JP2003220366A - Cleaning apparatus for substrate and cleaning method using this apparatus - Google Patents

Cleaning apparatus for substrate and cleaning method using this apparatus

Info

Publication number
JP2003220366A
JP2003220366A JP2002022241A JP2002022241A JP2003220366A JP 2003220366 A JP2003220366 A JP 2003220366A JP 2002022241 A JP2002022241 A JP 2002022241A JP 2002022241 A JP2002022241 A JP 2002022241A JP 2003220366 A JP2003220366 A JP 2003220366A
Authority
JP
Japan
Prior art keywords
solvent
cleaning
dropping
cleaning member
drops
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002022241A
Other languages
Japanese (ja)
Other versions
JP4053781B2 (en
Inventor
Kentaro Nakamura
中村  健太郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2002022241A priority Critical patent/JP4053781B2/en
Publication of JP2003220366A publication Critical patent/JP2003220366A/en
Application granted granted Critical
Publication of JP4053781B2 publication Critical patent/JP4053781B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Landscapes

  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cleaning apparatus for a substrate capable of detecting whether a solvent is certainly supplied to a cleaning member for cleaning the electrode surface of the substrate plate. <P>SOLUTION: This cleaning apparatus is equipped with the cleaning member 15 coming into contact with the substrate 5 while relatively moving with respect to the substrate 5 to clean the electrode on the substrate plate 5, a nozzle 24a for dropping a solvent to the part coming into contact with the electrode of the cleaning member before bringing the cleaning member into contact with the electrode, a sensor 28a for detecting the dropping number of liquid drops of the solvent dropped from the nozzle and a control unit 29 having the dropping number of the liquid drops of the solvent and a dropping time required for dropping the solvent corresponding to the dropping number of the liquid drops set thereto and comparing and judging whether the dropping numbers of the liquid drops of the solvent reach set numbers before and after arriving at the dropping time set on the basis of the detection signal of the sensor. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】この発明は基板に形成された
電極を清掃するための清掃装置及び清掃方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning device and a cleaning method for cleaning electrodes formed on a substrate.

【0002】[0002]

【従来の技術】液晶パネルなどの基板は、その基板の縁
部に沿って電極が設けられ、この電極上にTCP(Tape
Carrier Package)やICチップなどの電子部品が接
合載置されて構成される。
2. Description of the Related Art A substrate such as a liquid crystal panel is provided with electrodes along the edge of the substrate, and TCP (Tape
It is configured by joining and mounting electronic components such as a carrier package) and an IC chip.

【0003】上記電極と電子部品とは異方性導電膜を介
して電気的に接続される。そのため、接合部分におい
て、電気的に良好な導通状態を得るためには、上記電極
面がゴミの付着などによって汚れていないことが必要と
なる。そこで、基板の電極面に異方性導電膜を貼付する
に先立ち、その電極面を清掃装置によって清掃するとい
うことが行なわれている。
The electrodes and electronic components are electrically connected via an anisotropic conductive film. Therefore, in order to obtain a good electrical continuity in the joint portion, it is necessary that the electrode surface is not contaminated due to dust adhesion or the like. Therefore, prior to attaching the anisotropic conductive film to the electrode surface of the substrate, the electrode surface is cleaned with a cleaning device.

【0004】上記清掃装置は、基板を所定方向に沿って
搬送するテーブルを有し、このテーブルの上方には供給
リールと巻き取りリールとに張設されてテープ状の清掃
部材が設けられている。この清掃部材にはノズルからア
ルコールなどの揮発性の溶剤を滴下させて染み込ませ、
この溶剤が染み込んだ部分を所定位置まで移動させ、搬
送される基板の縁部の電極面に所定の圧力で接触させる
ことで、上記電極面を清掃するようにしている。
The cleaning device has a table for transporting the substrate along a predetermined direction, and a tape-shaped cleaning member which is stretched between the supply reel and the take-up reel is provided above the table. . A volatile solvent such as alcohol is dripped into this cleaning member from the nozzle to allow it to soak in,
The electrode surface is cleaned by moving the portion soaked with the solvent to a predetermined position and contacting the electrode surface at the edge of the substrate to be transferred with a predetermined pressure.

【0005】上記ノズルは溶剤が滴下される先端が細径
であるため、しばしば目詰まりを起こしたり、溶剤内に
気泡が混入して適正な滴下が行なわれないことがある。
その場合には、乾燥した清掃部材によって基板の電極面
が擦られることになるため、その摩擦によって静電気が
発生し、その静電気が電極を介して基板内に形成された
回路素子を破壊する虞がある。
Since the tip of the above-mentioned nozzle onto which the solvent is dripped has a small diameter, clogging often occurs, and bubbles may be mixed in the solvent to prevent proper dropping.
In that case, since the electrode surface of the substrate is rubbed by the dry cleaning member, static electricity is generated by the friction, and the static electricity may destroy the circuit element formed in the substrate through the electrode. is there.

【0006】そこで、従来は雫状にノズルから滴下する
溶剤の液滴数を、ノズルの近くに設けた、たとえば反射
型の光センサによってカウントし、この光センサによる
カウント値に基づいて液滴が適正に滴下されたか否かを
判定し、適正であれば清掃部材の液滴が滴下した部分に
よって基板の清掃を行なうようにしている。
Therefore, conventionally, the number of droplets of the solvent dripped from the nozzle in a drop shape is counted by, for example, a reflection type optical sensor provided near the nozzle, and the droplet is generated based on the count value by the optical sensor. It is determined whether or not the droplet has been properly dropped, and if it is appropriate, the substrate is cleaned by the portion of the cleaning member on which the droplet has been dropped.

【0007】[0007]

【発明が解決しようとする課題】ところで、ノズルから
滴下される溶剤は、このノズルの先端が細径であるた
め、自身の表面張力によりノズル先端から雫が落下せ
ず、液溜まり状態となることがある。その場合、ノズル
先端に溜まった溶剤が揺らぐと、その揺らぎによって上
記光センサはノズルから所定数以上の液滴が滴下したも
のと誤検出してしまうことがある。
By the way, the solvent dropped from the nozzle has a small diameter at the tip of the nozzle. Therefore, the droplet does not drop from the tip of the nozzle due to the surface tension of the solvent and becomes a liquid pool state. There is. In that case, if the solvent accumulated at the tip of the nozzle fluctuates, the fluctuation may cause the optical sensor to erroneously detect that a predetermined number or more of liquid droplets have dropped from the nozzle.

【0008】その結果、適正数の液滴数に達していない
にも係わらず基板の清掃を開始してしまい、清掃部材の
溶剤が十分に或いは全く染み込んでいない部分で基板の
電極面を清掃してしまうことになるから、静電気の発生
による回路素子の破壊を招く虞がある。
As a result, the cleaning of the substrate is started even though the proper number of droplets has not been reached, and the electrode surface of the substrate is cleaned at the portion of the cleaning member where the solvent is not sufficiently or completely impregnated. Therefore, there is a possibility that the circuit element may be destroyed due to the generation of static electricity.

【0009】この発明は、静電気の発生による回路素子
の破壊を防止することができる基板の清掃装置及び清掃
方法を提供することにある。
An object of the present invention is to provide a substrate cleaning device and a cleaning method capable of preventing the destruction of circuit elements due to the generation of static electricity.

【0010】[0010]

【課題を解決するための手段】この発明は、基板に形成
された電極を清掃するための清掃装置において、前記基
板に対し相対的に移動しつつ前記電極に接触し前記電極
を清掃する清掃部材と、この清掃部材を前記電極に接触
させる前に前記清掃部材における前記電極に接触する部
分に溶剤を滴下させるノズルと、このノズルから滴下す
る溶剤の液滴数を検出する検出手段と、溶剤の滴下数及
びその滴下数の溶剤を滴下するに要する時間とが設定さ
れるとともに、前記検出手段の検出信号に基づいて設定
された前記滴下時間の到達前と到達後とにおける溶剤の
滴下数が設定数に達したか否かを比較判定する制御手段
とを具備したことを特徴とする基板の清掃装置にある。
According to the present invention, there is provided a cleaning device for cleaning an electrode formed on a substrate, the cleaning member being in contact with the electrode while moving relative to the substrate to clean the electrode. A nozzle for dropping a solvent onto a portion of the cleaning member that comes into contact with the electrode before the cleaning member comes into contact with the electrode; a detection unit that detects the number of droplets of the solvent that is dropped from the nozzle; The number of drops and the time required to drop the solvent of the number of drops are set, and the number of drops of the solvent before and after the arrival of the drop time set based on the detection signal of the detection means is set. A cleaning device for a substrate is provided with a control means for comparing and determining whether or not the number has been reached.

【0011】前記清掃部材の前記ノズルに対向する部分
若しくは前記ノズルのどちらか一方は昇降機構によって
互いに接触可能に設けられ、前記設定された滴下時間の
後で前記検出手段によって検出される液滴数が設定数に
到達しない場合には、前記昇降機構によって前記清掃部
材と前記ノズルとを接触させることが好ましい。
Either the portion of the cleaning member facing the nozzle or the nozzle is provided so as to be in contact with each other by an elevating mechanism, and the number of droplets detected by the detecting means after the set dropping time. Is less than the set number, it is preferable to bring the cleaning member into contact with the nozzle by the elevating mechanism.

【0012】前記設定された滴下時間の前に前記検出手
段によって検出される液滴数が設定数に到達した場合に
は、前記清掃部材への溶剤の滴下を最初から実行し直す
ことが好ましい。
When the number of droplets detected by the detecting means reaches the set number before the set dropping time, it is preferable to restart the dropping of the solvent onto the cleaning member from the beginning.

【0013】基板に形成された電極に清掃部材を接触さ
せて清掃する清掃方法において、前記清掃部材に滴下す
る溶剤の滴下数と前記滴下数の溶剤を滴下するに要する
滴下時間を設定する設定工程と、前記設定工程にて設定
された滴下数と前記滴下時間とに基づいて、前記清掃部
材に前記溶剤を滴下する滴下する滴下工程と、前記滴下
工程中に前記溶剤の滴下数を検出するとともに、前記溶
剤の滴下開始からの経過時間を検出する検出工程と、前
記検出工程にて検出された滴下数と経過時間とに基づい
て前記清掃部材による清掃の実行の可否を判定する判定
工程と、を具備したことを特徴とする基板の清掃方法に
ある。
In a cleaning method in which a cleaning member is brought into contact with an electrode formed on a substrate for cleaning, a setting step of setting the number of drops of the solvent dropped onto the cleaning member and the dropping time required to drop the solvent of the dropped number A dropping step of dropping the solvent to the cleaning member based on the dropping number and the dropping time set in the setting step, and detecting the dropping number of the solvent during the dropping step. A detection step of detecting an elapsed time from the start of the dropping of the solvent, and a determination step of determining whether or not the cleaning by the cleaning member can be performed based on the number of drops detected in the detecting step and the elapsed time, The method for cleaning a substrate is characterized by comprising:

【0014】前記経過時間が前期滴下時間を経過した
後、前記検出された滴下数が前記設定された滴下数に満
たない場合、前記ノズルと前記清掃部材とを相対的に接
近させて前記ノズルと前記清掃部材とを接触させること
が好ましい。
If the detected number of drops is less than the set number of drops after the elapsed time has passed the previous drop time, the nozzle and the cleaning member are brought relatively close to each other. It is preferable to contact the cleaning member.

【0015】前記経過時間が前記滴下時間を経過する前
に前記検出された滴下数が前記設定された滴下数を超過
した場合、前記滴下工程を最初から実行し直すことが好
ましい。
If the detected number of drops exceeds the set number of drops before the elapsed time has passed the drop time, it is preferable to restart the dropping step from the beginning.

【0016】この発明によれば、溶剤の滴下数とその滴
下数の溶剤を滴下することに要する滴下時間とを設定
し、設定された滴下時間の到達前と到達後とにおける検
出された滴下数を設定された滴下数と比較するため、滴
下時間の到達前に滴下数が設定数に到達した場合と、滴
下時間の到達後に滴下数に達しない場合は、それぞれ清
掃部材に対する溶剤の滴下が異常である判定することが
できる。
According to the present invention, the number of drops of the solvent and the dropping time required for dropping the solvent of the number of drops are set, and the detected number of drops before and after the set dropping time is reached. In order to compare the number of drops to the set number of drops, if the number of drops reaches the set number before the drop time reaches, and if the number of drops does not reach after the drop time reaches, the dropping of the solvent to the cleaning member is abnormal. Can be determined.

【0017】[0017]

【発明の実施の形態】以下、この発明の一実施の形態を
図1乃至図6を参照しながら説明する。
BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to FIGS.

【0018】図1はこの発明の清掃装置の正面図、図2
は側面図であって、この清掃装置は本体1を備えてい
る。この本体1の前面側には搬送装置2が設けられてい
る。この搬送装置2は本体1の幅方向に沿うX方向に駆
動されるXテーブル3と、このXテーブル3上に設けら
れ本体1の前面に対して垂直なY方向に駆動されるYテ
ーブル4及びこのYテーブル4上に設けられ液晶パネル
などの基板5を吸着保持する保持部6とを備えている。
したがって、上記保持部6に保持された基板5はXY方
向に駆動されるようになっている。
FIG. 1 is a front view of the cleaning device of the present invention, and FIG.
Is a side view, and this cleaning device includes a main body 1. A transport device 2 is provided on the front side of the main body 1. The carrying device 2 has an X table 3 which is driven in the X direction along the width direction of the main body 1, a Y table 4 which is provided on the X table 3 and is driven in the Y direction perpendicular to the front surface of the main body 1. The Y table 4 is provided with a holding unit 6 that holds the substrate 5 such as a liquid crystal panel by suction.
Therefore, the substrate 5 held by the holder 6 is driven in the XY directions.

【0019】上記基板5は、縁部の上面に複数の電極
(図示せず)が所定方向に沿って設けられている。上記
保持部6は基板5に比べて小さく形成されている。そし
て、基板5は電極が形成された縁部を本体1の前面に対
向させて上記保持部6に保持される。
A plurality of electrodes (not shown) are provided on the upper surface of the edge of the substrate 5 along a predetermined direction. The holding portion 6 is formed smaller than the substrate 5. Then, the substrate 5 is held by the holding portion 6 with the edge portion on which the electrodes are formed facing the front surface of the main body 1.

【0020】上記本体1の前面には、上記保持部6に保
持された基板5を挟んで上側に位置する上部清掃部11
と、下側に対向位置する下部清掃部12とが設けられて
いる。各清掃部11,12は上下対称に設けられた供給
リール13a,13bと巻取りリール14a,14bを
有する。各供給リール13a,13bには耐磨耗性に優
れた柔らかなテープ状の布地からなる清掃部材15が巻
回されている。各清掃部材15はそれぞれ第1乃至第3
の中継ローラ16a〜16cと1つの巻取りローラ17
を介して各巻取りリール14a,14bに巻き取られる
ようになっている。
On the front surface of the main body 1, an upper cleaning section 11 located on the upper side with the substrate 5 held by the holding section 6 interposed therebetween.
And a lower cleaning unit 12 that is located on the lower side. The cleaning units 11 and 12 have supply reels 13a and 13b and take-up reels 14a and 14b, which are vertically symmetrical. A cleaning member 15 made of a soft tape-shaped cloth having excellent abrasion resistance is wound around each of the supply reels 13a and 13b. The cleaning members 15 are first to third
Relay rollers 16a to 16c and one take-up roller 17
It is adapted to be wound around each of the take-up reels 14a and 14b via.

【0021】上記供給リール13a,13bと巻取りリ
ール14a,14bとにはそれぞれ清掃部材15に適度
な張力を与えるモータ18a,18b及び19a,19
bが連結され、上記巻取りローラ17には、この巻取り
ローラ17を駆動するための駆動モータ21a,21b
が連結されている。
The supply reels 13a, 13b and the take-up reels 14a, 14b are respectively provided with motors 18a, 18b and 19a, 19 for applying an appropriate tension to the cleaning member 15.
drive motors 21a, 21b for driving the take-up roller 17 are connected to the take-up roller 17.
Are connected.

【0022】したがって、上部清掃部11と下部清掃部
12との清掃部材15は、駆動モータ21a,21bが
作動することで、供給リール13a,13bから巻取り
リール14a,14bに巻き取られるようになってい
る。
Therefore, the cleaning member 15 of the upper cleaning unit 11 and the lower cleaning unit 12 is wound from the supply reels 13a, 13b to the take-up reels 14a, 14b by the operation of the drive motors 21a, 21b. Has become.

【0023】なお、各モータは本体1の内部に設けら
れ、第1、第2の中継ローラ16a,16bを除く他の
ローラ及びリールは本体1の前面に回転可能に設けられ
ている。
Each motor is provided inside the main body 1, and the rollers and reels other than the first and second relay rollers 16a and 16b are rotatably provided on the front surface of the main body 1.

【0024】図4に示すように、上記第1、第2の中継
ローラ16a,16bは上記本体1の前面に上下方向に
沿ってスライド可能に設けられた可動板31に回転可能
に取付けられている。この可動板31は上記本体1の前
面に設けられた第1のシリンダ32によって上下方向に
駆動されるようになっている。
As shown in FIG. 4, the first and second relay rollers 16a and 16b are rotatably attached to a movable plate 31 provided on the front surface of the main body 1 so as to be slidable in the vertical direction. There is. The movable plate 31 is vertically driven by a first cylinder 32 provided on the front surface of the main body 1.

【0025】したがって、上記可動板31が上記第1の
シリンダ32によって上昇方向に駆動され、その動きに
第1、第2の中継ローラ16a,16bが連動すると、
上記清掃部材15の上記第1、第2の中継ローラ16
a,16bに係合した部分も連動する。つまり、上記可
動板31と第1のシリンダ32とで上記清掃部材15の
第1、第2の中継ローラ16a,16bの間に位置する
部分を上昇させる昇降機構を構成している。
Therefore, when the movable plate 31 is driven in the upward direction by the first cylinder 32 and the movement of the movable plate 31 causes the first and second relay rollers 16a and 16b to interlock with each other,
The first and second relay rollers 16 of the cleaning member 15
The parts engaged with a and 16b are also interlocked. That is, the movable plate 31 and the first cylinder 32 constitute an elevating mechanism for raising the portion of the cleaning member 15 located between the first and second relay rollers 16a and 16b.

【0026】上記第2の中継ローラ16bと第3の中継
ローラ16cとの間には押付けローラ22a,22bが
設けられている。各押付けローラ22a,22bは第2
の上下シリンダ23a,23bによって基板5の板面に
対して接離する方向に駆動されるようになっている。そ
れによって、各押付けローラ22a,22bは、保持部
6によって清掃う11,12による清掃位置へ位置付け
られた基板5の縁部に対し、清掃部材15を上方向およ
び下方向から所定の圧力で押付けることになる。
Pressing rollers 22a and 22b are provided between the second relay roller 16b and the third relay roller 16c. Each pressing roller 22a, 22b has a second
The upper and lower cylinders 23a and 23b are driven in a direction of moving toward and away from the plate surface of the substrate 5. As a result, the pressing rollers 22a and 22b press the cleaning member 15 from above and below against the edge of the substrate 5 positioned at the cleaning position of the cleaning units 11 and 12 by the holding unit 6 with a predetermined pressure. Will be attached.

【0027】清掃部材15の第1の中継ローラ16aと
第2の中継ローラ16bとの間の部分にはそれぞれ上部
ノズル24aと下部ノズル24bとが先端を対向させて
配置されている。
An upper nozzle 24a and a lower nozzle 24b are arranged with their tips opposed to each other in a portion of the cleaning member 15 between the first relay roller 16a and the second relay roller 16b.

【0028】各ノズル24a,24bはアルコールなど
の溶剤が収容された容器25に供給チューブ26を介し
て接続されている。この供給チューブ26の中途部には
ポンプ27が設けられている。このポンプ27は上記チ
ューブ26の中途部を回転するローラによって間歇的に
所定方向に沿って圧縮するようになっており、それによ
って上記容器25の溶剤を上記各ノズル24a,24b
から滴下させるようになっている。
Each nozzle 24a, 24b is connected to a container 25 containing a solvent such as alcohol via a supply tube 26. A pump 27 is provided in the middle of the supply tube 26. The pump 27 is adapted to intermittently compress the solvent in the container 25 by the rollers rotating in the middle of the tube 26 along a predetermined direction, whereby the nozzles 24a, 24b.
It is designed to be dropped from.

【0029】上記上部ノズル24aと下部ノズル24b
とから滴下された溶剤は清掃部材15に向かって落下す
る。それによって、各ノズル24a,24bから滴下さ
れた溶剤はそれぞれ清掃部材15に染み込むことにな
る。
The upper nozzle 24a and the lower nozzle 24b
The solvent dripped from and drops toward the cleaning member 15. As a result, the solvent dripped from the nozzles 24a and 24b permeates the cleaning member 15, respectively.

【0030】溶剤を清掃部材15に滴下する際、通常は
図7(a)に示すように正常に滴下されるが、図7
(b)に示すように溶剤がその表面張力により各ノズル
24a,24bから滴下されずにノズルの先端に付着残
留する液溜まりが生じることがある。その場合、図4に
矢印で示すように、上記第1のシリンダ32を駆動し、
可動板31とともに同図に鎖線で示すように第1、第2
の中継ローラ16a,16bを上昇させれば、その上昇
に清掃部材15の一対の中継ローラ16a,16bの間
の部分も上昇して各ノズル24a,24bの先端に接触
する。それによって、各ノズル24a,24bに付着残
留した溶剤を清掃部材15に吸収させることができる。
When the solvent is dropped onto the cleaning member 15, it is normally dropped as shown in FIG.
As shown in (b), the surface tension of the solvent may cause a liquid pool in which the solvent does not drip from the nozzles 24a and 24b and adheres to and remains at the nozzle tips. In that case, as shown by the arrow in FIG. 4, the first cylinder 32 is driven,
Along with the movable plate 31, as shown by a chain line in FIG.
When the relay rollers 16a, 16b are raised, the portion of the cleaning member 15 between the pair of relay rollers 16a, 16b also rises and comes into contact with the tips of the nozzles 24a, 24b. As a result, the solvent remaining on the nozzles 24a and 24b can be absorbed by the cleaning member 15.

【0031】なお、図4は上部清掃部11の昇降機構の
みを示しているが、昇降機構は下部清掃部12も同じ構
成である。
Although FIG. 4 shows only the lifting mechanism of the upper cleaning unit 11, the lower cleaning unit 12 of the lifting mechanism has the same structure.

【0032】上記上部ノズル24aと下部ノズル24b
の近傍には上記各ノズ24a,24bから滴下する溶剤
の液滴数をカウントする検出手段としてのたとえば反射
型光センサなどからなるセンサ28a,28bが配置さ
れている。
The upper nozzle 24a and the lower nozzle 24b
Sensors 28a and 28b, which are, for example, reflection type optical sensors or the like, are arranged as detection means for counting the number of droplets of the solvent dropped from the nozzles 24a and 24b.

【0033】なお、各清掃部11,12のノズル24
a,24bとセンサ28a,28bはそれぞれヘッド3
0に取付けられており、各ヘッド30は詳細は図示しな
いが、可動板31の上下動の妨げとならないように本体
1に取付けられている。
The nozzles 24 of the cleaning units 11 and 12
a, 24b and the sensors 28a, 28b are respectively the head 3
Although not shown in detail, each head 30 is attached to the main body 1 so as not to interfere with the vertical movement of the movable plate 31.

【0034】各センサ28a,28bの検出信号は制御
装置29に入力される。この制御装置29には図5に示
すように上記センサ28a,28bからの検出信号が入
力される入力部41、上記各ノズル24a,24bから
溶剤を滴下させる設定時間Tと、その時間内において滴
下する下限の滴下数αとを設定する設定部42、上記入
力部41に入力された検出数と設定部42で設定された
滴下数αとを、溶剤の滴下が開始されてから滴下時間T
の到達前と、到達後にそれぞれ比較する比較部43、こ
の比較部43での比較に基づいてポンプ27及び第1の
シリンダ32に選択的に駆動信号D、Dを出力
する駆動部44とを備えている。
Detection signals from the sensors 28a and 28b are input to the control device 29. As shown in FIG. 5, the control unit 29 has an input portion 41 to which detection signals from the sensors 28a and 28b are input, a set time T for dropping the solvent from the nozzles 24a and 24b, and a dropping time within that time. The lower limit of the number of drops α to be set is set by the setting unit 42, the detection number input to the input unit 41 and the number of drops α set by the setting unit 42 are set to the dropping time T after the start of the dropping of the solvent.
And a drive unit 44 that selectively outputs drive signals D 1 and D 2 to the pump 27 and the first cylinder 32 based on the comparison in the comparison unit 43. Is equipped with.

【0035】つぎに、上記構成の清掃装置によって基板
5に設けられた電極を清掃する手順を図6のフローチャ
ートを参照しながら説明する。
Next, a procedure for cleaning the electrodes provided on the substrate 5 by the cleaning device having the above structure will be described with reference to the flowchart of FIG.

【0036】まず、Sで示すように制御装置29の
設定部42によって溶剤の滴下数αを設定し、S
はSで設定された滴下数αを滴下するに要する溶剤
の滴下時間Tを設定する。それによって、滴下時間T内
において、溶剤は設定数α以上が滴下されることが条件
となる。
First, as shown by S 1 , the number of drops of solvent α is set by the setting section 42 of the controller 29, and in S 2 , the drop time T of the solvent required to drop the number of drops α set by S 1 is set. To set. Thereby, the condition is that the solvent is dropped by the set number α or more within the dropping time T.

【0037】Sでは、設定された滴下数αと滴下時
間Tとに基づいてポンプ27が作動し、容器25から供
給チューブ26を介して溶剤が上部ノズル24a及び下
部ノズル24bから清掃部材15に滴下される。
In S 3 , the pump 27 is operated based on the set dropping number α and dropping time T, and the solvent is transferred from the container 25 to the cleaning member 15 from the upper nozzle 24 a and the lower nozzle 24 b via the supply tube 26. Dropped.

【0038】Sでは、清掃部材15に滴下される溶
剤の実際の滴下数Cがセンサ28a,28bによって検
出されるとともに、溶剤の滴下が開始されてからの経過
時間tの計測が開始され、その検出信号が制御装置29
の入力部41に入力される。Sでは入力部41に入
力された経過時間tが設定部42で設定された滴下時間
Tと比較される。
[0038] In S 4, the actual number of drops C sensors 28a of solvent dropwise to the cleaning member 15, while being detected by 28b, the measurement of the elapsed time t after the dropping of the solvent is started is started, The detection signal is the control device 29
Is input to the input unit 41. In S 5 , the elapsed time t input to the input unit 41 is compared with the drip time T set by the setting unit 42.

【0039】Sでの比較において、経過時間tが滴
下時間Tに到達していなければ、判定がNOとなり、次
の工程Sでの処理が行われる。また、経過時間tが
滴下時間Tに到達していた場合、判定はYESとなり、
次の工程S10での処理が行われる。
In the comparison in S 5 , if the elapsed time t has not reached the dropping time T, the determination is NO, and the processing in the next step S 6 is performed. If the elapsed time t has reached the drip time T, the determination is YES,
Processing in the next step S 10 is performed.

【0040】Sでは、センサ28a,28bによっ
て検出されて制御装置29の入力部41に入力された清
掃部材15に滴下される溶剤の実際の滴下数Cが、設定
部42で設定された滴下数αと比較される。
At S 6 , the actual dropping number C of the solvent dropped on the cleaning member 15 detected by the sensors 28 a and 28 b and input to the input section 41 of the control device 29 is set by the setting section 42. Compared with the number α.

【0041】Sでの比較の結果、実際の滴下数Cが
設定された滴下数αよりも少なかった場合、判定はNO
となり、Sに戻り溶剤の滴下が継続して行なわれ
る。
As a result of the comparison in S 6 , if the actual number of drops C is less than the set number of drops α, the determination is NO.
Then, the process returns to S 4 and the dropping of the solvent is continued.

【0042】一方、Sでの比較の結果、滴下数Cが
滴下数α以上であった場合、判定はYESとなり、S
において、第1のシリンダ32の作動により清掃部
材15における第1、第2の中継ローラ16a,16b
間に位置する部分が上下動され、その上動時、清掃部材
15はノズル24a,24bに接触される。つぎに、S
において、清掃部材15が所定量送られて、清掃部
材15における未だ溶剤が滴下されていない未使用部分
がノズル24a,24bの真下に位置付けられる。さら
に、Sにおいて、検出された滴下数Cと経過時間t
とがリセットされ、その後、Sの滴下開始工程に戻
る。
On the other hand, S6As a result of the comparison in
If the number of drops is α or more, the determination is YES and S
7In operation, the cleaning unit is operated by the operation of the first cylinder 32.
First and second relay rollers 16a and 16b of the material 15
The part located between them is moved up and down, and when moving up, the cleaning member
The nozzle 15 is in contact with the nozzles 24a and 24b. Next, S
8At a predetermined amount, the cleaning member 15 is fed to
Unused portion of the material 15 on which the solvent has not yet been dripped
Are positioned directly below the nozzles 24a, 24b. Furthermore
To S9At, the number of drops C detected and the elapsed time t
And are reset, then SThreeReturn to the dropping start process
It

【0043】すなわち、経過時間tが滴下時間Tに到達
する前に、滴下数Cが滴下数α以上になるということ
は、図7(b)に示すようにノズル24a,24bの先
端に溜まった溶剤が揺らいだ結果、センサ28a,28
bが誤検出を生じたことが考えられ、このまま滴下を継
続しても溶剤の滴下数を正確に検出できない虞があるの
で、溶剤の滴下を中断し溶剤の滴下を最初からやり直す
ようにする。
That is, the fact that the number of drops C becomes equal to or more than the number of drops α before the elapsed time t reaches the drop time T is accumulated at the tips of the nozzles 24a and 24b as shown in FIG. 7 (b). As a result of the shaking of the solvent, the sensors 28a, 28
It is considered that b is erroneously detected, and there is a possibility that the number of drops of the solvent cannot be accurately detected even if the dropping is continued as it is, so the dropping of the solvent is interrupted and the dropping of the solvent is restarted from the beginning.

【0044】S10では、センサ28a,28bによっ
て検出された溶剤の実際の滴下数Cが、設定部42で設
定された滴下数αと比較される。
In S 10 , the actual drop number C of the solvent detected by the sensors 28 a and 28 b is compared with the drop number α set by the setting section 42.

【0045】S10での比較の結果、滴下数Cが滴下数
α以上であった場合、判定はYESとなり、次の工程S
11での処理が行われる。すなわち、経過時間tが滴下
時間Tに到達した時点で滴下数α以上になった場合、清
掃部材15に所定量の溶剤が滴下されたと考えられるこ
とから、清掃可能と判定し、制御装置29の駆動部44
から巻取りリール14a,14bや押付けローラ22
a,22bに駆動信号が出力され、清掃が開始される。
The result of the comparison in S 10, when dropping amount C was added dropwise a few α or more, the determination is YES, the next step S
The process of 11 is performed. That is, when the elapsed time t reaches the drip time T and becomes equal to or more than the drip number α, it is considered that a predetermined amount of the solvent is dripped on the cleaning member 15, and therefore it is determined that the cleaning is possible, and the control device 29 determines Drive unit 44
Take-up reels 14a, 14b and pressing roller 22
A drive signal is output to a and 22b, and cleaning is started.

【0046】つまり、上記清掃部材15が巻取りリール
14a,14bに巻き取られ、この清掃部材15の溶剤
が滴下された部分が押付けローラ22a,22bに対向
する位置まで送られた後、上記押付けローラ22a,2
2bが上下シリンダ23a,23bによって押し付けら
れる。それによって、上記清掃部材15の溶剤が滴下さ
れた部分が基板5の上下面の縁部に所定の圧力で押付け
られる。
That is, the cleaning member 15 is wound around the take-up reels 14a and 14b, and the portion of the cleaning member 15 on which the solvent is dropped is sent to a position facing the pressing rollers 22a and 22b, and then the pressing member is pressed. Rollers 22a, 2
2b is pressed by the upper and lower cylinders 23a and 23b. As a result, the portion of the cleaning member 15 onto which the solvent has been dropped is pressed against the edges of the upper and lower surfaces of the substrate 5 with a predetermined pressure.

【0047】清掃部材15を基板5に押付けると、搬送
装置2が作動して基板5を図1に示すX方向に搬送す
る。それによって、基板5における電極面を含む縁部が
上記清掃部材15の溶剤が滴下された部分によって静電
気の発生を招くことなく清掃されて清掃が終了する。
When the cleaning member 15 is pressed against the substrate 5, the transfer device 2 operates to transfer the substrate 5 in the X direction shown in FIG. As a result, the edge of the substrate 5 including the electrode surface is cleaned by the portion of the cleaning member 15 onto which the solvent has been dropped, without causing the generation of static electricity, and the cleaning is completed.

【0048】S10での比較の結果、滴下数Cが滴下数
αよりも少なかった場合、判定はNOとなり、次の工程
S12での処理が行われる。すなわち、経過時間tが滴
下時間Tに到達した時点で滴下数Cが滴下数αに満たな
い場合、図7(b)に示すように、ノズル24a,24
bに液溜まりが生じていることが考えられる。
The result of the comparison in S 10, if number of drops C was less than dropping several alpha, determination is NO, the processing in the subsequent second process S12 is performed. That is, if the number of drops C is less than the number of drops α at the time when the elapsed time t reaches the drop time T, as shown in FIG.
It is considered that a liquid pool is generated in b.

【0049】したがって、その場合には、駆動部44か
ら第1のシリンダ32に駆動信号が出力され、S12
示すように第1のシリンダ32を作動させて第1、第2
の中継ローラ16a,16bを上昇させ、清掃部材15
のこれらローラ16a,16bに張設された部分をノズ
ル24a,24bに接触させる。それによって、清掃部
材15にはノズル24a,24bに付着残留する溶剤が
吸収されるから、所望する量の溶剤が供給されることに
なる。
[0049] Therefore, in this case, the drive signal from the drive unit 44 to the first cylinder 32 is outputted, first by operating the first cylinder 32 as shown by S 12, the second
The relay rollers 16a and 16b of the cleaning member 15
The portions of the rollers 16a and 16b stretched are brought into contact with the nozzles 24a and 24b. As a result, the cleaning member 15 absorbs the solvent remaining on the nozzles 24a and 24b, so that a desired amount of solvent is supplied.

【0050】つまり、ポンプ27が正常に作動していれ
ば、予め設定された滴下数αに相当する量の溶剤が上記
ポンプ27からノズル24a,24bまでは送られてい
ることになるから、ノズル24a,24bに清掃部材1
5を接触させれば、このノズルまで送られてきている所
定量の溶剤が清掃部材15に吸収されることになる。
That is, if the pump 27 is operating normally, the amount of solvent corresponding to the preset number of drops α is being sent from the pump 27 to the nozzles 24a and 24b. Cleaning member 1 on 24a and 24b
When 5 is brought into contact, the cleaning member 15 absorbs a predetermined amount of solvent sent to this nozzle.

【0051】このようにして、清掃部材15に所定量の
溶剤を供給したならば、清掃部材15を下降させた後、
11の清掃開始工程に戻る。したがって、S10でN
Oの場合であっても、YESの場合と同様、静電気の発
生を招くことなく基板5の電極面を良好に清掃すること
ができる。
In this way, if a predetermined amount of solvent is supplied to the cleaning member 15, after the cleaning member 15 is lowered,
Return to the cleaning start step of S 11 . Therefore, N in S 10
Even in the case of O, as in the case of YES, the electrode surface of the substrate 5 can be satisfactorily cleaned without causing the generation of static electricity.

【0052】上記一実施の形態では昇降機構を用いて清
掃部材15の一部を上昇させ、その清掃部材15を溶剤
が付着残留するノズル24a,24bに接触させるよう
にしたが、ノズルを下降させて清掃部材15に接触させ
てもよい。
In the above-mentioned one embodiment, a part of the cleaning member 15 is raised by using the elevating mechanism and the cleaning member 15 is brought into contact with the nozzles 24a and 24b where the solvent remains, but the nozzle is lowered. Alternatively, the cleaning member 15 may be brought into contact with the cleaning member 15.

【0053】また、S10での判定結果がNOの場合、
液溜まりの他、ポンプ27の故障や、供給チューブ26
内への気泡の混入等、他の原因の可能性も考えられるの
で、安全のため警報して作業者に点検を促すようにして
もよい。
[0053] In addition, if the result of the determination in S 10 is NO,
In addition to liquid pool, pump 27 malfunctions, supply tube 26
There may be other causes such as the inclusion of air bubbles in the interior, so an alarm may be issued to prompt the operator to inspect for safety.

【0054】また、上記一実施の形態では基板5の縁部
の上面に電極が形成されている場合について説明した
が、基板の上下両面に電極が形成されている場合であっ
ても、適用可能である。
Further, although the case where the electrodes are formed on the upper surface of the edge portion of the substrate 5 has been described in the above-mentioned one embodiment, the present invention can be applied even when the electrodes are formed on both upper and lower surfaces of the substrate. Is.

【0055】[0055]

【発明の効果】以上のようにこの発明によれば、清掃部
材に溶剤が十分に供給されていない状態で清掃作業が行
なわれるのを防止することができ、これにより静電気の
発生により回路素子が破壊されることを防止できる。
As described above, according to the present invention, it is possible to prevent the cleaning work from being performed in the state where the solvent is not sufficiently supplied to the cleaning member, and the circuit element is prevented from being generated due to the generation of static electricity. Can be prevented from being destroyed.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明の一実施の形態を示す清掃装置の正面
図。
FIG. 1 is a front view of a cleaning device showing an embodiment of the present invention.

【図2】図1に示す清掃装置の側面図。FIG. 2 is a side view of the cleaning device shown in FIG.

【図3】図1に示す清掃装置の搬送装置を除いて示した
正面図。
FIG. 3 is a front view of the cleaning device shown in FIG. 1 excluding a carrying device.

【図4】図1に示す清掃装置の上部清掃部の拡大図。FIG. 4 is an enlarged view of an upper cleaning unit of the cleaning device shown in FIG.

【図5】図1に示す清掃装置の制御装置の詳細図。5 is a detailed view of a control device of the cleaning device shown in FIG.

【図6】動作を示すフローチャート。FIG. 6 is a flowchart showing an operation.

【図7】(a)はノズルの先端から溶剤が正常に滴下す
る状態の説明図、(b)はノズルの先端に液溜まりが生
じた場合の説明図。
FIG. 7A is an explanatory diagram of a state where a solvent is normally dropped from the tip of a nozzle, and FIG. 7B is an explanatory diagram when a liquid pool is generated at the tip of the nozzle.

【符号の説明】[Explanation of symbols]

2…搬送装置 5…基板 15…清掃部材 24a…上部ノズル 24b…下部ノズル 28…センサ(検出手段) 29…制御装置 42…設定部 43…比較部 2 ... Carrier 5 ... Substrate 15 ... Cleaning member 24a ... Upper nozzle 24b ... Lower nozzle 28 ... Sensor (detection means) 29 ... Control device 42 ... Setting unit 43 ... Comparison section

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 3B116 AA02 AB13 AB37 AB47 BA08 BA22 BA34 CD42 CD43 3B201 AA02 AB13 AB37 AB47 BA08 BA22 BA34 CD42 CD43 4K053 PA13 QA04 SA12 XA01 XA22 XA50 YA04    ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 3B116 AA02 AB13 AB37 AB47 BA08                       BA22 BA34 CD42 CD43                 3B201 AA02 AB13 AB37 AB47 BA08                       BA22 BA34 CD42 CD43                 4K053 PA13 QA04 SA12 XA01 XA22                       XA50 YA04

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 基板に形成された電極を清掃するための
清掃装置において、 前記基板に対し相対的に移動しつつ前記電極に接触し前
記電極を清掃する清掃部材と、 この清掃部材を前記電極に接触させる前に前記清掃部材
における前記電極に接触する部分に溶剤を滴下させるノ
ズルと、 このノズルから滴下する溶剤の液滴数を検出する検出手
段と、 溶剤の滴下数及びその滴下数の溶剤を滴下するに要する
時間とが設定されるとともに、前記検出手段の検出信号
に基づいて設定された前記滴下時間の到達前と到達後と
における溶剤の滴下数が設定数に達したか否かを比較判
定する制御手段とを具備したことを特徴とする基板の清
掃装置。
1. A cleaning device for cleaning an electrode formed on a substrate, comprising: a cleaning member that contacts the electrode and cleans the electrode while moving relative to the substrate; Nozzle for dropping the solvent onto the portion of the cleaning member that comes into contact with the electrode before contact with the cleaning member, detection means for detecting the number of droplets of the solvent dropped from this nozzle, the number of drops of the solvent and the solvent of the number of drops With the time required to drop the is set, whether the number of drops of the solvent before and after the arrival of the drop time set based on the detection signal of the detection means has reached a set number. A substrate cleaning apparatus comprising: a control unit for comparing and determining.
【請求項2】 前記清掃部材の前記ノズルに対向する部
分若しくは前記ノズルのどちらか一方は昇降機構によっ
て互いに接触可能に設けられ、 前記設定された滴下時間の後で前記検出手段によって検
出される液滴数が設定数に到達しない場合には、前記昇
降機構によって前記清掃部材と前記ノズルとを接触させ
ることを特徴とする請求項1記載の基板の清掃装置。
2. A portion of the cleaning member facing the nozzle or one of the nozzles is provided so as to be able to contact each other by an elevating mechanism, and the liquid detected by the detecting means after the set drip time. The substrate cleaning device according to claim 1, wherein the cleaning member and the nozzle are brought into contact with each other by the elevating mechanism when the number of drops does not reach a set number.
【請求項3】 前記設定された滴下時間の前に前記検出
手段によって検出される液滴数が設定数に到達した場合
には、前記清掃部材への溶剤の滴下を最初から実行し直
すことを特徴とする請求項1記載の基板の清掃装置。
3. When the number of droplets detected by the detection means reaches a set number before the set dropping time, the dropping of the solvent onto the cleaning member is restarted from the beginning. The substrate cleaning device according to claim 1, which is characterized in that.
【請求項4】 基板に形成された電極に清掃部材を接触
させて清掃する清掃方法において、 前記清掃部材に滴下する溶剤の滴下数と前記滴下数の溶
剤を滴下するに要する滴下時間を設定する設定工程と、 前記設定工程にて設定された滴下数と前記滴下時間とに
基づいて、前記清掃部材に前記溶剤を滴下する滴下する
滴下工程と、 前記滴下工程中に前記溶剤の滴下数を検出するととも
に、前記溶剤の滴下開始からの経過時間を検出する検出
工程と、 前記検出工程にて検出された滴下数と経過時間とに基づ
いて前記清掃部材による清掃の実行の可否を判定する判
定工程と、 を具備したことを特徴とする基板の清掃方法。
4. A cleaning method in which a cleaning member is brought into contact with an electrode formed on a substrate to clean the electrode, and the number of drops of the solvent dropped onto the cleaning member and the dropping time required to drop the solvent of the dropped number are set. A setting step, a dropping step of dropping the solvent onto the cleaning member based on the number of drops set in the setting step and the dropping time, and a number of drops of the solvent detected during the dropping step In addition, a detection step of detecting an elapsed time from the start of dropping the solvent, and a determination step of determining whether or not cleaning by the cleaning member can be performed based on the number of drops and the elapsed time detected in the detecting step. And a method for cleaning a substrate, comprising:
【請求項5】 前記経過時間が前期滴下時間を経過した
後、前記検出された滴下数が前記設定された滴下数に満
たない場合、前記ノズルと前記清掃部材とを相対的に接
近させて前記ノズルと前記清掃部材とを接触させること
を特徴とする請求項4記載の基板の清掃方法。
5. When the detected number of drops is less than the set number of drops after the elapsed time has passed the first drop time, the nozzle and the cleaning member are relatively brought close to each other. The method for cleaning a substrate according to claim 4, wherein a nozzle and the cleaning member are brought into contact with each other.
【請求項6】 前記経過時間が前記滴下時間を経過する
前に前記検出された滴下数が前記設定された滴下数を超
過した場合、前記滴下工程を最初から実行し直すことを
特徴とする請求項4記載の基板の清掃方法。
6. The dropping step is performed again from the beginning when the detected number of drops exceeds the set number of drops before the elapsed time exceeds the drop time. Item 4. A method for cleaning a substrate according to item 4.
JP2002022241A 2002-01-30 2002-01-30 Substrate cleaning device and cleaning method Expired - Fee Related JP4053781B2 (en)

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Application Number Priority Date Filing Date Title
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JP4053781B2 JP4053781B2 (en) 2008-02-27

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Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103611694A (en) * 2013-11-22 2014-03-05 日商株式会社雷恩工业 Workpiece surface wiping device and workpiece surface wiping method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103611694A (en) * 2013-11-22 2014-03-05 日商株式会社雷恩工业 Workpiece surface wiping device and workpiece surface wiping method

Also Published As

Publication number Publication date
JP4053781B2 (en) 2008-02-27

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