JP2003229515A - Bga part, method for mounting same and semiconductor device - Google Patents
Bga part, method for mounting same and semiconductor deviceInfo
- Publication number
- JP2003229515A JP2003229515A JP2002029075A JP2002029075A JP2003229515A JP 2003229515 A JP2003229515 A JP 2003229515A JP 2002029075 A JP2002029075 A JP 2002029075A JP 2002029075 A JP2002029075 A JP 2002029075A JP 2003229515 A JP2003229515 A JP 2003229515A
- Authority
- JP
- Japan
- Prior art keywords
- bga component
- positioning terminal
- bga
- mounting
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、配線基板に実装す
るＢＧＡ（Ball Grid Array）部品、ＢＧＡ部品の実装
方法及び半導体装置に関し、特に、配線基板への実装時
の位置決め及び実装高さの精度を向上させたＢＧＡ部
品、ＢＧＡ部品の実装方法及び半導体装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a BGA (Ball Grid Array) component to be mounted on a wiring board, a method of mounting the BGA component, and a semiconductor device, and more particularly to positioning and mounting height accuracy when mounting on a wiring board. The present invention relates to a BGA component, a method for mounting the BGA component, and a semiconductor device, which improve
【０００２】[0002]
【従来の技術】近年、電子機器における小型化、高機能
化に伴い、電子回路を構成する電子部品における多端子
化、狭ピッチ化の要求が強くなっている。この要求に対
して、電子部品（ＬＳＩ）のパッケージ下部にグリッド
状の電極を設け、その電極上に接続用の半田ボールを設
けたＢＧＡと呼ばれるパッケージの部品（以下、ＢＧＡ
部品という）が提案され、実用化されている。2. Description of the Related Art In recent years, with the miniaturization and higher functionality of electronic equipment, there has been an increasing demand for electronic terminals constituting electronic circuits to have a large number of terminals and a narrow pitch. In response to this requirement, a package component called BGA (hereinafter, referred to as BGA) in which a grid-like electrode is provided under a package of an electronic component (LSI) and a solder ball for connection is provided on the electrode
Parts) have been proposed and put into practical use.
【０００３】このＢＧＡ部品の接続端子となる球状の半
田ボールは、部品の裏面に配置されており、プリント配
線基板に実装する場合、半田接続部がＢＧＡ部品の下部
となる。このため、プリント配線基板との実装位置を合
わせることが難しく、実装後の接続状態の確認も困難で
あるという課題があった。The spherical solder balls, which are the connection terminals of the BGA component, are arranged on the back surface of the component, and when mounted on the printed wiring board, the solder connection portion is the lower portion of the BGA component. Therefore, there is a problem that it is difficult to align the mounting position with the printed wiring board, and it is also difficult to confirm the connection state after mounting.
【０００４】この課題を解決するため、例えば、特開平
１０−７４７９２号公報には、電極用半田ボールより高
融点の位置決め用半田ボールを設け、プリント配線基板
のスルーホールにより実装位置を決める方法が開示され
ている（以下、この技術を従来例１という）。To solve this problem, for example, Japanese Patent Laid-Open No. 10-74792 discloses a method of providing a positioning solder ball having a melting point higher than that of an electrode solder ball and determining a mounting position by a through hole of a printed wiring board. It is disclosed (hereinafter, this technique is referred to as Conventional Example 1).
【０００５】また、特開平１１−１７３０７号公報に
は、半導体装置にガイドピンと導電パンプを設け、プリ
ント基板にはガイドピンと導電パンプに接触される接続
パッドを凹設し、半導体装置をプリント基板に実装する
際には、ガイドピンをガイドホールに挿入して半田付け
することにより、導電パンプが接続パッドに接触して電
気接続が行われる半導体装置の実装構造が開示されてい
る（以下、この技術を従来例２という）。In Japanese Patent Laid-Open No. 11-17307, a semiconductor device is provided with a guide pin and a conductive pump, and a printed board is provided with a recessed connection pad for contacting the guide pin and the conductive pump. A mounting structure of a semiconductor device is disclosed in which, when mounting, a guide pin is inserted into a guide hole and soldered so that a conductive pump comes into contact with a connection pad for electrical connection. Is referred to as Conventional Example 2).
【０００６】また、特開平７−２４９７０９号公報に
は、プリント配線板に形成された孔と係合して位置決め
する位置決めピンを備えた半導体チップが開示されてい
る。この位置決めピンの縦方向の略中心位置には、十文
字状に突出したストッパが形成されている。ストッパ
は、プリント配線板表面に当接して位置規制している
（以下、この技術を従来例３という）。Further, Japanese Unexamined Patent Publication No. 7-249709 discloses a semiconductor chip provided with a positioning pin that engages with a hole formed in a printed wiring board and positions it. A stopper protruding in a cross shape is formed at a substantially central position in the vertical direction of the positioning pin. The stopper comes into contact with the surface of the printed wiring board to regulate the position (hereinafter, this technique is referred to as Conventional Example 3).
【０００７】さらに、特開平１１−１１１７７２号公報
には、半導体などのチップ部品を配線基板に実装する場
合に、チップ部品と配線基板を中継するキャリア基板の
配線基板との接続面側に、実装位置決め用端子パッドを
キャリア基板の４隅のうち対角になる２隅にそれぞれ設
け、実装位置決め用端子パッドに実装位置決め用半田バ
ンプを設け、キャリア基板を実装する配線基板に、実装
位置決め用半田バンプに対向する位置に実装位置決め用
穴を設け、実装位置決め用半田バンプを実装位置決め用
穴に合わせて置き、キャリア基板を配線基板に固定する
キャリア基板の実装位置決め方法が開示されている（以
下、この技術を従来例４という）。Further, in Japanese Laid-Open Patent Publication No. 11-111772, when a chip component such as a semiconductor is mounted on a wiring board, the chip component and the wiring board are mounted on the connection surface side of the carrier board for relaying the wiring board. Positioning terminal pads are provided at two diagonal corners of the four corners of the carrier board, mounting positioning solder bumps are provided on the mounting positioning terminal pads, and mounting positioning solder bumps are provided on the wiring board on which the carrier board is mounted. There is disclosed a mounting and positioning method for a carrier substrate, in which a mounting and positioning hole is provided at a position opposite to the mounting position, a mounting and positioning solder bump is aligned with the mounting and positioning hole, and the carrier substrate is fixed to a wiring board. The technology is called Conventional Example 4).
【０００８】[0008]
【発明が解決しようとする課題】従来例１では、プリン
ト配線基板に設けられたスルーホールの径を位置決め用
半田ボールの径より大きくなるように形成して、セルフ
アライメントにより位置決めを行うため、高い精度の位
置決めを行うことができない。その結果、実装位置のず
れが発生する場合がある。In the prior art example 1, since the diameter of the through hole provided in the printed wiring board is formed to be larger than the diameter of the positioning solder ball and the positioning is performed by self-alignment, it is high. Inaccurate positioning cannot be performed. As a result, the mounting position may shift.
【０００９】また、位置決め用半田ボールの沈み込みを
支える構造を有しておらず、電極用半田ボールのつぶれ
を抑制することができない。そのため、ＢＧＡ部品の重
心が偏心する場合、実装高さが均一とならない。その結
果、実装高さのばらつきや半田ボールのつぶれが発生す
る場合がある。半田のつぶれが発生すると半田ボール同
士が互いに短絡する場合がある。Further, since it does not have a structure for supporting the sinking of the positioning solder ball, it is impossible to suppress the collapse of the electrode solder ball. Therefore, when the center of gravity of the BGA component is eccentric, the mounting height is not uniform. As a result, mounting height variations and solder ball crush may occur. When the solder is crushed, the solder balls may be short-circuited with each other.
【００１０】従来例２では、ガイドピンをガイドホール
に挿入して半田付けしてあるだけなので、ガイドピンの
挿入位置にばらつきが生じ、ＢＧＡ部品を所望の実装高
さで精度よく支えることは困難である。In the conventional example 2, since the guide pin is simply inserted into the guide hole and soldered, the insertion position of the guide pin varies, and it is difficult to accurately support the BGA component at a desired mounting height. Is.
【００１１】従来例３では、位置決めピンの縦方向の略
中心位置にプリント配線板表面に当接するストッパが形
成されているが、このストッパは、十文字状に突出した
ものであり、強度が強くなく、当接時に折れ曲がる可能
性があり、ＢＧＡ部品を所望の実装高さで確実に支える
ことは困難である。また、位置決めピンを対称に配置し
ているので、実装向きを誤る可能性がある。In the conventional example 3, a stopper is formed at a substantially central position in the vertical direction of the positioning pin so as to come into contact with the surface of the printed wiring board. However, this stopper is a cross-shaped projection and is not strong. However, there is a possibility of bending at the time of contact, and it is difficult to reliably support the BGA component at the desired mounting height. Moreover, since the positioning pins are arranged symmetrically, the mounting direction may be wrong.
【００１２】従来例４では、ＢＧＡ部品に配置されてい
る位置決め半田バンプの径が配線用半田バンプの径より
大きいため、配線用端子数の減少が大きくなる。また、
位置決めを半田バンプで行っているため、リフロー時に
位置ずれが発生する可能性があり、実装精度が低くな
る。In Conventional Example 4, since the diameter of the positioning solder bumps arranged on the BGA component is larger than the diameter of the wiring solder bumps, the number of wiring terminals is greatly reduced. Also,
Since the solder bumps are used for positioning, there is a possibility that misalignment may occur during reflow, resulting in low mounting accuracy.
【００１３】本発明は、上記課題を解決するためになさ
れたものであり、配線基板への実装時の位置決め及び実
装高さの精度を向上させたＢＧＡ部品、ＢＧＡ部品の実
装方法及び半導体装置を提供することを目的とする。The present invention has been made in order to solve the above problems, and provides a BGA component, a BGA component mounting method, and a semiconductor device which are improved in positioning and mounting height accuracy during mounting on a wiring board. The purpose is to provide.
【００１４】[0014]
【課題を解決するための手段】本発明のＢＧＡ部品は、
電子部品を搭載した本体と、その本体の裏面に配置され
た複数の電極パッドと、その電極パッド上に設けられた
接続用半田ボールとを有するＢＧＡ部品において、前記
本体の裏面には、前記ＢＧＡ部品が実装される配線基板
に形成されたスルーホール内に挿入され、半田の溶融温
度で溶融しない材質で形成された位置決め用端子が設け
られ、前記位置決め用端子は、前記スルーホールに嵌入
される嵌入部と、前記嵌入部よりも径が大きく、所望の
実装高さ分の長さを実質的に備えた支持部とからなるこ
とを特徴とするものである。The BGA component of the present invention comprises:
A BGA component having a main body on which an electronic component is mounted, a plurality of electrode pads arranged on the back surface of the main body, and connecting solder balls provided on the electrode pad. A positioning terminal is provided which is inserted into a through hole formed in a wiring board on which a component is mounted and which is made of a material that does not melt at the melting temperature of solder, and the positioning terminal is fitted into the through hole. It is characterized by comprising a fitting portion and a supporting portion having a diameter larger than that of the fitting portion and having substantially a length corresponding to a desired mounting height.
【００１５】前記スルーホール内には、半田の溶融温度
で溶融しない材質で形成され、前記スルーホールに嵌入
される挿入部と、前記挿入部から外側に向かって形成さ
れた当接部とからなるガイド部材が設けられ、前記ガイ
ド部材の挿入部に、前記位置決め用端子の嵌入部が嵌入
され、前記ガイド部材の当接部上に前記位置決め用端子
の支持部が当接してもよい。Inside the through hole, there is an insert portion formed of a material that does not melt at the melting temperature of the solder and fitted into the through hole, and an abutting portion formed outward from the insert portion. A guide member may be provided, the fitting portion of the positioning terminal may be fitted into the insertion portion of the guide member, and the support portion of the positioning terminal may abut on the abutting portion of the guide member.
【００１６】前記ガイド部材の当接部の当接面は外側に
向かって幅広に傾斜して形成され、前記位置決め用端子
の支持部の当接面は、前記ガイド部材の当接部の当接面
に沿って傾斜して形成されていてもよい。An abutting surface of the abutting portion of the guide member is formed so as to be wide and inclined outward, and an abutting surface of the supporting portion of the positioning terminal abuts the abutting portion of the guide member. It may be formed to be inclined along the surface.
【００１７】前記位置決め用端子は、金属で作られてい
てもよく、例えば、Ｃｕ、Ｃｕ合金、Ｆｅ−Ｎｉ合金か
らなる群から選択される物質で作られていてもよい。The positioning terminal may be made of a metal, for example, a material selected from the group consisting of Cu, Cu alloys, and Fe-Ni alloys.
【００１８】前記位置決め用端子は、本体の中心線を間
に挟んで非対称に配置されていてもよい。The positioning terminals may be arranged asymmetrically with the center line of the main body interposed therebetween.
【００１９】本発明のＢＧＡ部品の実装方法は、前記記
載のＢＧＡ部品を配線基板に実装するＢＧＡ部品の実装
方法であって、前記位置決め用端子表面に半田を塗布す
る工程と、前記位置決め用端子を配線基板のスルーホー
ル上に接するようにＢＧＡ部品を位置決めする工程と、
前記ＢＧＡ部品及び配線基板を半田の溶融温度で加熱す
る工程と、前記位置決め用端子に塗布された半田が溶融
して、ＢＧＡ部品の自重によりＢＧＡ部品の位置決め用
端子の嵌入部が前記スルーホール内に嵌合するととも
に、前記ＢＧＡ部品の接続用半田ボールが配線基板のパ
ッド上に接続される工程とを有することを特徴とするも
のである。A BGA component mounting method of the present invention is a BGA component mounting method for mounting the BGA component described above on a wiring board, which comprises a step of applying solder to the surface of the positioning terminal and the positioning terminal. Positioning the BGA component so that the BGA is in contact with the through hole of the wiring board,
The step of heating the BGA component and the wiring board at the melting temperature of the solder, and the solder applied to the positioning terminal is melted, and the fitting portion of the positioning terminal of the BGA component is inside the through hole due to the weight of the BGA component. And the step of connecting the solder balls for connection of the BGA component to the pads of the wiring board.
【００２０】本発明の半導体装置は、前記記載のＢＧＡ
部品と、前記ＢＧＡ部品を実装するための配線基板とを
有することを特徴とするものである。The semiconductor device of the present invention is the BGA described above.
It is characterized by having a component and a wiring board for mounting the BGA component.
【００２１】本発明によれば、位置決め用端子が、スル
ーホールに嵌入される嵌入部と、嵌入部よりも径が大き
く、所望の実装高さ分の長さを実質的に備えた支持部と
からなるので、加熱後のＢＧＡ部品の沈み込みを位置決
め用端子の支持部によって実装高さで支えることができ
る。According to the present invention, the positioning terminal includes the fitting portion to be fitted into the through hole, and the supporting portion having a diameter larger than that of the fitting portion and substantially having a length corresponding to a desired mounting height. Therefore, the sinking of the BGA component after heating can be supported at the mounting height by the support portion of the positioning terminal.
【００２２】[0022]
【発明の実施の形態】以下、本発明の実施の形態につい
て図面を参照して説明する。図１は、本発明の第１の実
施形態例を説明するための側面断面図であり、（Ａ）は
実装前の状態、（Ｂ）は実装後の状態を示す。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. 1A and 1B are side sectional views for explaining a first embodiment of the present invention, where FIG. 1A shows a state before mounting and FIG. 1B shows a state after mounting.
【００２３】図１に示すように、本発明の第１の実施形
態例に係る半導体装置は、ＢＧＡ部品１と、ＢＧＡ部品
１を実装するためのプリント配線基板２とを有する。As shown in FIG. 1, the semiconductor device according to the first embodiment of the present invention has a BGA component 1 and a printed wiring board 2 on which the BGA component 1 is mounted.
【００２４】ＢＧＡ部品１は、電子部品を搭載した本体
３と、その本体３の裏面に配置された複数の電極パッド
４と、その電極パッド４上に設けられた接続用半田ボー
ル５とを有する。The BGA component 1 has a main body 3 on which electronic components are mounted, a plurality of electrode pads 4 arranged on the back surface of the main body 3, and connecting solder balls 5 provided on the electrode pads 4. .
【００２５】ＢＧＡ部品１の本体３の裏面には、ＢＧＡ
部品１が実装されるプリント配線基板２に形成されたス
ルーホール６内に挿入され、半田の溶融温度で溶融しな
い材質で形成された位置決め用端子７が設けられてい
る。位置決め用端子７は、スルーホール６に嵌入される
円柱状の嵌入部７ａと、嵌入部７ａよりも径が大きく、
所望の実装高さＨ（図１（Ｂ）参照）分の長さを実質的
に備えた円柱上の支持部７ｂとからなる。嵌入部７ａと
支持部７ｂとの間には段差が形成される。On the back surface of the main body 3 of the BGA part 1, the BGA
A positioning terminal 7 is provided which is inserted into a through hole 6 formed in a printed wiring board 2 on which the component 1 is mounted and which is made of a material that does not melt at the melting temperature of solder. The positioning terminal 7 has a cylindrical fitting portion 7a fitted into the through hole 6, and a diameter larger than that of the fitting portion 7a.
It is composed of a cylindrical support portion 7b substantially having a desired mounting height H (see FIG. 1B). A step is formed between the fitting portion 7a and the support portion 7b.
【００２６】位置決め用端子７は、金属で作られている
のが好ましく、例えば、ＩＣのリードフレーム等に用い
られるＣｕ、Ｃｕ合金、４２合金（Ｆｅ−Ｎｉ合金）等
で作られる。The positioning terminal 7 is preferably made of metal, for example, Cu, Cu alloy, 42 alloy (Fe-Ni alloy) or the like used for IC lead frames and the like.
【００２７】次に、ＢＧＡ部品１の実装方法について説
明する。Next, a method of mounting the BGA component 1 will be described.
【００２８】まず、プリント配線基板２のパッド８に半
田を塗布する。また、ＢＧＡ部品１の位置決め用端子７
表面に半田メッキ９を塗布する（図１（Ａ）参照）。First, solder is applied to the pads 8 of the printed wiring board 2. In addition, the positioning terminal 7 of the BGA component 1
Solder plating 9 is applied to the surface (see FIG. 1A).
【００２９】次いで、位置決め用端子７をプリント配線
基板２のスルーホール６上に接するようにＢＧＡ部品１
を位置決めする。Next, the BGA component 1 is placed so that the positioning terminal 7 contacts the through hole 6 of the printed wiring board 2.
To position.
【００３０】次いで、ＢＧＡ部品１及び配線基板２を半
田の溶融温度で加熱（リフロー）する。この加熱によっ
て、接続用半田ボール５及び半田メッキ９が溶融して、
半田は液体状態となり、ＢＧＡ部品１は沈み込む。ＢＧ
Ａ部品１の自重によりＢＧＡ部品１の位置決め用端子７
の嵌入部７ａがプリント配線基板２のスルーホール６内
に嵌合する。それと同時に、ＢＧＡ部品１の接続用半田
ボール５がプリント配線基板２のパッド８上に接続され
る（図１（Ｂ）参照）。Next, the BGA component 1 and the wiring board 2 are heated (reflow) at the melting temperature of the solder. This heating melts the solder balls 5 for connection and the solder plating 9,
The solder becomes liquid, and the BGA component 1 sinks. BG
Positioning terminal 7 of BGA component 1 due to the weight of A component 1
The fitting portion 7a of is fitted into the through hole 6 of the printed wiring board 2. At the same time, the connecting solder balls 5 of the BGA component 1 are connected to the pads 8 of the printed wiring board 2 (see FIG. 1B).
【００３１】本発明の第１の実施形態例によれば、位置
決め用端子７が、スルーホール６に嵌入される嵌入部７
ａと、嵌入部７ａよりも径が大きく、所望の実装高さＨ
分の長さを実質的に備えた支持部７ｂとからなるので、
加熱後のＢＧＡ部品１の沈み込みを位置決め用端子７の
支持部７ｂによって実装高さＨで支えることができるの
で、所望する最適な実装高さが確実に得られる。また、
ＢＧＡ部品１の加熱前の実装位置が正確でなかった場合
であっても、位置決め用端子７がスルーホール６に嵌入
することにより、位置の補正を行うことができる。According to the first embodiment of the present invention, the positioning terminal 7 is fitted into the through hole 6, and the fitting portion 7 is fitted therein.
a, the diameter is larger than the fitting portion 7a, and the desired mounting height H
Since the support portion 7b substantially has a length of
Since the sinking of the BGA component 1 after heating can be supported at the mounting height H by the support portion 7b of the positioning terminal 7, the desired optimum mounting height can be reliably obtained. Also,
Even if the mounting position of the BGA component 1 before heating is not accurate, the position can be corrected by fitting the positioning terminal 7 into the through hole 6.
【００３２】図２は本発明の第２の実施形態例を説明す
るための側面断面図であり、（Ａ）は実装前の状態、
（Ｂ）は実装後の状態を示す。FIG. 2 is a side sectional view for explaining a second embodiment of the present invention, in which (A) is a state before mounting,
(B) shows a state after mounting.
【００３３】図２に示すように、第２の実施形態例で
は、プリント配線基板２のスルーホール６内には、半田
の溶融温度で溶融しない材質で形成され、スルーホール
６に嵌入される挿入部１０ａと、挿入部１０ａから外側
に向かって延びて形成された当接部１０ｂとからなる漏
斗状のガイド部材１０が固定して設けられている。ガイ
ド部材１０の挿入部１０ａに位置決め用端子７の嵌入部
７ａが嵌入され、ガイド部材１０の当接部１０ｂ上に位
置決め用端子７の支持部７ｂが当接する。As shown in FIG. 2, in the second embodiment, the through hole 6 of the printed wiring board 2 is formed of a material that does not melt at the melting temperature of the solder and is inserted into the through hole 6. A funnel-shaped guide member 10 composed of a portion 10a and an abutting portion 10b extending outward from the insertion portion 10a is fixedly provided. The insertion portion 7a of the positioning terminal 7 is inserted into the insertion portion 10a of the guide member 10, and the support portion 7b of the positioning terminal 7 contacts the contact portion 10b of the guide member 10.
【００３４】また、ガイド部材１０の当接部１０ｂの当
接面は外側に向かって幅広に傾斜して形成されており、
位置決め用端子７の支持部７ｂの当接面は、ガイド部材
１０の当接部１０ｂの当接面に沿って傾斜して形成され
ている。その他の構造及び実装方法については、第１の
実施形態例と同様である。The abutting surface of the abutting portion 10b of the guide member 10 is formed so as to be wide and inclined outward.
The contact surface of the support portion 7b of the positioning terminal 7 is formed to be inclined along the contact surface of the contact portion 10b of the guide member 10. Other structures and mounting methods are the same as those in the first embodiment.
【００３５】第２の実施形態例によれば、プリント配線
基板２のスルーホール６にガイド部材１０が設置され、
そのガイド部材１０にＢＧＡ部品１の位置決め用端子７
が挿入、当接されるので、実装位置、実装高さの決定を
より高い精度で行うことが可能となる。特に、ガイド部
材１０の当接部１０ｂの当接面が外側に向かって幅広に
傾斜して形成されて、位置決め用端子７の支持部７ｂの
当接面が、ガイド部材１０の当接部１０ｂの当接面に沿
って傾斜して形成されている場合には、位置決め用端子
７の挿入方向に対して垂直方向のずれを防止できる。According to the second embodiment, the guide member 10 is installed in the through hole 6 of the printed wiring board 2,
The guide member 10 is provided with a positioning terminal 7 for the BGA component 1.
Since it is inserted and abutted, the mounting position and the mounting height can be determined with higher accuracy. In particular, the abutting surface of the abutting portion 10b of the guide member 10 is formed so as to incline toward the outside so that the abutting surface of the supporting portion 7b of the positioning terminal 7 is the abutting portion 10b of the guide member 10. When it is formed so as to be inclined along the contact surface, it is possible to prevent the vertical displacement with respect to the insertion direction of the positioning terminal 7.
【００３６】図３（Ａ）及び（Ｂ）は位置決め用端子７
の配置例を示す裏面図である。位置決め用端子７は、図
３（Ａ）に示すように、ＢＧＡ部品１の本体３裏面の４
隅に設けている。この場合、位置決め用端子７は本体３
の中心線Ｌに対して対称に配置されているため、ＢＧＡ
部品１の実装向きを誤るおそれがある。3A and 3B show a positioning terminal 7
It is a back view which shows the example of arrangement | positioning. As shown in FIG. 3A, the positioning terminal 7 is provided on the back surface of the main body 3 of the BGA component 1 at 4
It is provided in the corner. In this case, the positioning terminal 7 is the main body 3
Since they are arranged symmetrically with respect to the center line L of
The mounting direction of the component 1 may be wrong.
【００３７】そこで、図３（Ｂ）に示すように、例え
ば、位置決め用端子７を３隅に設け、本体３の中心線Ｌ
に対して非対称に配置することにより、実装向きの誤り
を防止するのが好ましい。Therefore, as shown in FIG. 3B, for example, positioning terminals 7 are provided at three corners, and the center line L of the main body 3 is provided.
It is preferable to prevent an error in the mounting direction by arranging them asymmetrically.
【００３８】本発明は、上記実施の形態に限定されるこ
とはなく、特許請求の範囲に記載された技術的事項の範
囲内において、種々の変更が可能である。例えば位置決
め用端子７の配置、数は図示したものに限定されるもの
ではない。また、位置決め用端子７は、全て同じ寸法、
形状に限らず、各々異なるようにしてもよい。The present invention is not limited to the above-mentioned embodiment, and various modifications can be made within the scope of technical matters described in the claims. For example, the arrangement and number of the positioning terminals 7 are not limited to those shown in the figure. The positioning terminals 7 all have the same size,
Not limited to the shape, they may be different from each other.
【００３９】[0039]
【発明の効果】本発明によれば、位置決め用端子が、ス
ルーホールに嵌入される嵌入部と、嵌入部よりも径が大
きく、所望の実装高さ分の長さを実質的に備えた支持部
とからなるので、加熱後のＢＧＡ部品の沈み込みを位置
決め用端子の支持部によって実装高さで支えることがで
き、所望する最適な実装高さが確実に得られる。また、
ＢＧＡ部品の加熱前の実装位置が正確でなかった場合で
あっても、位置決め用端子がスルーホールに嵌入するこ
とにより、位置の補正を行うことができる。According to the present invention, the positioning terminal is provided with a fitting portion to be fitted into the through hole, and a support having a diameter larger than the fitting portion and having a length corresponding to a desired mounting height. Since the supporting portion of the positioning terminal can support the sinking of the BGA component after heating at the mounting height, the desired optimum mounting height can be reliably obtained. Also,
Even if the mounting position of the BGA component before heating is not correct, the position can be corrected by fitting the positioning terminal into the through hole.
【００４０】[0040]
【図１】本発明の第１の実施形態例を説明するための側
面断面図であり、（Ａ）は実装前の状態、（Ｂ）は実装
後の状態を示す。FIG. 1 is a side sectional view for explaining a first embodiment of the present invention, (A) showing a state before mounting and (B) showing a state after mounting.
【図２】本発明の第２の実施形態例を説明するための側
面断面図であり、（Ａ）は実装前の状態、（Ｂ）は実装
後の状態を示す。FIG. 2 is a side sectional view for explaining a second embodiment of the present invention, (A) showing a state before mounting and (B) showing a state after mounting.
【図３】（Ａ）及び（Ｂ）は位置決め用端子の配置例を
示す裏面図である。3A and 3B are rear views showing an example of arrangement of positioning terminals.
１：ＢＧＡ部品 ２：プリント配線基板 ３：本体 ４：電極パッド ５：接続用半田ボール ６：スルーホール ７：位置決め用端子 ７ａ：嵌入部 ７ｂ：支持部 ８：パッド ９：半田メッキ １０：ガイド部材 １０ａ：挿入部 １０ｂ：当接部 Ｌ：中心線 1: BGA parts 2: Printed wiring board 3: Main body 4: Electrode pad 5: Solder ball for connection 6: Through hole 7: Positioning terminal 7a: Fitting part 7b: support part 8: Pad 9: Solder plating 10: Guide member 10a: insertion part 10b: contact part L: Center line
Claims (8)
面に配置された複数の電極パッドと、その電極パッド上
に設けられた接続用半田ボールとを有するＢＧＡ部品に
おいて、 前記本体の裏面には、前記ＢＧＡ部品が実装される配線
基板に形成されたスルーホール内に挿入され、半田の溶
融温度で溶融しない材質で形成された位置決め用端子が
設けられ、前記位置決め用端子は、前記スルーホールに
嵌入される嵌入部と、前記嵌入部よりも径が大きく、所
望の実装高さ分の長さを実質的に備えた支持部とからな
る、 ことを特徴とするＢＧＡ部品。1. A BGA component having a main body on which an electronic component is mounted, a plurality of electrode pads arranged on the rear surface of the main body, and connecting solder balls provided on the electrode pad. Is provided with a positioning terminal that is inserted into a through hole formed in a wiring board on which the BGA component is mounted and is made of a material that does not melt at the melting temperature of the solder. The positioning terminal is the through hole. A BGA component comprising: a fitting portion that is fitted into the hole; and a support portion that has a diameter larger than the fitting portion and that substantially has a length corresponding to a desired mounting height.
で溶融しない材質で形成され、前記スルーホールに嵌入
される挿入部と、前記挿入部から外側に向かって形成さ
れた当接部とからなるガイド部材が設けられ、 前記ガイド部材の挿入部に、前記位置決め用端子の嵌入
部が嵌入され、前記ガイド部材の当接部上に前記位置決
め用端子の支持部が当接する、 ことを特徴とする請求項１に記載のＢＧＡ部品。2. An insert portion formed in the through hole, which is made of a material that does not melt at a melting temperature of solder, and is fitted into the through hole, and an abutting portion formed outward from the insert portion. A guide member made of is provided, the fitting portion of the positioning terminal is fitted into the insertion portion of the guide member, and the support portion of the positioning terminal abuts on the abutting portion of the guide member. The BGA part according to claim 1.
向かって幅広に傾斜して形成され、前記位置決め用端子
の支持部の当接面は、前記ガイド部材の当接部の当接面
に沿って傾斜して形成されている、ことを特徴とする請
求項２に記載のＢＧＡ部品。3. The abutting surface of the abutting portion of the guide member is formed so as to be wide and inclined toward the outside, and the abutting surface of the supporting portion of the positioning terminal is the abutting surface of the abutting portion of the guide member. The BGA component according to claim 2, wherein the BGA component is formed to be inclined along the contact surface.
ることを特徴とする請求項１乃至３のいずれか１つの項
に記載のＢＧＡ部品。4. The BGA component according to claim 1, wherein the positioning terminal is made of metal.
Ｆｅ−Ｎｉ合金からなる群から選択される物質で作られ
ていることを特徴とする請求項４に記載のＢＧＡ部品。5. The positioning terminal is made of Cu, Cu alloy,
The BGA component according to claim 4, wherein the BGA component is made of a material selected from the group consisting of Fe-Ni alloys.
に挟んで非対称に配置されていることを特徴とする請求
項１乃至５のいずれか１つの項に記載のＢＧＡ部品6. The BGA component according to claim 1, wherein the positioning terminals are arranged asymmetrically with the center line of the main body interposed therebetween.
記載のＢＧＡ部品を配線基板に実装するＢＧＡ部品の実
装方法であって、 前記位置決め用端子表面に半田を塗布する工程と、 前記位置決め用端子を配線基板のスルーホール上に接す
るようにＢＧＡ部品を位置決めする工程と、 前記ＢＧＡ部品及び配線基板を半田の溶融温度で加熱す
る工程と、 前記位置決め用端子に塗布された半田が溶融して、ＢＧ
Ａ部品の自重によりＢＧＡ部品の位置決め用端子の嵌入
部が前記スルーホール内に嵌合するとともに、前記ＢＧ
Ａ部品の接続用半田ボールが配線基板のパッド上に接続
される工程と、 を有することを特徴とするＢＧＡ部品の実装方法。7. A BGA component mounting method for mounting the BGA component according to any one of claims 1 to 6 on a wiring board, the method including applying solder to a surface of the positioning terminal. Positioning the BGA component so that the positioning terminal is in contact with the through hole of the wiring board; heating the BGA component and the wiring board at the melting temperature of the solder; and solder applied to the positioning terminal. Melted, BG
The fitting portion of the positioning terminal of the BGA component fits into the through hole due to the weight of the A component and the BG
And a step of connecting a solder ball for connecting the A component onto a pad of the wiring board.
記載のＢＧＡ部品と、前記ＢＧＡ部品を実装するための
配線基板とを有することを特徴とする半導体装置。8. A semiconductor device comprising the BGA component according to any one of claims 1 to 6 and a wiring board for mounting the BGA component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002029075A JP3845314B2 (en) | 2002-02-06 | 2002-02-06 | BGA component, BGA component mounting method, and semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002029075A JP3845314B2 (en) | 2002-02-06 | 2002-02-06 | BGA component, BGA component mounting method, and semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003229515A true JP2003229515A (en) | 2003-08-15 |
| JP3845314B2 JP3845314B2 (en) | 2006-11-15 |
Family
ID=27750013
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002029075A Expired - Fee Related JP3845314B2 (en) | 2002-02-06 | 2002-02-06 | BGA component, BGA component mounting method, and semiconductor device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008139563A1 (en) * | 2007-05-07 | 2008-11-20 | Fujitsu Limited | Electronic device and its manufacturing method, and electronic equipment equipped with the electronic device |
| JP2009260068A (en) * | 2008-04-17 | 2009-11-05 | Fujitsu Ltd | Electronic component mounting apparatus and its manufacturing method |
-
2002
- 2002-02-06 JP JP2002029075A patent/JP3845314B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008139563A1 (en) * | 2007-05-07 | 2008-11-20 | Fujitsu Limited | Electronic device and its manufacturing method, and electronic equipment equipped with the electronic device |
| JP2009260068A (en) * | 2008-04-17 | 2009-11-05 | Fujitsu Ltd | Electronic component mounting apparatus and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3845314B2 (en) | 2006-11-15 |
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