JP2003243590A5 - - Google Patents

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Publication number
JP2003243590A5
JP2003243590A5 JP2003027769A JP2003027769A JP2003243590A5 JP 2003243590 A5 JP2003243590 A5 JP 2003243590A5 JP 2003027769 A JP2003027769 A JP 2003027769A JP 2003027769 A JP2003027769 A JP 2003027769A JP 2003243590 A5 JP2003243590 A5 JP 2003243590A5
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JP
Japan
Prior art keywords
fluid
die
microchannel
condenser
cooling device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003027769A
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English (en)
Japanese (ja)
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JP2003243590A (ja
Filing date
Publication date
Priority claimed from US10/074,885 external-priority patent/US6704200B2/en
Application filed filed Critical
Publication of JP2003243590A publication Critical patent/JP2003243590A/ja
Publication of JP2003243590A5 publication Critical patent/JP2003243590A5/ja
Withdrawn legal-status Critical Current

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JP2003027769A 2002-02-12 2003-02-05 マイクロチャネルをエッチング加工した半導体を蒸発器として利用するループ熱サイホン Withdrawn JP2003243590A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/074885 2002-02-12
US10/074,885 US6704200B2 (en) 2002-02-12 2002-02-12 Loop thermosyphon using microchannel etched semiconductor die as evaporator

Publications (2)

Publication Number Publication Date
JP2003243590A JP2003243590A (ja) 2003-08-29
JP2003243590A5 true JP2003243590A5 (https=) 2005-08-04

Family

ID=27659979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003027769A Withdrawn JP2003243590A (ja) 2002-02-12 2003-02-05 マイクロチャネルをエッチング加工した半導体を蒸発器として利用するループ熱サイホン

Country Status (2)

Country Link
US (2) US6704200B2 (https=)
JP (1) JP2003243590A (https=)

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US11073340B2 (en) * 2010-10-25 2021-07-27 Rochester Institute Of Technology Passive two phase heat transfer systems
TWI404904B (zh) 2010-11-19 2013-08-11 英業達股份有限公司 可拆式液態冷卻散熱模組
WO2013001735A1 (ja) * 2011-06-29 2013-01-03 パナソニック株式会社 冷却装置とこれを搭載した電子機器、および電気自動車
US9746248B2 (en) 2011-10-18 2017-08-29 Thermal Corp. Heat pipe having a wick with a hybrid profile
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US9035452B2 (en) 2012-08-07 2015-05-19 General Electric Company Electronic device cooling with autonomous fluid routing and method of assembly
JPWO2016035436A1 (ja) * 2014-09-04 2017-05-25 富士通株式会社 熱輸送デバイス及び電子機器
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