光に対する耐久性に優れ、信頼性の高いものとなる。
なお、この光導波路モジュールは、プラスチックケースや金属チューブなどの適当なケース内に収め、ケース内に充填剤を設けた構成とすることもできる。この充填剤は光吸収率が９０％以下の前記接着剤１２と同じものでも良いし、例えば光吸収率が９０％以下のグリスなど別種のものでもよい。この充填剤の機能としては、防湿、防水、振動・衝撃吸収などである。 Since the substrate waveguide type splitter module 1 has a configuration in which the adhesive 12 having a light absorption rate of 90% or less is used around the joint portion between the substrate waveguide 2 and the optical fiber arrays 3 and 4. Leakage light is not easily absorbed by the adhesive 12, the temperature rise of the adhesive due to absorption of the leaking light can be kept low, and it has excellent durability against high-intensity incident light and high reliability.
The optical waveguide module may be housed in a suitable case such as a plastic case or a metal tube, and a filler may be provided in the case. This filler may be the same as the adhesive 12 having a light absorption rate of 90% or less, or may be another type such as grease having a light absorption rate of 90% or less. Functions of this filler are moisture proofing, waterproofing, vibration / impact absorption, and the like.

図４は本発明の光導波路モジュールの第２実施形態を示す斜視図であり、図４中、符号１Ｂは光導波路モジュールの一例である基板導波路型スプリッタモジュール、２Ｂは光導波路の一例である基板型導波路（詳しくは、８分岐スプリッタ）、３Ｂ及び４Ｂは光ファイバアレイ、５及び６は光ファイバ、１２，１３は接着剤である。   FIG. 4 is a perspective view showing a second embodiment of the optical waveguide module of the present invention. In FIG. 4, reference numeral 1B denotes a substrate waveguide type splitter module, which is an example of the optical waveguide module, and 2B denotes an example of the optical waveguide. A substrate type waveguide (specifically, an 8-branch splitter), 3B and 4B are optical fiber arrays, 5 and 6 are optical fibers, and 12 and 13 are adhesives.

本実施形態では、リッド無し基板型導波路２Ｂと、リッド無し光ファイバアレイ３Ｂ，４Ｂを用い、基板型導波路２Ｂと光ファイバアレイ３Ｂ，４Ｂとの接合部と、光ファイバアレイ３Ｂ，４Ｂ上面とに複数の接着剤１２，１３を用いていることを特徴としている。このように接合部周辺に複数の接着剤１２，１３が複合して使用されている場合にも、本発明を適用することができる。   In the present embodiment, the substrate waveguide 2B without lid and the optical fiber arrays 3B and 4B without lid are used, the joint portion between the substrate waveguide 2B and the optical fiber arrays 3B and 4B, and the upper surfaces of the optical fiber arrays 3B and 4B. And a plurality of adhesives 12 and 13 are used. As described above, the present invention can also be applied to the case where a plurality of adhesives 12 and 13 are used in combination around the joint.

図５は本発明の光導波路モジュールの第３実施形態を示す斜視図であり、図５中、符号１Ｃは光導波路モジュールの一例である基板導波路型スプリッタモジュール、２Ｃは光導波路の一例である基板型導波路（詳しくは、８分岐スプリッタ）、５及び６は光ファイバ、１２は接着剤、１４はレーザ接合部である。   FIG. 5 is a perspective view showing a third embodiment of the optical waveguide module of the present invention. In FIG. 5, reference numeral 1C denotes a substrate waveguide type splitter module which is an example of the optical waveguide module, and 2C is an example of the optical waveguide. A substrate-type waveguide (specifically, an 8-branch splitter), 5 and 6 are optical fibers, 12 is an adhesive, and 14 is a laser junction.

この基板導波路型スプリッタモジュール１Ｃは、ガラス板や金属板などの平坦な固定部材上に基板型導波路２を固定し、その両端にそれぞれ光ファイバ５，６をレーザ融着して接合し、これらの光ファイバ５，６の被覆部分を、光吸収率９０％以下の接着剤１２を用いて固定部材上に接着固定した構成になっている。   This substrate waveguide type splitter module 1C fixes a substrate type waveguide 2 on a flat fixing member such as a glass plate or a metal plate, and optical fibers 5 and 6 are bonded to both ends thereof by laser fusion, The covering portions of these optical fibers 5 and 6 are bonded and fixed on a fixing member using an adhesive 12 having a light absorption rate of 90% or less.

本実施形態による光導波路モジュールについても、前記第１実施形態の光導波路モジュールと同様の効果を得ることができる。   Also for the optical waveguide module according to the present embodiment, the same effects as those of the optical waveguide module of the first embodiment can be obtained.

なお、前述した各実施形態では、光導波路として８分岐スプリッタを例示しているが、本発明はこれに限定されることなく、他のタイプの光スプリッタ、方向性結合器、アレイ導波路型合分波器（ＡＷＧ）などの各種の基板型導波路を含む光導波路モジュールに適用することができる。   In each of the above-described embodiments, an eight-branch splitter is exemplified as the optical waveguide. However, the present invention is not limited to this, and other types of optical splitters, directional couplers, arrayed waveguide type couplers are used. The present invention can be applied to an optical waveguide module including various substrate-type waveguides such as a duplexer (AWG).

［サンプル１］
図３に示すように、基板型導波路２（８分岐スプリッタ）と光ファイバアレイ３，４とを接着剤で接合した。この接合部の過剰損失は１ｄＢであった。図３に示すように接合部周辺に、光吸収率１０％（波長１．５５μｍ、厚さ１ｍｍで測定した光吸収率）の接着剤を塗布して基板導波路型スプリッタモジュールを製造した。この光吸収率１０％の接着剤は、エポキシ系紫外線硬化型接着剤であり、ガラス転移点１３０℃、せん断接着強さ１２０ｋｇｆ／ｃｍ２以上のものを用いた。 [Sample 1]
As shown in FIG. 3, the substrate-type waveguide 2 (8-branch splitter) and the optical fiber arrays 3 and 4 were joined with an adhesive. The excess loss at this junction was 1 dB. As shown in FIG. 3, a substrate waveguide type splitter module was manufactured by applying an adhesive having a light absorptivity of 10% (light absorptivity measured at a wavelength of 1.55 μm and a thickness of 1 mm) around the joint. The adhesive having a light absorption rate of 10% is an epoxy-based ultraviolet curable adhesive having a glass transition point of 130 ° C. and a shear adhesive strength of 120 kgf / cm 2 or more.

［サンプル２］
接着剤として、光吸収率５０％の接着剤を用いた以外は、サンプル１と同様にして基板導波路型スプリッタモジュールを製造した。この光吸収率５０％の接着剤は、エポキシ系紫外線硬化型接着剤であり、ガラス転移点３４℃、せん断接着強さ１４６ｋｇｆ／ｃｍ２以上のものを用いた。 [Sample 2]
A substrate waveguide type splitter module was manufactured in the same manner as Sample 1 except that an adhesive having a light absorption rate of 50% was used as the adhesive. The adhesive having a light absorption rate of 50% is an epoxy-based ultraviolet curable adhesive having a glass transition point of 34 ° C. and a shear adhesive strength of 146 kgf / cm 2 or more.

［サンプル３］
接着剤として、光吸収率９０％の接着剤を用いた以外は、サンプル１と同様にして基板導波路型スプリッタモジュールを製造した。この光吸収率９０％の接着剤は、アクリル系紫外線硬化型接着剤であり、ガラス転移点９９℃、せん断接着強さ２００ｋｇｆ／ｃｍ２以上のものを用いた。 [Sample 3]
A substrate waveguide type splitter module was manufactured in the same manner as Sample 1 except that an adhesive having a light absorption rate of 90% was used as the adhesive. The adhesive having a light absorption rate of 90% is an acrylic ultraviolet curable adhesive having a glass transition point of 99 ° C. and a shear adhesive strength of 200 kgf / cm 2 or more.

［サンプル４］
接合部の過剰損失を２ｄＢとした以外は、サンプル１と同様にして基板導波路型スプリッタモジュールを製造した。 [Sample 4]
A substrate waveguide type splitter module was manufactured in the same manner as Sample 1 except that the excess loss at the junction was 2 dB.

［サンプル５］
接合部の過剰損失を２ｄＢとした以外は、サンプル２と同様にして基板導波路型スプリッタモジュールを製造した。 [Sample 5]
A substrate waveguide type splitter module was manufactured in the same manner as Sample 2 except that the excess loss at the junction was 2 dB.

［サンプル６］
接合部の過剰損失を２ｄＢとした以外は、サンプル３と同様にして基板導波路型スプリッタモジュールを製造した。 [Sample 6]
A substrate waveguide type splitter module was manufactured in the same manner as Sample 3 except that the excess loss at the junction was 2 dB.

製造したサンプル１〜６の導波路タイプ、過剰損失、接着剤吸収率をまとめて表１に示す。   Table 1 summarizes the waveguide types, excess losses, and adhesive absorption rates of the manufactured samples 1 to 6.

Figure 2005250115
Figure 2005250115

製造したサンプル１〜６を用い、表２に示す試験条件で入射光強度を変化させ、接着剤の最高到達温度を測定した。サンプル１〜３の測定結果を図６に、サンプル４〜６の測定結果を図７にそれぞれ示す。   Using the manufactured samples 1 to 6, the incident light intensity was changed under the test conditions shown in Table 2, and the maximum temperature reached by the adhesive was measured. The measurement results of samples 1 to 3 are shown in FIG. 6, and the measurement results of samples 4 to 6 are shown in FIG.

Figure 2005250115
Figure 2005250115

一般の接着剤あるいは充填剤樹脂の耐熱温度は１００〜１２０℃程度である。例えば、光通信部品で汎用的に用いられているエポキシ接着剤（エポテック３５３ＮＤ）は、１５０℃／１時間の硬化条件でガラス転移点が１００℃である。一方、現在使用されているハイパワー光は、２２ｄＢｍ（３００ｍＷ）程度であるが、年々ハイパワー化が進んでおり、３０ｄＢｍ（１Ｗ）程度のハイパワー光をも想定する必要がある。従って、図６，７のグラフより光パワー１Ｗのとき、光吸収率が９０％で１２０℃であるので、これ以上の光吸収率は適さないことが容易にわかる。また、２００２年電子情報通信学会通信ソサエティ大会Ｂ−１０−８６に記載されているようなラマンアンプを用いた電送システムでは、２Ｗ程度のハイパワー光が用いられる可能性がある。こうしたことをも考慮すれば、グラフより２Ｗで１２０℃以下にするためには、光吸収率が５０％以下の接着剤を使用するのが望ましいことがわかる。
また、過剰損失を１ｄＢに抑えたとしても、２Ｗでは１２０℃以下にするためには、光吸収率が９０％以下の接着剤を用いることが望ましい。 The heat resistance temperature of a general adhesive or filler resin is about 100 to 120 ° C. For example, an epoxy adhesive (Epotech 353ND), which is widely used in optical communication parts, has a glass transition point of 100 ° C. under a curing condition of 150 ° C./1 hour. On the other hand, the high power light currently used is about 22 dBm (300 mW). However, the high power light is increasing year by year, and it is necessary to assume high power light of about 30 dBm (1 W). Therefore, it can be easily understood from the graphs of FIGS. 6 and 7 that when the optical power is 1 W, the optical absorptance is 90% and 120 ° C., so that an optical absorptance higher than this is not suitable. In addition, in a power transmission system using a Raman amplifier as described in the 2002 IEICE Communication Society B-10-86, high power light of about 2 W may be used. Considering these facts, it can be seen from the graph that it is desirable to use an adhesive having a light absorptivity of 50% or less in order to achieve 120 ° C. or less at 2 W.
Further, even if the excessive loss is suppressed to 1 dB, it is desirable to use an adhesive having a light absorption rate of 90% or less in order to make it 120 ° C. or less at 2 W.

光導波路モジュールの一例として基板導波路型スプリッタモジュールの構造を示す斜視図である。It is a perspective view which shows the structure of the board | substrate waveguide type | mold splitter module as an example of an optical waveguide module. 基板導波路型スプリッタモジュールにおける漏れ光の発生と温度上昇のメカニズムを説明するための図であり、（ａ）は基板導波路型スプリッタモジュールの斜視図、（ｂ）は（ａ）の要部拡大断面図である。It is a figure for demonstrating the mechanism of generation | occurrence | production of leak light and a temperature rise in a substrate waveguide type | mold splitter module, (a) is a perspective view of a substrate waveguide type | mold splitter module, (b) is the principal part expansion of (a). It is sectional drawing. 本発明の光導波路モジュールの第１実施形態を示す基板導波路型スプリッタモジュールの斜視図である。1 is a perspective view of a substrate waveguide type splitter module showing a first embodiment of an optical waveguide module of the present invention. FIG. 本発明の光導波路モジュールの第２実施形態を示す基板導波路型スプリッタモジュールの斜視図である。It is a perspective view of the board | substrate waveguide type | mold splitter module which shows 2nd Embodiment of the optical waveguide module of this invention. 本発明の光導波路モジュールの第３実施形態を示す基板導波路型スプリッタモジュールの斜視図である。It is a perspective view of the substrate waveguide type splitter module which shows 3rd Embodiment of the optical waveguide module of this invention. 本発明の実施例の結果を示すグラフである。It is a graph which shows the result of the Example of this invention. 本発明の別の実施例の結果を示すグラフである。It is a graph which shows the result of another Example of this invention.

符号の説明Explanation of symbols

１，１Ｂ，１Ｃ…基板導波路型スプリッタモジュール（光導波路モジュール）、２，２Ｂ，２Ｃ…基板型導波路、３，３Ｂ，４，４Ｂ…光ファイバアレイ、５，６…光ファイバ、１２，１３…接着剤、１４…レーザ接合部。
1, 1B, 1C ... Substrate waveguide type splitter module (optical waveguide module), 2, 2B, 2C ... Substrate type waveguide, 3, 3B, 4, 4B ... Optical fiber array, 5, 6 ... Optical fiber, 12, 13 ... Adhesive, 14 ... Laser junction.

Claims (6)

光導波路とそれに接合された光ファイバとを備えた光導波路モジュールであって、光導波路と光ファイバとの接合部周辺に、光吸収率（ただし、この光吸収率は、接着剤の厚さを１ｍｍとし、その光導波路モジュールの使用波長範囲の光に対する接着剤の光吸収率である。）が９０％以下の接着剤を用いたことを特徴とする光導波路モジュール。   An optical waveguide module including an optical waveguide and an optical fiber bonded to the optical waveguide, and an optical absorptance (however, this optical absorptivity is the thickness of the adhesive) around the joint between the optical waveguide and the optical fiber. An optical waveguide module using an adhesive having a thickness of 1 mm and an optical absorptance of the adhesive with respect to light in the wavelength range of use of the optical waveguide module) of 90% or less. 光ファイバの先端に光ファイバアレイが形成され、該光ファイバアレイと光導波路とが、光吸収率が９０％以下の前記接着剤を用いて接合されたことを特徴とする光導波路モジュール。   An optical waveguide module, wherein an optical fiber array is formed at a tip of an optical fiber, and the optical fiber array and the optical waveguide are bonded using the adhesive having a light absorption rate of 90% or less. 光ファイバアレイのＶ溝基板と光ファイバ裸線、あるいはＶ溝基板と光ファイバ裸線及び光ファイバアレイの接合に光吸収率が９０％以下の前記接着剤を用いたことを特徴とする請求項２に記載の光導波路モジュール。   The adhesive having an optical absorptance of 90% or less is used for bonding a V-groove substrate and an optical fiber bare wire of an optical fiber array or a joint between a V-groove substrate and an optical fiber bare wire and an optical fiber array. 2. The optical waveguide module according to 2. 光ファイバアレイのＶ溝基板テラス部に光吸収率が９０％以下の前記接着剤を用いたことを特徴とする請求項２又は３に記載の光導波路モジュール。   4. The optical waveguide module according to claim 2, wherein the adhesive having a light absorptivity of 90% or less is used for a V-groove substrate terrace portion of the optical fiber array. 光導波路と光ファイバアレイをケース内に収め、ケース内に光吸収率が９０％以下の充填剤を設けたことを特徴とする請求項２〜４のいずれかに記載の光導波路モジュール。   The optical waveguide module according to claim 2, wherein the optical waveguide and the optical fiber array are housed in a case, and a filler having a light absorption rate of 90% or less is provided in the case. 固定部材上の光導波路に光ファイバがレーザ接合されてなり、その接合部近傍の光ファイバの一部が固定部材に、光吸収率が９０％以下の前記接着剤を用いて接着固定されたことを特徴とする請求項１に記載の光導波路モジュール。

An optical fiber is laser-bonded to the optical waveguide on the fixing member, and a part of the optical fiber in the vicinity of the bonding portion is bonded and fixed to the fixing member using the adhesive having a light absorption rate of 90% or less. The optical waveguide module according to claim 1.

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