JP2003221563A - Adhesive sheet assembly - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a unit adhesive sheet assembly enabling an IC medium to be produced easily at a low cost by forming desired electrically conductive circuit(s) through cutting out or peeling an appropriate plurality of the unit adhesive sheets, appropriately combining them together and sticking them on the surface of an object such as an article like a base material (e.g. paper, plastic), card, label, tag or foam. <P>SOLUTION: This unit adhesive sheet assembly is such one that the respective unit adhesive sheets are provided with a plurality of electrically conductive circuit units differing in shape, size and function from one another. An appropriate plurality of the unit adhesive sheets are selected and removed from the assembly, appropriately combined together, and stuck on the surface of an object. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive sheet assembly provided with a plurality of unit adhesive sheets. More specifically, for example, the unit adhesive sheets of the adhesive sheet assembly are appropriately combined to make paper or plastic. Information such as contact-type, non-contact or hybrid-type IC cards, labels, tags, forms, etc. by sticking to the adherend surface such as base materials of cards, cards, labels, tags, forms or other various products Information recording members such as recording media, interposers, and inlet sheets, and general ICs including IC substrates incorporated in devices
The present invention relates to an adhesive sheet assembly capable of forming a conductive circuit applicable to a medium.

[0002]

2. Description of the Related Art Non-contact type IC cards, labels, tags, etc.
An example of the conventional manufacturing method of IC media such as foam is shown below. That is, the IC is printed on the surface of a substrate such as paper or plastic.
The structure is divided into an IC chip mounting interposer on which a chip is mounted and an antenna circuit holder provided with an antenna circuit (conductive circuit) formed on the surface of a base material such as paper or plastic. An antenna circuit holder provided with an antenna circuit is formed in advance, and a non-contact type IC medium is formed using these.

FIG. 5 shows a process of forming one of the IC chip mounting interposers. First, an adhesive layer is formed on a base material surface such as paper having a predetermined size so as to extend over a terminal portion of an antenna circuit holder described later. The adhesive sheet 20 provided is prepared (a), the thermosetting conductive ink is screen-printed on the adhesive layer surface of the adhesive sheet 20, the conductive ink is cured by heating, and the conductive portion 21 for mounting the IC chip and the conductive portion 21 are electrically conductive. Connection part 2
A pair of conductive patterns 23 continuous with 2 are provided (B). After that, the IC chip 24 is mounted so as to straddle the IC chip mounting conductive portion 21 to form the IC chip mounting interposer A (C).

FIG. 6 shows an antenna circuit holder B equipped with the other antenna circuit, in which a thermosetting conductive ink is screen-printed on a base material 25 such as paper or plastic and heated to conduct electricity. The ink is cured and the antenna part 26
Are formed. Reference numeral 27 is a resist portion formed between thermosetting insulating inks formed between the intersecting antenna portions 26. Reference numeral 26a denotes a conductive connection portion (a planned joining portion) which is a terminal portion formed at the end portion of the antenna portion 26, which is formed at the same time as the antenna portion 26. By these, the antenna circuit holder B including the antenna circuit is formed. The conductive connection portion 26a is provided so as to correspond to the conductive connection portion 22 of the IC chip mounting interposer A.

The IC chip mounting interposer A
And an antenna circuit holder B provided with an antenna circuit are overlapped so that the conductive connection portions 22 and 26a face each other, and the IC chip mounting interposer A is bonded via the adhesive layer and the conductive connection is made. Part 2
The non-contact type IC medium C shown in FIG. 7 is obtained by electrically connecting 2 and 26a and joining the IC chip mounting interposer A and the antenna circuit holder B having the antenna circuit.

[0006]

According to the conventional manufacturing method as described above, it is preferable to mass-produce IC media having a conductive circuit having a fixed shape, size, and function, but the shape (pattern) However, there is a problem that it is not easy to switch to the production of the IC media provided with the conductive circuits having different sizes and functions, and it takes time and cost.

An object of the present invention is an adhesive sheet assembly provided with a plurality of unit adhesive sheets, which makes it possible to easily and inexpensively produce IC media having conductive circuits having different shapes, sizes, and functions. Then, take out a plurality of appropriate unit adhesive sheets selected from the adhesive sheet assembly and combine them, and attach them to the surface of the adherend such as base materials such as paper and plastics, cards, labels, tags, foams and various other products. Another object of the present invention is to provide an adhesive sheet assembly capable of easily forming a desired conductive circuit.

[0008]

In order to solve the above problems, the adhesive sheet assembly according to claim 1 of the present invention is an assembly of unit adhesive sheets, wherein each of the unit sheets has a shape and a size. It is characterized in that a plurality of types of conductive circuit units having different functions are formed.

The adhesive sheet assembly according to claim 2 of the present invention is
The adhesive sheet assembly according to claim 1, wherein the adhesive sheet has removability and reattachability.

From the adhesive sheet assembly of the present invention, a unit adhesive sheet having a plurality of types of conductive circuit units having different shapes, sizes, and functions is appropriately selected, and a plurality of them are cut or peeled off. By combining unit adhesive sheets that have been cut off or peeled off and attached to the adherend surface such as base materials such as paper and plastics, cards, labels, tags, foams and various other products, A conductive circuit can be easily formed. In this way, IC media having conductive circuits of different shapes, sizes and functions can be easily produced at low cost. Using the adhesive sheet assembly of the present invention, it is incorporated into an information recording medium such as a contact type / non-contact type or hybrid type IC card, a label, a tag, a foam, an information recording member such as an interposer and an inlet sheet, and further devices. Conductive circuits applicable to general IC media including IC substrates can be easily formed. When the adhesive sheet is an adhesive sheet having removability and re-adhesive property, it is possible to appropriately cut or peel a plurality of unit adhesive sheets of the adhesive sheet assembly of the present invention, and combine the unit adhesive sheets appropriately. It can be used to adhere to the surface of an adherend such as a base material, or can be peeled off and re-adhered.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION The adhesive sheet assembly of the present invention will be described below with reference to FIGS. 1 and 2. FIG. 1 is a plan view illustrating one embodiment of the adhesive sheet assembly of the present invention,
FIG. 2 is an explanatory diagram schematically illustrating the XX cross section of the adhesive sheet assembly of the present invention in FIG. 1.

In FIGS. 1 and 2, the same components as those shown in FIGS. 5 to 7 are designated by the same reference numerals, and a duplicate description will be omitted. As shown in FIG. 1, the adhesive sheet assembly 1 of the present invention includes unit adhesive sheets 2a to 2x.
In each of the unit sheets 2a to 2x, a plurality of types of conductive circuit units 3a to 3x having different shapes, sizes, and functions are formed.

As shown in FIG. 2, the adhesive sheet assembly 1 of the present invention comprises a patch layer 5 formed on a substrate 4 and made of a patch having removability and re-sticking property. A thermosetting conductive ink is screen-printed on the surface of the adhesive layer 5 of the provided adhesive sheet 6, and the conductive ink is cured by heating to form the conductive circuit units 3a to 3x. 7 is a perforation, and each unit adhesive sheet 2 is cut by cutting from the perforation 7.
Each of a to 2x can be individually cut off.

For example, the conductive circuit unit 3m of the unit adhesive sheet 2m straddles the IC chip mounting conductive portion 21 of a pair of conductive patterns in which the IC chip mounting conductive portion 21 and the conductive connecting portion 22 are continuous. Corresponding to the IC chip mounting interposer A on which the IC chip 24 is mounted, the conductive circuit unit 3s of the unit adhesive sheet 2s is a unit forming a part of the antenna circuit holder B, and the conductive circuit 27 intersects. A resist portion made of thermosetting insulating ink formed between (a part of the antenna portion 26) is shown, and the conductive circuit units 3t and 3x of the unit adhesive sheets 2t and 2x are part of the antenna circuit holder B. Is a conductive circuit unit including a conductive connection portion (scheduled joining site) 26a.

For example, when the antenna circuit holder B (which is one type of IC medium in the present invention) is prepared from the adhesive sheet assembly 1 of the present invention, the unit adhesive sheets 2a to
Select an appropriate unit adhesive sheet from 2x and select perforations 7
It can be prepared by cutting a plurality of sheets by using, and appropriately combining the cut-off unit adhesive sheets, and by sticking them to the surface of an adherend such as a base material such as paper or plastic via the adhesive layer 5.

The antenna circuit holder B thus created and the unit adhesive sheet 2m (the IC chip mounting interposer A) are respectively connected to the conductive connecting portions 22 and 2.
Peeling and sticking are performed so that 6a faces each other, and they are overlapped with each other, and the unit adhesive sheet 2m is adhered via the adhesive layer 5, and at the same time, the conductive connection portions 21 and 26a are electrically connected to each other, thereby unit adhering. Sheet 2m and antenna circuit holder B
By joining and, the non-contact type IC medium C shown in FIG. 7 is obtained.

In the above embodiment, the adhesive layer 5 is the base material 4
Although the example in which the conductive circuit units 3a to 3x are formed on the upper surface of the base material 4 is shown, the adhesive layer 5 is not limited to the upper surface of the base material 4, and may be formed on the lower surface of the base material 4. Further, it may be formed on the upper surface and the lower surface of the base material 4.

FIG. 3 shows the adhesive sheet assembly of the present invention shown in FIG. 1 in which the adhesive layer 5 is formed on the lower surface of the substrate 4,
It is explanatory drawing which illustrates typically the XX cross section of the adhesive sheet assembly 1A of this invention which formed the conductive circuit units 3a-3x on the upper surface of the base material 4.

FIG. 4 shows the adhesive sheet assembly of the present invention shown in FIG. 1, in which the adhesive layer 5 is formed on the upper surface and the lower surface of the base material 4, and the adhesive layer 5 on the upper surface of the base material 4 is formed. It is explanatory drawing which illustrates typically the XX cross section of the adhesive sheet assembly 1B of this invention which formed the conductive circuit units 3a-3x on it.

In the above embodiment, the adhesive layer 5 is the base material 4
Although the example in which the adhesive layer 5 is provided on the entire upper surface and / or the lower surface is shown, the adhesive layer 5 can be provided only on the upper surface and / or the lower surface of the base material 4 where necessary.

The adhesive sheet used in the present invention may have strong tackiness, or may have removability and reattachability. However, the adhesive sheet used in the present invention is preferably an adhesive sheet having removability and re-adhesiveness. When it is an adhesive sheet having removability and re-adhesiveness, it can be attached to the surface of an adherend such as a substrate by appropriately combining unit adhesive sheets, or can be re-peeled and re-attached. it can.

The adhesive having removability and re-adhesiveness used in the present invention is not particularly limited, but specifically, for example, urethane resin, acrylic resin, polyester resin, rubber resin and the like. The urethane resin made of a polyurethane elastomer is particularly preferable. Polyurethane elastomer is composed of a soft segment containing a long-chain polyol as a main component and a hard segment consisting of a diisocyanate and a chain extender.As the long-chain polyol, a polyester polyol or a polyether polyol is mainly used, Diisocyanates include TDI (tolylene diisocyanate) and pure M
DI (diphenylmethane diisocyanate), HDI
(Hexamethylene diisocyanate) or the like is used. As the chain extender, low molecular weight polyhydric alcohols, aromatic diamines and the like are used. The type of polyurethane elastomer is a one-pack type in which a thermoplastic polyurethane elastomer obtained by polymerizing a long-chain polyol and a diisocyanate such as TDI or MDI is diluted with an organic solvent, or a polyurethane elastomer or a prepolymer thereof is polyisocyanate. A two-pack type in which a cross-linking agent such as the above is added and cured later is mentioned.

Other polyurethane elastomers include those obtained by reacting the following polyols with organic diisocyanates. Examples of the polyol include propylene glycol, ethylene glycol, or those obtained by addition-polymerizing propylene oxide or ethylene oxide, polyether diol such as polytetramethylene ether glycol, ethylene glycol, propylene glycol, 1,4-butanediol, and the like. Examples thereof include polyester glycols obtained by dehydration condensation of low molecular weight glycols and organic acids such as adipic acid and phthalic acid. As the organic diisocyanate, aromatic diisocyanates such as 2,4-toluylene diisocyanate and 2,6-toluylene diisocyanate, 4,4'-diphenylmethane diisocyanate, 2,4'-diphenylmethane diisocyanate, and 1,5-naphthylene diisocyanate are used. , Hexamethylene diisocyanate, isophorone diisocyanate,
4,4'-dicyclohexylmethane diisocyanate,
Examples thereof include aliphatic or alicyclic diisocyanates such as xylylene diisocyanate, dimers, trimers, and carbodiimide modified products thereof.

Examples of strong adhesives include natural rubber adhesives, synthetic rubber adhesives, acrylic resin adhesives, polyvinyl ether resin adhesives, urethane resin adhesives,
Examples thereof include silicone resin-based adhesives.

The pressure-sensitive adhesive used in the present invention may be, for example, a gravure coater, a flexo, an air knife coater, a bar coater, a blade coater, a river roll coater, a kiss roll coater, a cast coater. The pressure-sensitive adhesive layer can be formed by applying a predetermined portion on the surface of the base material with a coating means such as a coater or a coater coater, and drying and curing if necessary. The pressure-sensitive adhesive used in the present invention may be diluted with an optimal solvent or the like to a concentration suitable for each coater.

The base material used in the present invention is a woven fabric, a non-woven fabric, a mat, a paper or a combination thereof made of an inorganic or organic fiber such as glass fiber, alumina fiber, polyester fiber or polyamide fiber, or a combination thereof. Composite substrate formed by impregnating varnish, polyamide resin substrate, polyester resin substrate, polyolefin resin substrate, polyimide resin substrate, ethylene
Vinyl alcohol copolymer substrate, polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polystyrene resin substrate, polycarbonate resin substrate, acrylonitrile butadiene styrene copolymer resin Substrates, plastic substrates such as polyethersulfone resin substrates, or matte treatment, corona discharge treatment, plasma treatment, UV irradiation treatment,
It is possible to select and use from known materials such as those subjected to surface treatment such as electron beam irradiation treatment, flame plasma treatment and ozone treatment, or various types of easy adhesion treatment.

The conductive ink and insulating ink used in the present invention are not particularly limited, and specific examples of the conductive ink include those containing conductive particles and an insulating binder as main components. Specific examples of the insulating ink include those containing an insulating binder as a main component. As the conductive particles, metal powder, especially silver powder is preferable. Further, in order to control the resistance value and compatibility with solder, a conductive metal other than silver, for example, powder of gold, platinum, palladium, rhodium or the like may be added. However, as the conductive ink, when the binder itself is a binder having conductivity,
Conductive particles are not essential. The binder may be any known material such as a permeation dry type, a solvent volatilization type, a thermosetting type, and a photocuring type. When the photocurable resin is contained in the binder, the curing time can be shortened and the efficiency can be improved.

Specific insulating binders include, for example, acrylate compounds, methacrylate compounds, propenyl compounds, allyl compounds, vinyl compounds, acetylene compounds, unsaturated polyesters, epoxy poly (meth) acrylates, poly (meth) acrylates. Polyurethanes, polyester polyol poly (meth) acrylates, polyether polyol poly (meth) acrylates, phenoxyethyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, styrene, α-alkylstyrene, other epoxy compounds, etc. A thermosetting or radiation curable curable resin can be mentioned. You may use these in mixture of 2 or more types. If necessary, liquid polybutene, mineral oil, liquid polyisobutylene, liquid polyacrylic acid ester, tackifier, rosin and rosin derivative, polyterpene resin, terpene phenol resin, petroleum resin and the like can be added. If necessary, it can be diluted with an organic solvent. Further, a filler can be added if necessary. Examples of the filler include silica, alumina, calcium carbonate, titanium oxide, carbon black and the like. You may use these in mixture of 2 or more types.

The conductive ink or insulating ink used in the present invention is, for example, a gravure coater, a flexo coater, an air knife coater, a bar coater, a blade coater, a river roll coater, a kiss roll coater, a cast coater. -By coating means such as a coater or a coater on a predetermined portion of the surface of the base material or the pressure-sensitive adhesive layer formed on the surface of the base material, and drying and curing as necessary, various kinds of It is possible to form the adhesive sheet assembly of the present invention, which includes a plurality of conductive circuit units in which patterns, sizes, etc. are arbitrarily designed according to requirements.

Any known IC chip can be used in the present invention. If necessary, bumps 7 may be formed on the connection terminals of the IC chip by metal electrolytic plating, studs, electroless metal plating, fixing of conductive resin, or the like. When mounting the IC chip, heat, light, electromagnetic waves such as high frequency, and energy such as ultrasonic waves may be applied depending on the pressure and the adhesive as required.

Wire bonding and a known thermosetting adhesive are used for surely connecting, fixing and mounting the IC chip. Specifically, the thermosetting adhesive is
ACF (Anisotropic Conductiv
eFilm (anisotropic conductive film), ACP (Ani
sotropic Conductive Paste
(Anisotropic conductive paste) or other anisotropic conductive adhesive material, or NCF (Non-Conductive F)
ilm (insulating film), recently NCP
An insulating adhesive material (adhesive material not containing a conductive material) such as (Non-Conductive Paste) or a double-sided tape can be used, and a dispersion method, a printing method, a spray method or the like is used for application. be able to. Among these, ACP or NC
It is preferable to use P for the dispersion method or the printing method.

In the present invention, a release sheet may be provided to protect the adhesive layer. Examples of the release sheet include those obtained by subjecting a mirror-finished coated paper to a release treatment, a mirror-finished polyolefin melt-extruded coated paper alone or a release-treated one, a highly smooth synthetic resin such as polyethylene terephthalate film or polypropylene film. A single film or a film which has been subjected to a release treatment can be preferably used. The release treatment may be conventionally known, and examples of the release agent include silicone resin, alkyd resin, silicone / alkyd copolymer resin, polyethylene, polypropylene alone or in a mixture, and silicone / PVA mixture.

The above description of the embodiments is for explaining the present invention and does not limit the invention described in the claims or reduce the scope thereof. Further, the configuration of each part of the present invention is not limited to the above embodiment, and various modifications can be made within the technical scope described in the claims.

[0034]

The adhesive sheet assembly according to claim 1 of the present invention is an assembly of unit adhesive sheets, and each of the unit sheets has a plurality of types of conductive circuit units having different shapes, sizes, and functions. Is formed, the unit adhesive sheet is appropriately selected from the adhesive sheet assembly and cut or peeled off only a plurality of sheets, and by appropriately combining them, a base material such as paper or plastic, a card, a label, a tag, etc. A desired conductive circuit can be easily formed by sticking it to the surface of the adherend such as foam or various other products, so that an IC media with a conductive circuit having different shapes, sizes, and functions can be easily reduced. It has a remarkable effect that it can be produced at a cost. Contact-type / non-contact-type or hybrid-type IC using the adhesive sheet assembly of the present invention
Conductive circuits applicable to information recording media such as cards, labels, tags and forms, information recording members such as interposers and inlet sheets, and general IC media including IC substrates incorporated in equipment can be formed. .

The adhesive sheet assembly according to claim 2 of the present invention is
In the adhesive sheet assembly according to claim 1, since the adhesive sheet has removability and re-adhesiveness, the adhesive sheet assembly has the same effect as the adhesive sheet assembly according to claim 1, and a plurality of unit adhesive sheets are appropriately cut off. Or, it can be easily peeled off, and it can be attached to the surface of an adherend such as a base material using an appropriate combination of unit adhesive sheets, or it can be peeled off again and re-adhered. Play.

[Brief description of drawings]

FIG. 1 is an explanatory plan view illustrating an embodiment of an adhesive sheet assembly of the present invention.

FIG. 2 is an explanatory view schematically illustrating an XX cross section of the adhesive sheet assembly of the present invention in FIG.

FIG. 3 is a schematic cross-sectional view taken along line XX of the adhesive sheet assembly of the present invention shown in FIG. 1 in which an adhesive layer is formed on the lower surface of a base material and a conductive circuit unit is formed on the upper surface of the base material. FIG.

4] In the adhesive sheet assembly of the present invention shown in FIG. 1, adhesive layers are formed on the upper surface and the lower surface of a base material, and a conductive circuit unit is formed on the adhesive layer on the upper surface of the base material. It is explanatory drawing which illustrates typically the XX cross section in the case of doing.

FIG. 5 is an explanatory diagram showing a process of forming an IC chip mounting interposer.

FIG. 6 is an explanatory diagram showing an antenna circuit holder provided with an antenna circuit.

FIG. 7 is an IC chip mounting interposer shown in FIG.
It is explanatory drawing which shows the non-contact type IC medium formed by stacking the antenna circuit holding body provided with the antenna circuit shown in FIG.

[Explanation of symbols]

1, 1A, 1B Adhesive sheet assembly 2a to 2x of the present invention Unit adhesive sheet 3a to 3x Conductive circuit unit 4 Base material 5 Adhesive layer 6 Adhesive sheet A IC chip mounting interposer B Antenna circuit (conductive circuit) Antenna circuit holder C Non-contact type IC media

Continued front page    F-term (reference) 2C005 HA17 HA24 JA26 KA01 KA06                       LA04 MA19 MA33 NA09 RA04                       RA05 RA11 RA30                 4J004 AA04 AA05 AA10 AA11 AA14                       AA15 CA03 CA06 CA07 CA08                       CB01 CB02 CC02 CC03 CD07                       CD08 EA04 FA01 FA05 FA08                 4J040 CA001 CA011 DD051 DF001                       EF001 EF111 EF131 EF291                       EF301 EK031 JA09 JB09                       MB02 MB03 NA19 NA20 PA42                 5B035 AA04 BA03 BA05 BA06 BB09                       CA01 CA08

Claims (2)

[Claims] 1. An aggregate of unit adhesive sheets, wherein a plurality of types of conductive circuit units having different shapes, sizes, and functions are formed on each of the unit sheets. . 2. The adhesive sheet assembly according to claim 1, wherein the adhesive sheet has removability and reattachability.