JP2003228695A - Non-contact ic card and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact IC card whose built-in parts such as an antenna coil or an IC module can be prevented from being deformed or broken due to the ejection pressure of external layer resin and a method for manufacturing the non-contact IC card. <P>SOLUTION: Built-in parts consisting of an antenna coil 1 and an IC module 2 connected thereto are arranged and fixed to a resin sheet 4 functioning as a board member so as to be formed as a primary molded part 10, and this primary molded part 10 is inserted into a die, and sealed with external layer resin 3 by ejection molding. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact IC card having an antenna coil and an IC module built therein, and more particularly to a non-contact IC card formed by resin injection into a mold and a method for manufacturing the same. .

[0002]

2. Description of the Related Art In recent years, in place of magnetic cards such as telephone cards, cash cards, and commuter passes that have been conventionally used, ICs having an IC (integrated circuit) have been demanded in order to increase the amount of information to be handled and prevent forgery. IC cards with built-in modules have been introduced and are rapidly becoming popular.

IC cards have the following information transmission modes:
There are a contact type, a non-contact type and a composite type thereof. Among them, the non-contact IC card is an antenna coil for performing data communication with an external device by non-contact communication by electromagnetic induction,
A card in which an IC module including a memory, a CPU, and an IC that generates a signal in response to an input from the outside is installed, and when responding by contactless communication with an external device, specific information in the memory is displayed. It is configured to be modulated and output from the antenna coil.

When the above-mentioned non-contact IC card is further classified, the antenna coil is electrically conductively connected to the IC module and embedded in the card body made of plastic, and the IC module is mounted and the antenna coil is mounted. There is a type in which a substrate on which a pattern is formed is embedded in a plastic card body.

FIG. 7 is a sectional view showing the structure of the former non-contact IC card. 1 is an antenna coil, 2 is an IC module which is an electronic component including an IC chip, and 3 is the antenna coil 1 and the IC module. It is an outer layer resin that seals the built-in component made of 2 inside.

This non-contact IC card has a built-in component including an antenna coil 1 formed by wiring a metal conductor in a coil shape, an IC module 2 electrically connected to the antenna coil 1, and the like. For example, it is formed by coating with the outer layer resin 3 by injection molding.

[0007]

However, the magnet wire used for the antenna coil has a conductor diameter of 30.
Since it is a very thin line of about μm to 150 μm, the connecting portion between the lead portion 1a of the antenna coil and the IC module 2 is in an unstable state in terms of shape retention. for that reason,
When the internal components such as the antenna coil 1 and the IC module 2 are sealed and molded by injection molding, the antenna coil 1 is deformed / displaced, the lead portion 1a is broken, and the IC module 2 is caused by the resin flow and pressure at the time of molding resin injection. There is a concern that misalignment of positions will occur.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to solve the above problems and to prevent deformation and breakage of internal components such as an antenna coil and an IC module due to the injection pressure of the outer layer resin.
It is to provide a C card and a manufacturing method thereof.

[0009]

In order to achieve the above object, the present invention is configured as follows.

A non-contact IC card according to a first aspect of the present invention is a built-in component including an antenna coil formed by wiring a metal conductor in a coil shape, an IC module electrically connected to the antenna coil, and the like. In a non-contact IC card provided with an outer layer resin covering the built-in component, the built-in components such as the antenna coil and the IC module are arranged and fixed to a substrate member to form a primary molded component, and the outer layer of the primary molded component is formed. Is sealed with resin.

In this non-contact IC card, the primary molded part is formed by arranging the antenna coil, the IC module, and the like between resin sheets functioning as the substrate member, and laminating and sealing the resin sheet. In addition, the primary molded component includes a configuration in which the antenna coil, the IC module, and the like are arranged and fixed on one surface of a resin sheet that functions as the substrate member.

According to a second aspect of the present invention, in the non-contact IC card according to the first aspect, the built-in parts such as the antenna coil and the IC module are arranged between resin sheets functioning as the substrate member and laminated and sealed. A primary molded part is formed, and an outer layer of the primary molded part is sealed with a resin.

According to a third aspect of the present invention, in the non-contact IC card according to the first aspect, the built-in components such as the antenna coil and the IC module are arranged and fixed on one surface of the resin sheet functioning as the substrate member, and the primary molding is performed. A part is formed, and an outer layer of the primary molded part is sealed with a resin.

According to a fourth aspect of the present invention, in the non-contact IC card according to the second or third aspect, the resin sheet is a prepreg sheet of thermosetting resin.

[0015] A prepreg (resin preimpregnated glass cloth) obtained by impregnating a cloth woven with glass fiber with a thermosetting resin.
th) is used for the resin sheet, it is possible to impart heat resistance to high temperatures during injection molding.

According to a fifth aspect of the invention, in the non-contact IC card according to the second or third aspect, the resin sheet is made of a self-fusing material.

Examples of the self-bonding material include PET
G (non-crystalline PET copolymer) is used, and the copolymerized polyester resin in which 10 to 70% of the ethylene glycol component in polyethylene terephthalate is replaced with cyclohexanedimethanol exhibits moderately high heat resistance,
In addition, since it is excellent in punching workability in a sheet form, it is particularly recommended as a material for the resin sheet.

According to a sixth aspect of the present invention, in the non-contact IC card according to the second or third aspect, the resin sheet is a PET base material coated with a hot melt resin or an adhesive.

As described above, by using PET (polyethylene terephthalate) as the base material of the resin sheet, heat resistance can be provided.

According to a seventh aspect of the present invention, there is provided a non-contact IC card manufacturing method, wherein an antenna coil formed by wiring a metal conductor in a coil shape and I electrically connected to the antenna coil.
In a method of manufacturing a non-contact IC card including a built-in component including a C module and the like, and an outer layer resin covering the built-in component, the built-in components such as the antenna coil and the IC module are arranged between resin sheets. It is characterized in that a primary molded component is formed by laminating and sealing in a state, the primary molded component is inserted into a mold, and the outer layer of the primary molded component is sealed with resin by injection molding.

In the method of manufacturing a non-contact IC card according to the present invention, an antenna coil formed by wiring a metal conductor in a coil shape, and I electrically connected to the antenna coil.
In a method of manufacturing a non-contact IC card including a built-in component including a C module and the like and an outer layer resin covering the built-in component, the built-in components such as the antenna coil and the IC module are arranged on one side of a resin sheet. It is characterized in that a primary molded component in a fixed state is formed, the primary molded component is inserted into a mold, and the outer layer of the primary molded component is sealed with resin by injection molding.

<Main points of the invention> In the present invention, a built-in component comprising an antenna coil formed by wiring a metal conductor in a coil shape, an IC module electrically connected to the antenna coil, and the like are arranged. It is a primary molded part having a substrate member to be fixed. Therefore, when these internal parts are sealed and molded by injection molding, the resin flow and pressure at the time of injection of molding resin do not cause disconnection of the lead part, positional deviation of the IC module, etc., and non-contact with stable quality. You can get an IC card.

In the present invention, in order to effectively prevent breakage and deformation of built-in parts due to resin flow or injection pressure, a resin sheet as a substrate member is formed with a concave portion for housing an antenna coil on its surface. It is preferable that the antenna coil is housed and arranged in the recess to stabilize the position. In addition, the thickness of the resin sheet prevents the inflow of resin so that the outer layer resin of sufficient thickness can be formed around the primary molded part during injection molding, and the inflow and wraparound of the resin can be sufficiently achieved. Thin so that it does not become
Also, regarding the planar size of the resin sheet, it is preferable that the width of the outer peripheral edge of the antenna coil housing recess is as small as possible.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below based on the illustrated embodiments.

The non-contact IC card according to the first embodiment (FIG. 1) of the present invention includes an antenna coil 1 formed by wiring a metal conductor in a coil shape, and an IC electrically connected to the antenna coil 1. A built-in component including the module 2 and the like is laminated and sealed in a state of being disposed between the upper and lower two resin sheets 4 and 4 serving as substrate members, thereby forming the primary molded component 10. Is inserted into a mold (not shown), and the periphery of the primary molded component 10 is sealed with the outer layer resin 3 by injection molding. Here, the IC module 2, which is a component of the built-in component, is an electronic component including a memory, a CPU, and an IC that generates a signal in response to an input from the outside.

Depending on the resin flow and injection pressure during injection molding,
In order to effectively prevent breakage and deformation of the built-in parts, both resin sheets 4 are formed with an antenna coil housing recess 4a on the inner surface, and the antenna coil 1 is housed along the inner circumference of the recess. The position is stabilized by making it. Specifically, the antenna coil housing recess 4a is formed.
Is formed so that when the two resin sheets 4 are overlapped inward, the two recesses 4a form exactly one accommodation space in which the antenna coil 1 is exactly accommodated. In the case of this embodiment, the antenna coil 1 is
It is wound in a rectangular shape, and the antenna coil housing recess 4a is formed.
Is also formed so as to have an inner peripheral shape adapted to this, and each side of the antenna coil 1 is housed along the inner peripheral wall of the antenna coil housing space.

Further, the resin sheet 4 is formed thin so that the outer layer resin 3 having a sufficient thickness is formed around the primary molded part at the time of injection molding and the inflow and wraparound of the resin can be sufficiently achieved. In addition, the planar size of the resin sheet 4 is also such that the width of the outer peripheral edge of the antenna coil housing recess is as small as possible.

As mentioned above, the primary molded part 10 of FIG.
Is an antenna coil 1 and an IC electrically connected to the antenna coil 1.
Since the built-in components including the module 2 are laminated and sealed in a state of being arranged between the resin sheets 4 and 4, the antenna coil 1 and the IC module 2 electrically connected to the antenna coil 1 are completely connected between the resin sheets 4 and 4. It is sealed and fixed to. Therefore, by inserting this primary molded part 10 into the mold,
When the periphery is sealed with the outer layer resin 3 by injection molding,
The antenna coil 1 is not deformed or misaligned, the lead portion 1a is disconnected, or the IC module 2 is misaligned due to resin flow or injection pressure during injection molding. Can be molded.

A second embodiment of the present invention is shown in FIG. In this non-contact IC card, a built-in component including an antenna coil 1 formed by wiring a metal conductor in a coil shape, an IC module 2 electrically connected to the antenna coil 1, and the like is used as a substrate member. A primary molded part 10 is formed by arranging and fixing it on one surface of one resin sheet 4, and the primary molded part 10 is inserted into a mold (not shown) and the periphery of the primary molded part 10 is injection-molded. The outer layer resin 3 is used for sealing.

The structure of the resin sheet 4 is the same as that of the resin sheet 4 on one side of FIG. 1 described above, and in order to effectively prevent the internal parts from being broken or deformed by the resin flow or injection pressure at the time of injection molding, An antenna coil housing recess 4a is formed on the surface of the resin sheet 4, and the antenna coil 1 is housed and arranged along the inner circumference of the recess.

The primary molded part 10 shown in FIG. 2 includes an antenna coil 1 and an IC module 2 electrically connected to the antenna coil 1.
Is placed and fixed on one side of the resin sheet 4,
The antenna coil 1 and the IC module 2 electrically connected to the antenna coil 1 are completely fixed to one surface of the resin sheet 4. Therefore, by inserting this primary molded part 10 into the mold,
When the periphery is sealed with the outer layer resin 3 by injection molding,
A good non-contact IC card can be molded without breakage or deformation of built-in parts due to resin flow and injection pressure during injection molding. Further, the structure of the primary component has a simple structure in which the coil 1 and the IC module 2 electrically connected to the coil 1 are arranged and fixed on one surface of the resin sheet 4, so that the cost can be reduced.

FIGS. 3 to 6 show another embodiment of the primary molded component 10 in which built-in components including the antenna coil 1 and the IC module 2 electrically connected to the antenna coil 1 are arranged and fixed to the resin sheet 4 as a substrate member. Indicates. In each of the embodiments shown in FIGS. 3 to 6, (a) in the drawings is a configuration corresponding to FIG. 1 in which two resin sheets 4 are used as substrate members, and (b) is a substrate member. A form corresponding to FIG. 2 described above using a single resin sheet 4 is shown.

The third embodiment shown in FIGS. 3A and 3B is a prepreg 5 made of a thermosetting resin as the resin sheet 4, that is, a prepreg obtained by impregnating a cloth woven with glass fibers with the thermosetting resin. (Resin Preimpregnated Glass C
loth) is an example using. This is because the resin sheet 4 is made of a thermosetting resin, so that it can have heat resistance against a high temperature during injection molding.

The fourth embodiment shown in FIGS. 4 (a) and 4 (b) is a PETG sheet 6 as the resin sheet 4, that is, a copolyester obtained by substituting 10 to 70% of the ethylene glycol component in polyethylene terephthalate with cyclohexanedimethanol. A resin (PETG) is used. PETG is used as a general laminated card material because it exhibits moderately high heat resistance and is excellent in punching workability in the form of a sheet, and it is easy to mold the primary molded part 10 and is also free of PVC. It is also scratched.

In the fifth embodiment shown in FIGS. 5A and 5B, a PET (polyethylene terephthalate) sheet (base material) 7 as a resin sheet 4 is coated with a hot melt resin (hot melt adhesive layer) 8. It uses a sheet. The peripheral wall of the concave portion 4a for storing the antenna coil is
It is formed by the thickness of the hot melt resin 8. Heat resistance can be provided by using PET for the base material.

In the sixth embodiment shown in FIGS. 6A and 6B, a PET sheet (base material) 7 coated with an adhesive 9 is used as the resin sheet 4. The peripheral wall of the antenna coil housing recess 4 a is formed by the thickness of the adhesive 9. Heat resistance can be provided by using PET for the base material. Further, since it is an adhesive type, the molding of the primary part is performed by the antenna coil 1 and the IC.
Since the module 2 only needs to be attached at room temperature, molding is easy.

[0037]

As described above, according to the present invention, a built-in component including an antenna coil and an IC module connected to the antenna coil is formed as a primary molded component arranged and fixed on a substrate member, and this primary molded component is formed. The outer layer is sealed with resin for the parts. Therefore, in the secondary molding step of completely sealing the primary molded component, the antenna coil and the IC module are arranged and fixed to the substrate member and integrated, and the antenna flow and the injection pressure may cause the antenna coil and the IC module to be integrated. For built-in parts such as coils and IC modules,
Does not break or deform.

[Brief description of drawings]

FIG. 1 is a sectional view showing a non-contact IC card according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing a non-contact IC card according to a second embodiment of the present invention.

FIG. 3 shows a third embodiment of the present invention,
(A) is a cross-sectional view of a primary molded part having the same structure as in FIG. 1,
FIG. 3B is a sectional view of a primary molded part having the same configuration as that of FIG. 2.

FIG. 4 shows a fourth embodiment of the present invention,
(A) is a cross-sectional view of a primary molded part having the same structure as in FIG. 1,
FIG. 3B is a sectional view of a primary molded part having the same configuration as that of FIG. 2.

FIG. 5 shows a fifth embodiment of the present invention,
(A) is a cross-sectional view of a primary molded part having the same structure as in FIG. 1,
FIG. 3B is a sectional view of a primary molded part having the same configuration as that of FIG. 2.

FIG. 6 shows a sixth embodiment of the present invention,
(A) is a cross-sectional view of a primary molded part having the same structure as in FIG. 1,
FIG. 3B is a sectional view of a primary molded part having the same configuration as that of FIG. 2.

FIG. 7 is a cross-sectional view showing the structure of a conventional non-contact IC card.

[Explanation of symbols]

1 antenna coil 1a Lead part 2 IC module 3 Outer layer resin 4 resin sheet 4a recess 5 prepreg 6 PETG sheet 7 PET sheet 8 Hot melt resin 9 Adhesive 10 Primary molded parts

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 2C005 MA10 MA11 NA08 NB15 NB22                       NB37 PA04 RA07 RA17                 5B035 BA03 BA04 BA05 BB09 CA01                       CA23                 5F061 AA01 BA04 CA21 CA22 DE03                       FA03

Claims (8)

[Claims] 1. An antenna coil formed by wiring a metal conductor in a coil shape and I electrically connected to the antenna coil.
In a non-contact IC card including a built-in component including a C module and the like, and an outer layer resin covering the built-in component, the built-in component such as the antenna coil and the IC module is arranged and fixed on a substrate member for primary molding. A non-contact IC card in which a part is formed and an outer layer of the primary molded part is sealed with a resin. 2. The non-contact IC card according to claim 1, wherein built-in parts such as the antenna coil and the IC module are arranged between resin sheets functioning as the substrate member and laminated and sealed to form a primary molded part. A non-contact IC card in which the outer layer of the primary molded part is sealed with resin. 3. The non-contact IC card according to claim 1, wherein a built-in component such as the antenna coil and the IC module is arranged and fixed on one surface of a resin sheet functioning as the substrate member to form a primary molded component, A non-contact IC card in which the outer layer of the primary molded part is sealed with a resin. 4. The non-contact IC card according to claim 2, wherein the resin sheet is a prepreg sheet of thermosetting resin. 5. The non-contact IC card according to claim 2 or 3, wherein the resin sheet is made of a self-fusing material. 6. The non-contact IC card according to claim 2 or 3, wherein the resin sheet is a PET base material coated with a hot-melt resin or an adhesive. 7. An antenna coil formed by wiring a metal conductor in a coil shape and I electrically connected to the antenna coil.
In a method of manufacturing a non-contact IC card including a built-in component including a C module and the like, and an outer layer resin covering the built-in component, the built-in components such as the antenna coil and the IC module are arranged between resin sheets. A non-contact IC card characterized in that a primary molded part is formed by laminating and sealing in a state, the primary molded part is inserted into a mold, and the outer layer of the primary molded part is sealed with resin by injection molding. Manufacturing method. 8. An antenna coil formed by wiring a metal conductor in a coil shape and I electrically connected to the antenna coil.
In a method of manufacturing a non-contact IC card including a built-in component including a C module and the like, and an outer layer resin covering the built-in component, the built-in components such as the antenna coil and the IC module are arranged on one side of a resin sheet. A method for producing a non-contact IC card, which comprises forming a primary molded component in a fixed state, inserting the primary molded component into a mold, and sealing the outer layer of the primary molded component with a resin by injection molding.