JP2003238769A - Epoxy resin composition for conductive resin paste - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for a conductive resin paste which is suitable as a bonding agent that bonds a semiconductor element to a support member or as a conducting paste that gives continuity between the insulation layers of a build-up printed wiring board since influences of the composition on the environment and human body can be eliminated, and in addition, it has excellent heat resistance, mechanical properties, and electrical characteristics. <P>SOLUTION: This epoxy resin composition comprises, as essential components, as epoxy resin (A), a polyhydric phenol (B) obtained by reacting the reaction raw materials which contain phenols and a compound represented by formula (1) as the essential components (in formula (1), 2R<SP>1</SP>, which may be identical or different, indicate, each amino, methylolamino or dimethylolamino group; and R<SP>2</SP>indicates a 1-12C hydrocarbon group), and a conductive powder (C). <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive paste used for assembling semiconductor devices and adhering various parts. More specifically, it is excellent in adhesiveness and rapid curing, and has a large semiconductor chip and a large surface area. The present invention relates to an epoxy resin composition for a conductive resin paste, which has characteristics corresponding to mounting and further heat resistance to lead-free solder, and which can eliminate the influence on the environment and the human body.

[0002]

2. Description of the Related Art Epoxy resin compositions are used for electronic materials such as printed wiring boards and semiconductor encapsulants due to their excellent physical properties. However, with the remarkable development of the electronics industry, the degree of circuit integration has rapidly increased. As a result, the physical properties required for the assembly of semiconductor devices and adhesion of various components are increasing.

Above all, the required process is remarkably improved in the process of bonding a lead frame or a solder ball using a bonding material to a semiconductor chip such as IC or LSI, or in the process of conducting between insulating layers of a build-up printed wiring board. As these conventional methods, a method using gold plating or a method using lead solder has been the mainstream, but the rise in rare metals has triggered the rapid spread of epoxy resins containing silver powder. is there.

When a conductive paste is used, it has advantages such as excellent heat resistance and workability. However, since the resin and the curing agent are used for conventional epoxy resin applications, voids are generated. In addition, it was inferior in moisture resistance and hydrolysis resistance, and often promoted corrosion of the electrode, leading to disconnection failure. As a method for solving this, Japanese Patent Laid-Open No. 5-171073 discloses a conductive paste using a low-viscosity liquid epoxy resin and a phenol aralkyl resin as a curing agent thereof. In addition, in Japanese Patent No. 2893782,
(A) novolac type epoxy resin, (b) phenol aralkyl resin and / or novolac type phenol resin, (c) 30 to 500% by weight of glycidyl group-containing silane coupling agent, (d) organic A conductive adhesive containing a borate salt and (e) silver powder is disclosed, and in Japanese Patent No. 3191243,
(A) Mixed epoxy resin consisting of phenol novolac type epoxy resin and epi-bis type epoxy resin,
(B) a phenol novolac resin and / or a phenol aralkyl resin, (C) an organic borate salt, (D) a diluent containing at least one silane compound having one glycidyl group, and (E) a conductive metal powder There is disclosed a conductive resin paste comprising the above. However, the mounting form of the semiconductor package is a ball grid array (BGA) or a compact package size (CS).
P) and other surface mounting types, the build-up method of the printed wiring board becomes more complicated, and it becomes more susceptible to the stress generated inside the package and wiring board with the improvement of the via hole density. Advancement of conduction accuracy is essential, and improvement of adhesiveness is required.

Further, as a conventional method of the above-mentioned technique, a method using lead solder can be cited. However, in recent years, lead, which is contained in a large amount in solder, affects the environment and the human body, and therefore lead-free solder is being used for the purpose of environmental protection. When using lead-free solder, the solder reflow temperature becomes higher than before, so that semiconductor packaging materials are also required to have higher heat resistance, higher moisture resistance, and higher hydrolysis resistance in accordance with it. As one of means for solving this, as a conventional technique, addition of a halogen-based flame retardant or an antimony-based flame retardant can be mentioned.

However, there is a concern that halogen-based gas generated during high temperature exposure such as solder reflow process may invade circuit parts, and some halogen-based compounds generate harmful halogen-based gas during combustion. Halogen-free technology is required because the environmental impact and high impact on the human body during incineration of waste and thermal recycling by heat recovery are important issues. There is also concern that antimony compounds also have chronic toxicity.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it is possible to eliminate the effects on the environment and the human body, and to provide excellent heat resistance, mechanical properties, and electrical characteristics. To provide an epoxy resin composition for a conductive resin paste suitable for use as a bonding agent for bonding a semiconductor element to a supporting member or as a conductive paste for establishing electrical continuity between insulating layers of a buildup printed wiring board. With the goal.

[0008]

[Means for Solving the Problems] The inventors of the present invention have made various investigations on a resin composition which does not substantially contain halogen. Among them, (1) phenols and (2) compounds having a specific triazine ring structure A polyhydric phenol obtained by reacting a reaction raw material that requires a type of compound is excellent in basic performance such as physical properties and heat resistance, and in addition to having an aromatic ring in its molecule, nitrogen It has been found that flame retardancy becomes excellent due to having an atom, and such a polyhydric phenol can be suitably applied as a flame retardant for epoxy resins and the like. Further, when the reaction raw material further contains (3) a compound having a hydroxyl group, an alkyl ether group or an alkyl ester group having a specific carbon number at both ends, and a specific aromatic ring, such a reaction raw material is reacted. It has been found that the polyphenols thus produced can also exhibit excellent basic performance and flame retardancy. Such polyphenols are (1) to (3)
The viscosity of each of the three types of compounds is low, and the aromatic ring and (2) of the compounds of (1) and (3) are
The compound capable of exerting a synergistic effect with the nitrogen atom possessed by the compound can be suitably applied to the epoxy resin composition for the conductive resin paste as a curing agent for the epoxy resin. is there. It has also been found that in such a polyhydric phenol, the action and effect can be more sufficiently exhibited by specifying the blending molar ratio of these compounds or the nitrogen atom content rate.

Since the resin composition containing the polyhydric phenol, the epoxy resin, and the conductive powder as essential components exhibits halogen-free practical flame retardancy and fluidity at room temperature. Since it is possible to form a cured product with excellent workability and excellent basic properties such as heat resistance and mechanical properties and electrical characteristics, it can be used as a bonding agent for bonding a semiconductor element to a supporting member, or as a build-up printed wiring. The inventors have found that it can be suitably applied as a conductive paste for establishing electrical continuity between insulating layers of a substrate, and have reached the present invention.

That is, the present invention relates to an epoxy resin (A)
And phenols and the following general formula (1);

[0011]

[Chemical 3]

(Wherein R ¹ is the same or different,
It represents an amino group, a methylolamino group or a dimethylolamino group. R ² represents a hydrocarbon group having 1 to 12 carbon atoms. ) Is an epoxy resin composition for a conductive resin paste, which contains a polyhydric phenol (B) obtained by reacting a reaction raw material containing a compound represented by the formula (1) as an essential component and a conductive powder (C) as an essential component. The present invention is described in detail below.

The epoxy resin composition for a conductive resin paste of the present invention contains an epoxy resin (A), a polyhydric phenol (B), and a conductive powder (C) as essential components. These may be used alone or in combination of two or more. The blending ratio of the essential components in the epoxy resin composition for conductive resin paste may be appropriately set depending on the performance required for the epoxy resin composition and the like. For example, the essential components relative to 100% by mass of the epoxy resin composition. It is preferable that the total mass of the above is 30% by mass or more. More preferably, it is 50 mass% or more.

The epoxy resin (A) used in the present invention is not particularly limited as long as it is a compound having at least one epoxy group in the molecule, such as bisphenol A, bisphenol F and bisphenol S. Epibis type glycidyl ether type epoxy resin obtained by condensation reaction of bisphenols with epihalohydrin; phenols such as phenol, cresol, xylenol, resorcin, catechol, bisphenol A, bisphenol F and formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, salicyl Aldehyde, dicyclopentadiene, terpene,
Novolak aralkyl type glycidyl ether type epoxy resin obtained by condensation reaction of polyhydric phenol obtained by condensation reaction of coumarin, paraxylylene dimethyl ether, dichloroparaxylene, etc. with epihalohydrin; tetrahydrophthalic acid, hexahydro Glycidyl ether type epoxy resin obtained by condensation reaction of phthalic acid or benzoic acid with epihalohydrin;
Glycidyl ether type epoxy resin obtained by condensation reaction of hydrogenated bisphenol or glycols with epihalohydrin; amine-containing glycidyl ether type epoxy resin obtained by condensation reaction of hindertoin or cyanuric acid with epihalohydrin; biphenyl type epoxy resin, naphthalene type epoxy resin Examples thereof include aromatic polycyclic epoxy resins such as resins. Further, it may be a compound having an epoxy group in the molecule by an addition reaction between these epoxy resins and polybasic acids and / or bisphenols. Only one kind of these epoxy compounds may be used, or two or more kinds may be appropriately mixed.

As the epoxy resin (A) in the present invention, an epoxy resin obtained by reacting a polyhydric phenol (B) described later with epihalohydrin can also be preferably used.

In the epoxy resin composition for conductive resin paste of the present invention, the compounding mass ratio of the epoxy resin (A) to the polyphenol (B) (epoxy resin / polyphenol) is 30/70 or more. It is preferable that it is set to 70/30 or less. When the blending mass ratio of the epoxy resin (A) to the polyhydric phenol (B) is less than 30/70, the mechanical properties of the cured product formed from the epoxy resin composition for conductive resin paste may deteriorate. , 70/30
If it exceeds, flame retardancy may be insufficient. It is more preferably 35/65 or more, and 65/35 or less.

The conductive powder (C) is, for example,
Conductive metal powders such as silver, gold, copper, nickel, iron and stainless steel, or carbon allotropes such as carbon black and fullerene are preferable. The shape of such conductive powder is preferably spherical or elliptical. As for the size, the length or radius of the major axis is preferably 30 μm or less. More preferably, it is 0.01 μm or more and 20 μm or less.

In the epoxy resin composition for conductive resin paste of the present invention, the compounding mass ratio of the conductive powder (C) to the total mass of the epoxy resin (A) and the polyhydric phenol (B) (conductive powder (C ) / Epoxy resin (A) and polyphenol (B) total mass) is preferably 15/85 or more, and preferably 95/5 or less. When the compounding mass ratio of the conductive powder (C) to the total mass of the epoxy resin (A) and the polyphenol (B) is less than 15/85, a cured product formed from the epoxy resin composition for the conductive resin paste. May have insufficient electrical characteristics, and if it exceeds 95/5,
There is a risk that the joint / adhesion between the parts will be insufficient. More preferably 35/65 or more, and 80
/ 20 or less.

The polyhydric phenol (B) is obtained by reacting phenols with a reaction raw material containing the compound represented by the general formula (1) as an essential component. The reaction raw material of the polyhydric phenol (B) further has the following general formula (2);

[0020]

[Chemical 4]

(In the formula, R ³ represents a phenylene group, an alkyl-substituted phenylene group, a naphthalene group, an alkyl-substituted naphthalene group, a biphenyl group or an alkyl-substituted biphenyl group. R ⁴ is the same or different and is a hydroxyl group or a carbon atom. Alkyl ether group of 1 to 4 or 1 to 4 carbon atoms
4 represents an alkyl ester group. ) Is included in the compound. That is, a polyhydric phenol obtained by reacting a reaction raw material containing a phenol, a compound represented by the general formula (1) and a compound represented by the general formula (2) as essential components is used in the present invention. This is one of the preferred forms.

The reaction raw materials used for producing the polyhydric phenol are the essential components of the phenols that will constitute the product polyhydric phenol and the compound represented by the general formula (1). Means a mixture containing other compounds optionally used such as the compound represented by the general formula (2), and also containing a solvent optionally used for carrying out the reaction. Phenols and the above general formula (1)
Unlike a polyhydric phenol produced by using a compound having a chlorine atom as a raw material, the reaction product contains a chlorine-based compound such as hydrogen chloride by producing the compound represented by It is possible to manufacture without. The phenols, the compound represented by the general formula (1) and the compound represented by the general formula (2) may be used alone or in combination of two or more kinds. In the present specification, "polyhydric phenol" means a polymer having a plurality of aromatic rings having a hydroxyl group, which is produced using such a reaction raw material, and "phenols" means
It means a compound having an aromatic ring having a hydroxyl group, which is one of the raw materials used for producing a polyhydric phenol.

The above-mentioned phenols have 1 in the aromatic ring.
Is not particularly limited as long as it is a compound having one or two or more hydroxyl groups bonded and one or more than one hydroxyl group-containing substituent, and examples of phenols having one hydroxyl group include the following. General formula (3);

[0024]

[Chemical 5]

(In the formula, Rs are the same or different and each represents a hydrogen atom or a hydrocarbon group having 1 to 9 carbon atoms, and either one or both of them represents a hydrocarbon group having 1 to 9 carbon atoms. It is preferable to use a compound represented by
Moreover, you may use the phenols and polycyclic phenols which have two or more hydroxyl groups. Examples of the compound represented by the general formula (3) include phenol, o-cresol,
m-cresol, p-cresol, o-ethylphenol, p-ethylphenol, mixed cresol, pn-
Propylphenol, o-isopropylphenol, p
-Isopropylphenol, mixed isopropylphenol, o-sec-butylphenol, m-tert-butylphenol, p-tert-butylphenol, pentylphenol, p-octylphenol, p-nonylphenol, 2,3-dimethylphenol, 2,4-
Dimethylphenol, 2,6-dimethylphenol,
3,4-dimethylphenol, 2,4-di-s-butylphenol, 3,5-dimethylphenol, 2,6-di-s-butylphenol, 2,6-di-t-butylphenol, 3-methyl-4- Isopropylphenol, 3
-Methyl-5-isopropylphenol, 3-methyl-
6-isopropylphenol, 2-t-butyl-4-methylphenol, 3-methyl-6-t-butylphenol, 2-t-butyl-4-ethylphenol and the like can be mentioned. Examples of phenols having two or more hydroxyl groups include catechol, resorcin, biphenol, bisphenol A, bisphenol S, bisphenol F, and hydroquinone. Examples of polycyclic phenols include α-naphthol, Examples thereof include naphthol such as β-naphthol.

In the compound represented by the above general formula (1) in the present invention, the hydrocarbon group having 1 to 12 carbon atoms in R ² is, for example, methyl group, ethyl group, propyl group, butyl group or vinyl group. , Allyl group, phenyl group and the like. Examples of the compound represented by the general formula (1) include benzoguanamine derivatives such as melamine, benzoguanamine, and acetoguanamine.

In the compound represented by the general formula (2) in the present invention, the phenylene group, the naphthalene group and the biphenyl group in R ³ are represented by the following chemical structural formula (4).
It is represented by (6). Further, the position at which two substituents represented by R ⁴ —CH ₂ — are bonded is, in the phenylene group, an ortho position, a meta (meta) position or a para (pa) position.
When the carbon atom is numbered as in the chemical structure formula below, the naphthalene group is 1,3-, 1,4-,
1,5-, 1,6-, 1,7-, 1,8-, 2,4-,
2,5-, 2,6-, 2,7- or 2,8-position, and in the biphenyl group, 2,2'-, 2,3'-, 2,
The positions are 4'-, 3,3'-, 3,4'- or 4,4'-. These phenylene group, naphthalene group and biphenyl group may be an alkyl-substituted group, in which case it is preferably a group substituted with an alkyl group having 1 to 9 carbon atoms.

[0028]

[Chemical 6]

The hydrocarbon group constituting the alkyl ether group having 1 to 4 carbon atoms and the alkyl ester group having 1 to 4 carbon atoms in R ⁴ is, for example, a methyl group, an ethyl group, a propyl group, a butyl group or a vinyl group. Group, an allyl group, etc., and a substituent (R ⁴ — having such a hydrocarbon group
As CH ₂ —, a methoxymethyl group (me
thoxymethyl), ethoxymethyl group (eth
oxymethyl), propoxymethyl group (prop
oxymethyl), butoxymethyl group (butho
xymethyl), pentoxymethyl group (pento
xymethyl), vinyloxymethyl group (vinyl)
an alkyl ether group such as oxymethyl); an acetyloxymethyl group,
Propanoyloxymethyl group (propanoyloxy)
methyl), butanoyloxymethyl group (butan)
oyloxymethyl), pentanoyloxymethyl group, (meth) acryloyloxymethyl group ((meth) acry)
(loyloxymethyl), (meth) allyloyloxymethyl group ((meth) allyloxyloxyme)
Examples thereof include alkyl ester groups such as thyl), and more preferably alkyl ester groups.

Examples of the compound represented by the above general formula (2) include o-diacetyloxymethylbenzene and m-
Diacetyloxymethylbenzene, p-diacetyloxymethylbenzene, o-dipropanoyloxymethylbenzene, m-dipropanoyloxymethylbenzene, p-dipropanoyloxymethylbenzene, o-dibutanoyloxymethylbenzene, m -Dibutanoyloxymethylbenzene, p-dibutanoyloxymethylbenzene, o-dipentanoyloxymethylbenzene, m-dipentanoyloxymethylbenzene, p-dipentanoyloxymethylbenzene, o-di (meth) acryloyl Roxymethylbenzene,
m-di (meth) acryloyloxymethylbenzene, p-
Di (meth) acryloyloxymethylbenzene, o-di (meth) allyloyloxymethylbenzene, m-di (meth) allyloyloxymethylbenzene, p-di (meth) allyloyloxymethylbenzene, 1,3- Diacetyloxymethylnaphthalene, 1,4-diacetyloxymethylnaphthalene, 1,5-diacetyloxymethylnaphthalene,
1,6-Diacetyloxymethylnaphthalene, 1,7-Diacetyloxymethylnaphthalene, 1,8-Diacetyloxymethylnaphthalene, 2,4-Diacetyloxymethylnaphthalene, 2,5-Diacetyloxymethylnaphthalene,
2,6-Diacetyloxymethylnaphthalene, 2,7-Diacetyloxymethylnaphthalene, 2,8-Diacetyloxymethylnaphthalene, 1,3-Dipropanoyloxymethylnaphthalene, 1,4-Dipropanoyloxymethyl Naphthalene, 1,5-dipropanoyloxymethylnaphthalene, 1,6-dipropanoyloxymethylnaphthalene,
1,7-dipropanoyloxymethylnaphthalene, 1,8
-Dipropanoyloxymethylnaphthalene, 2,4-dipropanoyloxymethylnaphthalene, 2,5-dipropanoyloxymethylnaphthalene, 2,6-dipropanoyloxymethylnaphthalene, 2,7-dipropanoyloxymethyl Naphthalene, 2,8-dipropanoyloxymethylnaphthalene.

1,3-dibutanoyloxymethylnaphthalene, 1,4-dibutanoyloxymethylnaphthalene, 1,
5-dibutanoyloxymethylnaphthalene, 1,6-dibutanoyloxymethylnaphthalene, 1,7-dibutanoyloxymethylnaphthalene, 1,8-dibutanoyloxymethylnaphthalene, 2,4-dibutanoyloxymethylnaphthalene, 2, 5-dibutanoyloxymethylnaphthalene,
2,6-dibutanoyloxymethylnaphthalene, 2,7-
Dibutanoyloxymethylnaphthalene, 2,8-dibutanoyloxymethylnaphthalene, 1,3-dipentanoyloxymethylnaphthalene, 1,4-dipentanoyloxymethylnaphthalene, 1,5-dipentanoyloxymethylnaphthalene, 1 , 6-dipentanoyloxymethylnaphthalene, 1,7-dipentanoyloxymethylnaphthalene,
1,8-dipentanoyloxymethylnaphthalene, 2,4
-Dipentanoyloxymethylnaphthalene, 2,5-dipentanoyloxymethylnaphthalene, 2,6-dipentanoyloxymethylnaphthalene, 2,7-dipentanoyloxymethylnaphthalene, 2,8-dipentanoyloxymethyl Naphthalene, 1,3-di (meth) acryloyloxymethylnaphthalene, 1,4-di (meth) acryloyloxymethylnaphthalene, 1,5-di (meth) acryloyloxymethylnaphthalene, 1,6-di ( (Meth) acryloyloxymethylnaphthalene, 1,7-di (meth) acryloyloxymethylnaphthalene, 1,8-di (meth) acrylonyloxymethylnaphthalene, 2,4-di (meth) acryloyloxymethylnaphthalene 2,5-di (meth) acryloyloxymethylnaphthalene, 2,6-di (meth)
Acryloyloxymethylnaphthalene, 2,7-di (meth) acryloyloxymethylnaphthalene, 2,8-di (meth) acryloyloxymethylnaphthalene.

1,3-di (meth) allyloyloxymethylnaphthalene, 1,4-di (meth) allyloyloxymethylnaphthalene, 1,5-di (meth) allyloyloxymethylnaphthalene, 1,6-di (Meth) allyloyloxymethylnaphthalene, 1,7-di (meth) allyloyloxymethylnaphthalene, 1,8-di (meth) allylonyloxymethylnaphthalene, 2,4-di (meth) allyloyloxymethyl Naphthalene, 2,5-di (meth) allyloyloxymethylnaphthalene, 2,6-di (meth) allyloyloxymethylnaphthalene, 2,7-di (meth) allyloyloxymethylnaphthalene, 2,8-di ( (Meth) allyloyloxymethylnaphthalene, 2,2'-diacetyloxymethylbiphenyl, 2,3'-diacetyloxymethylbiphenyl,
2,4'-Diacetyloxymethylbiphenyl, 3,3 '
-Diaceteroxymethylbiphenyl, 3,4'-diacetyloxymethylbiphenyl, 4,4'-diacetyloxymethylbiphenyl, 2,2'-dipropanoyloxymethylbiphenyl, 2,3'-dipropanoyloxy Methylbiphenyl, 2,4'-dipropanoyloxymethylbiphenyl, 3,3'-dipropanoyloxymethylbiphenyl, 3,4'-dipropanoyloxymethylbiphenyl,
4,4'-dipropanoyloxymethylbiphenyl, 2,
2'-dibutanoyloxymethylbiphenyl, 2,3'-
Dibutanoyloxymethylbiphenyl, 2,4'-dibutanoyloxymethylbiphenyl, 3,3'-dibutanoyloxymethylbiphenyl, 3,4'-dibutanoyloxymethylbiphenyl, 4,4'-dibutanoyloxymethylbiphenyl, 2,2'-dipentanoyloxymethylbiphenyl, 2,3'-dipentanoyloxymethylbiphenyl, 2,4'-dipentanoyloxymethylbiphenyl,
3,3'-dipentanoyloxymethylbiphenyl, 3,
4'-dipentanoyloxymethylbiphenyl, 4,4 '
-Dipentanoyloxymethylbiphenyl, 2,2'-di (meth) acryloyloxymethylbiphenyl, 2,3 '
-Di (meth) acryloyloxymethyl biphenyl, 2,
4'-di (meth) acryloyloxymethylbiphenyl,
3,3'-di (meth) acryloyloxymethylbiphenyl, 3,4'-di (meth) acryloyloxymethylbiphenyl, 4,4'-di (meth) acryloyloxymethylbiphenyl, 2,2'- Di (meth) allyloyloxymethylbiphenyl, 2,3'-di (meth) allyloyloxymethylbiphenyl, 2,4'-di (meth) allyloyloxymethylbiphenyl, 3,3'-di (meth) ari Examples thereof include, but are not limited to, leuroxymethylbiphenyl, 3,4′-di (meth) allyloyloxymethylbiphenyl, and 4,4′-di (meth) allyloyloxymethylbiphenyl. The compound preferably used in the present invention is a diacetyloxymethylated product.

In the production of the polyhydric phenol (B), a reaction raw material containing phenols, the compound represented by the general formula (1) and the compound represented by the general formula (2) as essential components is reacted. In this case, the reaction sequence of the reaction raw materials is such that the phenols are mixed with the compound represented by the general formula (1) and the compound represented by the general formula (2) in advance before the reaction is started, It is preferable to react the compound represented by the general formula (1) before completion of the reaction with the compound represented by the general formula (2).
The phenols are reacted with the compound represented by the general formula (1) and the compound represented by the general formula (2) at the same time, or in the first step, the phenols and the compound represented by the general formula (1) are represented. After reacting with the compound, it is preferable to further react with the compound represented by the general formula (2) in the second step. Thereby, the flame retardancy can be more reliably improved, and the flame retardancy can be suitably applied to the conductive resin paste. More preferably, the phenols and the compound represented by the general formula (1) are reacted in the first step, and then the compound represented by the general formula (2) is further reacted in the second step. The polyhydric phenol thus produced is one of the preferred forms of the present invention.

The compounding molar ratio of the phenol used in the production of the polyhydric phenol of the present invention to the compound represented by the general formula (1) is as follows: The ratio (phenols / compound represented by the general formula (1)) is, for example, preferably 1/1 or more, and more preferably 10/1 or less. If the amount of phenols is less than 1/1, gelation may occur during the production of polyhydric phenols.
If the amount of phenols is more than 1/1, the polyhydric phenol may be hard to cure. More preferably, since the polyhydric phenol can exhibit high strength at high temperature, it is 1.3 / 1 or more, further preferably 2
/ 1 or more. Further, it is more preferably 8/1 or less, and further preferably 5/1 or less.

The compounding molar ratio of the compound represented by the general formula (1) and the compound represented by the general formula (2) used for producing the polyhydric phenol in the present invention is as follows. The ratio of the compound represented by the general formula (1) to the compound represented by 2) (the compound represented by the general formula (1) / the compound represented by the general formula (2)) is, for example, 10 / It is preferably 90 or more, and 9
It is preferably 0/10 or less. When the amount of the compound represented by the general formula (1) is less than that of 10/90, the conductive resin paste material may not have sufficient basic properties such as physical properties and heat resistance and flame retardancy. 90 /
When the amount of the compound represented by the general formula (1) is more than 10, the physical properties and the flame retardancy may not be sufficiently compatible with each other. More preferably, it is 30/70 or more, and 70/30 or less.

The polyhydric phenol in the present invention preferably has a nitrogen atom content of 1% by mass or more, and
It is preferably 50% by mass or less. If it is less than 1% by mass, the flame retardancy of the conductive resin paste may not be sufficient, and if it exceeds 50% by mass,
There is a possibility that physical properties and flame retardancy may not be sufficiently compatible with each other. It is more preferably 3% by mass or more, and 30% by mass or less, further preferably 5% by mass.
It is above, and is 20 mass% or less. The nitrogen atom content is the mass ratio of nitrogen atoms constituting the polyhydric phenol when the polyhydric phenol is 100% by mass.

The polyhydric phenol in the present invention is preferably obtained by reacting the above reaction raw materials in the presence of a catalyst. The catalyst that can be used for producing the polyhydric phenol is not particularly limited as long as it can react the above-mentioned reaction raw materials, and for example, it is preferable to use an ion exchange resin.

The above-mentioned ion exchange resin is not particularly limited, but for example, a strongly acidic cation exchange resin is preferable. The strongly acidic cation exchange resin means an acidic cation exchange resin having a stronger acidity than the carboxylic acid type ion exchange resin, and examples thereof include sulfonic acid type ion exchange resin and perfluoroalkanesulfonic acid type ion exchange resin. Can be mentioned. These may be used alone or in combination of two or more. The amount of the ion exchange resin used when producing the polyhydric phenol in the present invention is not particularly limited, and is represented by, for example, phenols, compounds represented by the general formula (1) and general formula (2). When the total mass of the compound and the ion exchange resin is 100% by mass, it is preferably 0.01% by mass or more and 10% by mass or less. The content is more preferably 0.01% by mass or more, and further preferably 1% by mass or more.
Further, it is 8% by mass or less, and more preferably 5% by mass.
It is the following.

The above-mentioned polyphenols include the aromatic ring in phenols, the substituent represented by R ¹ in the compound represented by the general formula (1) and R ⁴ -in the compound represented by the general formula (2). It is obtained by condensation with a substituent represented by CH ₂ — (R ⁴ is the same as above), and at this time, a polycarboxylic acid, a carboxylic acid represented by R ⁴ H, an alcohol, and water. Will be a by-product. Thus by-produced carboxylic acid and alcohol, water is distilled off under reduced pressure during the reaction or after the reaction, or by performing an operation such as azeotroping with a solvent without requiring a complicated step. A polyhydric phenol that can be easily removed from the reaction product and is produced by removing by-produced carboxylic acid and the like from the reaction product is one of the preferred embodiments of the present invention. Incidentally, the reaction product means a mixture containing all those obtained by reacting as described above, for example, in addition to polyhydric phenol and by-produced carboxylic acid and alcohol, water, if necessary. It will include the catalyst used and the solvent described below.

In the reaction for producing the above polyhydric phenol, the reaction conditions are not particularly limited, and for example, the reaction temperature is preferably a temperature at which the by-produced carboxylic acid and the like are volatilized and distilled off. For example, 100 to 2
The temperature is preferably 40 ° C. More preferably 110
To 180 ° C, and more preferably 130 to 160 ° C.
Is. As described above, in the production of the polyhydric phenol in the present invention, the carboxylic acid represented by R ⁴ H and the like are by-produced, but it can be easily removed from the reaction product. The reaction time depends on the raw materials used, the type and amount of the catalyst, the reaction temperature, and the like, but the reaction time includes phenols, a compound represented by the general formula (1) and a compound represented by the general formula (2). The reaction is preferably completed until the reaction is completed, that is, carboxylic acid, alcohol or water is not generated, and for example, 30 minutes to 24 hours is preferable. More preferably, it is 1 to 12 hours.

As a reaction method in the production of the above-mentioned polyhydric phenol, for example, the reaction can be carried out without a solvent, but the reaction may be carried out using a solvent. In this case, as the solvent to be used, it is preferable to use an organic solvent inert to the reaction between the phenol and the compound represented by the general formula (1) and the compound represented by the general formula (2). Toluene, xylene, monochlorobenzene, dichlorobenzene and the like can be used. By using the solvent, the raw materials can be dissolved in the solvent to be homogenized, and as described later, the ion exchange resin and the like can be easily removed from the reaction product by filtration.

In the production of the above-mentioned polyhydric phenol, when the carboxylic acid or the solvent is removed from the reaction product, for example,
It is preferable to distill off by distilling at the above temperature under a reduced pressure of 0.1 to 10 kPa. At this time, since unreacted phenols may be distilled off, it is preferable to carry out the reaction after the reaction is substantially completed.

When the ion exchange resin is used in the production, the polyhydric phenol is preferably produced by collecting the ion exchange resin from the reaction product by filtration. In the production of polyhydric phenol, it is preferable to use an ion exchange resin as a catalyst, but since the ion exchange resin is a solid catalyst,
The reaction product can be easily removed from the reaction product by filtering. That is, since the ion exchange resin is generally a granular copolymer of 10 to 100 mesh having a fine three-dimensional cross-linking structure and is insoluble in a solvent, it can be easily obtained by going through a filtration process using a filter having a pore size smaller than the particle size. Can be collected. As described above, when the ion exchange resin is used in the production of polyhydric phenol, the catalyst can be removed from the reaction product without performing industrially complicated steps such as a water washing step and a vacuum drying step. Also,
The ion exchange resin can collect ions in any solution regardless of the polarity of the solvent and can selectively remove various ion components eluted in the reaction system. Therefore, the ion-exchange resin, which is a catalyst, can be removed from the reaction product to produce an impurity-free polyhydric phenol. Furthermore, since the ion-exchange resin that is the catalyst is regenerable, it can be used multiple times in the production by recovering and regenerating the catalyst after the reaction. Therefore, it is also possible to recycle it after use and recovery and use it for manufacturing a plurality of times.

In the above polyhydric phenol, the compound represented by the general formula (2) used as a raw material is oxygen, palladium, ultrafine gold particles, and Periodic Table IIA.
Of a benzyl compound and a carboxylic acid in the presence of an oxidation reaction catalyst containing at least one element selected from the group consisting of group IIIA, group VIA, group VIA, group IIB, group VB, group VIII, and an alkali metal It is preferably a compound produced by the reaction. This gives the general formula (2)
The compound represented by can be industrially, efficiently and inexpensively produced, and the process in producing the polyhydric phenol can be a more industrially efficient process. A method for preparing the oxidation reaction catalyst,
The reaction method of the above-mentioned oxidation reaction is not particularly limited, and for example, it can be carried out in the same manner as the method described in JP-A-2000-70718. Further, the catalyst component for oxidation reaction is preferably supported on a carrier. This makes it possible to suppress the elution of the metal component, which is the catalyst component, into the reaction product, and to use the compound in which the content of impurities is suppressed for the production of polyhydric phenol.

Specific examples of the benzyl compound include alkylbenzenes such as toluene, ethylbenzene, n-propylbenzene, isopropylbenzene, n-butylbenzene, sec-butylbenzene and trimethylbenzene; xylene and ethyltoluene. , N
-Propyltoluene, isopropyltoluene, n-butyltoluene, sec-butyltoluene, o-, m
-, P-dialkylbenzene; aryl-substituted alkylbenzene such as 4,4'-dimethylbiphenyl; o-, m-, p-hydroxy-substituted alkylbenzene such as cresol; o-, m-, p-halogen such as chlorotoluene Substituted alkylbenzene; Nitro group-substituted alkylbenzene such as o-, m-, p-nitrotoluene; O-, m-, p-amino group-substituted alkylbenzene such as methylaniline;
O-, m-, p-amide group-substituted alkylbenzenes such as methylbenzamide; o-, m such as methylanisole
-, P-alkyloxy-substituted alkylbenzene; o-, m-, p-aryloxy-substituted alkylbenzene such as phenoxytoluene; o-, m such as tolyl acetate, tolyl propionate, tolyl butanoate, tolyl benzoate, etc.
-, P-carboxy substituted alkylbenzene (carboxylic acid tolyl ester); o-, m-, p-carbonyl substituted alkylbenzene such as methylacetophenone and methylbenzophenone; o-, such as methylbenzyl acetate
m-, p-carboxyalkyl-substituted alkylbenzene;
Etc. Of the above-exemplified benzyl compounds, alkylbenzene, dialkylbenzene, and carboxyalkyl-substituted alkylbenzene are more preferable, and o
-, M-, p-xylene and o-, m-, p-methylbenzyl acetate are particularly preferred.

The above-mentioned carboxylic acid is a compound having a carboxyl group. More specifically, as the carboxylic acid, a monocarboxylic acid is preferable, and specifically, for example, acetic acid, propionic acid, butanoic acid, etc. Examples thereof include aliphatic carboxylic acids; aromatic carboxylic acids such as benzoic acid; however, they are not particularly limited. Among the carboxylic acids exemplified above,
Acetic acid and propionic acid are more preferable, and acetic acid is particularly preferable.

The epoxy resin composition for conductive resin paste of the present invention preferably also contains a curing accelerator for epoxy resin in order to smoothly carry out the curing reaction. As the curing accelerator for the epoxy resin, any known publicly known epoxy resin can be used, for example,
Imidazoles such as 2-methylimidazole, 2-ethyl-4-methylimidazole and 2-phenylimidazole; benzyldimethylamine; 2,4,6-tris (dimethylaminomethyl) phenol; 1,4-diazabicyclo [2.2] 1.2. ] Octane; 1,8-diazabicyclo [5.4.0. ] Tertiary amines such as -7-undecene; phosphines such as triphenylphosphine; quaternary ammonium salts such as tetrabutylammonium bromide and benzyltriethylammonium bromide; phosphonium salts such as tetraphenylammonium bromide. The amount of the curing accelerator for the epoxy resin mixed is preferably 0.01% by mass or more based on the total mass of the epoxy resin (A) and the polyhydric phenol (B), and 10.00% by mass. The following is preferable. If it is out of this range, there is a possibility that a good curing acceleration effect cannot be obtained. More preferably, it is 0.1% by mass or more and 5% by mass or less.

Since the epoxy resin composition for a conductive resin paste of the present invention contains the above-mentioned polyphenol (B), it is excellent without using a compound having a halogen atom, a phosphorus compound or an antimony compound as a flame retardant. Although it exhibits flame retardancy, well-known flame retardants that are usually used can be appropriately used in combination. Such a flame retardant is not particularly limited as long as it exhibits a flame retardant effect, and examples thereof include phosphorus-containing compounds, fluorine compounds, silicon compounds, antimony compounds, nitrogen compounds, sulfur compounds, boron compounds,
Examples include heat-expandable graphite, metal oxides, metal hydroxides, alkali (earth) metal salts, polynuclear substituted hydroxystyrenes, alcohol compounds and the like. These may be used alone or in combination of two or more. Among these, it is preferable to use one that does not contain a halogen atom because a gas harmful to the environment may be generated during combustion.

In the epoxy resin composition for conductive resin paste of the present invention, a thermoplastic resin, a filler, and
Fiber reinforcement, solvent, pigment, colorant, flameproofing agent, defoaming agent, wetting agent, dispersant, rust inhibitor, antistatic agent, surface treatment agent, release agent, elastomer, lubricant, plasticizer, UV absorption An agent, a light stabilizer, an antioxidant, a heat resistance stabilizer, an antiaging agent, an anti-drip agent and the like can be added. Further, an impact strength improver for improving the properties of the epoxy resin composition for a conductive resin paste, a compatibilizing component and the like may be added. The blending amount of these is not particularly limited and may be appropriately set according to the intended use or the desired performance. The total blending amount of these additives is based on 100 parts by weight of the epoxy resin (A). For example, it is preferably 0.01 part by weight or more, and preferably 50 parts by weight or less. The amount is more preferably 0.1 part by weight or more, and further preferably 0.5 part by weight or more. Further, it is more preferably 30 parts by weight or less, and further preferably 20 parts by weight or less.

As a solvent to be optionally added to the epoxy resin composition for a conductive resin paste of the present invention, an organic solvent such as a ketone compound, an alkylene glycol ether compound, an alcohol compound or an aromatic compound is suitable, One kind or two or more kinds can be used. Suitable ketone compounds include acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone.
As the alkylene glycol compound, methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl cellosolve acetate, ethyl cellosolve acetate, butyl cellosolve acetate, ethylene glycol monopropyl ether, ethylene glycol monohexyl ether, ethylene glycol dimethyl ether, diethylene glycol ethyl ether, diethylene glycol diethyl ether, propylene. Glycol monomethyl ether, propylene glycol dimethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, propylene glycol monomethyl ether acetate, diethylene glycol methyl ether acetate, diet Glycol ether ether, diethylene glycol propyl ether acetate, diethylene glycol isopropyl ether acetate, diethylene glycol butyl ether acetate, diethylene glycol tert-butyl ether acetate, triethylene glycol methyl ether acetate, triethylene glycol ethyl ether acetate, triethylene glycol propyl ether acetate, triethylene Glycol isopropyl ether acetate, triethylene glycol butyl ether acetate, triethylene glycol-t-butyl ether acetate and the like are preferable, and as the alcohol compound,
Methyl alcohol, ethyl alcohol, isopropyl alcohol, n-butyl alcohol, 3-methyl-3-methoxybutanol and the like are preferable, and aromatic compounds include benzene, toluene, xylene and N-methyl-2-.
Pyrrolidone, N-hydroxymethyl-2-pyrrolidone and the like are preferable, and in addition, organic solvents such as 3-methyl-3-methoxybutyl acetate, ethyl acetate, tetrahydrofuran and dioxane are preferable.

The method for producing the epoxy resin composition for a conductive resin paste of the present invention is not particularly limited, and the epoxy resin (A), the polyhydric phenols (B) and the conductive powder (C), which are essential components, are used. And other components that are added as necessary can be mixed.
The mixing method is not particularly limited as long as it can uniformly mix these, and for example, mixing by a mixing machine such as an extruder, a Henschel mixer, a Banbury mixer, a kneader, a heating roll, kneading, etc. are applied. be able to.

There are no particular restrictions on the molding conditions for the epoxy resin composition for conductive resin paste of the present invention.
The molding temperature is preferably 80 ° C. or higher, and
The temperature is preferably 300 ° C or lower. By heating at such a temperature, when the epoxy resin composition for conductive resin paste contains a solvent, the solvent volatilizes and the curing of the epoxy resin composition proceeds. More preferably, it is 120 ° C. or higher and 200 ° C. or lower.

The epoxy resin composition for a conductive resin paste of the present invention is capable of eliminating the influence on the environment and the human body and has excellent workability because it has fluidity at room temperature and excellent heat resistance. It has mechanical and electrical properties. The epoxy resin composition for a conductive resin paste of the present invention can be suitably used as a bonding agent, for example, as a substitute for solder when bonding a semiconductor element to a supporting member. Further, it is preferably used as a conductive paste, and for example, when the epoxy resin composition for a conductive resin paste of the present invention is filled in a via hole provided for establishing conduction between insulating layers in a build-up printed wiring board, a line is incorporated. Since it is possible to manufacture an elliptical substrate, it is possible to form a complicated circuit in a limited substrate space. Thus, the epoxy resin composition for a conductive resin paste of the present invention is used as a bonding agent for bonding a semiconductor element to a supporting member, or as a conductive paste for establishing conduction between insulating layers of a buildup printed wiring board. Is one of the preferred embodiments of the present invention.

[0054]

The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples. Unless otherwise specified, "part" is
"Parts by weight" and "%" mean "% by mass", respectively.

Synthesis Example 1 Phenol 701.2 was placed in a 4-neck 1 L flask equipped with a gas inlet, a Dean-Stark trap and a stir bar.
g, 1,4-diacetoxymethylbenzene 231.8
g, 83.7 g of benzoguanamine, and 79.8 g of 37% formaldehyde were charged, and p of the mixture in the system was added with oxalic acid.
After adjusting the H to 5 or less, the temperature was raised to 120 ° C. with stirring under a nitrogen gas flow. Water started to be generated from around 105 ° C., and 90 g of water was collected in the trap over 5 hours. 21.2 g of a strongly acidic ion exchange resin (trade name “Amberlyst 15 Dry”, manufactured by Rohm & Haas Co.) was charged, and the temperature was further increased in a nitrogen stream. Acetic acid starts to be generated at around 145 ° C, and while collecting acetic acid in the trap, 1
The temperature was raised to 70 ° C. and kept for 8 hours. Since the production of acetic acid was completed when 123 g was collected, after cooling, the ion exchange resin was recovered by filtration, the temperature was raised to 180 ° C. again, unreacted phenol was distilled off under reduced pressure, and after cooling, a brown solid polyvalent Phenol A was obtained. The yield was 440 g, the thermal softening temperature was 58 ° C., and the hydroxyl value was 172 g / mol.

Synthesis Example 2 Phenol 658.8 was placed in a 4-neck 1 L flask equipped with a gas inlet, a Dean-Stark trap, and a stirring rod.
g, 2,6-diacetoxymethylnaphthalene 266.9
g, benzoguanamine 78.6 g, and 37% formaldehyde 75.0 g were charged, and oxalic acid was added to prepare a mixture of p
After adjusting the H to 5 or less, the temperature was raised to 120 ° C. with stirring under a nitrogen gas flow. Water started to be generated from around 105 ° C., and 80 g of water was collected in the trap over 5 hours. 20.9 g of a strongly acidic ion exchange resin (trade name “Amberlyst 15 Dry”, manufactured by Rohm & Haas Co.) was charged, and the temperature was further increased in a nitrogen stream. Acetic acid starts to be generated at around 145 ° C, and while collecting acetic acid in the trap, 1
The temperature was raised to 70 ° C. and kept for 8 hours. The production was completed when 115 g of acetic acid had been recovered, so after cooling, the ion exchange resin was recovered by filtration, the temperature was raised to 180 ° C. again, unreacted phenol was distilled off under reduced pressure, and after cooling, a brown solid polyvalent Phenol B was obtained. The yield was 423 g, the thermal softening temperature was 73 ° C., and the hydroxyl value was 186 g / mol.

Synthesis Example 3 Phenol 564.7 was placed in a 4-neck 1 L flask equipped with a gas inlet, a Dean-Stark trap, and a stirring rod.
g, benzoguanamine 224.6 g, and 37% formaldehyde 195.8 g were charged, and the pH of the mixture in the system was adjusted to 9 or more with triethylamine, and then the temperature was raised to 80 ° C. with stirring under a nitrogen gas flow. After holding for 3 hours, the temperature rise was started again under the flow of nitrogen gas. 1
Water started to be generated from around 05 ° C, the temperature was raised to 150 ° C while collecting water in the trap, and the temperature was maintained for 8 hours. Water 165
Since the generation of water was completed when g was collected in the trap, unreacted phenol was distilled off under reduced pressure, and after cooling, polyphenol C was obtained as a brown solid. The yield was 480 g, the thermal softening temperature was 81 ° C., and the hydroxyl value was 170 g / mol.

Synthesis Example 4 A 4-liter 1-L flask equipped with a gas inlet, a Dean-Stark trap, and a stirring rod was charged with 302.6 g of p-xylylene glycol, 687.0 g of phenol, and 13.2 g of p-toluenesulfonic acid. The temperature rise was started in a nitrogen stream. Water started to be generated from around 115 ° C., the temperature was raised to 150 ° C. while collecting water in the trap, and the temperature was maintained for 6 hours. After 79 g of water had been collected, the generation of water was completed, so after cooling, the product was washed with ion-exchanged water, heated to 180 ° C. again, the unreacted phenol was distilled off under reduced pressure, and a brown solid was obtained after cooling. Polyhydric phenol D was obtained. Yield 487g, thermal softening temperature 48 ° C, hydroxyl value 152g /
It was mol.

Production Example of Epoxy Resin Composition for Conductive Paste As a low-viscosity liquid epoxy resin, a low molecular weight bisphenol F type epoxy resin (trade name "YDF-170", epoxy equivalent 170 g / mol, manufactured by Toto Kasei Co., Ltd.) or low Molecular weight bisphenol A type epoxy resin (trade name "Araldite AER2600", epoxy equivalent 190g / mo
1, manufactured by Ciba-Geigy Co., Ltd.)
D, propylene glycol methyl ether acetate (trade name "PGM-AC", manufactured by Kuraray Co., Ltd.) or diethylene glycol ethyl ether acetate (trade name "ethyl diglycol acetate", manufactured by Daicel Chemical Industries, Ltd., hereinafter abbreviated as DEGE-AC as a solvent ), 2-ethyl-4-methylimidazole (trade name "2E4MZ", manufactured by Shikoku Chemicals Co., Ltd.) as a curing accelerator, and commercially available silver powder (purity 99.9% or more, average particle diameter 2 μm). The composition shown in 2 was mixed at 60 ° C. and further kneaded with a three-roll to obtain an epoxy resin composition for conductive paste.

Test 1 (Semiconductor Chip / Leadframe Bondability Test) After bonding the semiconductor chip and the leadframe using the compositions shown in Tables 1 and 2, 200 ° C. for 30 seconds using a heat block. The semiconductor device was manufactured by bonding under the conditions of (1) and (2). These semiconductor devices were tested for adhesive strength, appearance change, conductivity, and semiconductor warpage. The results are shown in Tables 1 and 2.

Test 2 (Adhesion Test to Printed Wiring Board) Using the compositions shown in Tables 1 and 2, a glass epoxy type copper clad laminate (flame retardant grade: 94V-0, constitution: F) was used.
R-4, trade name "R-1705", manufactured by Matsushita Electric Works, Ltd.), a line having a width of 200 μm and a length of 30 mm is printed by screen printing, and cured at 170 ° C. for 15 minutes,
A conductive cured film was prepared. A lead-free solder paste (alloy composition: 96.5% tin, 3.5% silver, melting point 221 ° C., manufactured by Harima Kasei Co., Ltd.) was applied onto this cured film, and 150 ° C. × 2
Soldering reflow was performed under the condition of 230 ° C. × 20 seconds for 2 minutes. After the solder reflow, the adjusted copper-clad laminate was subjected to 100 cycles of cold heat treatment at −40 ° C. for 30 minutes + 110 ° C. for 30 minutes. After the test, changes in adhesiveness and appearance of the conductive cured film were observed. The results are shown in Tables 1 and 2.

[0062]

[Table 1]

[0063]

[Table 2]

Tables 1 and 2 will be described below.
In the epoxy resin, YDF-170 (trade name) is a low molecular weight bisphenol F type epoxy resin (manufactured by Toto Kasei Co., Ltd.), and AER2600 is a low molecular weight bisphenol A type epoxy resin (trade name "Araldite AE".
R2600 ", manufactured by Ciba-Geigy). In the solvent, PGM-AC (trade name) is propylene glycol methyl ether acetate (manufactured by Kuraray Co., Ltd.), and D
EGE-AC is diethylene glycol ethyl ether acetate (trade name "ethyl diglycol acetate", manufactured by Daicel Chemical Industries, Ltd.). In the curing accelerator, 2E4MZ (trade name) is 2-ethyl-4-methylimidazole (manufactured by Shikoku Chemicals Co., Ltd.).

From Tables 1 and 2, as compared with the comparative examples, the resin compositions of the respective examples are halogen-free, and in addition to the recent severe environmental conditions such as surface mounting and lead-free solder reflow. It was revealed that even if exposed, it exhibits excellent practicality.

[0066]

EFFECTS OF THE INVENTION The epoxy resin composition for conductive resin paste of the present invention has the above-mentioned constitution, so that it is possible to eliminate the influence on the environment and human body, and at the same time, it has fluidity at room temperature. Excellent and excellent in heat resistance, mechanical properties, and electrical characteristics, so as a bonding agent for bonding a semiconductor element to a supporting member, or as a conductive paste for establishing conduction between insulating layers of a buildup printed wiring board It is preferably applied.

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 4J002 CD001 DA037 DA077 DA087                       EC036 EC046 EU186 FA087                       FD117 GJ02                 4J036 AA01 FA02 FA12 JA01                 5F047 BA34 BA35 BA52 BB11                 5G301 DA03 DA42 DA57 DD01 DD02

Claims (2)

[Claims] 1. An epoxy resin (A), phenols and the following general formula (1); (In the formula, R ¹ is the same or different and represents an amino group, a methylolamino group or a dimethylolamino group.
² represents a hydrocarbon group having 1 to 12 carbon atoms. ) An epoxy resin for a conductive resin paste, which comprises a polyhydric phenol (B) obtained by reacting a reaction raw material containing a compound represented by the formula (1) and a conductive powder (C) as essential components. Composition. 2. The reaction raw material of the polyhydric phenol (B) is further represented by the following general formula (2); (In the formula, R ³ represents a phenylene group, an alkyl-substituted phenylene group, a naphthalene group, an alkyl-substituted naphthalene group, a biphenyl group or an alkyl-substituted biphenyl group.
⁴ are the same or different and represent a hydroxyl group, an alkyl ether group having 1 to 4 carbon atoms or an alkyl ester group having 1 to 4 carbon atoms. The epoxy resin composition for conductive resin pastes of Claim 1 containing the compound represented by these.