TW200733327A - Oscillating heat sink sheet in plate structure - Google Patents
Oscillating heat sink sheet in plate structureInfo
- Publication number
- TW200733327A TW200733327A TW095106440A TW95106440A TW200733327A TW 200733327 A TW200733327 A TW 200733327A TW 095106440 A TW095106440 A TW 095106440A TW 95106440 A TW95106440 A TW 95106440A TW 200733327 A TW200733327 A TW 200733327A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat sink
- area
- oscillating heat
- oscillating
- heat pipe
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention provides an oscillating heat sink sheet in plate structure, in which the heat sink sheet comprises a substrate and an oscillating heat pipe formed on the substrate; and, the oscillating heat pipe is a closed and bent heat pipe structure, and comprises an evaporation area, a condensing area, and a conduction section fluidic communicating the evaporation area and the condensing area; wherein, a central processing unit is contacted with the evaporation area, and heat sink fins are contacted with the condensing area. The oscillating heat pipe is provided with a working fluid therein, and when the evaporation area is heated, the working fluid would generate a plurality of saturated vapor bubbles, and the saturated vapor bubbles would be transported to the condensing area through the conduction section, and the heat conducted by the saturated vapor bubbles would be dissipated through the heat sink fin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095106440A TWI279899B (en) | 2006-02-24 | 2006-02-24 | Oscillating heat sink sheet in plate structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095106440A TWI279899B (en) | 2006-02-24 | 2006-02-24 | Oscillating heat sink sheet in plate structure |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI279899B TWI279899B (en) | 2007-04-21 |
TW200733327A true TW200733327A (en) | 2007-09-01 |
Family
ID=38645533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095106440A TWI279899B (en) | 2006-02-24 | 2006-02-24 | Oscillating heat sink sheet in plate structure |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI279899B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI499899B (en) * | 2012-12-12 | 2015-09-11 | Inventec Corp | Electronic device |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103796478B (en) * | 2012-10-31 | 2016-12-21 | 英业达科技有限公司 | Electronic installation |
US20150060023A1 (en) * | 2013-08-28 | 2015-03-05 | Hamilton Sundstrand Corporation | Fin-diffuser heat sink with high conductivity heat spreader |
GB2520108A (en) * | 2013-08-28 | 2015-05-13 | Hamilton Sundstrand Corp | Fin-diffuser heat sink with high conductivity heat spreader |
CN103438741B (en) * | 2013-08-29 | 2016-05-25 | 特能传热科技(中山)有限公司 | Heat radiator |
FR3039510B1 (en) * | 2015-07-28 | 2017-09-01 | Thales Sa | HEATING FOR AERONAUTICAL EQUIPMENT FOR AIRCRAFT |
TWI757553B (en) | 2017-10-13 | 2022-03-11 | 訊凱國際股份有限公司 | Impulse uniform temperature plate |
TWI685638B (en) | 2018-09-14 | 2020-02-21 | 財團法人工業技術研究院 | Three dimensional pulsating heat pipe, three dimensional pulsating heat pipe assembly and heat dissipation module |
US11051428B2 (en) * | 2019-10-31 | 2021-06-29 | Hamilton Sunstrand Corporation | Oscillating heat pipe integrated thermal management system for power electronics |
-
2006
- 2006-02-24 TW TW095106440A patent/TWI279899B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI499899B (en) * | 2012-12-12 | 2015-09-11 | Inventec Corp | Electronic device |
Also Published As
Publication number | Publication date |
---|---|
TWI279899B (en) | 2007-04-21 |
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