JP2003224152A - Die bonding apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a die bonding apparatus for introducing automation for mounting electronic components to a stem. <P>SOLUTION: In this die bonding apparatus 1, after a stem 2 is mounted on a stem mounting head 6, when an electronic component S is placed on a component mounting surface 27 of the stem 6 and when a stem base 24 is heated by a heater 9, the stem 2 must be surely mounted on the step mounting head 6 without any displacement. Therefore, the stem 2 can be easily and surely fixed and maintained to the stem mounting head 6 by providing a chuck 40 to the stem mounting head 6 and then holding the circumference 24a of the stem base 24 by a plurality of clams 47 provided at the end of an oscillating lever 41 of the chuck 40. Moreover, the structure of the chuck 40 is employed corresponding to various shapes of the stem base 24 and can be used for the centering of the stem base 24. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonding apparatus used for mounting an electronic component such as a semiconductor laser crystal on a stem.

[0002]

2. Description of the Related Art Conventionally, as a device in which a semiconductor laser crystal is mounted on a stem, there is JP-A-7-32410. Further, the work of mounting such a minute component such as a semiconductor laser crystal on the stem is performed manually by using tweezers or the like, and the work is being carried out while enlarging the mounting portion with a magnifying glass. It is a reality.

[0003]

However, as described above, the mounting work of the minute parts largely depends on the skill of the operator because the work is done manually while looking through the magnifying glass, and the mounting work efficiency is improved. It was a problem in trying.

The present invention has been made to solve the above-mentioned problems, and particularly an object thereof is to provide a die bonding apparatus which achieves automation in mounting an electronic component on a stem.

[0005]

A die bonding apparatus according to the present invention is a die bonding apparatus for mounting an electronic component on a component mounting surface provided on a stem base of a stem, while adsorbing the electronic component. With the bonding nozzle that mounts electronic components on the component mounting surface of the stem and the stem arranged in the stem accommodating recess,
A stem mounting head having a chuck portion for sandwiching the peripheral portion of the stem base of the stem, and a heater portion for heating the electronic component placed on the component mounting surface of the stem are provided.
The chuck part has a plurality of rocking levers extending along the tube axis direction of the stem mounting head and arranged in an annular shape around the tube axis. The claw portion provided at the tip of the lever is reciprocated in a direction substantially orthogonal to the tube axis.

In this die bonding apparatus, the electronic components sucked by the bonding nozzle at a predetermined location are
It is transported to the stem mounted on the stem mounting head and placed on the component mounting surface. Then, the solder material placed between the component mounting surface and the electronic component is melted in the heater section,
After that, the electronic component is fixed to the stem by solidifying the solder material. Here, after mounting the stem on the stem mounting head, when mounting electronic components on the component mounting surface of the stem, or when heating the stem base by the heater part, the stem does not shift in position. The stem mounting head must be mounted securely. Therefore, by providing a chuck part on the stem mounting head and sandwiching the peripheral part of the stem base with a plurality of claw parts provided on the tip of the swing lever of the chuck part, the stem mounting head can be easily and securely mounted. Can be kept fixed. Further, since such a chuck portion configuration is adopted to correspond to various shapes of the stem base and is also used for centering the stem base, it can be said to be a useful measure for automating the die bonding apparatus.

Further, it is preferable that the base end of each rocking lever is reciprocated in a direction substantially orthogonal to the tube axis. As a result, the claw portion of the swing lever can be appropriately reciprocated, and the operation utilizing the lever principle can be performed.

A cam surface for contacting a roller provided at the base end of the rocking lever is formed on the peripheral surface of the actuating member which reciprocates along the tube axis, and the cam surface extends in the tube axis direction. Preferably, the roller is biased against the cam surface. When such a configuration is adopted, the cam surface reciprocates due to the reciprocating motion of the actuating member along the tube axis direction.
Each roller reciprocates in a direction substantially orthogonal to the tube axis. As a result, the claw portion of each rocking lever reciprocates in a direction substantially orthogonal to the tube axis, and the peripheral portion of the stem base is appropriately sandwiched between the claw portions. This is the most suitable configuration for opening and closing each claw easily and speedily.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION A preferred embodiment of a die bonding apparatus according to the present invention will be described in detail below with reference to the drawings.

As shown in FIGS. 1 and 2, a die bonding apparatus 1 is an apparatus for fusion-mounting an electronic component (for example, a minute component such as a semiconductor laser crystal) S on a metal stem 2. , Is the realization of automation. The die bonding apparatus 1 has a stocker 3 for arranging the stems 2 in a matrix in a housing H in a suspended state. This stocker 3
The stems 2 arranged in the above manner are conveyed one by one to a predetermined place. At this time, a suction head 4 which is movable back and forth and vertically and horizontally is used. This suction head 4
Is provided with reversible rotary suction nozzles 5A and 5B. The suction nozzles 5A and 5B are used to convey the stem 2 to the stem mounting head 6 substantially in the center of the housing H, while returning the stem 2 to the stocker 3 after the mounting process is completed.

The stem mounting head 6 is provided on the stem mounting unit 7 that moves back and forth in the horizontal direction, and
It rotates within a range of 90 degrees in the vertical plane. Therefore, the stem mounting head 6 rotates between a standing state for receiving the stem 2 and a sideways lying state for heating the stem 2. Further, the stem mounting head 6 moves forward in a sideways state and moves to the heater unit 8 facing the stem mounting unit 7. Then, the solder foil 15 is melted by the ceramic heater portion 9 provided in the heater unit 8 to mount the electronic component S on the stem 2 (see FIG. 6).

An image pickup unit 11 which is vertically moved by a feed screw mechanism 10 is arranged directly above the heater unit 8, and the image pickup unit 11 has a magnifying lens group and a CCD.
An imaging camera 12 which is a combination with a camera is attached. The imaging camera 12 is arranged at a position where the inside of the heater portion 9 is viewed from above, and is used for enlarging and recognizing a fine component mounting region on the stem 2 placed inside the heater portion 9. Therefore, when the image pickup camera 12 picks up an image of the component mounting region of the stem 2 from directly above along the image pickup axis L and performs image processing, it is possible to determine the positional deviation between the planned mounting position and the actual mounting position. The mounting position is corrected based on this value.

A light source unit 19 composed of LEDs arranged in a ring shape is attached to the tip (lower end) of the image pickup camera 12. The light source unit 19 can illuminate a part to be imaged, that is, a component mounting surface 27 described later.

Further, in the housing H, a chip bonding head 13 for conveying a semiconductor laser crystal (hereinafter referred to as "chip component") S to a predetermined position of the stem 2, the chip component S and the stem 2. And a solder bonding head 14 for transporting a solder foil 15 (see FIG. 6) to be mounted between the two to a predetermined position of the stem 2. Then, the bonding heads 13 and 14
Has an independent drive system, and makes independent horizontal movement by the feed screw 16 extending in the horizontal direction.
Further, the bonding nozzles 17 and 18 move up and down by the internal mechanism of the bonding heads 13 and 14.

The bonding heads 13 and 14 as described above
Within the moving range of the chip tray 20 and the solder tray 21.
Are arranged. The chip parts S are individually accommodated in the chip tray 20, and the chip parts S are reliably taken out one by one by the bonding head 13. Similarly, the solder foil 15 is individually accommodated in the solder tray 21, and the bonding foil 14 is used by the bonding head 14.
5 will be surely taken out one by one.

Further, in the housing H, the chip component S
A chip recognition camera 22 for picking up an image of the suction position of the chip tray 2 is arranged.
0 and the heater unit 8 are installed in the middle of the transportation path of the chip component S. In addition, the chip recognition camera 22
A light source unit 23 made up of annularly arranged LEDs is attached to the tip (upper end) of the light source, and the light source unit 23 can illuminate a region to be imaged.

Therefore, the bonding nozzle 17 is once stopped just above the chip recognition camera 22, and the chip component S is imaged from the bottom and image-processed, so that the planned component suction position and the actual component suction position are obtained. Positional deviation can be calculated. That is, the position shift of the chip component S with respect to the suction port of the bonding nozzle 17 is determined by this image processing, and the component mounting position correction is performed based on this value. Note that the accurate position determination when mounting the chip component S on the stem 2 is performed by a combination of the position correction information from the chip recognition camera 22 and the position correction information described above from the imaging camera 12.

Here, an example of the stem 2 applied to the die bonding apparatus 1 having the above-mentioned structure will be described.

As shown in FIGS. 3 to 5, the metal stem 2 has a disc-shaped stem base 24, and the stem base 24 is formed with a component mounting projection 26 directed upward. . The component mounting protrusion 26 is provided with a component mounting surface 27 extending in a direction orthogonal to the upper surface 24c of the stem base 24, and the chip component (semiconductor laser crystal) S is soldered on the component mounting surface 27. It will be fused and mounted via 15 (see FIG. 6). Also, the stem base 24
The three stem pins 28 protruding from the bottom surface side are fixed to the chip, and a predetermined voltage can be applied to the chip component S via the predetermined stem pins 28. The peripheral surface (peripheral portion) 24a of the stem base 24 is provided with a notch recess 29 located behind the component mounting protrusion 26, and is located on both sides of the component mounting protrusion 26 in the radial direction. A pair of notched grooves 25 facing each other is provided.

Next, the above-mentioned stem mounting unit 7 will be described in detail. As shown in FIGS. 7 and 8, the stem mounting unit 7 has a movable block 32 that moves forward and backward in the horizontal direction along the guide rail 31 by an air cylinder 90, and the stem mounting head 6 is mounted on the movable block 32. Is rotatably attached. The stem mounting head 6 is fixed to a rotary shaft 33 extending in the horizontal direction, and the rotary shaft 33 includes a movable block 32.
It is supported in a two-sided state by a bearing 34 provided in the.

Further, one end of a link 35 is fixed to one end of the rotary shaft 33, and the other end of the link 35 is
It is connected to a piston rod 37 of an air cylinder mechanism 39 via a shaft pin 36. Since it is necessary to swing the air cylinder mechanism 39, the end of the air cylinder mechanism 39 is rotatably attached to the movable block 32 via the shaft portion 38. Therefore, by projecting the piston rod 37, the stem mounting head 6 is erected (see the chain double-dashed line in FIG. 7), and by retracting the piston rod 37, the stem mounting head 6 is laid sideways (see FIG. 7), the stem base 24 of the stem 2 can be directed to the heater portion 9 side.

As described above, the stem mounting head 6 rotates within a range of 90 degrees in the vertical plane and stands in a state of receiving the stem pin 28 of the stem 2 and the component mounting projection 26 of the stem 2 is heated. Rotate between lying sideways to do. Therefore, in the state where the stem mounting head 6 is erected, the pin insertion hole 6a of the stem mounting head 6 (see FIG.
Since the opening side of (see) is directed upward, the stem pin 28 can be easily dropped into the pin insertion hole 6a from above. In this way, the stem 2 has the stem pin 28
In case of having a stem pin 2 in the pin insertion hole 6a,
By inserting 8, the stem base 24 can be reliably placed on the top of the stem mounting head 6. Moreover, by vacuuming the inside of the pin insertion hole 6a,
The stem base 24 can be held by the stem mounting head 6 with a predetermined suction force.

On the other hand, by tilting the stem mounting head 6 sideways, the component mounting surface 27 of the stem 2 is directed upward,
It is possible to mount the chip component S on the component mounting surface 27 from above. Further, since the stem mounting head 6 moves forward together with the movable block 32, the component mounting surface 2
7 in the state in which the component mounting projection 26 is placed on the heater 9
It becomes possible to insert it inside (see FIG. 9).

Here, since the stem mounting head 6 performs a 90-degree rotational movement and a linear forward / backward movement as necessary,
The stem 2 may jump out of the stem mounting head 6 or may be displaced. Therefore, as shown in FIGS. 10 and 11, the stem mounting head 6 has a chuck portion 40 for sandwiching the peripheral surface (peripheral portion) 24a of the disc-shaped stem base 24 from the outside. The chuck portion 40 extends along the tube axis M of the stem mounting head 6,
Four rocking levers 41 arranged annularly around the tube axis M
have. A main body 42 is fixed to the rotating shaft 33 extending in the horizontal direction, and the main body 42 has
A hollow tube 43 protruding in a direction orthogonal to the rotary shaft 33 is fixed. And this hollow tube 43 is
The stem base 2 extends along the tube axis M and is provided on the top of
A circular stem accommodating recess 44 for mounting 4 is provided.

Further, so as to surround the hollow tube 43,
The four rocking levers 41 are arranged at equal intervals, and each rocking lever 41 is fixed to the rotary shaft 33.
It is swingably attached to the shaft 2 via a support shaft 46.
A claw portion 47 protruding in a direction orthogonal to the tube axis M is provided at the tip of each rocking lever 41, and a rotatable roller 48 is provided at the base end of each rocking lever 41. Has been. Therefore, by reciprocating each roller 48 in a direction substantially orthogonal to the tube axis M, each claw portion 47 can be reciprocated in a direction substantially orthogonal to the tube axis M. As a result, the peripheral surface (peripheral edge) 24a of the stem base 24 is equally sandwiched by the four claws 47 from the outside, and the stem base 24 is centered in the stem accommodating recess 44 of the hollow tube 43. At the same time as being positioned, the stem mounting head 6 is quickly and fixedly maintained. Such a chuck portion 40 also facilitates adapting to various shapes of the peripheral edge portion 24a of the stem base 24.

Further, an air cylinder 50 is fixed to the rotary shaft 33 via a bracket 49 in order to drive the swing levers 41 appropriately. The piston portion 51 of the air cylinder 50 moves back and forth along the tube axis M, and moves the cylindrical actuating member 52 back and forth along the tube axis M. For example, the operating member 52 and the bracket 49
A compression spring 53 is arranged between the above and the head 51a of the piston portion 51 to engage with the operating member 52 from above. Therefore, when compressed air is supplied to the air cylinder 50, the piston portion 51 can be retracted against the spring force of the compression spring 53, and the operating member 52 can be appropriately retracted (see FIG. 10). On the other hand, when air is discharged from the air cylinder 50, the spring force of the compression spring 53 causes the operating member 52 to instantaneously move forward toward the stem 2 (FIG. 1).
2). A guide shaft 55 extending in the tube axis M direction is fixed to the main body portion 42, and the guide rod 5
By fitting 5 into the central guide recess 52a of the operating member 52, the operating member 52 is reliably reciprocated along the tube axis M.

On the basis of such reciprocal movement of the operating member 52, in order to reciprocate the base end of each rocking lever 41 in a direction substantially orthogonal to the tube axis M, the outer peripheral surface of the operating member 52 is moved. Has a cam surface 54 on which the rollers 48 slide. In this cam surface 54, a first cam surface 54a extending parallel to the tube axis M is formed at the upper portion thereof, and a second cam surface 54a is formed at the lower portion thereof as an inclined surface that spreads downward. Cam surface 54b is formed.
Further, in order to press the rollers 45 against the cam surface 54, a compression spring 56 is arranged between the main body 42 and the swing levers 41. Therefore, when the roller 48 slides on the inclined second cam surface 54b, the claw portions 47 move so as to approach each other against the biasing force of the spring 56 (see FIG. 12). The roller 48 has the first cam surface 54a.
When sliding on, each claw 4 is pressed by the urging force of the spring 56.
7 move so as to be separated from each other (see FIG. 10). Therefore, each claw portion 47 moves outward only when the compressed air is supplied to the air cylinder 50.

The bottom surface 24b of the stem base 2 is pressed against the bottom surface of the stem accommodating recess 44 even by vacuuming through the pin insertion hole 6a provided in the stem mounting head 6, so that the above-mentioned machine is used. The stem 2 is prevented from popping out and displaced not only by a physical means but also by a physical means. This is the stem housing recess 44
It is extremely effective immediately after the stem base 24 of the stem 2 is housed therein.

Next, the operation of the die bonding apparatus 1 based on the above configuration will be briefly described.

First, as shown in FIG. 1 and FIG. 2, a plurality of stems 2 arranged so as to be hung on the stocker 3 are selected, and each of the suction nozzles 5A and 5B is selected.
The stem bases 24 of the selected stems 2 are adsorbed one by one. In this state, the suction head 4 is moved forward, and the suction head 4 is stopped so that the suction nozzles 5A and 5B are directly above the stem mounting head 6. Then, the stem pin 2 of the stem 2 is inserted into the pin insertion hole 6a of the stem mounting head 6.
In order to insert 8, the claw portions 47 are separated from each other,
It is necessary to open the stem accommodating recess 44.

Therefore, as shown in FIG. 10 and FIG.
Compressed air is supplied to the air cylinder 50 to retract the plunger 51 against the spring force of the compression spring 53, and the operating member 52 is retracted accordingly. As a result, the roller 48 rides on the first cam surface 54a, the swing lever 41 swings, and the stem accommodating recess 44 is opened while the four claw portions 47 are separated from each other. In this state, the suction nozzle 5A is lowered, and the stem pin 28 of the stem 2 is inserted into the pin insertion hole 6a of the stem mounting head 6 in the upright state.

Then, as shown in FIGS. 12 and 13,
By discharging the air from the air cylinder 50, the spring force of the compression spring 53 causes the operating member 52 to move to the stem 2.
Instantly advance to the side. As a result, the roller 48 rides on the second cam surface 54b, the swing lever 41 swings, and the claw portions 47 approach each other, while the stem base 2 moves.
The four peripheral surfaces 24a are firmly sandwiched by the four claws 47. As a result, the stem mounting head 6 is ready for rotation.

From this state, the stem mounting head 6 is rotated 90 degrees so as to lie down, and the component mounting surface 27 is directed right above. After that, the movable block 32 is moved forward to insert the component mounting protrusion 26 of the stem 2 into the recess 9 a of the heater unit 9. In this state, the component mounting surface 27 is enlarged by the image capturing camera 12, and the component mounting area of the stem 2 is captured by the image capturing axis L.
An image is taken from directly above along with and image processing is performed, and the positional deviation between the planned mounting position and the actual mounting position is calculated.

After the completion of this image processing, the solder foil 15 in the solder tray 21 is conveyed to the stem base 24 and placed on the component mounting surface 27 while being attracted to the bonding nozzle 18. After that, the chip component S in the chip tray 20 is adsorbed by the bonding nozzle 17 and temporarily stopped immediately above the chip recognition camera 22 while being conveyed to the stem base 24. Then, the chip recognition camera 22 performs image processing to determine the positional deviation between the planned component suction position and the actual component suction position at the suction port of the bonding nozzle 17. And
By combining the position correction information from the chip recognition camera 22 and the position correction information from the imaging camera 12, the chip component S is accurately placed on the component mounting surface 27 while controlling the bonding nozzle 17.

Thereafter, the ceramic heater portion 9 is heated to, for example, about 350 ° C. to melt the solder foil 15 between the chip component S and the component mounting surface 27. After that, the heater power supply is turned off, and nitrogen gas is caused to flow into the heater portion 9 to rapidly cool the heater portion 9. Then, by cooling the solder foil 15, the solder foil 15 is solidified and the chip component S is mounted on the component mounting surface 27. In this case, the stem base 24 is also cooled by blowing nitrogen gas from the pin insertion hole 6a of the stem mounting head 6.

After the component mounting process is completed, the movable block 32 is retracted by the air cylinder 90, and then the stem mounting head 6 is rotated 90 degrees so as to stand. Then, as shown in FIGS. 10 and 11, compressed air is supplied again to the air cylinder 50 to retract the plunger 51 against the spring force of the compression spring 53 and separate the four claw portions 47 from each other. Meanwhile, the pinching of the stem base 24 by the cooperation of the claws 47 is released. While maintaining this state, the suction nozzle 5A lifts the stem 2 after mounting is completed. Then, the stem 2 is carried to the stocker 3 and returned to the original place,
A series of component mounting process is completed.

Here, after the stem 2 is taken out from the stem mounting head 6 by the suction nozzle 5A, the suction head 4 is mounted on the empty stem mounting head 6 in order to mount the stem 2 with no component mounted thereon. ° Rotate. As a result, the suction nozzle 5B is directed downward, and in this state, the stem pin 28 of the stem 2 is dropped into the pin insertion hole 6a of the stem mounting head 6. In this way, when the rotary suction head 4 is adopted, the suction nozzle 5B is immediately after the stem 2 after mounting is completed by the suction nozzle 5A is taken out.
Then, another stem 2 can be loaded into the stem mounting head 6, and the preparation for the next component mounting work can be completed in a short time, and the efficiency of the component mounting work process can be achieved.

[0038]

The die bonding apparatus according to the present invention is
Since it is configured as described above, the following effects are obtained. That is, in the die bonding apparatus for mounting the electronic component on the component mounting surface provided on the stem base of the stem, a bonding nozzle for adsorbing the electronic component and mounting the electronic component on the component mounting surface of the stem, With the stem placed in the stem receiving recess,
A stem mounting head having a chuck portion for sandwiching the peripheral portion of the stem base of the stem, and a heater portion for heating the electronic component placed on the component mounting surface of the stem are provided.
The chuck part has a plurality of rocking levers extending along the tube axis direction of the stem mounting head and arranged in an annular shape around the tube axis. By reciprocating the claw portion provided at the tip of the lever in a direction substantially orthogonal to the tube axis, automation can be appropriately achieved in mounting the electronic component on the stem.

[Brief description of drawings]

FIG. 1 is a side view showing an embodiment of a die bonding apparatus according to the present invention.

FIG. 2 is a front view of the die bonding apparatus shown in FIG.

FIG. 3 is a perspective view showing a stem.

FIG. 4 is a plan view of a stem.

FIG. 5 is a rear view of the stem.

FIG. 6 is an enlarged view showing a state in which a chip component is mounted on the component mounting surface of the stem.

FIG. 7 is an enlarged side view of a main part of the die bonding apparatus shown in FIG.

FIG. 8 is a plan view showing a rotation mechanism of the stem mounting head.

FIG. 9 is a cross-sectional view showing a state where the component mounting surface of the stem is arranged in the heater portion.

FIG. 10 is a cross-sectional view showing a chuck portion that is a main portion of the die bonding apparatus according to the present invention.

11 is a plan view of the chuck unit shown in FIG.

FIG. 12 is an enlarged cross-sectional view of an essential part showing a state in which the stem base is sandwiched between chuck parts.

FIG. 13 is a plan view of the chuck unit shown in FIG.

[Explanation of symbols]

S ... Chip component (electronic component), M ... Tube axis, 1 ... Die bonding device, 2 ... Stem, 6 ... Stem mounting head, 6
a ... Pin insertion hole, 9 ... Heater part, 17 ... Bonding nozzle, 24 ... Stem base, 24a ... Stem base peripheral surface (peripheral part), 27 ... Component mounting surface, 40 ... Chuck part,
41 ... rocking lever, 44 ... stem accommodating recess, 47 ... claw, 48 ... roller, 52 ... actuating member, 54 ... cam surface.

Claims (3)

[Claims] 1. A die bonding apparatus for mounting an electronic component on a component mounting surface provided on a stem base of a stem, wherein the electronic component is sucked and the electronic component is mounted on the component mounting surface of the stem. A bonding nozzle to be mounted, a stem mounting head having a chuck portion for sandwiching a peripheral edge portion of the stem base of the stem in a state where the stem is arranged in a stem accommodating recess, and a component mounting surface of the stem. And a heater section for heating the electronic component in a state where the chuck is arranged, the chuck section extends along the tube axis direction of the stem mounting head, and is arranged in a ring shape around the tube axis. A swing lever is provided, and the middle of each swing lever is pivotally supported so that a claw portion provided at the tip of the swing lever is in a direction substantially orthogonal to the tube axis. Die bonding apparatus, characterized in that to restore motion. 2. The die bonding apparatus according to claim 1, wherein the base end of each swing lever is reciprocated in a direction substantially orthogonal to the tube axis. 3. A cam surface for contacting a roller provided at the base end of the swing lever is formed on a peripheral surface of an actuating member that reciprocates along the tube axis, and the cam surface is the above-mentioned cam surface. The die bonding apparatus according to claim 1 or 2, wherein the die bonding apparatus extends in a tube axis direction and urges the roller toward the cam surface.