JP2003224150A - Die bonding apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a die bonding apparatus for introducing automation for mounting electronic components to a metal stem. <P>SOLUTION: In the die bonding apparatus 1, if a stem 2 which has generated displacement is mounted to a stem mounting head 6, an electronic component S cannot be mounted accurately on a component mounting surface 27. Therefore, a structure is configured so that the stem mounting head 6 can be rotated freely with an axial line M passing the center of the stem mounting surface 27 defined as a rotating axial line. Therefore, a stem base itself 24 is rotated under the condition that the stem base 24 is arranged on the stem mounting surface 44, the displacement of the stem base 24 is thereby corrected on the stem mounting head 6, and, as a result, the component mounting surface 27 of the stem base 24 can be oriented to the desired position with higher accuracy. Accordingly, the mounting of the electronic component S by a bonding nozzle 17 on the component mounting surface 27 can be achieved accurately. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonding apparatus used for mounting an electronic component such as a semiconductor laser crystal on a stem.

[0002]

2. Description of the Related Art Conventionally, as a device in which a semiconductor laser crystal is mounted on a stem, there is JP-A-7-32410. Further, the work of mounting such a minute component such as a semiconductor laser crystal on the stem is performed manually by using tweezers or the like, and the work is being carried out while enlarging the mounting portion with a magnifying glass. It is a reality.

[0003]

However, as described above, the mounting work of the minute parts largely depends on the skill of the operator because the work is done manually while looking through the magnifying glass, and the mounting work efficiency is improved. It was a problem in trying.

The present invention has been made to solve the above-mentioned problems, and in particular, it is an object of the present invention to provide a die bonding apparatus which achieves automation in mounting electronic components on a metal stem. To do.

[0005]

A die bonding apparatus according to the present invention is a die bonding apparatus for mounting an electronic component on a component mounting surface provided on a stem base of a metal stem. The stem that rotates the stem base around the axis passing through the center of the stem mounting surface with the bonding nozzle that mounts the electronic component on the component mounting surface of the stem and the stem base placed on the stem mounting surface. It is characterized by comprising a mounting head and a heater section for heating the electronic component placed on the component mounting surface of the stem.

In this die bonding apparatus, in order to surely mount the electronic component on the component mounting surface of the stem, it is required to accurately position the component mounting surface. In other words, if the stem with the positional deviation generated is mounted on the stem mounting head, the component mounting surface cannot be oriented in the correct direction, and accordingly, the electronic component is accurately mounted on the component mounting surface. I can't. Therefore, the inventor has set an axis passing through the center of the stem mounting surface as a rotation axis,
Adopting a rotatable structure for the stem mounting head, rotating the stem base itself with the stem base placed on the stem mounting surface, thereby correcting the position deviation of the stem base on the stem mounting head. As a result, the component mounting surface on the stem base is accurately oriented to a desired position.
Therefore, it becomes possible to accurately mount the electronic component on the component mounting surface by the bonding nozzle, and such a configuration is a useful measure for automating the die bonding apparatus.

Further, the stem mounting head has a chuck portion for sandwiching the peripheral portion of the stem base of the stem, and the chuck portion has a plurality of claw portions extending along the axis and arranged in an annular shape. It is preferable that the stem mounting surface is formed at the end of the claw portion, and the chuck portion rotates about an axis orthogonal to the stem mounting surface. After placing the stem base on the stem mounting surface, when mounting electronic components on the component mounting surface of the stem, or when heating the stem base by the heater part, the stem does not shift its position. It is necessary to surely mount it on the mounting head. Therefore, if the chuck portion is provided on the stem mounting head and the peripheral portion of the stem base is sandwiched by the chuck portion, the stem can be easily and reliably fixed and maintained on the stem mounting head. Furthermore, such a chucking part makes it possible to accommodate various shapes of the stem base of the stem. Further, the peripheral portion of the stem base can be sandwiched by the plurality of claw portions arranged in a ring shape, and the chuck portion corresponding to the shape of the stem base can be easily configured.

The pressing means for pressing each claw from the outside is a hollow piston rod that reciprocates in the axial direction along the outer peripheral surface of each claw, and is annular on the inner peripheral surface of the piston rod. By the cooperation of the first tapered surface formed on the claw portion and the second tapered surface formed on the outer peripheral surface of each claw portion in an annular shape, each claw portion is pressed from the outside in a direction substantially orthogonal to the axis. It is suitable if it is. When such a configuration is adopted, each claw can be opened and closed easily and speedily by the reciprocating motion of the hollow piston rod.

Further, it is preferable that the chuck portion is provided with a rotary shaft extending along the axis, and the rotary shaft is rotated by a predetermined angle by a motor fixed to the stem mounting head. It can be said that such a configuration is an effective measure for rotating the chuck portion by a predetermined angle.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION A preferred embodiment of a die bonding apparatus according to the present invention will be described in detail below with reference to the drawings.

As shown in FIGS. 1 and 2, the die bonding apparatus 1 is an apparatus for fusion-mounting an electronic component (for example, a minute component such as a semiconductor laser crystal) S on a metal stem 2. , Is the realization of automation. The die bonding apparatus 1 has a stocker 3 for arranging the stems 2 in a matrix in a housing H in a suspended state. This stocker 3
The stems 2 arranged in the above manner are conveyed one by one to a predetermined place. At this time, a suction head 4 which is movable back and forth and vertically and horizontally is used. This suction head 4
Is provided with reversible rotary suction nozzles 5A and 5B. The suction nozzles 5A and 5B are used to convey the stem 2 to the stem mounting head 6 substantially in the center of the housing H, while returning the stem 2 to the stocker 3 after the mounting process is completed.

The stem mounting head 6 is provided on a stem mounting unit 7 that moves back and forth in the horizontal direction, and
It rotates within a range of 90 degrees in the vertical plane. Therefore, the stem mounting head 6 rotates between a standing state for receiving the stem 2 and a sideways lying state for heating the stem 2. Further, the stem mounting head 6 moves forward in a sideways state and moves to the heater unit 8 facing the stem mounting unit 7. Then, the solder foil 15 is melted by the ceramic heater portion 9 provided in the heater unit 8 to mount the electronic component S on the stem 2 (see FIG. 6).

An image pickup unit 11 which is vertically moved by a feed screw mechanism 10 is arranged directly above the heater unit 8, and the image pickup unit 11 has a magnifying lens group and a CCD.
An imaging camera 12 which is a combination with a camera is attached. The imaging camera 12 is arranged at a position where the inside of the heater portion 9 is viewed from above, and is used for enlarging and recognizing a fine component mounting region on the stem 2 placed inside the heater portion 9. Therefore, when the imaging camera 12 images the component mounting area of the stem 2 from directly above and performs image processing, it is possible to determine the positional deviation between the planned mounting position and the actual mounting position, and based on this value, The mounting position is corrected.

A light source unit 19 composed of LEDs arranged in an annular shape is attached to the tip (lower end) of the image pickup camera 12. The light source unit 19 can illuminate a part to be imaged, that is, a component mounting surface 27 described later.

Further, in the housing H, a chip bonding head 13 for transporting a semiconductor laser crystal (hereinafter referred to as "chip component") S to a predetermined position of the stem 2, the chip component S and the stem 2. And a solder bonding head 14 for transporting a solder foil 15 (see FIG. 6) to be mounted between the two to a predetermined position of the stem 2. Then, the bonding heads 13 and 14
Has an independent drive system, and makes independent horizontal movement by the feed screw 16 extending in the horizontal direction.
Further, the bonding nozzles 17 and 18 move up and down by the internal mechanism of the bonding heads 13 and 14.

The bonding heads 13 and 14 as described above
Within the moving range of the chip tray 20 and the solder tray 21.
Are arranged. The chip parts S are individually accommodated in the chip tray 20, and the chip parts S are reliably taken out one by one by the bonding head 13. Similarly, the solder foil 15 is individually accommodated in the solder tray 21, and the bonding foil 14 is used by the bonding head 14.
5 will be surely taken out one by one.

Further, in the housing H, a chip component S
A chip recognition camera 22 for picking up an image of the suction position of the chip tray 2 is arranged.
0 and the heater unit 8 are installed in the middle of the transportation path of the chip component S. In addition, the chip recognition camera 22
A light source unit 23 made up of annularly arranged LEDs is attached to the tip (upper end) of the light source, and the light source unit 23 can illuminate a region to be imaged.

Therefore, the bonding nozzle 17 is once stopped just above the chip recognition camera 22, the chip component S is imaged from the bottom and image processing is performed, so that the planned component suction position and the actual component suction position are obtained. Positional deviation can be calculated. That is, the position shift of the chip component S with respect to the suction port of the bonding nozzle 17 is determined by this image processing, and the component mounting position correction is performed based on this value. Note that the accurate position determination when mounting the chip component S on the stem 2 is performed by a combination of the position correction information from the chip recognition camera 22 and the position correction information described above from the imaging camera 12.

Here, an example of the stem 2 applied to the die bonding apparatus 1 having the above-mentioned structure will be described.

As shown in FIGS. 3 to 5, the metal stem 2 has a disc-shaped stem base 24, and the stem base 24 is formed with a component mounting projection 26 directed upward. . The component mounting protrusion 26 is provided with a component mounting surface 27 extending in a direction orthogonal to the upper surface 24c of the stem base 24, and the chip component (semiconductor laser crystal) S is soldered on the component mounting surface 27. It will be fused and mounted via 15 (see FIG. 6). Also, the stem base 24
The three stem pins 28 protruding from the bottom surface side are fixed to the chip, and a predetermined voltage can be applied to the chip component S via the predetermined stem pins 28. The peripheral surface (peripheral portion) 24a of the stem base 24 is provided with a notch recess 29 located behind the component mounting protrusion 26, and is located on both sides of the component mounting protrusion 26 in the radial direction. A pair of notched grooves 25 facing each other is provided.

Next, the above-mentioned stem mounting unit 7 will be described in detail. As shown in FIG. 7, the stem mounting unit 7 uses the air cylinder 90 to guide the guide rail 3
1 has a movable block 32 that advances and retracts in the horizontal direction, and the stem mounting head 6 is rotatably attached to the movable block 32. As shown in FIGS. 8 and 9, the stem mounting head 6 is fixed to a horizontally extending rotary shaft 33.
Are supported by a bearing 34 provided on the movable block 32 in a two-sided manner.

Further, one end of a link 35 is fixed to one end of the rotary shaft 33, and the other end of the link 35 is
It is connected to a piston rod 37 of an air cylinder mechanism 39 via a shaft pin 36. Further, since it is necessary to swing the air cylinder mechanism 39, the end of the air cylinder mechanism 39 is rotatably attached to the movable block 32 via the shaft portion 38. Therefore, by projecting the piston rod 37, as shown in FIG.
The stem mounting head 6 can be set upright, and the piston rod 37 is retracted so that the stem mounting head 6 is laid sideways and the stem base 24 of the stem 2 is directed to the heater portion 9 side, as shown in FIG. be able to.

As described above, the stem mounting head 6 rotates within a range of 90 degrees in the vertical plane, stands in a state of receiving the stem pin 28 of the stem 2, and heats the component mounting projection 26 of the stem 2. Rotate between lying sideways to do. Therefore, in the state where the stem mounting head 6 is erected, the pin insertion hole 6a of the stem mounting head 6 (see FIG.
Since the opening side of (see) is directed upward, the stem pin 28 can be easily dropped into the pin insertion hole 6a from above. In this way, the stem 2 has the stem pin 28
In case of having a stem pin 2 in the pin insertion hole 6a,
By inserting 8, the stem base 24 can be reliably placed on the top of the stem mounting head 6. Moreover, by vacuuming the inside of the pin insertion hole 6a,
The stem base 24 can be held by the stem mounting head 6 with a predetermined suction force.

On the other hand, by tilting the stem mounting head 6 sideways, the component mounting surface 27 of the stem 2 is directed upward,
It is possible to mount the chip component S on the component mounting surface 27 from above. Further, since the stem mounting head 6 moves forward together with the movable block 32, the component mounting surface 2
7 in the state in which the component mounting projection 26 is placed on the heater 9
It is possible to insert it inside.

Here, the stem mounting head 6 carries out a 90 ° rotational movement and a linear forward / backward movement as necessary,
The stem 2 may jump out of the stem mounting head 6 or may be displaced. Therefore, as shown in FIGS. 10 and 11, the stem mounting head 6 has a chuck portion 40 for sandwiching the peripheral surface (peripheral portion) 24a of the disc-shaped stem base 24 from the outside. The chuck portion 40 includes a plurality of (for example, four) claw portions 41 that extend along the tube axis M direction of the stem mounting head 6 and are arranged in an annular shape. Each claw portion 41 that is elastically deformable in the radial direction is formed by the hollow tube
2 is formed by four slits 43 extending along the tube axis M direction, and each claw portion 41 has a configuration in which the end portion of the hollow tube 42 is vertically divided into four equal parts, It is integrally formed with the metal hollow tube 42 (see FIG. 12).

A circular stem mounting surface 44 for mounting the stem base 24 is provided on the top of the chuck portion 40 formed by the four claw portions 41. The stem mounting surface 44 is It forms the bottom surface of a circular stem accommodating recess 45 formed on the top of the chuck portion 40. Then, such a hollow tube 42 is surrounded by a cylindrical cylinder portion 46, and the cylinder portion 46 is fixed to the rotary shaft 33 via a screw or the like. As a result, the rotating shaft 3
Following the rotation of 3, the hollow tube 42 moves 90 degrees in the vertical plane.
Perform a degree of rotational movement. Further, the hollow tube 42 and the cylinder portion 4
A hollow piston rod (pressurizing means) 48 that is capable of reciprocating in the direction of the pipe axis M is disposed between the piston rod 6 and 6, and the piston rod 48 slides along the outer peripheral surface of each claw portion 41.

Further, the piston rod 48 is provided with an actuating portion 48a which projects in the radial direction, and the cylinder portion 46 is supplied with compressed air to the inside thereof to supply the piston rod 4 with it.
First and second air inlets / outlets 50, 51 for reciprocating the tube 8 in the tube axis M direction are provided. Therefore, when compressed air is supplied from the first air inlet / outlet 50 to the inside of the cylinder portion 46 via the pipes 56 and 57 extending from an air pump (not shown), the piston rod 48 advances in the direction of arrow A along the pipe axis M. To do. On the other hand, when compressed air is supplied from the second air inlet / outlet 51 to the inside of the cylinder portion 46 while bleeding air from the first air inlet / outlet 50, the piston rod 48 moves in the direction of arrow B toward the pipe axis M.
Retreat along.

Further, at the tip portion of the hollow piston rod 48, an annular first taper surface 53 is provided on the inner peripheral surface thereof.
On the other hand, an annular second taper surface 54 parallel to the first taper surface 53 is formed on the outer peripheral surface of the clamp portion 40 constituted by each claw portion 41. Therefore,
As shown in FIG. 13, the stem 2 is placed in the stem accommodating recess 45.
After housing the stem base 24, the piston rod 48 is advanced in the direction of arrow A as shown in FIG.
The first tapered surface 53 abuts the second tapered surface 54. After that, when the piston rod 48 continues to move forward,
By the cooperation of the first taper surface 53 and the second taper surface 54, each claw portion 41 is substantially orthogonal to the tube axis M so as to be compressed in the radial direction while narrowing the width of the slit 43. Is pressed from the outside in the direction. As a result, as shown in FIGS. 14 and 15, the peripheral surface 24a of the stem base 24 is
Are sandwiched by the respective claw portions 41, and the stem 2 is simply and reliably fixed to the stem mounting head 6.

Such a chuck portion 40 can be easily adapted to various shapes of the stem base 24 of the stem 2. For example, the shape of the stem base 24 is not limited to a disk shape, but a rectangular plate shape or the like. Even then, a reliable chucking operation is achieved. This can be said to be a useful measure for automating the die bonding apparatus 1.

The bottom surface 24b of the stem base 2 is also pressed against the stem mounting surface 44 by vacuuming through the pin insertion hole 6a provided in the stem mounting head 6, so that the mechanical mounting described above is performed. Not just means
The physical means also prevents the stem 2 from popping out and being displaced. This is extremely effective immediately after the stem base 24 of the stem 2 is housed in the stem housing recess 45, as shown in FIG.

Here, in the die bonding apparatus 1, in order to surely mount the chip component S on the component mounting surface 27 of the stem 2, it is required to position the component mounting surface 27 with high accuracy. That is, when the stem 2 in which the positional deviation has occurred is mounted on the stem mounting head 6, the component mounting surface 27 cannot be oriented in the correct direction, and accordingly, the chip component S is placed on the component mounting surface 27. Can not be implemented exactly.

Therefore, when the stem base 24 is placed on the stem mounting surface 44 and the stem base 24 is rotated about an axis (tube axis) M passing through the center of the circular stem mounting surface 44, as shown in FIG. As shown in, the rotary shaft 60 is provided at the lower end of the hollow tube 42. The rotary shaft 60 is exposed to the outside from the rotary shaft 33 so that the rotary shaft line and the tube axis M coincide with each other. Further, a pulse motor 61 is fixed to the rotary shaft 33 via a bracket 62, and the drive shaft 63 of the pulse motor 61 and the rotary shaft 60 provided in the hollow tube 42 have predetermined reduction gears 64, 65. It is connected through. Therefore, after the peripheral surface 24a of the stem base 24 is chucked by the claw portions 48 (see FIG. 14), the hollow tube 42 is rotated by a desired angle by the rotation of the drive shaft 63 by the pulse motor 61.

For such rotation of the hollow tube 42, it is necessary to orient the component mounting surface 27 on the stem base 24 in a predetermined direction. Therefore, as shown in FIG.
An image of the stem base 24 is taken from directly above each claw portion 48 by an image pickup device 67 having a CD and a condenser lens group. In this image pickup, the image pickup device 67 is arranged right above the stem mounting surface 44 so that the image pickup axis line and the tube axis M coincide with each other. Then, as shown in FIG.
So that the reference axis K on the side and the component mounting surface 27 coincide with each other.
The pulse motor 61 is driven to perform the θ correction of the stem 2. In this way, the positional displacement of the stem base 24 is corrected, and as a result, the component mounting surface 27 on the stem base 24 is accurately oriented to the desired position.

With the stem 2 positioned as described above, the rotary shaft 33 is rotated so that the stem mounting head 6 is turned sideways as shown in FIG. 7, and the stem base 24 of the stem 2 is directed toward the heater portion 9 side. . As a result, the component mounting surface 27 of the stem 2 is accurately oriented right above, and the chip component S can be mounted on the component mounting surface 27 from above. Further, since the stem mounting head 6 moves forward together with the movable block 32, the component mounting projection 26 is inserted into the heater portion 9 with the component mounting surface 27 accurately facing right above. Then, the solder foil 15 and the chip component S are placed on the component mounting surface 27. in this way,
The chip component S can be mounted on the component mounting surface 27 by the bonding nozzle 17 accurately and speedily.

Next, the operation of the die bonding apparatus 1 based on the above-mentioned configuration will be briefly described.

First, as shown in FIGS. 1 and 2, a large number of stems 2 arranged so as to be hung on the stocker 3 are selected, and the suction nozzle 5A and the suction nozzle 5B are respectively selected.
The stem bases 24 of the selected stems 2 are adsorbed one by one. In this state, the suction head 4 is moved forward, and the suction head 4 is stopped so that the suction nozzles 5A and 5B are directly above the stem mounting head 6. After that, the suction nozzle 5A is lowered, and the stem mounting head 6 in the upright state.
The stem pin 28 of the stem 2 is inserted into the pin insertion hole 6a.

Thereafter, compressed air is supplied from the first air inlet / outlet 50 to the inside of the cylinder portion 46 through a pipe 56 extending from an air pump (not shown), and the piston rod 48 is advanced along the pipe axis M to move the piston. Rod 48
The first tapered surface 53 of the above is abutted against the second tapered surface 54. After that, the piston rod 48 is further advanced, and the first taper surface 53 and the second taper surface 54 cooperate with each other so that each claw portion 41 is compressed in the radial direction against its elastic force. As a result, as shown in FIGS. 14 and 15, the peripheral surface 24 a of the stem base 24 is firmly sandwiched by the claws 41. As a result, the stem mounting head 6 is ready for rotation.

In this state, the image pickup device 67 picks up an image of the component mounting surface 27 of the stem base 24 from directly above each claw portion 48. Then, the pulse motor 61 is rotated so that the reference axis K on the imaging device 67 side and the component mounting surface 27 are aligned. As a result, the θ correction of the stem base 24 is performed, and as a result, the component mounting surface 27 on the stem base 24 is accurately oriented to a desired position.

In this state, the stem mounting head 6 is rotated 90 degrees so as to lie down, and the component mounting surface 27 is directed right above. After that, the movable block 32 is moved forward to insert the component mounting protrusion 26 of the stem 2 into the recess 9 a of the heater unit 9. Then, the component mounting surface 2 by the imaging camera 12
7 is enlarged, the component mounting area of the stem 2 is imaged from directly above and image processing is performed, and the positional deviation between the planned mounting position and the actual mounting position is determined.

After this image processing is completed, the solder foil 15 in the solder tray 21 is conveyed to the stem base 24 and is placed on the component mounting surface 27 while being attracted to the bonding nozzle 18. After that, the chip component S in the chip tray 20 is adsorbed by the bonding nozzle 17 and temporarily stopped immediately above the chip recognition camera 22 while being conveyed to the stem base 24. Then, the chip recognition camera 22 performs image processing to determine the positional deviation between the planned component suction position and the actual component suction position at the suction port of the bonding nozzle 17. And
By combining the position correction information from the chip recognition camera 22 and the position correction information from the imaging camera 12, the chip component S is accurately placed on the component mounting surface 27 while controlling the bonding nozzle 17.

After that, the ceramic heater portion 9 is heated to, for example, about 350 ° C. to melt the solder foil 15 between the chip component S and the component mounting surface 27. After that, the heater power supply is turned off, and nitrogen gas is caused to flow into the heater portion 9 to rapidly cool the heater portion 9. Then, by cooling the solder foil 15, the solder foil 15 is solidified and the chip component S is mounted on the component mounting surface 27. In this case, the stem base 24 is also cooled by blowing nitrogen gas from the pin insertion hole 6a of the stem mounting head 6.

After the component mounting process as described above is completed, the movable block 32 is retracted by the air cylinder 90, and then the stem mounting head 6 is rotated 90 degrees so as to stand. Then, by supplying compressed air from the second air inlet / outlet port 51 to the inside of the cylinder portion 46, the piston rod 48 is retracted along the pipe axis M, and the piston rod 4 is moved.
The contact between the first tapered surface 53 of No. 8 and the second tapered surface 54 of each claw portion 41 is released. As a result, each claw portion 41 is
It returns outward due to its own elastic force. As a result, the stem 2 is released from the stem mounting head 6.
Then, the suction nozzle 5A lifts the stem 2 after completion of mounting. And this stem 2
It is transported to the stocker 3 and returned to the original place, and a series of component mounting steps are completed.

Here, after the stem 2 is taken out from the stem mounting head 6 by the suction nozzle 5A, the suction head 4 is mounted on the empty stem mounting head 6 in order to mount the stem 2 with no components mounted thereon. ° Rotate. As a result, the suction nozzle 5B is directed downward, and in this state, the stem pin 28 of the stem 2 is dropped into the pin insertion hole 6a of the stem mounting head 6. In this way, when the rotary suction head 4 is adopted, the suction nozzle 5B is immediately after the stem 2 after mounting is completed by the suction nozzle 5A is taken out.
Then, another stem 2 can be loaded into the stem mounting head 6, and the preparation for the next component mounting work can be completed in a short time, and the efficiency of the component mounting work process can be achieved.

[0044]

The die bonding apparatus according to the present invention is
Since it is configured as described above, the following effects are obtained. That is, in a die bonding apparatus for mounting an electronic component on a component mounting surface provided on a stem base of a metal stem, the electronic component is sucked and the electronic component is mounted on the component mounting surface of the stem. With the nozzle and stem base placed on the stem mounting surface, the stem mounting head that rotates the stem base around the axis that passes through the center of the stem mounting surface, and the electronic components on the stem component mounting surface By providing the heater part that heats in an open state, it becomes possible to automate the mounting of the electronic component on the metal stem.

[Brief description of drawings]

FIG. 1 is a side view showing an embodiment of a die bonding apparatus according to the present invention.

FIG. 2 is a front view of the die bonding apparatus shown in FIG.

FIG. 3 is a perspective view showing a stem.

FIG. 4 is a plan view of a stem.

FIG. 5 is a rear view of the stem.

FIG. 6 is an enlarged view showing a state in which a chip component is mounted on the component mounting surface of the stem.

FIG. 7 is an enlarged side view of a main part of the die bonding apparatus shown in FIG.

FIG. 8 is a plan view showing a rotation mechanism of the stem mounting head.

FIG. 9 is a side view showing a rotation mechanism of the stem mounting head.

FIG. 10 is a cross-sectional view showing a state where the component mounting surface of the stem is arranged in the heater portion.

FIG. 11 is a sectional view showing a chuck portion which is a main portion of the die bonding apparatus according to the present invention.

12 is a plan view of the chuck section shown in FIG. 11. FIG.

13 is an enlarged cross-sectional view of an essential part of the chuck section shown in FIG.

FIG. 14 is an enlarged sectional view of an essential part showing a state in which the stem base of the stem is sandwiched by the chuck portion.

FIG. 15 is a plan view of the chuck unit shown in FIG.

FIG. 16 is a plan view showing an imaging state of a stem base.

[Explanation of symbols]

1 ... Die bonding device, 2 ... Stem, 5A, 5B ...
Adsorption nozzle, 6 ... Stem mounting head, 6a ... Pin insertion hole, 9 ... Heater section, 17 ... Bonding nozzle, 24 ...
Stem base, 24a ... Stem base peripheral surface (peripheral portion), 27 ... Component mounting surface, 40 ... Chuck portion, 41 ... Claw portion, 44 ... Stem mounting surface, 48 ... Piston rod (pressurizing means), 53 ... 1 taper surface, 54 ... 2nd taper surface, 60 ... Rotating shaft, 61 ... Pulse motor (motor), S
... chip parts (electronic parts), M ... tube axis (axis).

Claims (4)

[Claims] 1. A die bonding apparatus for mounting an electronic component on a component mounting surface provided on a stem base of a metal stem, wherein the electronic component is adsorbed and the stem is mounted on the component mounting surface of the stem. With a bonding nozzle for mounting electronic parts and the stem base arranged on the stem mounting surface,
A stem mounting head that rotates the stem base around an axis passing through the center of the stem mounting surface, and a heater unit that heats the electronic component placed on the component mounting surface of the stem are provided. A die bonding apparatus characterized in that 2. The stem mounting head has a chuck portion that sandwiches a peripheral portion of the stem base of the stem, and the chuck portion includes a plurality of claw portions that extend along the axis and are arranged in an annular shape. 2. The stem mounting surface is formed at an end of each of the plurality of claw portions, and the chuck portion rotates about the axis orthogonal to the stem mounting surface. Die bonding equipment. 3. The pressing means for pressing each of the claws from the outside is a hollow piston rod that reciprocates in the axial direction along the outer peripheral surface of each of the claws. By cooperation of the first taper surface formed annularly on the peripheral surface and the second taper surface formed annularly on the outer peripheral surface of each claw portion, each claw portion is substantially orthogonal to the axis. The die-bonding apparatus according to claim 2, wherein the die-bonding apparatus presses in a direction from the outside. 4. The chuck portion is provided with a rotary shaft extending along the axis, and the rotary shaft is rotated by a predetermined angle by a motor fixed to the stem mounting head. Item 3. The die bonding apparatus according to item 2 or 3.