JP2003207802A - Liquid crystal display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the generation of a defective display due to chipping existing on the connection side of active matrix substrates and to prevent the generation of a defective curing of a frame-like peripheral seal constituting a liquid crystal display panel, in a liquid crystal display device forming a large screen by connecting a plurality of active matrix substrates onto their side faces. <P>SOLUTION: In the liquid crystal display device constituting one large substrate by connecting the side faces of active matrixes and attaining a large screen by sticking the large substrate to the other substrate, pixel electrodes are arranged close to the connection side of the active matrixes as compared with signal lines or scanning lines laid along the connection side. In the liquid crystal display device attaining the large screen by connecting the side faces of liquid crystal display panels, pixel electrodes are arranged rather close to the connection side of the panels as compared with signal lines or scanning lines formed along the connection side. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a large-screen liquid crystal display device used as a display device for AV (audio-vidual) equipment or a display device for OA (office automation) equipment, and more particularly to a plurality of active matrix substrates or The present invention relates to a liquid crystal display device in which a liquid crystal display panel is connected on a side surface to achieve a large screen and a manufacturing method thereof.

[0002]

2. Description of the Related Art In recent years, home-use televisions used as AV equipment and display devices used in OA equipment have been reduced in weight,
Thinning, low power consumption, high definition and large screen are required. Therefore, the CRT, the liquid crystal display (LC
D), plasma display device (PDP), EL display device, L
Development of a large screen for display devices such as ED display devices
Practical application is in progress.

Among them, the liquid crystal display device has the advantages that the thickness (depth) can be remarkably thin, power consumption is small, and full-color display is easy as compared with other display devices. It is being used in various fields, and there are great expectations for larger screens. Liquid crystal display devices are roughly classified into simple matrix type and active matrix type, and active matrix type liquid crystal display devices are expected to have high definition, large screen and high display quality.

On the other hand, in the active matrix liquid crystal display device, when the size of the screen is increased, the defective rate due to the disconnection of the signal wiring, the scanning wiring, the pixel defect and the like is rapidly increased in the manufacturing process, and further, the liquid crystal display device. The problem arises that it will lead to a rise in prices. Therefore, in order to solve this, a liquid crystal display device having a structure in which at least one of a pair of substrates with electrodes constituting a liquid crystal display device is connected to a plurality of small substrates at its side surface to form a large substrate is provided. It is disclosed in Japanese Utility Model Publication No. 60-191029.

FIG. 11 is a plan view (a) and a cross-sectional view (b) taken along the line BB ′ of the plan view (a) showing the configuration of the liquid crystal display device disclosed in Japanese Utility Model Laid-Open No. 191029/1985. Indicate. Here, four active matrix substrates (hereinafter,
One of the large substrates is formed by connecting side surfaces of 52, 53, 54, and 55 (referred to as TFT substrates) in a cross-shaped pattern.
A spacer 57 is provided between the other substrate 51 (hereinafter referred to as a CF substrate) 51 on which a color filter with electrodes is formed.
A large-screen liquid crystal display device is formed by laminating the liquid crystal layer 50 and the liquid crystal layer 50. Generally, in the case of an active matrix type liquid crystal display device, it is extremely difficult to manufacture a TFT substrate in which minute active elements 70 and pixel electrodes 71 are arranged in a matrix for each pixel in a large area with a high yield. Therefore, of the pair of substrates that make up the liquid crystal display device, the TFT substrate is manufactured as a plurality of small substrates,
If they are connected to each other at their side surfaces to form one large-sized TFT substrate and then bonded to the other large-sized opposite substrate provided with a color filter to form a panel, the efficiency is improved in terms of productivity.

For the same purpose as described above, a liquid crystal display device having a large screen by connecting a plurality of liquid crystal display panels on the same plane so that their side surfaces are adjacent to each other is disclosed in JP-A-8-1227.
No. 69 publication.

FIG. 15 is a plan view (a) and a sectional view (b) of the liquid crystal display device disclosed in Japanese Patent Laid-Open No. 8-122769. Here, a large-screen liquid crystal display device is formed by adhering two left and right active matrix type liquid crystal display panels 81 and 82 on the reinforcing substrate 83 so that their side surfaces are adjacent to each other with an adhesive 84. Each of the liquid crystal display panels 81 and 82 has a TFT substrate 85 or 86.
And a counter substrate (C
F substrate) 87 and 88 are bonded together by a seal 90 with a liquid crystal layer 89 interposed therebetween. The seal 90 is provided in a frame shape in the peripheral portion of each liquid crystal display panel, and has a structure in which the liquid crystal layer 89 is enclosed in the frame seal. The liquid-layer display device with this structure is a liquid crystal display device with the largest size that can be obtained from existing production equipment, thus increasing the screen size of the liquid crystal display device without introducing new production equipment for large liquid crystal display devices. It has the advantage that it can be realized.

[0008]

However, the above liquid crystal display device has the following problems.

Problem of Japanese Utility Model Laid-Open No. 60-191029 In this liquid crystal display device, a plurality of TFT substrates 52, 53,
54 and 55 are manufactured first, and they are connected to each other at their side surfaces to form one large TFT substrate. As we all know, TF
On the T substrate, scanning wirings (gate bus lines) 72 and signal wirings (source bus lines) formed in a matrix are formed.
73, an active element 70 using a thin film transistor (TFT element) formed at each matrix intersection of both wirings as a switching element, and a pixel electrode 71.

As can be seen from FIG. 11, a plurality of small TFT substrates 52, 53, 5 forming a large TFT substrate.
The signal wirings 73 and the scanning wirings 72, the active elements 70, and the pixel electrodes 71, which are arranged in a matrix, are provided at the positions 4 and 55 in the same positional relationship. Specifically, in all the TFT substrates 52, 53, 54, 55, the signal wiring is on the right side of the signal wiring 73 extending in the Y direction and below the scanning wiring 72 extending in the X direction. An active element 70 including a TFT whose source electrode is connected to 73 and whose gate electrode is connected to the scanning wiring 72
And a pixel electrode 71 connected to the drain
Is provided.

FIG. 12 is an enlarged plan view showing the vicinity of the connection region between the upper left TFT substrate 52 and the upper right TFT substrate 53. The left and right TFT substrates 52 and 53 are connected to each other in the connection region 60 using an adhesive 56. This connection area 60
The pixel pitch in the area including the
To obtain continuity of 2 and 53, TFT substrates 52 and 53
It is desirable to form the pixel pitch in the same display area. For this reason, it is necessary to process the connection end face of each TFT substrate to be flat with extremely high precision and to form the connection region 60 narrow. However, if a scribe cutting method is used when cutting the TFT substrate from the mother glass into a predetermined size, it is impossible to obtain a flat cut end surface because unevenness of about 0.5 mm occurs on the cut surface. Therefore, it is necessary to cut using a dicing device using a diamond blade in order to obtain flatness of the cut end surface. In the case of cutting using a dicing device, it is possible to finish the cut surface into unevenness of 0.05 mm or less.

Even when cutting is performed using a dicing device,
As shown in FIG. 13, a fine chipping 63 may occur at the edge of the cut end surface of the TFT substrate 53. For example, according to experience, when the dicing cutting is performed under the conditions shown in Table 1, the length is 550 mm, the width is 650 mm, and the thickness is 1.1.
650 m when laterally cutting a mm mother glass
Within the cutting distance of m, there are many small chippings (having a chipping depth W of 0.01 mm or less) and large chippings (chipping depth W of 0.03 to 0.05 m).
It has been found that 2 to 5 places suddenly occur.

[0013]

[Table 1]

By optimizing the dicing conditions, it is possible to reduce the probability of occurrence of large chippings with a chipping depth W of about 0.03 to 0.05 mm, but improvement in production efficiency is required. In production conditions, it is impossible to eliminate the occurrence of large chippings.

If large chipping (having a chipping depth W of about 0.03 to 0.05 mm) occurs in the connection area of the TFT substrate, the following problems occur.

FIG. 14 is an enlarged plan view of the vicinity of the connection region when the left and right TFT substrates 52 and 53 having the chippings 63 in the connection region are joined together. As shown in the figure, the chipping 63 generated when cutting the dicing may disconnect the signal wiring 73 adjacent to the connection side on the right TFT substrate 53. Moreover, the active element 70 may be destroyed in some cases. As described above, the large chipping 63 has a great influence on the production yield rate of the liquid crystal display panel, but the small chipping does not cause damage such as disconnection of the signal wiring affecting the large production yield rate.

Therefore, a large chipping (chipping depth W of 0.03 to 0.05) is formed on the edge of the TFT substrate 53.
Therefore, even if a signal wire or an active element is generated, a structure is required.

Problems of Japanese Patent Application Laid-Open No. 8-122769 This liquid crystal display device is shown in a plan view in FIG.
(B) As shown in the sectional view, the liquid crystal display panels 81 and 82 are connected adjacent to each other. As is well known, on the TFT substrates 85 and 86 used for the liquid crystal display panel, scanning wirings (gate bus lines) 91 and signal wirings (source bus lines) 92, which are formed in a matrix, and matrix intersections of both wirings are provided. The formed active element (TFT element) 93 and the pixel electrode 94 are provided. Further, as described above, the seal 90 is provided in a frame shape around the liquid crystal display panels 81 and 82, and the liquid crystal layer 89 is enclosed inside the frame-shaped seal 90. .

FIG. 16 is an enlarged plan view of the TFT substrates 85 and 86 near the connection regions of the left and right liquid crystal display panels 81 and 82 in the liquid crystal display device shown in FIG.
The left and right TFT substrates 85 and 86 are connected to each other using an adhesive 84 in the connection region 80, and the TFT substrate 8
Along the connecting sides of 5, 86, the TFT substrates 85, 86 and C
A seal 90 for attaching the F substrates 87 and 88 is provided. The seal 90 is a frame-shaped seal pattern provided around the individual liquid crystal display panels 81 and 82.

Here, if the pixel pitch in the connection area is set to be the same as the pixel pitch in the other area, the uniformity of the display is obtained and the seam becomes inconspicuous. Therefore, the seal 90 is formed as thin as possible and the connection side is formed. It is necessary to dispose the pixel electrode 94 adjacent to the pixel electrode 94. For this reason, as the material of the seal 90, a photo-curing type sealant that causes little shape disorder during curing is used so as not to adversely affect the display pixels adjacent to the seal 90 such as display defects.

However, the matrix-shaped scanning wiring 9 is used.
1 and signal wiring 92, TFT element 93 and pixel electrode 9
4 is the same in the left and right liquid crystal display panels 81 and 82, that is, in the left and right TFT substrates 85 and 86, as shown in FIG. 16, under the scanning wiring 91 extending in the X direction. If the scanning wiring 91, the TFT element 93 connected to the signal wiring 92, and the pixel electrode 94 are provided on the side and on the right side of the signal wiring 92 extending in the Y direction, the following problems occur.

TFT substrates 85 and 86 and CF substrates 87 and 8
In the step of sealing 8 in a frame shape at the peripheral portion, when the sealing resin is cured by light irradiation, the CF substrates 87, 88
When the light is irradiated from the side of, the light is blocked by the black matrix (BM) formed in the region other than the region facing the pixel electrode 94, and therefore it is necessary to perform the irradiation from the side of the TFT substrates 85 and 86. However, the right TF
On the T-board 86, as shown in FIG. 16, since the seal 90 and the signal wiring 92 along the connection side overlap, the signal wiring 9
The light is blocked by 2 and the curing failure of the seal 90 is caused. If there is a curing failure of the seal 90, the display pixels adjacent to the seal 90 will be adversely affected such as display failure.

Therefore, even if the display pixel is arranged adjacent to the seal 90, there is a demand for a structure that does not cause curing failure of the seal 90.

[0024]

In the liquid crystal display device according to claim 1 of the present invention, the signal wiring and the scanning wiring are arranged orthogonally,
An active matrix substrate having active elements and pixel electrodes formed in the vicinity of each intersection of the signal wiring and the scanning wiring is connected on a plurality of side surfaces to form one large substrate,
In a liquid crystal display device configured by laminating a liquid crystal layer between one of the substrates and a counter substrate with electrodes of approximately the same size, color filters of three different colors are formed on the counter substrate. A pixel unit having adjacent three-color pixels and a non-display region as one unit is formed, and the width of the non-display region is between the pixel electrodes formed on the respective connection region sides of the active matrix substrate. It is characterized by being almost equal to the interval.

Further, in a liquid crystal display device according to a second aspect of the present invention, the pixel among the signal wiring and the pixel electrode formed along the connection side on the active matrix substrate which constitutes the one large substrate is the pixel. It is characterized in that the electrode is formed on the side of the connection region, or the pixel electrode is formed on the side of the connection region among the scanning line and the pixel electrode.

Further, in the liquid crystal display device according to claim 3 of the present invention, the signal wirings and the scanning wirings are arranged orthogonally, and active elements and pixel electrodes are formed in the vicinity of each intersection of the signal wirings and the scanning wirings. Active matrix substrate,
A plurality of liquid crystal display panels, which are bonded to each other with a liquid crystal layer interposed between the active matrix substrate and a counter substrate with electrodes of substantially the same size, are formed by adjoining side surfaces of a plurality of liquid crystal display panels. In the liquid crystal display device, color filters of three different colors are formed on the counter substrate, pixels of adjacent three colors and a pixel unit having a non-display area as one unit are configured, and a width of the non-display area is formed. Is substantially equal to the interval between the pixel electrodes formed on the connection region side of the liquid crystal display panel.

Further, in a liquid crystal display device according to a fourth aspect of the present invention, among the signal wiring and the pixel electrode formed along the connection side on the active matrix substrate constituting the liquid crystal display panel, the pixel electrode One of the scanning line and the pixel electrode is formed on the side of the connection region, or one of the scanning line and the pixel electrode is formed on the side of the connection region.

Further, in a liquid crystal display device according to a fifth aspect of the present invention, a sealant for sealing the liquid crystal layer between the active matrix substrate and the counter substrate is provided along the connection side of the liquid crystal display panel. The sealant provided on the active matrix substrate and provided along the connection side is provided so as not to overlap the signal wiring and the operation wiring.

Since the liquid crystal display device of the present invention has the above characteristics, it has the following effects in each embodiment.

(Operation of Example 1) In the liquid crystal display device of Example 1 of the present invention, one large substrate is formed by connecting two active matrix substrates at their side surfaces. A large-screen liquid crystal display device is configured by laminating a counter substrate of approximately the same size through a liquid crystal layer. The point that the TFT substrate is formed of a plurality of small substrates and they are connected to each other at their side faces to form one large TFT substrate is basically the same as the liquid crystal display device shown in the conventional example. However, the positional relationship between the scanning wirings and the signal wirings formed in a matrix on the TFT substrate, and the active elements and pixel electrodes formed at each matrix intersection of these wirings are different. That is, T on the right
On the FT substrate, active elements and pixel electrodes connected to the signal wirings are provided on the left side of the signal wirings extending in the Y direction. On the other hand, in the left TFT substrate, the active element and the pixel electrode connected to the signal wiring are provided on the right side of the signal wiring extended in the Y direction. That is, not the signal wiring but the pixel electrodes are adjacent to each other in the vicinity of the connection sides of the two left and right TFT substrates.

Therefore, when the connecting sides of these TFT substrates are cut out by the dicing cutting method, it is assumed that large chipping (having a chipping depth W of about 0.03 to 0.05 mm) occurs on the connecting sides for the reason described above. Also, it is possible to prevent the signal wiring and the active element from being destroyed. Even if the chipping is large enough to reach the pixel electrode, only the pixel damaged by the chipping becomes the point defect defect, and the line defect defect due to the disconnection of the signal wiring is generated as in the conventional case. This is not the case, and it is possible to suppress the display defect to the minimum. However, since this chipping has a maximum chipping depth W of 50 μm, in order to obtain the above effect, the gap M from the connection side of the TFT substrate to the pixel electrode is set to 5 mm.
It is necessary to set it to 0 μm or more.

(Operation of Second Embodiment) In addition, the second embodiment of the present invention has a structure similar to that of the first embodiment, and by connecting four active matrix substrates vertically and horizontally in a cross pattern, A large-screen liquid crystal display device is formed by forming a substrate and bonding the one substrate and a counter substrate having substantially the same size with a liquid crystal layer interposed therebetween. In the second embodiment, the TFT substrate on the upper right side is connected to the signal wiring and the scanning wiring on the left side of the signal wiring extended in the Y direction and on the lower side of the scanning wiring extended in the X direction. Active elements and pixel electrodes are provided. In the lower right TFT substrate, on the left side of the signal wiring extending in the Y direction and on the upper side of the scanning wiring extending in the X direction, the signal wiring and the active element connected to the scanning wiring are provided. Pixel electrodes are provided. In the TFT substrate on the upper left side, on the right side of the signal wiring extending in the Y direction and on the lower side of the scanning wiring extending in the X direction, an active element connected to the signal wiring and the scanning wiring is provided. Pixel electrodes are provided. In the TFT substrate on the lower left side, on the right side of the signal wiring extended in the Y direction and on the upper side of the scanning wiring extended in the X direction, the signal wiring, the TFT element and the pixel connected to the scanning wiring. Electrodes are provided.

Therefore, when the connecting sides of these TFT substrates are cut out by the dicing cutting method, it is assumed that large chipping (having a chipping depth W of about 0.03 to 0.05 mm) occurs on the connecting sides for the reason described above. Also, similarly to the first embodiment, it is possible to prevent the signal wiring, the scanning wiring, and the active element from being destroyed. Further, even if a large amount of chipping is generated to reach the pixel electrode, only the pixel damaged by the chipping becomes a point defect defect, and a line defect defect due to a signal disconnection as in the conventional case does not occur. It is possible to suppress the display defect to the minimum.

(Operation of Third Embodiment) The liquid crystal display device according to the third embodiment of the present invention has a large size by adhering two active matrix type liquid crystal display panels on the left and right sides on the reinforcing substrate so that the side surfaces thereof are adjacent to each other with an adhesive. Forming a liquid crystal display device for the screen. Basically, each liquid crystal display panel has a structure in which a TFT substrate and a CF substrate are attached to each other with a frame-shaped seal around the periphery of the liquid crystal display panel, and liquid crystal is enclosed in the frame-shaped seal. This is similar to the liquid crystal display device shown in the conventional example. However, the positional relationship between the scanning wirings and the signal wirings formed in a matrix on the TFT substrate, and the active elements and pixel electrodes formed at each matrix intersection of these wirings are different. That is, the right TF
On the T substrate, active elements and pixel electrodes connected to the signal wiring are provided on the left side of the signal wiring extending in the Y direction. On the other hand, in the left TFT substrate, the active element and the pixel electrode connected to the signal wiring are provided on the right side of the signal wiring extended in the Y direction. That is, not the signal wiring but the pixel electrodes are adjacent to each other near the connection sides of the left and right TFT substrates.

Therefore, when the seal is provided along the connection side of these TFT substrates, the seal does not overlap with the signal wiring even if the seal is brought close to the pixel electrode. Therefore, even if light is irradiated from the TFT substrate side to cure the seal, the signal wiring does not block the light, and the seal can be completely cured.

(Operation of Embodiment 4) Embodiment 4 of the present invention
Has a structure similar to that of the third embodiment, and four liquid crystal display panels are attached to each other on the reinforcing substrate so that the side surfaces thereof are adjacent to each other in the vertical and horizontal directions to form a large-screen liquid crystal display device. In the fourth embodiment, the TFT substrate on the upper right side is connected to the signal wirings and the scanning wirings on the left side of the signal wirings extended in the Y direction and on the lower side of the scanning wirings extended in the X direction. Active elements and pixel electrodes are provided. In the lower right TFT substrate, on the left side of the signal line extending in the Y direction and on the upper side of the scanning line extending in the X direction, the signal line, the active element connected to the scanning line, and Pixel electrodes are provided. In the TFT substrate on the upper left side, on the right side of the signal wiring extending in the Y direction and below the scanning wiring extending in the X direction, the signal wiring, the active element connected to the scanning wiring, and Pixel electrodes are provided. In the TFT substrate on the lower left side, on the right side of the signal wiring extending in the Y direction and on the upper side of the scanning wiring extending in the X direction, the signal wiring, active elements and pixels connected to the scanning wiring. Electrodes are provided.

Therefore, when the seal is provided along the connection side of these TFT substrates, the seal does not overlap the signal wiring and the scanning wiring even if the seal is brought close to the pixel electrode. Therefore, even if light is irradiated from the TFT substrate side to cure the seal, the signal wiring and scanning wiring do not block the light, and the seal can be completely cured.

[0038]

BEST MODE FOR CARRYING OUT THE INVENTION (Embodiment 1) Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings.

FIG. 1 shows the structure of a liquid crystal display device according to the first embodiment of the present invention. FIG. 1 (a) is a plan view and FIG.
(B) shows a sectional view. As shown in FIG. 1, the liquid crystal display device of the present invention includes an active matrix substrate (TFT substrate).
One large substrate is formed by connecting 1 and 2 on the left and right, and a liquid crystal layer 4 is interposed between the one large substrate and a counter substrate 3 on which a color filter with electrodes of substantially the same size is formed. A large-screen liquid crystal display device is formed by bonding them together. Usually, the large substrate to which the TFT substrates 1 and 2 are connected is formed to be slightly larger than the counter substrate 3,
Connection terminals for scanning wiring and signal wiring are formed in a larger portion. FIG. 2 is an enlarged plan view showing the vicinity of the connection regions of the left and right TFT substrates that constitute the liquid crystal display device shown in FIG. The TFT substrates 1 and 2 are, as shown in FIG. 2, scanning lines (gate bus lines) 5 and signal lines (source bus lines) 6 arranged in a matrix on a transparent substrate such as glass, and both of these lines. Thin film transistors (TFTs) formed of semiconductor materials such as amorphous silicon and polysilicon formed at matrix intersections.
m Transistor)) is used as a switching element, and an active element 7 and a pixel electrode 8 formed of a transparent conductive film such as ITO are formed by known materials and processes. The gate electrode of the TFT is connected to the scanning wiring 5,
The source electrode is connected to the signal wiring 6, and the drain electrode is connected to the pixel electrode 8. The counter substrate (CF substrate) 3 is a transparent substrate made of glass or the like and each color filter 9 of red (R) green (G) blue (B) provided corresponding to each pixel electrode 8 and each pixel. Lattice-shaped light-shielding film (black matrix (BM)) 10 for preventing light leakage from between the electrodes 8, IT
The common electrode formed of a transparent conductive film such as O is formed by a known material and process.

FIG. 2 shows the positional relationship among the scanning wirings 5, the signal wirings 6, the active elements 7, and the pixel electrodes 8 arranged in a matrix. As shown in FIG. 2, the TFT substrate 1 on the left side and the TFT substrate 2 on the right side have a structure in which the scanning wirings 5, the signal wirings 6, the active elements 7 and the pixel electrodes 8 are arranged in the opposite positional relationship. Has become. That is, they are arranged in line symmetry around the connection region N. Specifically, on the TFT substrate 1 on the left side, the active element 7 and the pixel electrode 8 to which the signal line 6 and the source electrode are connected are provided on the right side of the signal line 6 extending in the Y direction. On the other hand, the TFT substrate 2 on the right side
Then, on the left side of the signal line 6 extending in the Y direction, the active element 7 and the pixel electrode 8 to which the signal line 6 and the source electrode are connected are provided. That is, the left and right T
The signal wiring 6 is not provided in the vicinity of the connection region N of the FT substrates 1 and 2, and the pixel electrodes 8 are adjacent to each other. The side surfaces of the two left and right TFT substrates 1 and 2 are connected to each other with a transparent adhesive 11 in a connection region N shown in the figure.

As shown in FIG. 3, the distance M from the connection side between the TFT substrates 1 and 2 to the pixel electrode 8 was set to 50 μm. Therefore, when the connection region N is 50 μm, T
Between the pixel electrodes 8 and 8 sandwiching the connection region N between the FT substrates 1 and 2.
The distance is (2M + N) = 150 μm. by the way,
The liquid crystal display device of the present invention shown in FIG.
In order to obtain an inch size display with a resolution of 800 × 600 (SVGA), the size of one pixel unit with 3 units of R, G and B as one unit is about 1000 μm × 100.
It becomes 0 μm. Therefore, as shown in FIG. 4, the non-display area N is set at a rate of 150/1000 per pixel unit U.
By providing U, the connection region N of the TFT substrate can be accommodated in this non-display area. By providing such a non-display area in all the pixel units in the display area, the same pixel pitch as in the other portions can be realized in the connection area N between the TFT substrates 1 and 2, and the seams will not be conspicuous and will be uncomfortable. No display can be realized. The non-display area NU may be covered with a black matrix (BM) provided on the CF substrate.

When a TFT substrate is cut out from a mother glass into a predetermined size, if a simple scribe cutting method is used, it is impossible to obtain a flat cut end surface because unevenness of about 0.5 mm is generated on the cut surface. Therefore, in this embodiment, cutting is performed using a dicing device using a diamond blade. As a result, by using the dicing device under the conditions shown in Table 1, the cut surface is 0.0
It can be finished to 2 mm unevenness and the connection area N is 50
It was possible to make the connection in μm.

However, even if cutting is performed using a dicing device, a fine chipping (chipping) B occurs at the edge of the cut surface as shown in FIG. For example, when dicing cutting is performed under the conditions shown in Table 1, many small chippings (having a chipping depth W of 0.01 mm or less) and large chippings (having a chipping depth W of 0. (About 0.3 to 0.05 mm) suddenly occurs at 2 to 5 places.

In such a case, in the conventional liquid crystal display device, chipping that occurs when the dicing of the TFT substrate is cut may break the signal wiring adjacent to the connection side as shown in FIG. . In some cases, the active element may be destroyed.

However, in the case of the liquid crystal display device of the present invention, since the structure shown in FIG. 2 is adopted, such a problem can be solved. FIG. 3 is an enlarged plan view of the TFT substrate when the TFT substrates 1 and 2 having the chipping B on the connection side are joined together. As shown in the figure, TF
Even if chipping B occurs at the time of cutting the dicing of the T substrates 1 and 2, the signal wiring 6 is not adjacent to the connection region N as in the conventional case.
Is never broken. In addition, the active element 7
Will not be destroyed. However, since the chipping B has a maximum chipping depth W of 50 μm, it is necessary to set the gap M from the connection side of the TFT substrate to the pixel electrode to 50 μm or more in order to obtain the above effect.

As described above, in the liquid crystal display device of the present invention, the wiring design shown in FIG.
The gap M from the connection region N of No. 2 to the pixel electrode 8 is 50 μm
With the above settings, it is possible to prevent the occurrence of disconnection defects and point defect defects even when chipping B having a chipping depth W of about 0.03 to 0.05 mm occurs when cutting the TFT substrate. Become. Further, it is not necessary to optimize the dicing / cutting processing conditions to the ultimate, and the improvement of production efficiency is not hindered. Even if chipping, which is extremely rare but large enough to reach the pixel electrode 8, occurs, only the portion of the pixel electrode 8 damaged by the chipping becomes a point defect defect. It is possible to suppress the display defect to the minimum without causing the line defect defect due to the disconnection.

Here, the diagonal size of 40 inches,
A specific example of a liquid crystal display device capable of obtaining a display with a resolution of 800 × 600 (SVGA) has been shown, but the present invention is not limited to these sizes and resolutions.
If the liquid crystal display device is intended to be large-sized by connecting the TFT substrate as shown in (4), it can be widely applied regardless of size. In addition, the plan view of FIG.
As shown in the liquid crystal display device shown in the sectional view of FIG.
Similar effects can be obtained even in a liquid crystal display device having a structure in which seals 12 and 12 are provided in the gaps between the TFT substrates 1 and 2 and the CF substrate 3 along the connection region N of the FT substrates 1 and 2. . As an active element, for example, MIM
Even when a device other than the TFT element is used as described above, the same effect can be obtained.

(Embodiment 2) The liquid crystal display device of the present invention shown in Embodiment 2 is an active matrix substrate (TFT substrate).
Are arranged vertically and horizontally to form one large substrate by connecting in a cross-shaped pattern, and between this one large substrate and the opposite substrate on which the color filter with the other electrode of almost the same size is formed. Then, a large-screen liquid crystal display device is formed by laminating the liquid crystal layer through the liquid crystal layer. The structure is basically the same as that of the liquid crystal display device shown in Example 1 except that the number of TFT substrates connected is different.

FIG. 6 shows upper, lower, left and right TFT substrates 21, 2
It is an enlarged plan view which shows the connection area vicinity of 2, 23, and 24. The positional relationship among the matrix-shaped scanning wirings 25, the signal wirings 26, the active elements 27, and the pixel electrodes 28 is shown. As can be seen from the figure, the upper, lower, left and right TFT substrates
In Nos. 1, 22, 23, and 24, the positional relationship between the scanning lines 25 and the signal lines 26 in a matrix, the active elements 27, and the pixel electrodes 28 is different. That is, the connection area N
Are arranged in line symmetry vertically and horizontally. Specifically, in the TFT substrate 21 on the upper right side,
To the left of the signal wiring 26 extending in the Y direction, and X
An active element 27 connected to the signal wiring 26 and the scanning wiring 25 is provided below the scanning wiring 25 extending in the direction.
And a pixel electrode 28 are provided. Also, T on the lower right side
On the FT substrate 22, the signal wiring 2 extended in the Y direction
The scanning wiring 25 on the left side of 6 and extending in the X direction
An active element 27 connected to the signal wiring 26 and the scanning wiring 25 and a pixel electrode 28 are provided on the upper side of the. In the upper left TFT substrate 24, the signal wiring 26 and the scanning wiring 25 are connected to the right side of the signal wiring 26 extending in the Y direction and below the scanning wiring 25 extending in the X direction. The active element 27 and the pixel electrode 28 are provided. In addition, the TFT substrate 23 on the lower left side
Then, on the right side of the signal wiring 26 extending in the Y direction,
The signal wiring 26, the active element 27 connected to the scanning wiring 25, and the pixel electrode 28 are provided above the scanning wiring 25 extending in the X direction.

Therefore, these TFT substrates 21, 22, 2
When cutting the connection sides of 3 and 24 by the dicing cutting method, a large chipping B is formed on the connection side for the reason described above.
Even if (chipping depth W is about 0.03 to 0.05 mm) occurs, the signal wiring 26, the scanning wiring 25, and the active element 27 are prevented from being destroyed by the same action as in the first embodiment. be able to. However, since there is chipping B having a maximum chipping depth W of 50 μm, in order to obtain the above effect, both the horizontal connection side and the vertical connection side are from the connection side of the TFT substrate to the pixel electrode. It is necessary to set the gap M to 50 μm or more.

Further, it is not necessary to optimize the dicing / cutting processing conditions to the ultimate, and the improvement of production efficiency is not hindered. Further, even if the chipping, which is extremely rare but large enough to reach the pixel electrode, occurs, only the pixel damaged by the chipping becomes a point defect defect.
It is possible to suppress the display defect to the minimum without causing the line defect defect due to the disconnection of the signal wiring as in the conventional case.

(Embodiment 3) FIG. 7 shows the structure of the liquid crystal display device of the present invention shown in Embodiment 3, FIG.
FIG. 7B shows a sectional view. In this liquid crystal display device, the left and right active matrix liquid crystal display panels 31 and 32 are attached to each other on the reinforcing substrate 33 so that their side surfaces are adjacent to each other with an adhesive 34 to form a large screen liquid crystal display device. TFT substrate 35 used for liquid crystal display panels 31, 32
Reference numerals a and 35b are scanning wirings (gate bus lines) 41 and signal wirings (source bus lines) 42 arranged in a matrix on a transparent substrate such as glass, and thin film transistors (TFTs) formed at matrix intersection points of these wirings.
An active element 43 having a (Thin Film Transistor) as a switching element and a pixel electrode 44 formed of a transparent conductive film such as ITO are formed by a known material and process. The gate electrode of the TFT is connected to the scanning wiring 41, the source electrode is connected to the signal wiring 42, and the drain electrode is connected to the pixel electrode 44. In addition, the counter substrate (CF
Substrates 37a and 37b are provided on a transparent substrate such as glass to prevent red (R) green (G) blue (B) color filters 45 provided for each pixel and light leakage between the pixels. Lattice-like light-shielding film (black matrix (BM)) 46, I
A common electrode formed of a transparent conductive film such as TO is formed by a known material and process.

Further, the TFT substrates 35a and 35b and the CF substrates 37a and 37b are attached by a seal 40. The seal is provided in the shape of a frame on the periphery of each of the liquid crystal display panels 31 and 32, and the liquid crystal layer 39 is enclosed in the frame seal. Polarizing plates 36a and 36b are provided on the light incident side and the light emitting side of the liquid crystal display device, and in the case of the normally white mode, the polarizing plate 36
The polarization axes of a and 36b are arranged so as to be orthogonal to each other.

FIG. 8 is an enlarged plan view showing the vicinity of the connecting portion between the left and right TFT substrates 35a and 35b which constitute the liquid crystal display device shown in FIG. Matrix-shaped scan wiring 41,
Signal wiring 42, active element 43 and pixel electrode 44
The positional relationship of is shown. As can be seen from the figure, the left and right TFT substrates 35a and 35b have different positional relationships between the matrix-shaped scanning wirings 41 and signal wirings 42, and the active elements 43 and the pixel electrodes 44. That is, they are line-symmetric with respect to the connection region N '. Specifically, on the TFT substrate 35b on the right side, the active element 43 and the pixel electrode 44 connected to the signal wiring 42 are provided on the left side of the signal wiring 42 extending in the Y direction. On the other hand, in the left TFT substrate 35a, the signal wiring 4 is provided on the right side of the signal wiring 42 extending in the Y direction.
An active element 43 and a pixel electrode 44 that are connected to the pixel 2 are provided. That is, the left and right TFT substrates 35a and 3a
In the vicinity of the connection side of 5b, not the signal line 42 but the pixel electrode 44 is adjacent.

The gap M ′ from the connection side of the TFT substrates 35a and 35b to the pixel electrode 44 was set to 150 μm. Therefore, when the connection area N ′ is 50 μm, TF
The gap between the pixel electrodes straddling the connection region of the T substrates 35a and 35b is (2M ′ + N ′) = 350 μm. By the way, in the liquid crystal display device of the present invention shown in FIG. 7, for example, a diagonal size of 40 inches and a resolution of 800 × 600 (SVGA).
In order to obtain the display of, the size of one pixel unit with three pixels of R, G and B as one unit is about 1000 μm × 1
000 μm. Therefore, as shown in FIG. 9, by providing the non-display area NU at a ratio of 350/1000 per pixel unit U, the connection portion of the TFT substrate can be accommodated in the non-display area. By providing such a non-display area in all the pixel units in the display area, the same pixel pitch as in the other portions can be realized in the connection area N ′ of the TFT substrates 35a and 35b, and the seams can be made inconspicuous. A display with no discomfort can be realized. In addition,
The non-display area is preferably covered with a black matrix (BM) provided on the CF substrate.

Further, the left and right liquid crystal display panels 31, 32
Are connected with the adhesive 34 in the connection region N ′, and the TFT substrate 3 is connected along the connection side of the TFT substrate.
A seal 40 for attaching the CF substrates 37a and 37b to the 5a and 35b is provided. The seal 40
Is a seal provided along the connection sides of the left and right TFT substrates in the frame-shaped seal pattern provided around each of the liquid crystal display panels 31 and 32. The seal 40 is formed as thin as possible in order to align the pixel pitch in the connection area with the pixel pitch in the other area to obtain display uniformity, and is made as close as possible to the pixel electrode 44 formed along the connection side. Need to be placed. For example, in the case of the design shown in FIG. 8, it is necessary to put the seal 40 within the gap M ′ (150 μm) from the connection side of the TFT substrate to the pixel electrode 44. Therefore, the seal 40
As the material of (1), it is necessary to use a photo-curing type sealing agent which causes little shape disorder during curing so as not to adversely affect display pixels adjacent to the seal 40 such as display defects. Specifically, an acrylic ultraviolet curing sealant is used.

Conventionally, since the matrix-shaped scanning wirings 91 and the signal wirings 92 have the positional relationship between the active element 93 and the pixel electrode 94 as shown in FIG. 16, the signal wirings along the seal 40 and the connection side are formed. 92 may overlap, and when the seal 40 is cured by light irradiation, light is blocked by the signal wiring 92, which causes the curing failure of the seal 40.

On the other hand, in the liquid crystal display device of the present invention,
As shown in FIG. 8, even if the seal 40 is arranged as close as possible to the pixel electrode 44 adjacent to the connection region N ′,
The signal wiring 42 and the seal 40 do not overlap. Therefore, even when the light for curing the seal is irradiated from the TFT substrate side, the light is not blocked by the signal wiring 42, and the seal 40 can be completely cured, and the display pixel adjacent to the seal 40 has a defective display. There is no adverse effect such as.

In this case, a diagonal size of 40 inches,
A specific example of a liquid crystal display device capable of obtaining a display with a resolution of 800 × 600 (SVGA) was shown, but the present invention is not limited to these sizes and resolutions.
As shown in, the left and right active matrix liquid crystal display panels can be widely applied regardless of their size as long as they are liquid crystal display devices that are made larger by adhering the side surfaces adjacent to each other with an adhesive. Is. Further, the same effect can be obtained even when an element other than the TFT element such as MIM is used as the active element.

(Embodiment 4) In the liquid crystal display device of the present invention shown in Embodiment 4, the active matrix liquid crystal display panels are arranged vertically and horizontally, and the side surfaces are adjacent to each other in the shape of a cross with an adhesive. A large-screen liquid crystal display device is formed by pasting. The structure is basically the same as that of the liquid crystal display device according to the third embodiment except that the number of connected liquid crystal display panels is different.

FIG. 10 is an enlarged plan view showing the vicinity of the connecting portions of the TFT substrates arranged vertically and horizontally. The positional relationship between the matrix-shaped scanning wirings, signal wirings, active elements and elementary electrodes is shown. As can be seen from the drawing, in the TFT substrates 47, 48, 49, 50 arranged vertically and horizontally, the positional relationship between the scanning wiring 41 and the signal wiring 42 in the matrix, the active element 43 and the pixel electrode 44 is different. That is, they are arranged line-symmetrically in the vertical and horizontal directions centering on the connection region N ′. Specifically, the upper right TFT
On the substrate 45, on the left side of the signal wiring 42 extending in the Y direction and below the scanning wiring 41 extending in the X direction, the signal wiring 42, the active element 43 connected to the scanning wiring 41, and The pixel electrode 44 is provided. In the lower right TFT substrate 48, the signal wiring 42 and the scanning wiring 41 are arranged on the left side of the signal wiring 42 extending in the Y direction and on the upper side of the scanning wiring 41 extending in the X direction.
An active element 43 and a pixel electrode 44 which are connected to the active element 43 are provided. In the lower left TFT substrate 50, the signal wiring 4 is provided on the right side of the signal wiring 42 extending in the Y direction and below the scanning wiring 41 extending in the X direction.
2. The active element 43 and the pixel electrode 44 connected to the scanning wiring 41 are provided. In the upper left TFT substrate 49, the signal wiring 42 and the scanning wiring 41 are connected to the right side of the signal wiring 42 extending in the Y direction and to the upper side of the scanning wiring 41 extending in the X direction. An active element 43 and a pixel electrode 44 are provided.

Therefore, these liquid crystal display panels are provided with a seal 40 along the connecting sides of the TFT substrates 47, 48, 49 and 50.
When the seal is provided, the seal 40 does not overlap with the signal wiring 42 or the scanning wiring 41 even if the seal 40 is brought close to the pixel electrode. Therefore, even if light is irradiated from the TFT substrate side to cure the seal 40, the signal wiring 42 and the scanning wiring 41
This allows the seal 40 to be completely cured without the light being blocked.

[0063]

(Effects of Embodiment 1) In the liquid crystal display device of the present invention, not the signal wiring but the pixel electrodes are adjacent to each other in the vicinity of the connection sides of the left and right TFT substrates constituting the liquid crystal display device. The wiring is designed. Therefore, when the connection sides of these TFT substrates are cut out by the dicing cutting method, even if chipping occurs on the connection sides, signal wiring and TF
It is possible to prevent the T element from being destroyed. Further, even if the chipping is large enough to reach the pixel wiring, only the pixel damaged by the chipping becomes a point defect defect, and a line defect defect due to a signal disconnection is generated as in the past. However, it is possible to suppress the display defect to the minimum.

(Effect of Embodiment 2) In the liquid crystal display device of the present invention, not the signal wiring or the scanning wiring but the pixel electrodes are adjacent in the vicinity of the connection sides of the upper, lower, left and right TFT substrates constituting the liquid crystal display device. The wiring is designed. Therefore, when the connection sides of these TFT substrates are cut out by the dicing cutting method, even if chipping occurs on the connection sides, it is possible to prevent the signal wiring, the scanning wiring, and the TFT element from being destroyed. Even if the chipping is large enough to reach the pixel electrode, only the pixel damaged by the chipping becomes a point defect defect, and a line defect defect due to a signal disconnection is generated as in the conventional case. However, it is possible to suppress the display defect to the minimum.

(Effect of Embodiment 3) In the liquid crystal display device of the present invention, not the signal wiring but the pixel is provided in the vicinity of the connection side of the TFT substrate of the left and right active matrix type liquid crystal display panels constituting the liquid crystal display device. The wiring is designed so that the electrodes are adjacent to each other. Therefore, even if the seal is arranged as close as possible to the pixel electrode adjacent to the connection side, T
Since the light emitted from the FT substrate side reaches the seal without being blocked, it is possible to completely cure the seal.

(Effect of Embodiment 4) In the liquid crystal display device of the present invention, the signal wiring and the scanning wiring are provided near the connection sides of the TFT substrate of the upper, lower, left and right active matrix type liquid crystal display panels constituting the liquid crystal display device. Instead, the wiring design is such that the pixel electrodes are adjacent. Therefore, even if the seal 40 is arranged as close as possible to the pixel electrode adjacent to the connection side, the light emitted from the TFT substrate reaches the seal 40 without being blocked, so that the seal 40 is completely cured. It is possible.

[Brief description of drawings]

FIG. 1 shows a configuration of a liquid crystal display device according to a first embodiment of the present invention, (a) is a plan view and (b) is a sectional view.

FIG. 2 is an enlarged plan view showing the vicinity of the connection region of the left and right TFT substrates that constitute the liquid crystal display device shown in FIG.

FIG. 3 is an enlarged plan view of the TFT substrate when the TFT substrates having chipping on the connection side are joined together in the enlarged plan view of FIG.

FIG. 4 is a pixel layout diagram of one pixel unit of the liquid crystal display device shown in FIG.

5A and 5B show a liquid crystal display device having a structure in which a seal is provided in a gap between a TFT substrate and a CF substrate of the liquid crystal display device shown in FIG. 1, FIG. 5A is a plan view, and FIG.

FIG. 6 is an enlarged plan view showing the vicinity of connection regions of the upper, lower, left and right TFT substrates of the liquid crystal display device according to the second embodiment of the present invention.

FIG. 7 shows a configuration of a liquid crystal display device according to a third embodiment of the present invention, (a) is a plan view and (b) is a sectional view.

8 is an enlarged plan view showing the vicinity of the connection region of the left and right TFT substrates that constitute the liquid crystal display device shown in FIG.

9 is a pixel layout diagram of one pixel unit of the liquid crystal display device shown in FIG. 7. FIG.

FIG. 10 is an enlarged plan view showing the vicinity of the connection regions of the upper, lower, left and right TFT substrates of the liquid crystal display device according to the fourth embodiment of the present invention.

FIG. 11 shows a configuration of a conventional liquid crystal display device, (a) is a plan view and (b) is a cross-sectional view.

12 is an enlarged plan view showing the vicinity of the connection region of the left and right TFT substrates of the liquid crystal display device shown in FIG.

FIG. 13 is a diagram showing fine chipping (chipping) that occurs at the edge of the cut surface when the TFT substrate is cut using a dicing device.

FIG. 14 is an enlarged plan view of the TFT substrate when the TFT substrates having chipping on the connection side are joined together.

FIG. 15 shows a configuration of a conventional liquid crystal display device, (a) is a plan view and (b) is a cross-sectional view.

16 is an enlarged plan view showing the vicinity of the connection region of the left and right TFT substrates of the liquid crystal display device shown in FIG.

[Explanation of symbols]

1, 2 Active matrix substrate (TFT substrate) 3 Counter substrate 4 Liquid crystal layer 5 Scan wiring (gate bus line) 6 Signal wiring (source bus line) 7 Active element (TFT element) 8 pixel electrodes 9 color filters 10 Black Matrix (BM) 11 adhesive B chipping 12 seals 21, 22, 23, 24 TFT substrate 25 scanning wiring 26 signal wiring 27 Active element 28 pixel electrodes 31, 32 Active matrix liquid crystal display panel 33 Reinforcing board 34 Adhesive 35a, 35b TFT substrate 36a, 36b Polarizing plate 37a, 37b Counter substrate 39 Liquid crystal layer 40 seals 41 Scan wiring 42 signal wiring 43 Active element 44 pixel electrode 45 color filter 46 Black Matrix (BM) 47, 48, 49, 50 TFT substrate

Continued front page    F term (reference) 2H089 HA33 HA40 JA10 LA41 NA44                       TA01 TA02 TA09 TA12                 2H091 FA02Y FD02 GA01 GA02                       GA09 GA13                 2H092 JB22 JB31 JB54 NA29 PA01                       PA04 PA08

Claims (5)

[Claims] 1. An active matrix substrate, in which signal wirings and scanning wirings are arranged orthogonally, and active elements and pixel electrodes are formed in the vicinity of respective intersections of the signal wirings and scanning wirings. Of the large substrate, and the one large substrate and a counter substrate with electrodes of substantially the same size are bonded to each other with a liquid crystal layer interposed therebetween. A color filter composed of three colors is formed, and a pixel unit having adjacent three color pixels and a non-display area as one unit is configured, and the width of the non-display area is closer to each connection area side of the active matrix substrate. A liquid crystal display device, wherein the distance between the formed pixel electrodes is substantially equal. 2. Of the signal wiring and the pixel electrode formed along the connection side on the active matrix substrate forming the one large substrate, the pixel electrode is formed on the connection region side. 2. The liquid crystal display device according to claim 1, wherein, of the scanning line and the pixel electrode, the pixel electrode is formed on the side of the connection region. 3. An active matrix substrate in which signal wirings and scanning wirings are arranged orthogonally and active elements and pixel electrodes are formed in the vicinity of respective intersections of the signal wirings and scanning wirings, and substantially the same as the active matrix substrate. A liquid crystal display device comprising a plurality of liquid crystal display panels that are bonded together with an electrode-equipped counter substrate with a liquid crystal layer interposed therebetween, and are formed by adjoining side surfaces of a plurality of liquid crystal display panels. Color filters of three different colors are formed on the substrate, pixels of adjacent three colors and a pixel unit having a non-display area as one unit are configured, and the width of the non-display area is equal to that of the liquid crystal display panel. A liquid crystal display device, wherein the distance between the pixel electrodes formed on each connection region side is substantially equal. 4. Of the signal wiring and the pixel electrode formed along the connection side on the active matrix substrate forming the liquid crystal display panel, the pixel electrode is formed on the connection region side. 4. The liquid crystal display device according to claim 3, wherein, of the scanning line and the pixel electrode, the pixel electrode is formed on the connection region side. 5. A sealant for sealing the liquid crystal layer between the active matrix substrate and a counter substrate is provided on the active matrix substrate along a connection side of the liquid crystal display panel, and the connection side is further provided. The liquid crystal display device according to claim 3, wherein the sealant provided along the line is provided so as not to overlap the signal line and the operation line.