JP2003233188A5 - - Google Patents
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- Publication number
- JP2003233188A5 JP2003233188A5 JP2002032449A JP2002032449A JP2003233188A5 JP 2003233188 A5 JP2003233188 A5 JP 2003233188A5 JP 2002032449 A JP2002032449 A JP 2002032449A JP 2002032449 A JP2002032449 A JP 2002032449A JP 2003233188 A5 JP2003233188 A5 JP 2003233188A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- alicyclic hydrocarbon
- hydrocarbon group
- general formula
- linear
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 125000002723 alicyclic group Chemical group 0.000 claims 8
- 125000000217 alkyl group Chemical group 0.000 claims 6
- 125000004432 carbon atoms Chemical group C* 0.000 claims 5
- 125000004435 hydrogen atoms Chemical group [H]* 0.000 claims 3
- 239000002253 acid Substances 0.000 claims 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 2
- 125000002947 alkylene group Chemical group 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 125000000753 cycloalkyl group Chemical group 0.000 claims 1
- 238000004090 dissolution Methods 0.000 claims 1
- 125000004185 ester group Chemical group 0.000 claims 1
- 125000001033 ether group Chemical group 0.000 claims 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 claims 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims 1
- 125000005647 linker group Chemical group 0.000 claims 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims 1
- 125000003718 tetrahydrofuranyl group Chemical group 0.000 claims 1
- 125000001412 tetrahydropyranyl group Chemical group 0.000 claims 1
Claims (2)
Ｒ12〜Ｒ16は、各々独立に、炭素数１〜４個の、直鎖もしくは分岐のアルキル基又は脂環式炭化水素基を表す。但し、Ｒ12〜Ｒ14のうち少なくとも１つ、及びＲ15、Ｒ16のいずれかは脂環式炭化水素基を表す。
Ｒ17〜Ｒ21は、各々独立に、水素原子、炭素数１〜４個の、直鎖もしくは分岐のアルキル基又は脂環式炭化水素基を表し、但し、Ｒ17〜Ｒ21のうち少なくとも１つは脂環式炭化水素基を表す。また、Ｒ19、Ｒ21のいずれかは炭素数１〜４個の、直鎖もしくは分岐のアルキル基又は脂環式炭化水素基を表す。
Ｒ22〜Ｒ25は、各々独立に、炭素数１〜４個の、直鎖もしくは分岐のアルキル基又は脂環式炭化水素基を表し、但し、Ｒ22〜Ｒ25のうち少なくとも１つは脂環式炭化水素基を表す。また、Ｒ23とＲ24は、互いに結合して環を形成していてもよい。
Ｒ2は、水素原子又はアルキル基を表す。
Ｒ3は、脂環式炭化水素基を表す。
Ｒ4は、鎖状３級アルキル基、１−アルコキシアルキル基、テトラヒドロピラニル基又はテトラヒドロフラニル基を表す。
Ａ1及びＡ2は、各々独立に、単結合、アルキレン基、エーテル基、カルボニル基、エステル基のいずれか、またはその組み合わせを表す。(A) A resin containing a repeating unit represented by the following general formula (I) and a repeating unit represented by the following general formula (II) whose dissolution rate in an alkaline developer is increased by the action of an acid; B) A positive resist composition containing a compound that generates an acid upon irradiation with actinic rays or radiation.
R 12 to R 16 each independently represents a linear or branched alkyl group having 1 to 4 carbon atoms or an alicyclic hydrocarbon group. However, at least one of R 12 to R 14 and any one of R 15 and R 16 represents an alicyclic hydrocarbon group.
R 17 to R 21 each independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 4 carbon atoms, or an alicyclic hydrocarbon group, provided that at least one of R 17 to R 21 Represents an alicyclic hydrocarbon group. Further, either R 19 or R 21 represents a linear or branched alkyl group or alicyclic hydrocarbon group having 1 to 4 carbon atoms.
R 22 to R 25 each independently represents a linear or branched alkyl group having 1 to 4 carbon atoms or an alicyclic hydrocarbon group, provided that at least one of R 22 to R 25 is a fat Represents a cyclic hydrocarbon group. R 23 and R 24 may be bonded to each other to form a ring.
R 2 represents a hydrogen atom or an alkyl group.
R 3 represents an alicyclic hydrocarbon group.
R 4 represents a chain tertiary alkyl group, a 1-alkoxyalkyl group, a tetrahydropyranyl group, or a tetrahydrofuranyl group.
A 1 and A 2 each independently represents a single bond, an alkylene group, an ether group, a carbonyl group, an ester group, or a combination thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002032449A JP3907171B2 (en) | 2002-02-08 | 2002-02-08 | Positive resist composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002032449A JP3907171B2 (en) | 2002-02-08 | 2002-02-08 | Positive resist composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003233188A JP2003233188A (en) | 2003-08-22 |
| JP2003233188A5 true JP2003233188A5 (en) | 2005-04-07 |
| JP3907171B2 JP3907171B2 (en) | 2007-04-18 |
Family
ID=27775568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002032449A Expired - Fee Related JP3907171B2 (en) | 2002-02-08 | 2002-02-08 | Positive resist composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3907171B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004067592A1 (en) * | 2003-01-31 | 2004-08-12 | Mitsubishi Rayon Co., Ltd. | Resist polymer and resist composition |
| WO2004096787A1 (en) * | 2003-04-28 | 2004-11-11 | Mitsubishi Chemical Corporation | Polycyclic lactones, (meth)acrylates having polycyclic lactone structures, and process for production thereof |
| JP4191103B2 (en) | 2004-07-02 | 2008-12-03 | 東京応化工業株式会社 | Positive resist composition and resist pattern forming method |
| JP5250226B2 (en) * | 2007-09-04 | 2013-07-31 | 東京応化工業株式会社 | POLYMER COMPOUND, POSITIVE RESIST COMPOSITION, AND METHOD FOR FORMING RESIST PATTERN |
| US8029972B2 (en) * | 2007-10-11 | 2011-10-04 | Tokyo Ohka Kogyo Co., Ltd. | Resist composition and method of forming resist pattern |
| JP6959726B2 (en) * | 2015-11-16 | 2021-11-05 | 住友化学株式会社 | Method for producing compound, resin, resist composition and resist pattern |
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2002
- 2002-02-08 JP JP2002032449A patent/JP3907171B2/en not_active Expired - Fee Related