JP2003212209A - Taping apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve tact-up of a taping apparatus. <P>SOLUTION: A CPU60 controls to simultaneously conduct both capture of a picture, taken by a component recognition camera 23, of a chip part 17 to be taken out from a component housing portion 16 and capture of a picture, taken by a component recognition camera 26, of a housing groove 3B of a tape main body 3A in which the chip part 17 is inserted with an absorption nozzle 19. Then the CPU60 controls a recognition treatment apparatus 26A to conduct recognition treatment of the taken picture of the housing groove 3B and further controls a recognition treatment apparatus 23A to conduct the recognition treatment of the taken picture of the chip part 17. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a turntable which is provided with a plurality of suction nozzles at predetermined intervals for sequentially picking up chip parts from a parts housing device and sequentially inserting the chip parts into respective housing parts of a housing tape. And a component recognition camera for picking up an image of a chip component to be taken out from the component storage device while the rotary disc is rotating, and a storage part for the storage tape in which the chip component is to be inserted by the suction nozzle while the rotary disc is rotating. A storage unit recognition camera that captures an image of the object, a closing device that closes an opening on the upper surface of the storage unit with a cover tape when the chip component is stored in the storage unit, and a storage tape that is closed with a cover tape by the closing device. The present invention relates to a taping device provided with a tape feeding mechanism that conveys a tape by a predetermined pitch.

[0002]

2. Description of the Related Art This taping device is disclosed in Japanese Patent Laid-Open No.
001-122213, JP 2001-12222 A
It is disclosed in Japanese Patent Laid-Open No. 15-15, Japanese Patent Laid-Open No. 2001-122216 and the like. Then, as shown in the timing chart of FIG. 13, this taping device captures an image of a chip component to be taken out in the component storage device by the component recognition camera during rotation of the turntable, and then recognizes the storage portion. A camera captures an image of the storage part of the storage tape into which the chip component should be inserted by the suction nozzle, performs recognition processing of the captured image of the storage part, and performs recognition processing of the captured image of the chip component. .

[0003]

However, while the rotating disk is rotating, the image of the chip component captured by the component recognition camera is captured, the image of the storage portion of the storage tape captured by the storage portion recognition camera is captured, and the storage portion is stored. Since the recognition processing of the picked-up image and the recognition processing of the picked-up image of the chip component are serially performed, the improvement of the tact time of the taping device is hindered.

Therefore, an object of the present invention is to improve the tact time of a taping device.

[0005]

Therefore, the first invention is
A rotary disk that is provided with a plurality of suction nozzles for sequentially taking out the chip parts from the parts housing device and sequentially inserting the chip parts into the respective housing parts of the housing tape, and rotating the disk continuously while the disk is rotating. A component recognition camera that captures an image of a chip component to be taken out from the storage device, a storage unit recognition camera that captures an image of the storage part of the storage tape into which the chip component is to be inserted by the suction nozzle while the rotating disk is rotating, and the chip. A closing device that closes the opening on the upper surface of the storage part with a cover tape when the parts are stored in the storage part, and a tape feeding mechanism that conveys the storage tape closed by the cover tape by the closing device by a predetermined pitch. In the provided taping device, a control device for controlling to simultaneously capture the images picked up by the recognition cameras is provided.

According to a second aspect of the present invention, there is provided a rotary disk which is provided with a plurality of suction nozzles at predetermined intervals for sequentially picking up chip components from the component storage device and sequentially inserting the chip components into respective storage portions of the storage tape, and a rotating disk. A component recognition camera for picking up an image of a chip component to be taken out of the component storage device during rotation of the turntable, and a storage section for storing the storage tape for inserting the chip component by the suction nozzle during rotation of the turntable. A storage unit recognition camera that captures an image, a closing device that closes an opening on the upper surface of the storage unit with a cover tape when the chip component is stored in the storage unit, and a storage tape that is closed by a cover tape by the closing device. In a taping device equipped with a tape feed mechanism that conveys a predetermined pitch at a time, the recognition processing of each captured image after the capture of the images captured by both recognition cameras is performed simultaneously. Characterized in that a control device for controlling to perform.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a taping device of the present invention will be described below with reference to the drawings. FIG. 1 is a front view of a taping device to which the present invention is applied. Reference numeral 1 denotes a taping device main body, in which a tape reel 2 is rotatably locked to a pin 2A standing on a side wall of the main body 1. Pulleys 4, 5, 6, 7, 8, 9, 10 for giving a proper tension to the tape body 3A by the tip of the tape body (also referred to as a carrier tape) 3A wound around the tape reel 2 It is also fixed to the take-up reel 12 via the transport rail 11. Then, while the tape main body 3A is sequentially conveyed by a predetermined amount in accordance with the rotation of the take-up reel 12 by a rotation drive system (not shown) (taken up by the take-up reel 12), the tape main body 3A is stored in the storage section. A cover tape 3C in which a chip component is inserted into a certain storage groove 3B, is further transported to a predetermined position, and is supplied from the cover tape supply reel 13 through the opening on the upper surface of the storage groove 3B.
After being coated with, it is wound on the winding reel 12.
As described above, the tape 3 is formed by the tape main body 3A having the storage groove 3B (see FIG. 3 and the like) and the cover tape 3C that is pressure-bonded to the upper surface thereof.

FIG. 2 is a partially enlarged view of FIG. 1, showing various work steps performed by the taping device in order from the right on the paper surface of FIG. That is, from the right, the component insertion process by the component insertion mechanism 15 into the housing groove 3B of the tape body 3A, the component inspection process by the component inspection mechanism 35 after this component insertion, and the tape crimping mechanism 50 after this component inspection are performed. In the pressure bonding step of the tape main body 3A and the cover tape 3C, the chip component 17 which is a die which is a target in various work steps is blackened for convenience.

The component insertion mechanism 15 is the tape body 3
This is for inserting a chip component into the storage groove 3B of A, and will be described below with reference to its plan view (FIG. 3) and side views (FIGS. 4 to 6).

(I) is a component suction station, in which the chip components 17 in the component storage unit 16 are provided on the back surface of the turntable 18 of the component insertion mechanism 15 at predetermined intervals, for example, four suction nozzles 19 are installed. The chip components 17 that are sequentially sucked and taken out and sucked by the suction nozzle 19 are conveyed to the next station in accordance with the intermittent rotation (in units of 90 degrees) of the turntable 18. In the component storage unit 16, a dicing tape is attached to the mounting table 20, the wafer is diced and mounted in a state of being divided into individual chip components 17, and each chip component 17 is pushed up from the back surface of the wafer by a pin 21. While picking up, the suction nozzle 19 sucks and takes out. Reference numeral 22 is an XY table that positions the chip component 17 to be taken out above the push-up pin 21 by moving the mounting table 20 in the XY direction by driving the X-axis drive motor 22A and the Y-axis drive motor 22B. Reference numeral 23 denotes a component recognition camera for picking up an image of the chip component 17 to be taken out on the wafer while the turntable 18 is rotating.
The recognition processing device 23 that captures the image captured by 3
The recognition processing is performed by A, and the position of the chip component 17 to be taken out is recognized. Based on the processing result of the recognition processing device 23A, the CPU 60, which will be described later, controls the X-axis drive motor 22A and the Y-axis drive motor 22B so that the CPU 60 is positioned immediately below the suction nozzle 19 which is moved by the rotation of the turntable 18. The XY table 22 is corrected and moved so as to be positioned, and at this component suction station, the chip nozzle 17 on the wafer of the component storage unit 16 is sucked down by the suction nozzle 19 and taken out.

(II) is a component recognition station, in which the chip is picked up by the component recognition camera 25 provided below the chip component 17 which is sucked by the suction nozzle 19 when the turntable 18 is stopped at the recognition station. Part 17
Is picked up and an image is captured to recognize the attitude of the chip part 17 by the recognition processing device 17A. At this time, in the previous component suction station, the suction and removal of the chip component 17 in the wafer is performed by another suction nozzle 19 that has reached this station.

(III) is a component insertion station, which is a storage groove 3 of the tape body 3A on the transport rail 11 on which the chip component 17 sucked by the suction nozzle 19 is on standby below.
Insert in B. The chip component 17 is inserted into the storage groove 3B with its back surface facing upward so that the component inspection mechanism 35 described later can easily inspect it. Further, although not shown, the tape body 3A placed on the transport rail 11
A cover is provided on the upper surface for the purpose of guiding at the time of transportation and preventing the parts from jumping out. This cover has a predetermined area (6 chips in this embodiment) only at the parts insertion work position and the parts inspection work position. Since the component 17 is considered to be one unit, an opening having a size such that six storage grooves 3B are exposed is formed. The reason why the above-mentioned one unit is six chip components 17 is that the number of the storage grooves 3B recognized by the recognition camera 26, which will be described later, is six. However, the recognition area (field of view) of the recognition camera 26 is not limited to these values.
The number can be appropriately set according to the size of the area, and the time required for the tape feeding by the tape feeding mechanism described later can also be appropriately set by the number.

In this component insertion station, first, while the turntable 18 is rotating, the storage section recognition camera 26 captures an image of the storage groove 3B to capture an image, and the recognition processing unit 26 is acquired.
The position of the storage groove 3B to be inserted is recognized by A, and the recognition result and the recognition result of the component attitude in the previous component recognition station (II) are taken into consideration, and the arm to which the turntable 18 is attached by the CPU 60. Reference numeral 27 is XY corrected by an X table 28A and a Y table 28B that are moved by an X axis drive motor 28C and a Y axis drive motor 28D that form an XY table 28. Therefore, the storage groove 3
The chip component 17 is properly inserted into B.

Further, 29 is a tape pressing mechanism which, after being recognized by the recognition camera 26, comes into contact with the tape main body 3A when the suction nozzle 19 is inserted, mechanical vibration or the like causes the storage groove 3B.
The tape body 3A can be moved up and down so as not to change its position, and a pair of tape pressing plates are arranged outside the recognition area of the recognition camera 26. For example, the tape pressing is performed by downward movement of the rod portion of the cylinder. The plate contacts the upper surface of the tape body 3A and presses the tape body 3A.

Further, reference numeral 30 denotes a shutter for closing the opening on the upper surface of the storage groove 3B after the chip component 17 is inserted into the storage groove 3B by the component insertion mechanism 15, which is the Y table 28B of the XY table 28. When the turntable 18 moves to the left side in the plane of FIG. 6 by the Y movement of the Y table 28B after the chip component 17 is inserted into the storage groove 3B, The shutter 30 is also moved in Y and the shutter 30 is closed. In addition, FIG. 4 shows the chip component 17 in the storage groove 3B.
5 is a state immediately before the insertion of the chip component 17, FIG. 5 is a state in which the chip component 17 is inserted in the storage groove 3B, and FIG. 6 is a state after the chip component 17 is inserted in the storage groove 3B.
7 are separated from each other, and the opening of the upper surface of the storage groove 3B is closed by the shutter 30.

In the present invention, the suction nozzle 19 and the shutter 30 are interlockable (both fixed to the XY table 28 and interlocked with movement in the Y direction). As shown in FIG. 6, when the Y table 28B is moved in the Y direction with the chip component 17 inserted in the storage groove 3B, the suction nozzle 19 leaves the chip component 17 in the storage groove 3B while the chip component 17 is left in the storage groove 3B. Since the opening on the upper surface is closed by the shutter 30 and these two operations can be controlled only by the Y movement of the Y table 28B, the workability is good. Further, when the chip component 17 is inserted into the storage groove 3B, an uncertain insertion form due to static electricity, vibration, catching or the like can be stably inserted by operating the shutter 30 while moving the suction nozzle 19. It will be possible.

Further, in the present invention, the recognition camera 26 recognizes the positions of a plurality of (six in the present embodiment) storage grooves 3B at a time, and the X table 28A of the XY table 28 is moved in the X direction. While moving, each chip component 17 is sequentially inserted into each storage groove 3B. In this way, without moving the tape body 3A, six chip components 17 are inserted while the component insertion mechanism 15 is moved along the tape body 3A by one pitch in the X direction, and after this insertion, the tape feed mechanism is used to make a one-shot operation. A method of transporting the tape body 3A downstream by 6 pitches is adopted. As a result, for example, the chip parts 17 are inserted one by one into the storage groove 3B, the tape main body 3A is conveyed downstream by one pitch by the tape feeding mechanism, and the above operation is repeated again as compared with the conventional one. The working time can be shortened.

Furthermore, at the start of the tape transport,
The vibration (braking) at the time of stop causes a problem such as popping out of the chip component 17 in the storage groove 3B.
In the present invention, one tape feed pitch becomes long, and the number of times of feeding as a whole is reduced. Therefore, the influence of vibration is reduced accordingly, and the feeding operation can be stabilized as compared with the conventional one-pitch feeding.

The component inspection mechanism 35 performs component inspection (for example, electrical characteristic inspection) on the chip component inserted in the storage groove 3B of the tape body 3A, and is a plan view as follows. (FIG. 7) and side view (FIGS. 8 to 1)
This will be described with reference to 0).

In FIGS. 2 and 7, reference numeral 36 is fixed to an arm 38, which will be described later, like the component inspection mechanism 35, and is prepared above the chip component 17 inserted into the storage groove 3B. With the component recognition camera, the storage groove 3B after insertion
An image of the chip component 17 in the inside is captured, an image is captured, and the posture of the chip component 17 is recognized by the recognition processing device 36A (in FIG. 7, only the recognition area is indicated by a chain double-dashed line).

In FIG. 8, reference numeral 37 denotes an inspecting unit having a probe needle on the lower surface for inspecting electrical characteristics.
The arm 38 fixed to is movable up and down along a guide 39, and the vertical movement mechanism 40 is an XY table 4 driven by an X-axis drive motor 41A and a Y-axis drive motor 41B.
1 is placed. Therefore, the inspection unit 37 is XY
By moving the table 41 and the vertical movement mechanism 40 in XYZ (vertical), the chip component 17 inserted into the storage groove 3B is brought into contact with the chip component 17 for inspection. FIG. 8 shows a state in which the chip component 17 inserted into the storage groove 3B has been conveyed to the inspection position (at this point, the shutter 47, which will be described later,
The upper surface of the chip component 17 before the inspection is closed. 9) shows a state in which the shutter 47 moves Y to expose the chip component 17 in the storage groove 3B, and FIG. 10 shows the above-described inspection while pressing the chip component 17 in the storage groove 3B with a component pressing plate 43 described later. The state in which the probe needle of the portion 37 is in contact with the chip part 17 for inspection is shown. In the inspection work, the inspection unit 37 drives the X-axis drive motor 41A one pitch at a time to sequentially inspect the chip components 17 one by one in a total of six units, and after the inspection of six units, the inspection unit 37 6 pitches back and 6 pitches tape body 3
In order to convey A, the opening is formed in the cover so as to expose the six storage grooves 3B as in the insertion work position described above.

Reference numeral 42 is a component position restricting mechanism for preventing the chip component 17 inserted into the housing groove 3B from being displaced when the component is inspected by the inspecting section 37, which is a component retainer for retaining the six chip components 17. The plate 43 is attached to the vertical movement mechanism 44, and the vertical movement mechanism 44 is placed on the XY table 45 driven by the X-axis drive motor 45A and the Y-axis drive motor 45B.
Similarly to the above, it is configured to be movable in XYZ.

A shutter 47 for closing the upper surface of the chip component 17 before inspection by the inspection unit 37 is provided on the transport rail 11 so as to be movable in Y along a Y movement guide 48.

As described above, according to the present invention, the chip part 17 is inserted into the storage groove 3B of the tape body 3A, and the electrical characteristics of the chip part 17 are inspected while the chip part 17 is being inserted into the storage groove 3B. Therefore, before inserting the component into the storage unit as in the conventional method, once place the chip component on the workbench, inspect it at that location, and again suck the chip component with the suction nozzle to store it inside the storage unit. It is possible to avoid the occurrence of component defects due to the impact at the time of suction applied after the inspection such as the one in which the components are inserted into the tape, and it is possible to prevent the problem that defective products are mixed in the tape. Furthermore, by inserting the chip component 17 into the storage groove 3B with the back surface thereof facing upward, the component inspection mechanism 35 can easily perform the inspection and the workability is improved.

The component inspection by the component inspection mechanism 35 is performed after the chip component 17 is inserted into the storage groove 3B.
Since it suffices to perform it at one place on the transport path until the tape main body 3A and the cover tape 3C are pressure-bonded by the tape pressure-bonding mechanism 50, which will be described later, it is relatively easy to secure the installation place in the device.

Finally, 50 is a vertically movable tape crimping mechanism for inserting the chip component 17 into the storage groove 3B and crimping the tape main body 3A and the cover tape 3C, which have been inspected for the chip component 17. , Taping is completed.

Then, the tape 3 for which taping has been completed is sequentially wound on the winding reel 12.

Next, a control block diagram of the taping device will be described with reference to FIG. Reference numeral 60 is a CPU as a control device for integrally controlling the operation of taking out and loading the chip parts of the taping device, 61 is a RAM (random access memory) as a storage device, and 62 is a ROM.
(Read only memory). And CPU
Reference numeral 60 denotes each drive source and each recognition processing device 23A via the interface 63 for the operation related to the taking out and loading of the chip component of the taping device according to the program stored in the ROM 62 based on the data stored in the RAM 61. 25A, 26A, and 36A are collectively controlled.

Then, the CPU 60 controls the tape main body 3
From the moving speed of one pitch in the X direction of the XY table 28 for moving the component inserting mechanism 15 when sequentially inserting into the respective housing grooves 3B of A, the moving speed of returning by 6 pitches after six pieces are inserted The component insertion mechanism 1 so that it is faster
5 controls the X-axis drive motor 28C which is the movement drive source in the X direction. Thereby, it is possible to improve the tact time.

Further, the CPU 60 controls the tape main body 3A.
XY for moving the component inspection mechanism 35 when sequentially inspecting each chip component 17 inserted in each storage groove 3B of
The X-axis drive which is the movement drive source of the component inspection mechanism 35 in the X direction so that the movement speed of the table 41 when returning by 6 pitches after six inspections is faster than the movement speed of one pitch in the X direction. The motor 41A is controlled. Thereby, it is possible to improve the tact time.

It should be noted that these two types of moving speed data are stored in the R
It may be stored in the AM 61 and the CPU 60 may control the X-axis drive motors 28C and 41A according to this data, or may be stored in the ROM 62 and controlled.

Further, XY for moving the parts storage section 16
The CPU 60 controls the X-axis drive motor 22A and the Y-axis movement motor 22B of the table 22 so that the movement speed when moving a plurality of pitches is faster than the movement speed when moving one pitch at a time. Good.

Then, as shown in FIG. 12, while the turntable 18 is rotating, the image picked up by the component recognition camera 23 of the chip component 17 to be taken out of the component housing 16 and the suction nozzle are taken. The CPU 60 controls so that the image picked up by the storage portion recognition camera 26 of the storage groove 3B of the tape main body 3A into which the chip component 17 is to be inserted is simultaneously captured by the CPU 19. Thereby, it is possible to improve the tact time.

After that, the CPU 60 controls the recognition processing device 26A so as to perform the recognition process of the picked-up image of the storage groove 3B, and then the recognition processing device 23A so as to perform the recognition process of the picked-up image of the chip part 17. Control.

It should be noted that the CPU 60 can be controlled so that not only the respective images are captured, but also the recognition processing by the recognition processing devices 26A and 23A is simultaneously performed. In this case, the tact time can be further improved.

Therefore, at the component pick-up station, the CPU 60 determines X based on the processing result of the recognition processing device 23A.
The XY table 2 is controlled by controlling the axis drive motor 22A and the Y axis drive motor 22B so as to be positioned immediately below the suction nozzle 19 which is moved by the rotation of the turntable 18.
2 is corrected and moved, and the chip component 17 on the wafer in the component storage unit 16 is lowered by the suction nozzle 19 to be sucked and taken out.

In the component insertion station, the recognition result of the recognition processing device 26A and the recognition result of the recognition processing device 25A are taken into consideration, and the CPU 60 causes the X-axis drive motor 2 to operate.
XY table 28 by 8C and Y-axis drive motor 28D
Since the XY correction movement is performed, the chip component 17 is properly inserted into the storage groove 3B.

Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention can be carried out in various ways without departing from the spirit of the invention. It is intended to cover alternatives, modifications or variations.

[0039]

According to the present invention, conventionally, an image obtained by picking up an image of a chip component by a component recognition camera while the turntable is rotating, an image obtained by picking up an image of a storage part of a storage tape by a storage part recognition camera, and a captured image of the storage part Since the recognition process and the recognition process of the captured image of the chip part are performed serially, this hinders the improvement of the tact time of the taping device. However, according to the present invention, control is performed so that both images are captured at the same time. Therefore, it is possible to improve the tact time.

[Brief description of drawings]

FIG. 1 is a front view showing a taping device according to an embodiment of the present invention.

FIG. 2 is a partially enlarged view of FIG.

FIG. 3 is a plan view for explaining a component insertion mechanism.

FIG. 4 is a side view for explaining the component insertion mechanism.

FIG. 5 is a side view for explaining the component insertion mechanism.

FIG. 6 is a side view for explaining the component insertion mechanism.

FIG. 7 is a plan view for explaining the component inspection mechanism.

FIG. 8 is a side view for explaining the component inspection mechanism.

FIG. 9 is a side view for explaining the component inspection mechanism.

FIG. 10 is a side view for explaining the component inspection mechanism.

FIG. 11 is a control block diagram of the taping device.

FIG. 12 is a timing chart for recognition.

FIG. 13 is a timing chart diagram related to conventional recognition.

[Explanation of symbols]

1 Taping device body 2 tape reel 3 tapes 12 take-up reel 15 Parts insertion mechanism 18 turntable 22 XY table 22A X-axis drive motor 22B Y-axis drive motor 23 Parts recognition camera 23A recognition processing device 26 Storage part recognition camera 26A recognition processing device 28 XY table 28C X-axis drive motor 28D Y-axis drive motor 60 CPU 61 RAM 62 ROM

Claims (2)

[Claims] 1. A rotary disk which is provided with a plurality of suction nozzles for sequentially taking out chip parts from a parts housing device and sequentially inserting the chip parts into respective housing parts of a housing tape at predetermined intervals, and a rotating disk which is intermittently rotated. A component recognition camera that images the chip component to be taken out from the component storage device during rotation, and a storage unit recognition that images the storage part of the storage tape into which the chip component is to be inserted by the suction nozzle during rotation of the turntable. A camera, a closing device that closes an opening on the upper surface of the housing with the chip component housed in the housing with a cover tape, and the housing tape that is closed with the cover tape by the closing device is conveyed at predetermined pitches. In a taping device equipped with a tape feeding mechanism, a control device for controlling to simultaneously capture images picked up by both recognition cameras is provided. Characteristic taping device. 2. A turntable which is provided with a plurality of suction nozzles at predetermined intervals for sequentially picking up chip components from a component storage device and sequentially inserted into each storage section of a storage tape, and a rotary disc of the rotary disc. A component recognition camera that images the chip component to be taken out from the component storage device during rotation, and a storage unit recognition that images the storage part of the storage tape into which the chip component is to be inserted by the suction nozzle during rotation of the turntable. A camera, a closing device that closes an opening on the upper surface of the housing with the chip component housed in the housing with a cover tape, and the housing tape that is closed with the cover tape by the closing device is conveyed at predetermined pitches. In a taping device equipped with a tape feeding mechanism, control is performed so that recognition processing of each captured image after capturing images captured by both recognition cameras is performed simultaneously. A taping device, which is provided with a control device.