JP2003209077A5 - - Google Patents
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- Publication number
- JP2003209077A5 JP2003209077A5 JP2002005834A JP2002005834A JP2003209077A5 JP 2003209077 A5 JP2003209077 A5 JP 2003209077A5 JP 2002005834 A JP2002005834 A JP 2002005834A JP 2002005834 A JP2002005834 A JP 2002005834A JP 2003209077 A5 JP2003209077 A5 JP 2003209077A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002005834A JP2003209077A (ja) | 2002-01-15 | 2002-01-15 | Ｃｍｐ装置及び半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002005834A JP2003209077A (ja) | 2002-01-15 | 2002-01-15 | Ｃｍｐ装置及び半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003209077A JP2003209077A (ja) | 2003-07-25 |
| JP2003209077A5 true JP2003209077A5 (enrdf_load_stackoverflow) | 2005-08-04 |
Family
ID=27644764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002005834A Pending JP2003209077A (ja) | 2002-01-15 | 2002-01-15 | Ｃｍｐ装置及び半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003209077A (enrdf_load_stackoverflow) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7125318B2 (en) * | 2003-11-13 | 2006-10-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad having a groove arrangement for reducing slurry consumption |
| JP4563025B2 (ja) * | 2003-12-19 | 2010-10-13 | 東洋ゴム工業株式会社 | Ｃｍｐ用研磨パッド、及びそれを用いた研磨方法 |
| US6955587B2 (en) * | 2004-01-30 | 2005-10-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Grooved polishing pad and method |
| US6958002B1 (en) * | 2004-07-19 | 2005-10-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with flow modifying groove network |
| US20060194530A1 (en) * | 2005-02-25 | 2006-08-31 | Thomson Clifford O | Polishing pad for use in polishing work pieces |
| JP4909706B2 (ja) * | 2006-10-24 | 2012-04-04 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP6948878B2 (ja) | 2017-08-22 | 2021-10-13 | ラピスセミコンダクタ株式会社 | 半導体製造装置及び半導体基板の研磨方法 |
| KR102746090B1 (ko) | 2020-03-13 | 2024-12-26 | 삼성전자주식회사 | Cmp 패드 및 이를 구비하는 화학적 기계적 연마 장치 |
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2002
- 2002-01-15 JP JP2002005834A patent/JP2003209077A/ja active Pending