JP2836921B2 - Adhesive coating device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for applying an adhesive which is used for mounting a minute electronic component such as a semiconductor chip component on an electronic circuit board such as a printed board. is there. Further, the present invention relates to the adhesive applying apparatus, which also has a nozzle cleaning mechanism for applying the adhesive.

[Prior Art] In recent years, electronic components have been further miniaturized and electronic circuit boards have been mounted at high density, and accordingly, an adhesive coating apparatus has been required to apply the adhesive quantitatively and accurately.

As the direction of miniaturization and high-density mounting of such electronic components advances, it has become an important technical problem to detect the amount of adhesive applied and to control the amount of adhesive applied.

Hereinafter, an example of a conventional adhesive application device will be described with reference to the drawings.

FIG. 4 is an overall schematic perspective view of a conventional adhesive application device. In FIG. 4, 2 holds the printed circuit board 1,
The table unit 9 can be positioned at any position in the Y-axis direction (longitudinal direction of the Y-axis drive unit 3) based on the NC command signal or the like by the Y-axis drive unit 3, and 9 is an application nozzle unit for applying an adhesive. It consists of an adhesive tank 5. Reference numeral 6 denotes a drive unit for moving the application nozzle unit 9 up and down.
Reference numeral 7 denotes a camera unit including a camera for detecting the amount of the adhesive applied on the printed circuit board. The application nozzle unit 9, the driving unit 6, and the camera unit 7 are held by an X-axis driving unit 8. , NC command signal, etc., in the X-axis direction (X
It can be positioned at any position (in the longitudinal direction of the shaft drive unit 8).

The operation of the adhesive application device configured as described above will be described.

The printed circuit board 1 carried into the table unit 2 is positioned by the table unit 2 with an NC command signal according to a program. At the position where the positioning is performed, the application nozzle unit 9 moves up and down to apply a fixed amount of the adhesive on the printed circuit board 1. At this time, when the long time has elapsed since the previous application, the application nozzle unit 9 is often clogged, or the application of the first point or the first few points is often out of a predetermined amount range. That is, it has been difficult to stably discharge a fixed amount of the adhesive from the beginning. Therefore, in order to prevent such excessive or insufficient application during the application of the adhesive, the application is performed in advance in an extra space of the printed circuit board 1 before the actual application operation is performed, and the application amount is detected by the camera unit 7. By image processing, the pressure is compared with a preset reference value, and feedback (correction by adding or subtracting the pressurization time) is performed on the pressurization time of the adhesive in the application nozzle unit by the correction signal from the comparison value output circuit. , The actual amount is applied to the printed circuit board 1, and after completion, the printed circuit board 1 is carried out from the table unit 2.

[Problems to be Solved by the Invention] However, in the above-described conventional adhesive application apparatus, useless adhesive must be applied to the printed circuit board. In addition, there are cases where detection is difficult due to the color of the adhesive and the color of the printed circuit board. For example, printed circuit boards are different in material, thickness, etc. depending on the purpose of use, but have a roughly green color, while the adhesive often has a reddish color white, and is applied on the printed circuit board. It is quite difficult to clearly determine and confirm the adhesive application section by a camera section or the like. As a result, there is a problem that the control mechanism of the adhesive application amount does not work sufficiently and the substrate is also stained.

SUMMARY OF THE INVENTION In view of the above problems, the present invention detects the amount of adhesive applied without soiling a printed circuit board, and furthermore, at that time, cleans excess adhesive adhering to the tip of the nozzle as needed, thereby stably The present invention is to provide an adhesive applying device capable of applying a fixed amount of adhesive.

Means for Solving the Problems To solve the above problems, the present invention includes a table section for holding and positioning a printed board, and an adhesive application nozzle section, and fixes an electronic component on the printed board. A test application unit having a rollable roll paper for detecting the amount of the adhesive applied on the table unit, wherein the inspection unit is provided near the adhesive application nozzle unit. The camera has a configuration in which a camera unit for detecting the amount of adhesive applied to the application unit is provided.

In the adhesive application device, it is preferable that the inspection application unit has a mechanism that moves up and down on the table unit and a mechanism that winds the roll paper.

[Operation] According to the present invention, the inspection application section for detecting the adhesive application amount is provided on the table section, and the adhesive application amount applied to the inspection application section is detected near the adhesive application nozzle section. A camera unit is provided for detecting the amount of the adhesive applied, and the amount of the adhesive applied is detected by the camera, and it is determined whether the amount is a predetermined amount. In this case, there is no need to apply an extra adhesive to the printed circuit board, so that the printed circuit board is not stained, and there is no need to provide an extra space for this purpose on the printed circuit board. Further, by selecting an appropriate roll paper having a different color from the adhesive, the identification becomes easy, and the detection of the amount of the applied adhesive becomes easy. Further, by winding the nozzle in a state in which the nozzle is in contact with the roll paper, the adhesive adhering to the nozzle tip can be removed. Thereby, a fixed amount of adhesive can be stably applied to the printed circuit board.

Example An adhesive application device according to an example of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic perspective view showing an entire apparatus of an adhesive applying apparatus having a nozzle cleaning mechanism according to an embodiment of the present invention. Reference numeral 1 denotes a printed circuit board, and a table unit 2
Is held in. The table section 2 is positioned at an arbitrary position in the Y-axis direction (longitudinal direction of the Y-axis drive section 3) by the Y-axis drive section 3 according to the NC command signal. Reference numeral 9 denotes a coating nozzle portion, and reference numeral 4 denotes a nozzle, which is provided with an adhesive tank 5. A plurality of nozzles 4 are provided according to the amount of application. A driving unit 6 drives the nozzle unit 9 up and down. A camera unit 7 is provided near the nozzle unit 9 and is integrated therewith. The camera unit 7 is driven by the X-axis drive unit 8 and positioned at an arbitrary position in the X-axis direction (the longitudinal direction of the X-axis drive unit 8). Reference numeral 24 denotes an inspection application unit having a roll paper provided on the table unit 2 and capable of being taken up for detecting the amount of adhesive applied.

FIG. 2 is a schematic perspective view of a main part of the apparatus of the present invention (FIG. 1). On the table section 2, a roll paper 15 and an inspection coating section 24 having a winding mechanism and a vertical drive mechanism are provided. I have. Other parts are the same as those described in FIG.

FIG. 3 is a front view of a main part of the inspection application unit 24. A shaft 11 fixed to the table 2 and a frame 10 guided by a sliding bearing 12 are movable in the vertical direction. here,
The cam follower 13 of the frame 10 is in contact with the roller follower 13, and the frame 10 moves up and down by moving an air cylinder 14 fixed to the table 2. Roll paper 15 is frame 10
The roll paper 15 is wound around a reel 18 via a roller 17 from a reel 16 installed above, and the roll paper 15 is fed and wound by rotating the reel 18 via a belt 20.

The operation of the adhesive coating apparatus configured as described above will be described below with reference to FIGS.

The air cylinder 14 is operated so that the roll paper surface 22 which is the adhesive application surface of the roll paper 15 is at the same height as the surface of the printed circuit board 1 carried into the table unit 2. The X-axis drive unit 8 and the Y-axis drive unit 3 are driven by the NC command signal, and the nozzle 4 is positioned so that the nozzle 4 is positioned above the roll paper 15. Is lowered, and a predetermined amount of adhesive is applied onto the roll paper 15 from the nozzle 4. This is controlled by applying a certain pressure to the tank 5 for a certain time. Thereafter, an image of the applied adhesive 23 is obtained by the camera unit 7 and the area is calculated to estimate the applied amount, and the difference from the predetermined amount is known. That is, the applied adhesive 23 is captured by the camera unit 7, the applied area is calculated, a detection circuit for estimating the applied amount, an upper / lower limit value setting circuit for the applied amount, a signal of the detection circuit, , Receives a signal from a comparison circuit that compares the signal of the lower limit value setting circuit and a comparison value output circuit that outputs the comparison result, and gives feedback on the pressurization time when the adhesive is discharged, The amount is controlled, and if the amount is equal to the predetermined amount, the X-axis driving unit 8 and the Y-axis driving unit 3 are operated by the NC command signal, and the position of the printed circuit board 1 where the adhesive is to be applied is determined. Then, the driving unit 6 is operated in the same manner as described above, and the nozzle unit 9 is lowered, and the application of the adhesive on the printed circuit board 1 is started.

Note that the inspection application section 24 has a motor 19 for sequentially drawing out new roll paper, and moves slightly each time the adhesive is applied onto the roll paper surface 22 once at the time of inspection application. If the amount of application does not reach the predetermined value even after several trials, the roll paper 15 is wound up with the nozzle 4 in contact with the roll paper surface 22 to clean the tip of the nozzle 4.

When the application of the predetermined adhesive to the printed circuit board 1 is completed, the air cylinder 14 of the inspection application section 24 is operated, the inspection application section 24 is lowered, and the printed circuit board 1 on which the adhesive is applied is transported from the table section 2. Is discharged.

As described above, according to the present embodiment, at least the table unit for holding and positioning the printed circuit board and the adhesive application nozzle unit are provided, and the adhesive for fixing the electronic component on the printed circuit board is applied. An inspection application section having a rollable roll paper provided for detecting the amount of adhesive applied on the table section, wherein a roll of the inspection application section is provided near the adhesive application nozzle section. Since the camera unit for detecting the amount of the adhesive applied on the paper is provided, the predetermined amount of the adhesive can be applied accurately and stably, and the printed circuit board is not stained. In addition, even when the nozzle becomes dirty, it can be easily cleaned by removing the adhesion of the adhesive at the tip of the nozzle.

[Effects of the Invention] As described above, the present invention provides an inspection application section for detecting the amount of adhesive applied on a table section, and applies the adhesive applied to the inspection application section near the adhesive application nozzle section. Since the camera unit for detecting the amount is provided, it is possible to apply the predetermined amount of the adhesive applied accurately and stably.
Further, when necessary, the adhesive at the tip of the nozzle can be removed and cleaned. Further, according to a preferred example in which the inspection application section has a roll paper that can be wound up, and a mechanism that moves up and down on the table section and a mechanism that winds up the roll paper is provided, the adhesive is not stained on the printed circuit board. Can be applied.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing an adhesive application apparatus according to an embodiment of the present invention, FIG. 2 is a schematic perspective view of a main part of the adhesive application apparatus according to the embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. FIG. 4 is a front view of a main part of an inspection application section of the adhesive application apparatus in FIG. 4, and FIG. 4 is a schematic perspective view of a conventional adhesive application apparatus. DESCRIPTION OF SYMBOLS 1 ... Printed circuit board, 2 ... Table part, 3 ... Y-axis drive part, 4 ... Nozzle, 5 ... Tank, 6 ... Drive part, 7 ... Camera part, 8 ... X-axis drive part, 9: Application nozzle section, 14: Air cylinder, 15: Roll paper, 16: Reel, 18: Reel, 19: Motor, 23: Adhesive, 24: Inspection application section.

──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Yasushi Yamamoto 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-1-307470 (JP, A) JP-A-1- 318298 (JP, A) (58) Field surveyed (Int. Cl. ⁶ , DB name) H05K 3/32-3/34

Claims (2)

(57) [Claims] 1. An apparatus for applying an adhesive for fixing an electronic component on a printed circuit board, comprising: a table section for holding and positioning the printed circuit board; and an adhesive applying nozzle section. An inspection application unit having a rollable roll paper for detecting an adhesive application amount is provided on the table unit, and the amount of the adhesive applied to the inspection application unit is detected near the adhesive application nozzle unit. An adhesive application device provided with a camera unit. 2. The adhesive applying apparatus according to claim 1, wherein the inspection applying section has a mechanism for moving up and down on the table section and a mechanism for winding the roll paper.