JP2003243590A - マイクロチャネルをエッチング加工した半導体を蒸発器として利用するループ熱サイホン - Google Patents

マイクロチャネルをエッチング加工した半導体を蒸発器として利用するループ熱サイホン

Info

Publication number
JP2003243590A
JP2003243590A JP2003027769A JP2003027769A JP2003243590A JP 2003243590 A JP2003243590 A JP 2003243590A JP 2003027769 A JP2003027769 A JP 2003027769A JP 2003027769 A JP2003027769 A JP 2003027769A JP 2003243590 A JP2003243590 A JP 2003243590A
Authority
JP
Japan
Prior art keywords
fluid
die
condenser
microchannel
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003027769A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003243590A5 (https=
Inventor
Roy Zeighami
ザイガミ ロイ
Christian L Belady
エル ベァディ クリスチャン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of JP2003243590A publication Critical patent/JP2003243590A/ja
Publication of JP2003243590A5 publication Critical patent/JP2003243590A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2003027769A 2002-02-12 2003-02-05 マイクロチャネルをエッチング加工した半導体を蒸発器として利用するループ熱サイホン Withdrawn JP2003243590A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/074885 2002-02-12
US10/074,885 US6704200B2 (en) 2002-02-12 2002-02-12 Loop thermosyphon using microchannel etched semiconductor die as evaporator

Publications (2)

Publication Number Publication Date
JP2003243590A true JP2003243590A (ja) 2003-08-29
JP2003243590A5 JP2003243590A5 (https=) 2005-08-04

Family

ID=27659979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003027769A Withdrawn JP2003243590A (ja) 2002-02-12 2003-02-05 マイクロチャネルをエッチング加工した半導体を蒸発器として利用するループ熱サイホン

Country Status (2)

Country Link
US (2) US6704200B2 (https=)
JP (1) JP2003243590A (https=)

Cited By (3)

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JP2007129157A (ja) * 2005-11-07 2007-05-24 C & C:Kk 半導体冷却装置
CN102506598A (zh) * 2011-11-01 2012-06-20 浙江建设职业技术学院 一种带超声振动雾化装置的重力辅助回路热管
JP2013032904A (ja) * 2011-06-29 2013-02-14 Panasonic Corp 冷却装置およびこれを搭載した電子機器、および電気自動車

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US6934154B2 (en) * 2003-03-31 2005-08-23 Intel Corporation Micro-channel heat exchangers and spreaders
WO2005006436A1 (de) * 2003-07-08 2005-01-20 Infineon Technologies Ag Integrierte kühl-schaltungsanordnung, betriebsverfahren und herstellungsverfahren
RU2369939C2 (ru) * 2003-12-08 2009-10-10 НОЙЗ ЛИМИТ АпС Система охлаждения с пузырьковым насосом
US8309112B2 (en) * 2003-12-24 2012-11-13 Advanced Cardiovascular Systems, Inc. Coatings for implantable medical devices comprising hydrophilic substances and methods for fabricating the same
US20050257532A1 (en) * 2004-03-11 2005-11-24 Masami Ikeda Module for cooling semiconductor device
US7180742B1 (en) 2004-05-24 2007-02-20 Nvidia Corporation Apparatus and method for cooling semiconductor devices
US7342787B1 (en) * 2004-09-15 2008-03-11 Sun Microsystems, Inc. Integrated circuit cooling apparatus and method
TWI246880B (en) 2004-11-23 2006-01-01 Ind Tech Res Inst Device of a micro thermosyphon loop for a ferrofluid power generator
DE502005011314D1 (de) 2004-12-30 2011-06-09 Osram Opto Semiconductors Gmbh Kühlvorrichtung zur kühlung eines halbleiterbauelementes, insbesondere eines optoelektronischen halbleiterbauelementes
US20060187639A1 (en) * 2005-02-23 2006-08-24 Lytron, Inc. Electronic component cooling and interface system
DE102005017452B4 (de) 2005-04-15 2008-01-31 INSTITUT FüR MIKROTECHNIK MAINZ GMBH Mikroverdampfer
TWI259569B (en) * 2005-06-09 2006-08-01 Ind Tech Res Inst Micro channel heat sink driven by hydromagnetic wave pump
US7494910B2 (en) * 2006-03-06 2009-02-24 Micron Technology, Inc. Methods of forming semiconductor package
DE102006011331A1 (de) * 2006-03-09 2007-09-13 Behr Industry Gmbh & Co. Kg Vorrichtung zur Kühlung, insbesondere von elektronischen Bauelementen, Gaskühler und Verdampfer
DE102006011333A1 (de) * 2006-03-09 2007-09-13 Behr Industry Gmbh & Co. Kg Vorrichtung zur Kühlung, insbesondere elektronischer Bauelemente
US7551439B2 (en) * 2006-03-28 2009-06-23 Delphi Technologies, Inc. Fluid cooled electronic assembly
US7870893B2 (en) * 2006-04-06 2011-01-18 Oracle America, Inc. Multichannel cooling system with magnetohydrodynamic pump
US7672129B1 (en) 2006-09-19 2010-03-02 Sun Microsystems, Inc. Intelligent microchannel cooling
CN101155497A (zh) * 2006-09-29 2008-04-02 诺亚公司 相变散热装置与方法
WO2008052330A1 (en) * 2006-10-31 2008-05-08 Tir Technology Lp Light-emitting element light source and temperature management system therefor
US7436059B1 (en) 2006-11-17 2008-10-14 Sun Microsystems, Inc. Thermoelectric cooling device arrays
US7843695B2 (en) * 2007-07-20 2010-11-30 Honeywell International Inc. Apparatus and method for thermal management using vapor chamber
US20100186820A1 (en) * 2008-11-10 2010-07-29 Schon Steven G Solar electricity generation with improved efficiency
US9157687B2 (en) * 2007-12-28 2015-10-13 Qcip Holdings, Llc Heat pipes incorporating microchannel heat exchangers
US8302419B2 (en) * 2008-05-02 2012-11-06 Thermal Take Technology Co., Ltd. Computer cooling apparatus
FR2941562B1 (fr) * 2009-01-29 2011-04-29 Philippe Rhul Systeme et procede de refroidissement d'un circuit integre, notamment d'un processeur
US20100326627A1 (en) * 2009-06-30 2010-12-30 Schon Steven G Microelectronics cooling system
TWI506238B (zh) * 2009-12-29 2015-11-01 鴻準精密工業股份有限公司 微型液體冷卻裝置
WO2011159251A1 (en) * 2010-06-18 2011-12-22 Gatekeeper Laboratories Pte Ltd Thermosyphon for cooling electronic components
US11073340B2 (en) * 2010-10-25 2021-07-27 Rochester Institute Of Technology Passive two phase heat transfer systems
TWI404904B (zh) 2010-11-19 2013-08-11 英業達股份有限公司 可拆式液態冷卻散熱模組
US9746248B2 (en) 2011-10-18 2017-08-29 Thermal Corp. Heat pipe having a wick with a hybrid profile
US9035452B2 (en) 2012-08-07 2015-05-19 General Electric Company Electronic device cooling with autonomous fluid routing and method of assembly
JPWO2016035436A1 (ja) * 2014-09-04 2017-05-25 富士通株式会社 熱輸送デバイス及び電子機器
US10462935B2 (en) * 2015-06-23 2019-10-29 Google Llc Cooling electronic devices in a data center
US10032694B2 (en) 2016-03-08 2018-07-24 Toyota Motor Engineering & Manufacturing North America, Inc Power electronics assemblies having a semiconductor cooling chip and an integrated fluid channel system
US10121729B2 (en) 2016-07-25 2018-11-06 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics assemblies having a semiconductor device with metallized embedded cooling channels
US10231364B2 (en) 2016-10-24 2019-03-12 Toyota Motor Engineering & Manufacturing North America, Inc. Fluidly cooled power electronics assemblies having a thermo-electric generator
US10431524B1 (en) * 2018-04-23 2019-10-01 Asia Vital Components Co., Ltd. Water cooling module
EP3671828A1 (en) * 2018-12-21 2020-06-24 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Evaporative microchip cooling

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US6031286A (en) * 1997-02-28 2000-02-29 International Business Machines Corporation Semiconductor structures containing a micro pipe system therein
US6215166B1 (en) * 1997-04-30 2001-04-10 Motorola, Inc. Radio frequency electronic device and method for regulating an amount of power delivered to a radio frequency electronic device
US6242778B1 (en) * 1998-09-22 2001-06-05 International Business Machines Corporation Cooling method for silicon on insulator devices
US6457515B1 (en) * 1999-08-06 2002-10-01 The Ohio State University Two-layered micro channel heat sink, devices and systems incorporating same
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US6437981B1 (en) * 2000-11-30 2002-08-20 Harris Corporation Thermally enhanced microcircuit package and method of forming same
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007129157A (ja) * 2005-11-07 2007-05-24 C & C:Kk 半導体冷却装置
JP2013032904A (ja) * 2011-06-29 2013-02-14 Panasonic Corp 冷却装置およびこれを搭載した電子機器、および電気自動車
CN102506598A (zh) * 2011-11-01 2012-06-20 浙江建设职业技术学院 一种带超声振动雾化装置的重力辅助回路热管

Also Published As

Publication number Publication date
US20030151896A1 (en) 2003-08-14
US6704200B2 (en) 2004-03-09
US7002801B2 (en) 2006-02-21
US20040080913A1 (en) 2004-04-29

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