JP2003224147A - Die bonding apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a die bonding apparatus for introducing automation for mounting electronic components to a metal stem. <P>SOLUTION: In the die bonding apparatus 1, a stem positioning means 60 including a pair of clamping portions 61, 62 which are freely opened and closed is applied so that the ends of the clamping portions 61, 62 are inserted from the external side into a cutout groove 25 of a stem base 24 which is mounted on a stem mounting head 6 when the clamping portions 61, 62 are closed. Accordingly, the stem base 24 is held by the pair of clamping portions 61, 62 and simultaneously the displacement of the stem base 24 can be corrected on the stem mounting head 6. As a result, a component mounting surface 27 can be oriented to a predetermined position with higher accuracy and the mounting of the electronic component S on the component mounting surface 27 can be attained accurately by a bonding nozzle 17. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonding apparatus used for mounting an electronic component such as a semiconductor laser crystal on a stem.

[0002]

2. Description of the Related Art Conventionally, as a device in which a semiconductor laser crystal is mounted on a stem, there is JP-A-7-32410. Further, the work of mounting such a minute component such as a semiconductor laser crystal on the stem is performed manually by using tweezers or the like, and the work is being carried out while enlarging the mounting portion with a magnifying glass. It is a reality.

[0003]

However, as described above, the mounting work of the minute parts largely depends on the skill of the operator because the work is done manually while looking through the magnifying glass, and the mounting work efficiency is improved. It was a problem in trying.

The present invention has been made to solve the above-mentioned problems, and in particular, it is an object of the present invention to provide a die bonding apparatus which achieves automation in mounting electronic components on a metal stem. To do.

[0005]

A die bonding apparatus according to the present invention is a die bonding apparatus for mounting an electronic component on a component mounting surface provided on a stem base of a metal stem. And a bonding nozzle that mounts an electronic component on the component mounting surface of the stem, a stem mounting head that mounts the stem, a heater section that heats the electronic component placed on the component mounting surface of the stem, and a stem With the stem mounted on the stem mounting head, the stem has a pair of openable and closable clamp parts that insert the tip into a pair of notched grooves formed on the peripheral surface of the stem base of the stem and sandwich the stem base from the side. And positioning means.

In the die bonding apparatus, in order to surely mount the electronic component on the component mounting surface of the stem,
Accurate positioning of the component mounting surface is required. In other words, if the stem with the positional deviation generated is mounted on the stem mounting head, the component mounting surface cannot be oriented in the correct direction, and accordingly, the electronic component is accurately mounted on the component mounting surface. I can't. Therefore, the inventor has proposed to use the pair of notched grooves formed in the stem base to accurately position the stem in a state where the stem is mounted on the stem mounting head. That is, in the present invention, the stem positioning means having a pair of openable / closable clamp parts is applied, and the tip of each clamp part of the stem base in a state of being mounted on the stem mounting head at the time of closing operation of each clamp part. It is inserted from the outside into the notch groove. As a result, the stem base is sandwiched between the pair of clamp portions, and at the same time, the position shift of the stem base on the stem mounting head can be corrected, and as a result,
The component mounting surface can be accurately oriented to a desired position, and the electronic component can be accurately mounted on the component mounting surface by the bonding nozzle. The adoption of such a stem positioning means can be said to be a useful measure for automating the die bonding apparatus.

Further, it is preferable that the tip end surface of the clamp portion is formed in an obtuse V-shape, and the V-shaped tip end surface is pressed against an edge portion which forms a boundary between the peripheral surface of the stem base and the wall surface of the notch groove. Is. In this way, when sandwiching the stem base between the pair of clamp portions, the V-shaped tip end surface of the clamp portion is pressed against the edge portion of the stem base, whereby the stem base can be reliably positioned on the stem mounting head. .

Further, it is preferable that a suction nozzle for sucking and transporting the stem to the stem mounting head is further provided, and the stem mounting head is provided with a pin insertion hole into which a stem pin protruding from the bottom surface of the stem base is inserted. By adopting the suction nozzle, the stem can be picked up at a predetermined place and then mounted on the stem mounting head from above. Even if the stem has a stem pin, by inserting the stem pin into the pin insertion hole, the stem base can be reliably placed on the stem mounting head, and the inside of the pin insertion hole can be vacuumed. When pulled, the stem base can be held with a predetermined suction force with respect to the stem mounting head.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION A preferred embodiment of a die bonding apparatus according to the present invention will be described in detail below with reference to the drawings.

As shown in FIGS. 1 and 2, in the die bonding apparatus 1, an electronic component (for example, a minute component such as a semiconductor laser crystal) S is fused and mounted at a predetermined position of a metal stem 2. This device realizes automation. The die bonding apparatus 1 has a stocker 3 for arranging the stems 2 in a matrix in a housing H in a suspended state. The stems 2 arranged in the stocker 3 are conveyed one by one to a predetermined place. At this time, a suction head 4 which is movable back and forth and vertically and horizontally is used. The suction head 4 includes reversible rotary suction nozzles 5A, 5A.
B is provided. And each suction nozzle 5A, 5B
Is used to return the stem 2 to the stocker 3 after completion of the mounting process while transporting the stem 2 to the stem mounting head 6 substantially in the center of the housing H.

The stem mounting head 6 is provided on the stem mounting unit 7 that moves back and forth in the horizontal direction, and
It rotates within a range of 90 degrees in the vertical plane. Therefore, the stem mounting head 6 rotates between a standing state for receiving the stem 2 and a lying state for heating the stem 2. Further, the stem mounting head 6 moves forward in a lying state and moves to the heater unit 8 facing the stem mounting unit 7. Then, the solder foil 15 is melted by the ceramic heater portion 9 provided in the heater unit 8 to mount the electronic component S on the stem 2 (see FIG. 6).

An image pickup unit 11 which is vertically moved by a feed screw mechanism 10 is arranged directly above the heater unit 8, and the image pickup unit 11 has a magnifying lens group and a CCD.
An imaging camera 12 which is a combination with a camera is attached. The imaging camera 12 is arranged at a position where the inside of the heater portion 9 is viewed from above, and is used for enlarging and recognizing a fine component mounting region on the stem 2 placed inside the heater portion 9. Therefore, when the imaging camera 12 images the component mounting area of the stem 2 from directly above and performs image processing, it is possible to determine the positional deviation between the planned mounting position and the actual mounting position, and based on this value, The mounting position is corrected.

A light source unit 19 composed of LEDs arranged in a ring shape is attached to the tip (lower end) of the image pickup camera 12. The light source unit 19 can illuminate a part to be imaged, that is, a component mounting surface 27 described later.

Further, in the housing H, a chip bonding head 13 for conveying a semiconductor laser crystal (hereinafter referred to as "chip component") S to a predetermined position of the stem 2, the chip component S and the stem 2. And a solder bonding head 14 for transporting a solder foil 15 (see FIG. 6) to be mounted between the two to a predetermined position of the stem 2. Then, the bonding heads 13 and 14
Has an independent drive system, and makes independent horizontal movement by the feed screw 16 extending in the horizontal direction.
Further, the bonding nozzles 17 and 18 move up and down by the internal mechanism of the bonding heads 13 and 14.

The bonding heads 13 and 14 as described above
Within the moving range of the chip tray 20 and the solder tray 21.
Are arranged. The chip parts S are individually accommodated in the chip tray 20, and the chip parts S are reliably taken out one by one by the bonding head 13. Similarly, the solder foil 15 is individually accommodated in the solder tray 21, and the bonding foil 14 is used by the bonding head 14.
5 will be surely taken out one by one.

Further, in the housing H, the chip component S
A chip recognition camera 22 for picking up an image of the suction position of the chip tray 2 is arranged.
0 and the heater unit 8 are installed in the middle of the transportation path of the chip component S. In addition, the chip recognition camera 22
A light source unit 23 made up of annularly arranged LEDs is attached to the tip (upper end) of the light source, and the light source unit 23 can illuminate a region to be imaged.

Therefore, the bonding nozzle 17 is once stopped just above the chip recognition camera 22, and the chip component S is imaged from the bottom and image-processed, so that the planned component suction position and the actual component suction position are obtained. Positional deviation can be calculated. That is, the position shift of the chip component S with respect to the suction port of the bonding nozzle 17 is determined by this image processing, and the component mounting position correction is performed based on this value. Note that the accurate position determination when mounting the chip component S on the stem 2 is performed by a combination of the position correction information from the chip recognition camera 22 and the position correction information described above from the imaging camera 12.

Here, an example of the stem 2 applied to the die bonding apparatus 1 having the above-mentioned structure will be described.

As shown in FIGS. 3 to 5, the metal stem 2 has a disc-shaped stem base 24, and the stem base 24 is formed with a component mounting projection 26 directed upward. . The component mounting protrusion 26 is provided with a component mounting surface 27 extending in a direction orthogonal to the upper surface 24c of the stem base 24, and the chip component (semiconductor laser crystal) S is soldered on the component mounting surface 27. It will be fused and mounted via 15 (see FIG. 6). Also, the stem base 24
The three stem pins 28 protruding from the bottom surface side are fixed to the chip, and a predetermined voltage can be applied to the chip component S via the predetermined stem pins 28. The peripheral surface 24a of the stem base 24 is provided with a notch 29 for positioning which is located behind the component mounting projection 26, and is located on both sides of the component mounting projection 26 and faces each other in the radial direction. A pair of cutout grooves 25 are provided.

Next, the above-mentioned stem mounting unit 7 will be described in detail. As shown in FIG. 7, the stem mounting unit 7 uses the air cylinder 90 to guide the guide rail 3
1 has a movable block 32 that advances and retracts in the horizontal direction, and the stem mounting head 6 is rotatably attached to the movable block 32. As shown in FIGS. 8 and 9, the stem mounting head 6 is fixed to a horizontally extending rotary shaft 33.
Are supported by a bearing 34 provided on the movable block 32 in a two-sided manner.

Further, one end of a link 35 is fixed to one end of the rotary shaft 33, and the other end of the link 35 is
It is connected to a piston rod 37 of an air cylinder mechanism 39 via a shaft pin 36. Further, since it is necessary to swing the air cylinder mechanism 39, the end of the air cylinder mechanism 39 is rotatably attached to the movable block 32 via the shaft portion 38. Therefore, by projecting the piston rod 37, as shown in FIG.
The stem mounting head 6 can be set upright, and the piston rod 37 is retracted, so that the stem mounting head 6 is laid down and the stem base 24 of the stem 2 is moved to the heater portion 9 side as shown in FIG. Can be turned.

As described above, the stem mounting head 6 rotates within a range of 90 degrees in the vertical plane and stands in a state of receiving the stem pin 28 of the stem 2 and the component mounting projection 26 of the stem 2 is heated. Rotate between lying down to do. Therefore, in the state where the stem mounting head 6 is erected, the pin insertion hole 6a of the stem mounting head 6 (see FIG.
Since the opening 6b (see (1)) faces upward, the stem pin 28 can be easily dropped into the pin insertion hole 6a from above. In this way, the stem 2 is the stem pin 2
In the case of having eight, by inserting the stem pin 28 into the pin insertion hole 6a, the stem base 24 can be reliably placed on the top of the stem mounting head 6. Moreover, by vacuuming the inside of the pin insertion hole 6a,
The stem base 24 can be held by the stem mounting head 6 with a predetermined suction force.

On the other hand, when the stem mounting head 6 is laid down, the opening 6b faces sideways, and the component mounting surface 27 of the stem 2 faces upward. The component S can be mounted. Further, since the stem mounting head 6 moves forward together with the movable block 32, it becomes possible to insert the component mounting projection 26 into the heater portion 9 with the component mounting surface 27 facing upward.

Further, since the stem mounting head 6 performs a 90 degree rotational movement and a linear forward / backward movement, the stem 2 may jump out of the stem mounting head 6 or may be displaced. Therefore, as shown in FIGS. 10 and 11, the stem base receiving portion 40 projects from the top of the stem mounting head 6, and the stem pin 28 of the stem 2 is inserted into the pin insertion hole 6a. The bottom surface 24b is supported by the stem base receiving portion 40.
Further, the pressing claw 41 is provided on the peripheral surface 24 a of the stem base 24.
Is pressed against the opposite sides of the stem base receiving portion 40.

This pressing claw 41, as shown in FIG.
It is provided at the tip of a swing lever 42 extending along the stem mounting head 6. The swing lever 42 is swingably supported by a shaft portion 46 provided on the stem mounting head 6, and the base end of the swing lever 42 is biased by a spring 43. Therefore, the pressing claw 41 is pressed against the peripheral surface 24 a of the stem base 24 by the urging force of the spring 43, and the peripheral surface 24 a of the stem base 24 is
Since the tip end of the pressing claw 41 and the stem base receiving portion 40 are sandwiched, the stem 2 can be prevented from jumping out or being displaced by a mechanical means.

The pressing release of the pressing claw 41 is achieved by the piston rod 45 of the air cylinder mechanism 44. That is, by the projecting operation of the piston rod 45, the tip of the piston rod 45 is pressed against the base end of the swing lever 42 against the force of the spring 43, and as a result,
The pressing claw 41 is released outward. Such a pressing release operation is performed immediately before the stem 2 is mounted on the stem mounting head 6 and after the component mounting is completed.
Used when removing from.

The bottom surface 24b of the stem base 2 is pressed against the stem base receiving portion 40 by vacuuming through the pin insertion hole 6a provided in the stem mounting head 6, so that the above-mentioned mechanical Not only the means but also the physical means prevent the stem 2 from popping out and being displaced.

As shown in FIGS. 10 and 13, the concave portion 9a formed on the front surface of the heater portion 9 at the time of imaging or heating.
When the component mounting surface 27 is arranged inside, it is necessary to prevent the stem 2 from rotating so that the component mounting surface 27 always faces upward. Therefore, the positioning claw 50 is projected from below toward the stem base 24, and the positioning claw 5
0 is inserted into the notch recess 29 provided in the peripheral surface 24a of the stem base 24. This positioning claw 50
Is fixed to the tip of an elevating member 55 extending in the vertical direction,
The elevating member 55 is fixed to the tip of the swing arm 51 extending horizontally.

The swing arm 51 is swingably supported by a shaft portion 52 provided in the heater unit 8 and is also supported by a spring 53 disposed below so as to push up from below. Therefore, the urging force of the spring 53 causes the positioning claw 50 to be inserted into the notch recess 29 of the stem base 24.

On the other hand, the positioning release by the positioning claw 50 is achieved by the piston rod 56 of the air cylinder mechanism 54 arranged on the base end side of the swing arm 51. That is, by the projecting operation of the piston rod 56, the tip of the piston rod 56 is pressed against the base end of the swing arm 51 from below against the force of the spring 53, and as a result, the positioning claw 50 is released downward. become.
Such a positioning release operation is performed after the heating / cooling work of the stem 2 is completed.

As shown in FIG. 10, the positioning of the component mounting surface 27 in the heater unit 9 is performed at a position where the optical axis L of the image pickup camera 12 passes through the center of the mounting scheduled region of the chip component S. . Then, in order to recognize the mounting position of the minute chip component S, it is necessary to enlarge the component mounting surface 27 by the imaging camera 12 at a high magnification. At this time, the imaging camera 12 uses the bonding heads 13 and 14
Reciprocate vertically to avoid collision with. Then, the imaging camera 12 uses the depth of field of the lens to reciprocate along the optical axis L passing through the component mounting surface 27. As a result, a movement error, which is inevitably generated when the imaging camera 12 mechanically reciprocates by the feed screw mechanism 10 or the like, can be absorbed within the depth of field, and reliable imaging can be performed with a simple configuration. This makes it possible to achieve a remarkable effect when the component mounting scheduled area is very small and the imaging camera 12 has to be moved.

Here, the die bonding apparatus 1 described above is used.
Then, in mounting the chip component S on the component mounting surface 27 of the stem 2, it is required that the component mounting surface 27 be accurately positioned upward. That is, if the stem 2 is mounted on the top of the stem mounting head 6 in a state in which the positional displacement has occurred, the component mounting surface 27 cannot be oriented in an appropriate direction, and accordingly, the chip component S is mounted on the component. It cannot be mounted exactly on the surface 27. Therefore, before inserting the stem 2 into the heater unit 9,
When the stem mounting head 6 is in the upright state, the stem 2 is positioned.

As shown in FIGS. 7 and 14, the stem mounting unit 7 has a stem positioning means 60 for positioning the stem 2 on the stem mounting head 6. The stem positioning means 60 includes a pair of left and right metal clamp portions 61 and 62 which can be opened and closed, and each clamp portion 6.
It has a linear actuator 63 for opening and closing 1, 62 in the horizontal direction. The linear actuator 63 is fixed to the stem mounting unit 7 and is used as a drive source for the clamp portions 61 and 62 that horizontally project from the linear actuator 63.

As shown in FIGS. 14 to 16, the linear actuator 63 is composed of an air cylinder mechanism having a pair of left and right movable portions 64 and 65 that move linearly in the horizontal direction. Therefore, the movable portion 64 and the movable portion 65 move toward each other by pumping air into the air cylinder body portion 63a, and the air cylinder body portion 63a moves.
By discharging the air from the inside, they operate in a direction in which they are separated from each other.

The movable parts 64 and 65 are provided with positioning pins 66 and 67 projecting in the horizontal direction, and the clamp parts 61 and 62 are provided with the positioning pins 6 respectively.
Positioning holes 68, 69 for inserting 6, 67 are provided. Therefore, with the positioning pins 66, 67 inserted in the positioning holes 68, 69, the screws 70, 71
Thus, the clamp parts 61 and 62 are fixed to the movable parts 64 and 65, respectively.

The clamp parts 61 and 62 are provided in the movable parts 6 respectively.
Proximal end portion 6 fixed to screws 4, 71 with screws 70, 71
1b and 62b and L-shaped claw portions 61c and 62c extending horizontally from the base end portions 61b and 62b, and the tip portions 61a and 62a of the clamp portions 61 and 62 are in the state where the stem 2 is upright. Each notch groove 25 in the stem base 24
It is plugged in from the side. Then, the stem base 24 is sandwiched from both sides by the pair of clamp portions 61 and 62, and the stem 2 is positioned on the stem mounting head 6.

To properly perform such positioning, as shown in FIGS. 17 and 18, the respective clamp portions 61,
The front end surface 73 of 62 has a substantially V-shaped cutout groove 2 at the top thereof.
It is formed in a V-shape with an angle α in order to be surely inserted into 5. As shown in FIG. 19, when the angle α is set to an obtuse angle of 120 degrees, for example, the edge portion 75 that forms a boundary between the peripheral surface 24a of the stem base 24 and the wall surface 25a of the cutout groove 25 has a V-shape. It will be pressed against the tip surface 73. As a result, the forced positioning of the stem base 24 is achieved without being affected by the shape of the cutout groove 25.

Next, the operation of the die bonding apparatus 1 based on the above configuration will be briefly described.

First, as shown in FIGS. 1 and 2, a plurality of stems 2 arranged so as to be hung on the stocker 3 are selected, and each of the suction nozzles 5A and 5B is selected.
The stem bases 24 of the selected stems 2 are adsorbed one by one. In this state, the suction head 4 is moved forward, and the suction head 4 is stopped so that the suction nozzles 5A and 5B are directly above the stem mounting head 6. After that, the suction nozzle 5A is lowered, and the stem mounting head 6 in the upright state.
The stem pin 28 of the stem 2 is inserted into the pin insertion hole 6a.

After that, air is sent under pressure to the air cylinder main body 63a to move the left and right clamp parts 61, 62 to the position shown in FIG.
As shown in FIG. 8, it is driven from the open state of the chain double-dashed line to the closed state of the solid line. As a result, the tips of the clamp portions 61, 62 are inserted from the outside into the notch grooves 25, 25 of the stem base 24 mounted on the stem mounting head 6. As a result, the stem base 24 is sandwiched between the clamp portions 61 and 62, and at the same time, the stem mounting head 6
Above, the displacement of the stem base 24 is corrected, and the centering of the stem base 24 is achieved. In this state, after the pin insertion hole 6a is evacuated, the stem base 24 is sandwiched between the stem base receiving portion 40 and the pressing claw 41 while pressing the peripheral surface 24a of the stem base 24 with the pressing claw 41. Thereby, the above-mentioned clamp parts 61, 62
Thus, the stem base 24 is accurately fixed on the stem mounting head 6. After that, the air cylinder body 63a
Air is exhausted from the left and right clamp parts 61, 62 to open state, and the stem mounting head 6 is ready for rotation.

From this state, the stem mounting head 6 is rotated 90 degrees so as to lie down, and the component mounting surface 27 is directed right above. After that, the movable block 32 is moved forward to insert the component mounting protrusion 26 of the stem 2 into the recess 9 a of the heater unit 9. Then, the positioning claw 50 is projected from below, and the positioning claw 50 is inserted into the notch recess 29 of the stem base 24 to position the stem 2. As a result, the component mounting surface 27 of the stem 2 is accurately oriented and fixed right above. In this state, the component mounting surface 27 by the imaging camera 12
Is enlarged, the component mounting area of the stem 2 is imaged from directly above and image processing is performed, and the positional deviation between the planned mounting position and the actual mounting position is determined.

After this image processing is completed, the solder foil 15 in the solder tray 21 is conveyed to the stem base 24 and placed on the component mounting surface 27 while being attracted to the bonding nozzle 18. After that, the chip component S in the chip tray 20 is adsorbed by the bonding nozzle 17 and temporarily stopped immediately above the chip recognition camera 22 while being conveyed to the stem base 24. Then, the chip recognition camera 22 performs image processing to determine the positional deviation between the planned component suction position and the actual component suction position at the suction port of the bonding nozzle 17. And
By combining the position correction information from the chip recognition camera 22 and the position correction information from the imaging camera 12, the chip component S is accurately placed on the component mounting surface 27 while controlling the bonding nozzle 17.

Thereafter, the ceramic heater portion 9 is heated to, for example, about 350 ° C. to melt the solder foil 15 between the chip component S and the component mounting surface 27. After that, the heater power supply is turned off, and nitrogen gas is caused to flow into the heater portion 9 to rapidly cool the heater portion 9. Then, by cooling the solder foil 15, the solder foil 15 is solidified and the chip component S is mounted on the component mounting surface 27. In this case, the stem base 24 is also cooled by blowing nitrogen gas from the pin insertion hole 6a of the stem mounting head 6.

After the component mounting process is completed, the movable block 32 is retracted by the air cylinder 90,
Rotate the stem mounting head 6 90 degrees so that it stands up,
The stem 2 is released from the stem mounting head 6 by allowing the pressing claw 41 to escape to the outside. And the suction nozzle 5A
Thus, the stem 2 after the mounting is completed is lifted. Then, the stem 2 is carried to the stocker 3 and returned to the original place, and a series of component mounting steps are completed.

Here, after the stem 2 is taken out from the stem mounting head 6 by the suction nozzle 5A, the suction head 4 is mounted on the empty stem mounting head 6 in order to mount the stem 2 with no components mounted thereon. ° Rotate. As a result, the suction nozzle 5B is directed downward, and in this state, the stem pin 28 of the stem 2 is dropped into the pin insertion hole 6a of the stem mounting head 6. In this way, when the rotary suction head 4 is adopted, the suction nozzle 5B is immediately after the stem 2 after mounting is completed by the suction nozzle 5A is taken out.
Then, another stem 2 can be loaded into the stem mounting head 6, and the preparation for the next component mounting work can be completed in a short time, and the efficiency of the component mounting work process can be achieved.

[0046]

The die bonding apparatus according to the present invention is
Since it is configured as described above, the following effects are obtained. That is, in a die bonding apparatus for mounting an electronic component on a component mounting surface provided on a stem base of a metal stem, the electronic component is sucked and the electronic component is mounted on the component mounting surface of the stem. The nozzle, the stem mounting head that mounts the stem, the heater that heats with the electronic components placed on the component mounting surface of the stem, and the stem base of the stem with the stem mounted on the stem mounting head. The electronic component is made of a metal stem by providing a stem positioning means having a pair of openable and closable clamp portions for inserting the tip into a pair of notched grooves formed on the peripheral surface and sandwiching the stem base from the side. Automation can be achieved in the implementation.

[Brief description of drawings]

FIG. 1 is a side view showing an embodiment of a die bonding apparatus according to the present invention.

FIG. 2 is a front view of the die bonding apparatus shown in FIG.

FIG. 3 is a perspective view showing a stem.

FIG. 4 is a plan view of a stem.

FIG. 5 is a rear view of the stem.

FIG. 6 is an enlarged view showing a state in which a chip component is mounted on the component mounting surface of the stem.

FIG. 7 is an enlarged side view of a main part of the die bonding apparatus shown in FIG.

FIG. 8 is a plan view showing a rotation mechanism of the stem mounting head.

FIG. 9 is a side view showing a rotation mechanism of the stem mounting head.

FIG. 10 is a cross-sectional view showing a state where the component mounting surface of the stem is arranged in the heater portion.

11 is a plan view of FIG.

FIG. 12 is a cross-sectional view showing an operating mechanism of a pressing claw.

FIG. 13 is a sectional view showing an operating mechanism of a positioning claw.

FIG. 14 is a plan view showing a stem mounting unit applied to the die bonding apparatus according to the present invention.

15 is a plan view showing a stem positioning means provided in the stem mounting unit shown in FIG.

16 is a front view of the stem positioning means shown in FIG.

FIG. 17 is a perspective view showing a relationship between a clamp portion applied to a stem positioning means and a stem.

FIG. 18 is an enlarged plan view showing a closed state and an open state of a pair of clamp portions.

FIG. 19 is an enlarged view of an essential part showing the engaged state of the clamp part and the stem base.

[Explanation of symbols]

S ... Chip component (electronic component), 1 ... Die bonding device, 2 ... Stem, 5A, 5B ... Adsorption nozzle, 6 ... Stem mounting head, 6a ... Pin insertion hole, 9 ... Heater part, 17 ...
Bonding nozzle, 24 ... Stem base, 24a ... Stem base peripheral surface, 24b ... Stem base bottom surface, 25
... Notch groove, 27 ... Component mounting surface, 28 ... Stem pin, 6
0 ... Stem positioning means, 61, 62 ... Clamping section, 7
3 ... Tip surface of the clamp part.

Claims (3)

[Claims] 1. A die bonding apparatus for mounting an electronic component on a component mounting surface provided on a stem base of a metal stem, wherein the electronic component is adsorbed and the stem is mounted on the component mounting surface of the stem. A bonding nozzle that mounts an electronic component, a stem mounting head that mounts the stem, a heater section that heats the electronic component placed on the component mounting surface of the stem, and a stem that mounts the stem on the stem. Stem positioning with a pair of openable and closable clamp parts that insert the tip into a pair of notched grooves formed on the peripheral surface of the stem base of the stem to sandwich the stem base from the side while mounted on the head A die-bonding apparatus comprising: 2. A tip surface of the clamp portion is formed in an obtuse V shape, and the V-shaped tip surface is formed at an edge portion which forms a boundary between the peripheral surface of the stem base and a wall surface of the cutout groove. 2. The die bonding apparatus according to claim 1, wherein the die bonding apparatus is pressed against. 3. A suction nozzle for sucking and conveying the stem to the stem mounting head, wherein the stem mounting head is provided with a pin insertion hole into which a stem pin protruding from a bottom surface of the stem base is inserted. The die bonding apparatus according to claim 1 or 2.