JP2003209395A - Electronic component thickness check program and mounting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To mount only the electronic components within the allowable range to a substrate 41 by picking up measured images of nozzle end 25a and electronic component 18 with an image sensor 51, and then measuring thickness of the electronic component 18 from the measured image. <P>SOLUTION: There are provided a mounting apparatus 21, a computer, and an electronic component thickness check program. The computer is controlled to selectively realize the following steps for picking up the images, measured with the image sensor 51, tracking the boundary of the measured images, and calculating upper surface data by detecting the intersecting points of the nozzle 25 and electronic component 18 for all electronic components to be mounted on the substrate 41; and the step for defining the nozzle data of the previously recorded relevant nozzle 25 as the upper surface data when the intersecting point is not detected. Accordingly, thickness of the measured electronic component 18 is collated with the previously recorded component data. It is judged depending on the result of collation that the relevant electronic component 18 should be mounted or wasted. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a so-called electronic circuit board such as a main circuit board of a computer, a control circuit board used for electronic control of devices ranging from electric appliances used at home to manufacturing plants in factories, and game circuit boards of cam machines. The present invention relates to a mounting machine used in a line for manufacturing a board, the mounting machine having a function of checking the thickness of an electronic component and determining whether the electronic component is mounted or discarded. Measure the thickness of the electronic parts to be mounted on the board, and mount only the electronic parts that fit within the predetermined allowable intersection and are adsorbed to the nozzle in the correct posture on the board to mount defective electronic parts. This is to eliminate the occurrence of poorly mounted substrates such as a defective substrate or a substrate in which the positions of electronic components are displaced. In the line that manufactures electronic boards,
In advance, cream solder, adhesive, etc. are applied to the base, then electronic parts are mounted on the base by a mounting machine, and then the solder is melted in a heating furnace or the like and then solidified or the adhesive is cured. The mounting machine has CPU, RAM,
A mounting apparatus according to the present invention, which is an apparatus for mounting electronic components such as a ROM, a resistor, a capacitor, and various ICs, includes an index device, a plurality of mounting units, a component supply unit, a conveyor, a positioning mechanism, and the like.

[0002]

2. Description of the Related Art Japanese Patent Laid-Open Nos. 6-302993 and 9-214184 disclose inventions for detecting the thickness of electronic parts in a mounting machine for electronic parts. Japanese Patent Laid-Open Publication No.
According to the invention of No. 302993, the thickness of the electronic component is detected by the component thickness detecting unit, and when the thickness of the electronic component is out of the allowable range or when the electronic component is not picked up in a normal posture, the thickness of the electronic component is detected. Is an invention in which the allowable thickness range is automatically changed according to the variation of. However, regarding the component thickness detector,
It only describes that it is photographed by a CCD camera and detected by image processing, but does not describe a specific method for detecting the thickness of an electronic component by image processing. Also,
The detected thickness data of the electronic component was used only for determining whether or not it falls within the allowable range of the electronic component. JP-A-9-21
The invention of No. 4184 is an invention for detecting and mounting the component supply shape and the component thickness when the component thicknesses are different. However, although the component thickness detection unit is described, the specific configuration and how to detect the component thickness are not described.

In order to check the thickness of the electronic component, a side image of the electronic component and the tip portion of the nozzle was taken by an image sensor on a trial basis. As shown in FIGS. 3 (a) to 3 (f). Although it was possible to detect various images, the prior art did not have a method that enables appropriate thickness measurement in all of these cases. In addition, when dust adheres to the light receiving portion of the image sensor, the image of the dust cannot be distinguished from the image of the component or the nozzle, which causes a problem of impairing the measurement accuracy. When adsorbing electronic components to the nozzle tip, the nozzle is lowered to press the nozzle tip against the top surface of the electronic component, and the nozzle is evacuated while a constant pressing force is generated by the spring to adsorb the electronic component to the nozzle tip. I am letting you. However, conventionally, there has been a problem that the nozzle tip position changes and the probability of successful suction decreases. In addition, molten solder or adhesive has already been applied on the substrate, and if the electronic component is pushed too much onto the substrate, it tends to slip. In the prior art, there was a problem that the electronic component was pushed too much onto the substrate and the position of the electronic component was deviated, resulting in a poorly mounted substrate.

[0004]

SUMMARY OF THE INVENTION The present invention has been made to eliminate the above-mentioned drawbacks of the prior art, and is suitable for all captured images of side images of electronic components and the tip of the nozzle. It is to provide a program capable of measuring various thicknesses and a mounting machine having such a program. In addition, if dust adheres to the light receiving part of the image sensor, etc., it should be detected as soon as possible within the range that does not hinder production efficiency, and a program to notify the worker by issuing a dust detection warning and a mounting machine with such a program should be installed. To provide. In addition, by constantly detecting the nozzle tip position and updating the nozzle data, the nozzle data is fed back to the control of the nozzle lowering position at the suction station so that electronic components are always sucked under a certain condition, and the probability of suction is increased. Is to maintain a high value and reduce the number of discarded parts to reduce the cost of parts. Further, the value of the lower surface data obtained by the lower surface recognition procedure is fed back to the control of the nozzle lowering position at the mounting station, and the electronic component is always pushed onto the substrate under a constant condition to prevent the occurrence of a mounting failure substrate. To do.

[0005]

According to a first aspect of the present invention, there is provided a program for causing a computer for controlling a mounting machine to execute the following steps. The step of receiving the input as part data including the data of the allowable crossing of the part and recording this, operating the mounting machine without adsorbing the electronic parts, capturing the nozzle measurement images of all nozzles, and nozzles from the nozzle measurement images. Nozzle tip measurement step that searches the tip position and records the data at the bottom of the nozzle or the data that calculates the average value of the two angles at the nozzle tip as nozzle data. This is a step of taking a side image of the electronic component and the tip of the nozzle that sucks the electronic component with an image sensor for all the electronic components to be searched, and retrieving the measurement image. And the bottom surface recognition, the top surface recognition, the component thickness calculation, and the thickness verification step. The bottom surface recognition and the top surface recognition may be performed first. The recognition is a procedure of recognizing the data at the lowermost end of the measurement image as the lower surface of the electronic component and recording this as the lower surface data.The upper surface recognition is to obtain the nozzle data of the relevant nozzle and center the nozzle tip position. Boundary tracing is performed in the upper and lower αmm ranges on the measurement image to detect two intersections between the nozzle and the electronic component. When two intersections are detected, the average value is recognized as the upper surface of the electronic component, and this is the upper surface. A means for recording as data and a means for recognizing the nozzle data of the nozzle recorded in advance as the upper surface of the electronic component when the two intersections of the nozzle and the electronic component are not detected, and forming the upper surface data. The procedure for calculating the thickness of a component is to calculate the difference between the bottom surface data and the top surface data of the electronic component and record it as detection data.For the thickness matching, the component data of the electronic component and the detection data are matched. As a result of the thickness measurement step, if the detected data falls within the tolerance of the component thickness of the component data, the step of instructing to mount the electronic component on the board, and the detected data is the component thickness of the component data. And a step of instructing to dispose of the electronic component when the tolerance does not fall within the allowable tolerance.

According to the invention of claim 2, in contrast to the invention of claim 1, when two intersections of the nozzle and the electronic component are detected by boundary tracking in top surface recognition, the average value is recognized as the nozzle tip position. , A step of erasing and recording old nozzle data as new nozzle data was added. According to the invention of claim 3, in contrast to the invention of claim 1 or claim 2, when the substrate is replaced, a background image in which no parts are imaged is photographed by an image sensor to confirm whether or not dust is attached to the image. A dust confirmation step was added, and a step of issuing a dust detection warning when adhering dust was recognized was added. The invention of claim 4 is different from the inventions of claims 1 to 3 in that when the nozzle data in the nozzle tip measuring step is acquired, old data is erased and newly acquired nozzle data is recorded. ,
As a result of the boundary tracking in the thickness measurement step, when two intersections of the nozzle and the electronic component are detected, the average value is recognized as the nozzle tip position, and the old data is erased and recorded as new nozzle data. And a step of reflecting the value of the nozzle data on the descending amount of the nozzle tip when the electronic component is sucked on the component supply unit. The invention of claim 5 is different from the inventions of claims 1 to 4 in that the value of the lower surface data obtained by the lower surface recognition procedure of the thickness measurement step is used for mounting the electronic component on the substrate. A step was added to reflect the descending amount of the tip.

According to a sixth aspect of the present invention, there is provided a parts supply unit,
An indexing device having a plurality of stop stations,
A plurality of mounting units held by the index device, each of which has a nozzle and has a function of vertically elevating and lowering the nozzle and a function of rotating the nozzle around a Q axis that is a vertical axis passing through the center of the nozzle. A mounting machine including a mounting unit, a conveyor, a positioning mechanism, and a computer for controlling these, wherein the plurality of stop stations are at least a suction station, a Q-axis large swivel station, a plane image photographing station, a Q-axis correction station, and a mounting station. A suction station, the nozzle is lowered, the tip of the nozzle is brought into contact with an electronic component on the component supply unit to suck the electronic component, and the nozzle is raised while the electronic component is sucked, Roughly adjust the Q axis at the large axis turning station, A plane view image of an electronic component is captured at the surface image capturing station, the Q-axis final adjustment is performed at the Q-axis correction station, the electronic component to be mounted at the mounting station is mounted on the board, and the component disposal station disposes. Dispose of electronic components that should be discarded,
Furthermore, in the mounting machine that proceeded to the next process starting from the adsorption station,
An image sensor having a light projecting portion and a light receiving portion, which has a function of capturing a side image of the electronic component and the tip portion of the nozzle, is attached to any one of the stop stations between the axis correction stations, and the side surface The image capturing station was used, and a mounting machine comprised of a program recorded in the main storage device of the computer and any one of the programs described above. On the other hand, claim 7
In the invention of claim 6, a nozzle type switching station and a nozzle type confirmation station are added as stop stations to the invention of claim 6, electronic components to be mounted at the mounting station are mounted on the base, and the components are discarded at the component disposal station. After discarding the electronic components to be used, the nozzle type switching station selects the nozzle to be used next, the nozzle type confirmation station confirms the selected nozzle, and the next step starting from the adsorption station The mounting machine is

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. The mounting machine 21 according to the present invention includes a component supply unit 31, an index device 22, sixteen mounting units 23 held by the index device 22, a conveyor 42, a positioning mechanism 43, and a computer for controlling them. The mounting machine 21 is composed of. The component supply unit 31 includes a plurality of feeders 32 that feed different electronic components toward the Y-axis suction station 1. The component supply unit 31 is supported by the X-axis moving mechanism 33 so as to be movable in the X-axis direction. The index device 22 includes 16 stop stations (1
16 to 16) and 22.5 in the direction of index turning 26
It is configured to repeat the step of turning and stopping once. Therefore, the 16 mounting units 23 stop or move to the respective stop stations (1 to 16) one after another. 1
The six stop stations are a suction station 1, a Q-axis large turning station 3, a plane image capturing station 5,
A side image photographing station 6, a Q-axis correction station 8, a mounting station 9, a Q-axis original position returning station 10, a component discarding station 13, a nozzle type switching station 14, a nozzle type checking station 15, and the like. The mounting unit 23 has a vertically elevating mechanism and a Q-axis turning 27 mechanism, and a bracket 24 at the lower end. A rotary shaft 28 is rotatably attached to the bracket 24, a block 29 is attached to the rotary shaft 28, and six nozzles 25 are attached to the block 29. Therefore, the mounting machine 21 according to the present embodiment has a total of 96 nozzles 2
Have 5 Each nozzle 25 was held slidably by a block 29, a force was applied in a pushing direction by a spring, and each nozzle 25 was pipe-connected to a vacuum device via a valve. A plane image sensor 45 is attached to the plane image taking station 5, and an image sensor 51 including a light emitting section 53 of an LED light emitting element and a light receiving section 54 of a CCD light receiving element is attached to the side image taking station 6. The image sensor 51 was installed so as to capture a part of the nozzle tip 25a and the entire side surface of the electronic component 18. The light receiving unit 54 has vertical 659 pixels × horizontal 494 pixels and has a vertical resolution of 12.3 μm. Projector 53
The light projected by is detected by the light receiving element of the light receiving unit 54, converted into a voltage, and output. When there is a boundary between light and shade in each pixel, the brightness is decomposed stepwise and the voltage value is changed and output. Therefore, the detection accuracy has a performance of ± 10 μm. The conveyor 42 is configured to carry out the board 41 on which the electronic components have been mounted from the positioning mechanism 43, and then carry the board 41 on which the electronic components are mounted to the positioning mechanism 43. The positioning mechanism 43 holds the board 41 and holds the X-axis and Y-axis.
The structure has a function of moving in the Z-axis direction of the axis and the vertical direction and stopping.

Next, the operation of each mechanism according to the present invention will be described. Each electronic component has a separate feeder 3
2 is sent on the Y-axis toward the adsorption station 1. The component supply unit 31 is moved by the X-axis moving mechanism 33 so that the electronic component to be next picked up is positioned directly below the pick-up station 1. At the suction station 1, the mounting unit 23 pushes down the bracket 24, brings the tip 25a of the nozzle into contact with the upper surface of the electronic component 18 and pushes it with an appropriate force by a spring, and switches the valve between the nozzle and the vacuum device. . In this way, the electronic component 18 is attracted to the nozzle 25. Then the bracket 24
When is pushed up, the electronic component moves with the movement of the mounting unit 23 in a state where the electronic component is attracted to the nozzle 25. At the Q-axis large turning station 3, the mounting unit 23 turns the Q-axis 27 and roughly adjusts the angle in plan view. afterwards,
The plane image sensor 4 in the plane image photographing station 5
5, a plane image is taken, and the image data is analyzed and fed back to the disposal of electronic components having a defective planar dimension or the final correction of the electronic components in the Q-axis correction station 8. At the side image photographing station 6, the nozzle tip 2
The 5a portion and the electronic component 18 are located between the light projecting portion 53 and the light receiving portion 54 to block light. Since the light receiving element in the portion where the light is blocked does not receive the light and does not output the voltage, it is possible to capture the measurement image and the nozzle measurement image as shown in FIG. 3 as data.
At the Q-axis correction station 8, the mounting unit 23 feeds back the analysis result of the plane image data to perform the Q-axis turning 2
Step 7: Perform the final angle correction so that the board can be mounted accurately and accurately. When mounting the electronic component 18 at the mounting station 9, the positioning mechanism 43 holds the substrate 41 and moves in the X-axis, Y-axis, and Z-axis directions to mount the substrate at a position where the next electronic component 18 should be mounted. Move and stop. After that, the mounting unit 23 pushes down the bracket 24, puts the electronic component 18 on the substrate 41 and pushes it with an appropriate force by a spring, and switches the valve of the nozzle to open to the atmosphere. In this way, the electronic component 18 separates from the nozzle 25. After that, the mounting unit 23 pushes up the bracket 24. On the other hand, when the electronic component 18 is not mounted, the nozzle 25 moves to the next station while the electronic component 18 is adsorbed. At the Q-axis original position returning station 10, the mounting unit 23 turns the Q-axis and returns to the predetermined original position. In the component disposal station 13, when the mounting unit 23 has a defective electronic component 18 having a flat dimension or an electronic component 18 which does not fit within the side surface tolerance, the valve is switched to open the nozzle to the atmosphere to release the electronic component. Discard 18. At the nozzle type switching station 14, the mounting unit 23 rotates the block 29 based on the nozzle type switching command, and switches the nozzle 25 to be used next to the lowermost position. At the nozzle type confirmation station 15, the nozzle 2 actually located at the bottom end position
It is confirmed whether or not the type of the nozzle 25 to be used next is the same as that of the nozzle 25.

The electronic component thickness check program recorded in the main memory of the computer of the mounting machine 21 according to the present invention causes the computer of the mounting machine 21 to execute the following steps. The step of accepting and recording the input of the component thickness data of the electronic component, including the data of each allowable intersection, as the component data in advance, and the data of the nozzle diameter D of each nozzle 25 being accepted and recorded. Steps to take. The mounting machine is operated without adsorbing the electronic component 18, and
A nozzle tip measurement step of capturing the nozzle measurement images of all the nozzles 25 as shown in (g), searching the nozzle bottom end 55f from the nozzle measurement image, and recording the retrieved data of the nozzle bottom end 55f as nozzle data. . However, in this embodiment, the nozzle lowermost end 55f is determined to be the nozzle tip position, but there is also a method of determining the average value of the corners 55g of the two nozzles as the nozzle tip position, and the present invention is not limited to the above embodiment. The nozzle tip measurement step can be performed by an operator's input operation, automatically after a certain period of time has elapsed, or automatically every time a fixed amount of substrate is mounted. However, in the present embodiment, the method of performing the input operation by the operator is adopted, and it is encouraged to perform the operation every day at the start of work. This is because it is preferable to feed back data such as the production amount, production efficiency, defective substrate occurrence rate, and the number of parts to be discarded at each customer and appropriately perform the nozzle tip measurement step.

During the mounting of electronic parts, the thickness measuring step is to search the measurement image taken by the image sensor 51 at the side image taking station 6, which is bottom surface recognition, top surface recognition, part thickness calculation, and thickness verification. , And the step consisting of each procedure. However, in this embodiment, the lower surface recognition is performed before the upper surface recognition. Underside recognition is shown in Fig. 3.
The procedure of recognizing the data of the lowermost end 55e of the measurement image as shown in (a) to (f) as the lower surface of the electronic component and recording this as the lower surface data is adopted. In the upper surface recognition, first, the nozzle data of the nozzle is acquired, the upper and lower 0.2 mm ranges centering on the nozzle tip position are traced in the measurement image, and the two intersection points 55c of the nozzle image 55a and the component image 55b are detected. To detect. At this time, the data of the nozzle diameter D is also obtained, and the data of the nozzle image is used to obtain the data shown in FIG.
As shown in FIG. 7, at the lowest point of two perpendicular lines separated by the D dimension, data close to the shape of two corners that bend inward with each other is determined to be the corner 55g of the nozzle, and the nozzle image 55a and the component image 55b are I tried to exclude it from the intersection. On the other hand, D
Data close to the shapes of the two corners that bend outward from each other at the lowest points of the two perpendicular lines that are distant from each other are determined as the intersections of the nozzle image 55a and the component image 55b. As a result, when two intersection points 55c are detected, 2
The average value of the two intersections 55c is recognized as the upper surface of the electronic component, and this is recorded as the upper surface data. Boundary tracking is performed by extracting the outermost peripheral boundary with the pixel in the shadow portion as 1 and the pixel in the background portion as 0. The reason why the α value is set to 0.2 and the boundary is traced in the upper and lower 0.2 mm ranges is that the nozzle tip position is not largely displaced, and it is considered sufficient to trace the boundary in this range. Also, by limiting the range in which boundary tracking is performed, quick search and determination can be performed, and the load on the computer can be reduced. Further, as shown in FIGS. 3E and 3F, when the two intersection points 55c are not detected as a result of the boundary tracking, the nozzle data of the nozzle recorded in advance is recognized as the upper surface of the electronic component, and the upper surface is detected. The procedure consisted of means for making data. The component thickness calculation is a procedure for obtaining the difference between the lower surface data and the upper surface data and recording it as detection data, and the thickness matching is a procedure for matching the component data and detection data of the electronic component. As a result of the thickness measurement step, if the component thickness is within the allowable tolerance, execute the step to instruct to mount the electronic component on the board, and if it is not within the allowable tolerance, instruct to discard the electronic component. To execute the steps to be performed. In this way, when the electronic component 18 is adsorbed to the nozzle 25 in an inclined state, even if the electronic component 18 having an actual thickness within the allowable range is discarded, the electronic component 18 is adsorbed in an inclined state. When the electronic component 18 is mounted on the base, the mounting position is likely to be displaced and the mounting defect is likely to occur. Therefore, it is preferable to dispose the electronic component 18 from the viewpoint of preventing the generation of the mounting defective base.

Further, when two intersection points 55c of the nozzle and the electronic component are detected by the boundary tracking in the top surface recognition,
The average value of the intersection points 55c is recognized as the nozzle tip position, and the step of erasing and recording old nozzle data as new nozzle data is executed. Also,
When exchanging the base 41, a background image in which the electronic component 18 is not reflected is photographed by the image sensor 51, and a dust confirmation step for confirming the presence or absence of dust is executed. If dust is recognized, a dust detection warning is issued. I tried to execute the step to issue. Adhesion of dust does not always occur, and even if dust adheres, it does not immediately cause defective thickness measurement. This embodiment proposes eliminating the influence of dust adhesion without lowering the production efficiency. There is no room to detect dust adhesion while mounting electronic components. On the other hand, regarding the last electronic component to be mounted on the board 41, the board 41 must be taken after the images are taken at the plane image taking station 5 and the side image taking station 6.
Do not decide whether to attach to or discard. In this embodiment, the substrate 41 cannot be replaced unless the thickness measurement step is performed and it is confirmed that the component thickness is within the allowable tolerance. In addition, after the board 41 is replaced, the electronic component to be mounted on the next board 41 can be sucked. Therefore, in this embodiment, the eight mounting units 23 from the plane image photographing station 5 to the Q-axis large swivel station 3, the suction station 1, and the nozzle type switching station 14 including the nozzle type confirmation station 15 are replaced at the time of board replacement. The electronic parts cannot be adsorbed. In the dust confirmation step according to the present invention, when the substrate 41 is replaced as described above, the dust is confirmed by acquiring the background image in a state in which the electronic components are not held, so that the production efficiency of the substrate is completely hindered. There is no such thing. Also,
When the latest nozzle data of the nozzle tip position in the nozzle tip measurement step is obtained, the step of erasing the old data and recording the newly obtained nozzle data is executed. Further, when two intersections 55c of the nozzle image 55a and the component image 55b are detected as a result of boundary tracking in the thickness measuring step, the two intersections 55c are detected.
The average value of is recognized as the data of the nozzle tip position, and this is used as new nozzle data to execute the step of erasing and recording the old data. Then, the step of reflecting the values of these nozzle data on the descending amount of the nozzle 25 when the electronic component 18 in the suction station 1 is sucked is executed. Further, the step of reflecting the value of the lower surface data obtained by the lower surface recognition procedure of the thickness measuring step on the descending amount of the nozzle 25 when the electronic component 18 is mounted on the board 41 in the mounting station 9 is executed. I chose

[0013]

According to the present invention, an electronic component thickness check program capable of taking a side image of an electronic component and a tip portion of a nozzle and measuring an appropriate thickness with respect to all image data obtained as a measurement image. It was possible to provide a mounting machine having such a program. Further, according to the present invention, when dust adheres to the light receiving portion of the image sensor,
We found it as quickly as possible without hindering production efficiency, and issued a dust detection warning to notify the workers. Therefore, it is possible to provide an electronic component thickness check program that eliminates the occurrence of measurement failure due to dust adhesion and a mounting machine having such a program. Further, according to the present invention, the nozzle tip position is constantly detected and the nozzle data is updated, the latest nozzle data is fed back to the control of the nozzle lowering position in the suction station, and the electronic component is always sucked under a constant condition, Since the probability of adsorption was maintained at a high value and the number of parts to be discarded was reduced, the cost of parts could be reduced. Further, according to the present invention, the lower surface data obtained in the thickness measuring step is fed back to the control of the nozzle lowering position in the mounting station so that the electronic component is always pushed onto the base under a constant condition, so that the base of the mounting failure It was possible to prevent the occurrence of.

[Brief description of drawings]

FIG. 1 is a plan view showing a configuration of an embodiment of a mounting machine according to the present invention.

FIG. 2 is a side view showing a mounting state of nozzles of the mounting machine of FIG.

FIG. 3 is a diagram showing a representative image of a measurement image and a nozzle measurement image.

FIG. 4 is a process drawing of an embodiment of an electronic component thickness check program according to the present invention.

FIG. 5 is a process drawing of one embodiment of a nozzle tip measuring step according to the present invention.

FIG. 6 is a process diagram of one embodiment of a dust confirmation step according to the present invention.

[Explanation of symbols]

1: Adsorption station 3: Q-axis large swivel station 5: Plane image capturing station 6: Side image capturing station 8: Q-axis correction station 9: Mounting station 10: Q-axis original position returning station 13: Parts disposal station 14: Nozzle type Switching station 15: Nozzle type confirmation station 18: Electronic component 21: Mounting machine 22: Indexing device 23: Mounting unit 24: Bracket 25: Nozzle 25a: Tip 26: Index swiveling 27: Q-axis swiveling 28: Rotating shaft 29: Block 31 : Component supply unit 32: Feeder 33: X-axis moving mechanism 41: Base 42: Conveyor 43: Positioning mechanism 45: Planar image sensor 51: Image sensor 53: Light emitting part 54: Light receiving part 55a: Nozzle image 55b: Part image 55c : Intersection 5e: the lowest end 55f: nozzle lowest end 55g: the corners of the nozzle

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 3C007 AS08 DS08 FS01 FT17 KS07                       KT01 KT11 NS17                 5E313 AA03 AA11 CC04 CD06 EE02                       EE03 EE24 EE34 FF24 FF29

Claims (7)

[Claims] 1. A mounting machine for adsorbing an electronic component on a component supply unit to a tip of a nozzle and mounting the electronic component on a substrate held by a positioning mechanism, which has an image sensor, and controls these. A mounting machine comprising a computer or the like, which is a program for causing the computer to execute the following steps, which accepts in advance the input of data on the thickness of electronic components,
This step is recorded as component data, and the mounting machine is operated without adsorbing the electronic component, an image of the nozzle tip portion (hereinafter simply referred to as “nozzle measurement image”) is taken, and the nozzle tip is extracted from the nozzle measurement image. A step of searching the position and recording the data of the searched nozzle tip position as nozzle data (hereinafter simply referred to as "nozzle tip measuring step").
Say. ), And while the electronic components are being mounted on the substrate by the mounting machine (hereinafter simply referred to as “electronic component mounting”), regarding the electronic components to be mounted on the substrate, the electronic components and the tip of the nozzle that adsorbs them. A step of capturing a side image (hereinafter, simply referred to as “measurement image”) of the part by the image sensor and searching for the measurement image, each of bottom surface recognition, top surface recognition, component thickness calculation, and thickness collation. Step consisting of procedure (hereinafter simply referred to as "thickness measurement step")
Say. ), And the lower surface recognition and the upper surface recognition may be performed first, and the lower surface recognition recognizes the data at the lowermost end of the measurement image as the lower surface of the electronic component, As a procedure for recording this, the upper surface recognition first acquires the nozzle data of the nozzle concerned, and performs boundary tracking of the upper and lower α mm ranges centering on the acquired nozzle tip position in the measurement image to determine the intersection of the nozzle and the electronic component. Is detected, and when two intersections are detected, the average value is recognized as the top surface of the electronic component, and this is recorded as top surface data. When two intersections are not detected, the previously recorded nozzle The procedure of recognizing the nozzle data as the upper surface of the electronic component and converting it into the upper surface data is performed, and the component thickness calculation calculates the difference between the lower surface data and the upper surface data. , A procedure of recording as detection data, the thickness collation is a procedure of collating the component data of the electronic component with the detection data, and as a result of the thickness measurement step, the detection data is the component thickness of the component data. If the detected tolerance does not fit within the tolerance of the thickness of the component data, the electronic component should be discarded. An electronic component thickness check program, comprising: a step of instructing. 2. The invention according to claim 1, wherein when two intersections of the nozzle and the electronic component are detected by boundary tracking in upper surface recognition, an average value of the two intersections is recognized as a nozzle tip position, A program for checking the thickness of an electronic component, which has a step of erasing and recording old nozzle data as new nozzle data. 3. The invention according to claim 1 or 2, wherein when the substrate is replaced, a background image in which no parts are imaged is photographed by an image sensor and the presence or absence of dust adhesion to the image is confirmed ( Hereinafter, simply referred to as a "dust confirmation step"), and a step for instructing to issue a dust detection warning when adhering dust is admitted, is provided, and a thickness check program for electronic parts. 4. The program according to claim 1, wherein when the nozzle data of the nozzle tip position in the nozzle tip measurement step is obtained, old data is erased and the newly obtained nozzle data is used. As a result of the recording step and the boundary tracking in the thickness measurement step, when two intersections of the nozzle and the electronic component are detected, the average value of the two intersections is recognized as the nozzle tip position, and this is used as new nozzle data. Electronic component thickness check, which comprises a step of erasing and recording old data, and a step of reflecting the value of the nozzle data in a descending amount of a nozzle tip when adsorbing an electronic component at a suction station. program. 5. The program according to claim 1, wherein the value of the lower surface data obtained by the lower surface recognition procedure of the thickness measuring step is used to mount the electronic component on the board at the mounting station. A thickness check program for electronic parts, characterized in that it has a step of reflecting the amount of lowering of the nozzle. 6. A component supply unit, an index device having a plurality of stop stations, and a plurality of mounting units held by the index device, each of which has a nozzle and has a function of vertically moving the nozzle. A mounting machine comprising a mounting unit having a function of rotating the nozzle around a Q axis which is a vertical axis passing through the center of the nozzle, a conveyor, a positioning mechanism, and a computer controlling these, the plurality of stop stations. Has at least a suction station, a Q-axis large swivel station, a plane image photographing station, a Q-axis correction station, a mounting station, and a parts disposal station. The nozzle is lowered at the suction station, and the tip of the nozzle is placed on the parts supply unit. The electronic part is brought into contact with and absorbed by the electronic part. Raising the nozzle while adsorbing the rough Q in the Q-axis large turning station
Axis adjustment is performed, a plane view image of an electronic component is captured at the plane image capturing station, Q axis final adjustment is performed at the Q axis correction station, and an electronic component to be mounted is mounted on a board at a mounting station. A mounting machine for discarding electronic components to be disposed of at a component disposal station and further proceeding to the next step starting from the suction station, which is located between the Q-axis large swivel station and the Q-axis correction station. An image sensor having a light projecting portion and a light receiving portion, which has a function of capturing a side image of the electronic component and the tip portion of the nozzle, is attached to the stop station, and this is used as a side image capturing station. The program recorded in a main storage device of the computer according to any one of claims 1 to 5. Mounting machine consisting of any of the programs of the program. 7. The mounting machine according to claim 6, further comprising a nozzle type switching station and a nozzle type confirmation station after the parts disposal station of the index device, which is used next in the nozzle type switching station. A mounting machine characterized in that the nozzle is selected, the selected nozzle is confirmed at the nozzle type confirmation station, and the process is advanced to the next step starting from the adsorption station.