JP2003203945A - Wiring base board and indication device utilizing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To permit highly reliable electrical connection between a wiring base board and a drive IC 6a, by preventing the corrosion of a terminal 9a due to moisture infiltrate from the peripheral rim of an ACF 14. <P>SOLUTION: The terminal 9a on the wiring base board is provided with an opening unit 15 formed on an insulation layer. The shape of the plane of the opening unit 15 is a pentagon, having a chamfer 100 beveled at a corner. When the ACF (amorphous conductive film) 14 is heated via the drive IC 6a, a peripheral rim 141 of a thermosetting region near the corner 61 of the drive IC 6a becomes an arced shape. The size of the opening unit 15 is set so that a distance M, from the peripheral rim 141 of the thermosetting area to the chamfer 100 of the opening unit 15, is longer than a distance L from the other side 101 of the opening unit 15 to the peripheral rim 141 of the thermosetting region. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a wiring board that can be used for a display panel or the like. The present invention also relates to a display device in which a display panel such as a liquid crystal display panel or an organic EL (Electoro Luminescence) panel and a driving IC (integrated circuit) for driving the display panel are electrically connected.

[0002]

2. Description of the Related Art A liquid crystal display device will be described as a conventional display device. In a liquid crystal display device, a liquid crystal panel in which a liquid crystal layer is sandwiched between a pair of substrates is mounted on a driving integrated circuit substrate (hereinafter referred to as "driving IC"). Will be implemented). Conventionally, as this mounting structure, TCP (Tape Carrier Packag
Although the structure using e) is generally known, in recent years,
From the viewpoints of low cost, high reliability, thinness, etc., drive ICs
COG (Chip On Gl
The ass) method is also becoming popular.

Among them, a connecting method is generally used in which bumps are formed on the electrodes of the driving IC to form a face-down bonding connection between the liquid crystal panel and the driving IC.
The face-down bonding connection is a drive I
It refers to mounting the driving IC directly on the substrate with the electrode C facing the substrate.

In a liquid crystal display device adopting the COG method, a wiring for supplying a data signal and a scanning signal to a display portion is provided in an area of a liquid crystal panel to which a driving IC is connected, and an output connected to the wiring. Bonding pads,
An input wiring for inputting signals and power to the driving IC, an input bonding pad connected to the input wiring, and a flexible printed circuit board (hereinafter referred to as “FPC”) input terminal connected to the input wiring are provided. It is formed. As a result, the FPC for connecting to an external circuit is connected to the liquid crystal panel via the FPC input terminal, and signals and power are supplied from the external circuit to the input wiring.

As a connecting means of the COG system, a driving I
A method of forming a bonding bump electrode with solder on C and melting and connecting the solder, or a method of forming a bonding bump electrode with a metal such as Au and conducting with a conductive paste or in an insulating adhesive. There is known a method of connecting with an anisotropic conductive adhesive in which functional particles are diffused and mixed.

Particularly, according to the connection method using this anisotropic conductive adhesive, the conductive particles in the anisotropic conductive adhesive are adhered to the bonding bump electrodes provided on the driving IC and the liquid crystal panel. By being sandwiched between the provided input and output bonding pads, conduction is established between the driving IC and the liquid crystal panel. Therefore, the connection pitch depends only on the size of the bump electrodes of the driving IC, and the insulating adhesive is filled between the electrodes, so that sufficient insulation can be easily ensured between the electrodes. It has advantages such as being able to do so. Due to these advantages, the connection method using the anisotropic conductive adhesive has become the mainstream in the COG method.

Among the anisotropic conductive adhesives, especially A
A conventional liquid crystal display device in which a liquid crystal panel and a driving IC are connected by face-down bonding using an anisotropic conductive film called CF (Anisotoropic Conductive Film) will be described. Such a liquid crystal display device is disclosed, for example, in Japanese Patent Laid-Open No. 9-26586.

FIG. 5 is a schematic plan view of a conventional liquid crystal display device, and FIG. 6 is a schematic plan view of a liquid crystal panel to which a driving IC and an FPC are not connected. In the area 2 of the liquid crystal panel 21 to which the driving IC 6 is connected, the wiring 4 for supplying the data signal and the scanning signal to the display unit 3, the output bonding pad 8 connected to the wiring 4, and the driving IC 6 are connected. Input wiring 5 for inputting signals and power
And the input bonding pad 9 connected to the input wiring 5.
And the FPC input terminal 10 connected to the input wiring 5 is formed. As a result, via the FPC input terminal 10,
The FPC 7 for connection with an external circuit (not shown) is connected to the liquid crystal panel, and the input wiring 5 is connected from the external circuit (not shown).
Signal and power are supplied to.

FIG. 7 is an enlarged view of a portion surrounded by B shown in FIG. 5, and FIG. 8 is a sectional view taken along line VIII-VIII of FIG. Output and input bonding pads 8 and 9, FPC
The input terminals (not shown) and the output and input wirings 4 and 5 are formed of the same conductor as the panel electrode wiring formed in the display section 3.

These connection processes are as follows.
First, on the output and input bonding pads 8 and 9,
The ACF 14 and the driving IC 6 are sequentially arranged, and the driving I
The tool head is brought into contact with the back surface of C6 (the side surface opposite to the surface on which the bump electrodes 13 are formed). This tool is provided with a pressurizing mechanism for applying pressure in the direction of the liquid crystal panel 1, and a heating mechanism for heating the insulating adhesive in the ACF 14 via the abutting drive IC 6. IC for driving the tool head
The bump electrodes 13 of the driving IC 6 and the output and input bonding pads 8 and 9 are electrically connected to each other by pressing them against the back surface of the driving IC 6 and thermocompression bonding. At this time, the bump electrodes 13 and the output / input bonding pads 8 and 9 are electrically connected by sandwiching the conductive particles in the ACF 14 therebetween. The ACF 14 has a planar shape that surrounds the peripheral edge of the driving IC 6.

By heating, the insulative adhesive in the ACF 14 is thermoset, and the thermoset region 141 is formed. The thermosetting region 141 is formed so as to surround the peripheral edge of the driving IC 6. At this time, the heat applied to the ACF 14 by the tool is indirectly transmitted through the driving IC 6, so that the heat is not evenly transmitted and the corner portion of the driving IC 6 has poor heat conduction. Therefore, the ACF 14 surrounding the periphery of the driving IC 6
In the vicinity of the corner portion of the driving IC 6, the uncured region increases, and the peripheral edge of the thermosetting region 141 becomes a substantially arc shape. As a result, the shortest distance R from the substantially arc-shaped peripheral edge of the thermosetting region 141 to the input bonding pad 9 is obtained.
Is shorter than the shortest distance P from the peripheral edge other than the substantially arcuate peripheral edge to the input bonding pad 9.

Since the output and input wirings 4 and 5 are exposed, the resin mold 17 prevents corrosion of the exposed portions. In a transmissive liquid crystal display device,
The ACF 14 also plays the role of a light-shielding film that prevents malfunction of the driving IC 6 due to photoelectromotive force.

[0013]

As described above, in the COG method, when the ACF 14 is heat-cured by the tool, the shortest distance R from the substantially arc-shaped peripheral edge in the heat-cured region 141 to the input bonding pad 9 is substantially a circle. It is shorter than the shortest distance P from the peripheral edge other than the arcuate peripheral edge to the input bonding pad 9. Therefore, in the vicinity of the corner of the ACF 14, there is a problem that the output and input bonding pads 8 and 9 and the output and the input wirings 4 and 5 cannot have sufficient corrosion resistance as compared with the portions other than the corner of the ACF 14. . As a countermeasure against this, in order to sufficiently heat the ACF 14 near the corner of the driving IC 6, it is conceivable to raise the heating temperature by the tool. However, in this case, the driving IC 6 is excessively heated, resulting in element destruction. Alternatively, since the thermal expansion strain between the driving IC 6 and the glass substrate becomes large, the connection reliability between the output / input bonding pads 8 and 9 and the bump electrode 13 may be deteriorated.

An object of the present invention is to provide a display in which terminals provided on a wiring board and bump electrodes provided on a driving circuit board such as a driving IC are connected via an adhesive layer such as ACF. In the device, it is to ensure the connection reliability between the terminal and the bump electrode.

[0015]

A wiring board according to the present invention comprises a plurality of electrodes, a plurality of output wirings for outputting signals to the plurality of electrodes, and a plurality of output terminals respectively connected to the plurality of output wirings. A wiring board having a polygonal driving circuit board for outputting a signal to the plurality of output terminals, and a plurality of input terminals for inputting a signal to the driving circuit board, wherein the plurality of output terminals and The plurality of input terminals,
The adhesive layer is connected to the driving circuit board having a conductive layer in which insulating layers having a polygonal opening are laminated, and a plurality of bump electrodes corresponding to the conductive layers are provided through an adhesive layer. Is a polygonal adhesive layer having a size including the region of the drive circuit board and having conductive particles dispersed therein, and being cured by heating through the drive circuit board, the output terminal And / or among the input terminals, the opening of the terminal in the vicinity of the corner of the driving circuit board has a notched side in which the corner in the vicinity of the corner of the driving circuit board is notched, The cured region of the adhesive layer after heating the adhesive layer includes at least the formation region of the opening portion, and the cutting of the opening portion from the peripheral edge of the cured region in the vicinity of the corner of the driving circuit board. The distance to the missing side Is distance or more from one side than the notch edge of the opening to the periphery of said curing zone.

The term "polygon" includes squares such as squares, diamonds, and rectangles, and includes not only the case where the sides intersect with each other at an obtuse angle or an acute angle, but also the case where the sides are rounded.

The display device of the present invention comprises the wiring board of the present invention, a counter electrode facing the wiring board, a plurality of electrodes formed on the wiring board, and a display medium layer interposed between the counter electrodes. Have. The display medium layer includes not only a light modulation layer such as a liquid crystal layer that can change the transmittance of incident external light, but also a layer made of an organic EL material that itself emits light.

[0018]

DETAILED DESCRIPTION OF THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In the following embodiments, an active matrix wiring substrate in which thin film transistors (TFTs) connected to signal lines and scanning lines are provided in a matrix as a wiring substrate will be described as an example. The wiring board is MIM (Me
A two-terminal element such as a tal insulator (metal insulator) can be applied to the wiring board formed on the board. The display device of the present invention can also be applied to a simple matrix drive display device in which electrodes provided on each of a pair of substrates sandwiching a light modulation layer intersect with each other.

FIG. 1 is a plan view schematically showing a liquid crystal panel 1 using the active matrix wiring substrate of this embodiment. The liquid crystal panel 1 has an active matrix wiring substrate, a counter substrate described later, and a liquid crystal layer. The active matrix wiring substrate has a connection region 2 and a display region 3 formed on an insulating substrate. In the display region 3 of the active matrix wiring substrate, a plurality of scanning lines (gate bus lines) parallel to each other and a plurality of signal lines (source bus lines) intersecting the scanning lines and parallel to each other are provided. A plurality of TFTs are formed near the intersections of the scanning wirings and the signal wirings. Further, in the display area 3, pixel electrodes connected to signal lines via TFTs are formed in a matrix.

The counter substrate 20 facing the active matrix wiring substrate is attached to the active matrix wiring substrate via a sealing material. The counter substrate 20 has red,
A color filter layer in which green and blue colors are arranged in stripes and a common electrode are stacked. Furthermore, between the active matrix wiring substrate and the counter substrate 20,
A liquid crystal material is injected to form a liquid crystal layer.

The light transmittance of the liquid crystal layer interposed between the active matrix wiring substrate and the counter substrate 20 can be modulated for each picture element region by the following operation. The pixel electrodes in the display region 3 of the active matrix wiring substrate are connected to the signal wiring (including the source electrode) to which the data signal (signal voltage) is applied via the semiconductor layer. A channel region in the semiconductor layer between the signal wiring and the pixel electrode is controlled to be opened / closed by a scanning signal supplied from the scanning wiring (including the gate electrode). The channel region of the TFT is turned on by the scanning signal, and the signal voltage is applied to the pixel electrode. An electric field is generated between the pixel electrode to which the signal voltage is applied and the common electrode, whereby the alignment of the liquid crystal molecules in the liquid crystal layer is changed and the light transmittance of the liquid crystal layer is modulated.

A signal wiring 4a for outputting a data signal to a source electrode (not shown) extends below the display area 3 (see FIG. 1) of the connection area 2 of the active matrix wiring board. A source output terminal 8a connected to 4a is formed. On the right side of the display area 3 (see FIG. 1), a scanning wiring 4b for outputting a scanning signal to a gate electrode (not shown) extends, and a gate output terminal 8b connected to the scanning wiring 4b is formed. ing.

A plurality of source input terminals 9a are provided near the source output terminal 8a, and similarly, a plurality of gate input terminals 9b are provided near the gate output terminal 8b. Source input terminal 9a and gate input terminal 9b
From this, electric power and control signals are input to the driving IC described later, and the signals output to the source output terminal 8a and the gate output terminal 8b are controlled by the circuit in the driving IC.

A plurality of FPC input terminals 10 are provided at the lower end of the active matrix wiring board, and each FPC input terminal 10 is connected to a source input terminal 9a and a gate input terminal 9b.
a and the gate input wiring 5b.

A driving IC and an FPC are connected to the active matrix wiring substrate of this embodiment. Figure 2
FIG. 3 is a plan view schematically showing the liquid crystal panel 1 in a state where a driving IC and an FPC are connected. The driving IC is a semiconductor integrated circuit substrate such as a silicon chip on which a circuit for driving the source electrode or the gate electrode is formed, and the source output terminal 8a (or the gate output terminal 8b) is provided on one surface of the driving IC. ) And source input terminal 9a
A plurality of bump electrodes (not shown) that are in contact with (or the gate input terminal 9b) are provided. In this embodiment, the source electrode driving IC 6a is provided below the display region 3, and the gate electrode driving IC 6 is provided on the right side of the display region 3.
b is provided. Each of the ICs 6a and 6b for driving the source electrode and the gate electrode has a rectangular planar shape.

The bump electrodes of the driving ICs 6a and 6b are electrically connected to the output terminals 8a and 8b and the input terminals 9a and 9b through the anisotropic conductive film (ACF) 14. AC
F14 is a rectangular sheet in which plastic particles having a gold-plated surface and a curing agent are dispersed in an epoxy resin, and has a size including a region where a driving IC is arranged. Bump electrodes and output terminals 8a, 8
The tool head is brought into contact with the back surface (side surface opposite to the surface on which the bump electrodes 13 are formed) of the driving IC 6 with the ACF interposed between the input terminal 9b and the input terminals 9a and 9b. This tool is provided with a pressurizing mechanism for applying pressure in the direction of the liquid crystal panel 1, and a heating mechanism for heating the insulating adhesive in the ACF 14 via the abutting drive IC 6. The insulating adhesive in the ACF 14 is hardened by pressing the tool head against the back surface of the driving IC 6 and thermocompression bonding. Also,
The conductive particles in the ACF 14 interposed between the bump electrode 13 of the driving IC 6 and the output / input bonding pads 8 and 9 are agglomerated and partially crushed, so that the bump electrode 13 and the output / input are input. Electrical connection with the bonding pads 8 and 9 is achieved. The insulating adhesive in the ACF is thermally cured by heating, and the output terminal 8
The connection between a and 8b and the input terminals 9a and 9b becomes strong.
The periphery of the cured region, that is, the boundary between the cured region and the uncured region can be confirmed by, for example, a microscope.

In the present embodiment, the insulating adhesive in the ACF 14 is not limited to the thermosetting resin, but may be a thermoplastic resin in which the curing agent is dispersed.

An FPC 7 connected to an external circuit (not shown) for supplying signals and power is connected to the FPC input terminal 10 of the active matrix wiring board. F
Circuit wiring is provided on one surface of the PC 7, and the electrode where a part of the circuit wiring is exposed and the FPC input terminal 10 are electrically connected via the ACF. As a result, signals and power are supplied from the external circuit to the source input wiring 5a and the gate input wiring 5b via the FPC 7.

Next, the structure of the terminal 9a will be described by taking the source input terminal 9a as an example, but the source output terminal 8a, the gate output terminal 8b and the gate input terminal 9b may have the same structure. FIG. 3 shows the liquid crystal panel 1 shown in FIG.
4 is an enlarged view of a portion surrounded by A in FIG. 4, and FIG. 4 is a sectional view taken along line IV-IV of FIG. 3. The input terminal 9a is made of tantalum (Ta) or aluminum (A) formed on an insulating substrate.
1) and the like, and an insulating layer 12 made of silicon nitride or the like for covering the conductive layer 11. The insulating layer 1
2 is formed in a region on the substrate other than the region of the input terminal 9a.

The insulating layer 12 has an opening 1 of a predetermined size.
5 is provided, and the conductive layer 11 exposed by the opening 15 is covered with a metal layer 16 made of ITO (Indium Tin Oxide) or aluminum (Al) having an island pattern. The planar shape of the opening 15 is a pentagonal shape having a cutout side 100 in which a corner is cut out near the corner 61 of the driving IC 6. The conductive layer 11 of the input terminal 9a is electrically connected to the source input wiring 5a, and usually can be formed of the same film as the source input wiring 5a. In addition, the metal layer 16 that covers the exposed conductive layer 11
Also has a planar shape that is substantially similar to the opening 15, and the planar shape of the metal layer 16 is a pentagonal shape having a notched side 200 with a corner cut out. As a result, the metal layer 16 is electrically connected to the source input wiring 5a via the conductive layer 11.

The exposed conductive layer 11 is replaced with ITO or Al.
The reason for covering with the metal layer 16 made of, for example, is to ensure connection with the bump electrode using ACF. Specifically, when Ta is used for the conductive layer 11, an oxide film is formed on the surface thereof. Since the oxide film of Ta is strong, A
The particles in CF may not be able to break through the oxide film and electrical conduction may not occur. On the other hand, ITO is a stable conductive film that does not cause surface oxidation. Further, although Al is surface-oxidized, its oxide film is soft, so AC
The particles in F can be easily broken through, and electrical conduction can be achieved. Therefore, as the uppermost conductive film, I
By covering the conductive layer 11 made of Ta or the like with the metal layer 16 made of TO or Al, the connection with the bump electrode via the ACF is surely made.

The ACF 14 of this embodiment is a driving IC 6
It has a size including the region where a is arranged. In other words, it has a size that surrounds the periphery of the driving IC 6a. One ACF 14 may have a size that surrounds the periphery of one driving IC 6a, or may have a size that surrounds the periphery of a plurality of driving ICs 6a and 6b.

In this embodiment, the opening 1 of the input terminal 9a is formed.
5 is a plurality of bump electrodes 1 provided on the driving IC 6a
3 has such a size that it abuts the metal layer 16 in the opening 15. The size of the opening 15 is set so that the plurality of bump electrodes 13 come into contact with each other, so that the driving ICs in which the intervals of the bump electrodes are different and the distances between the bump electrode groups including the plurality of bump electrodes are different. It is not necessary to change the positions of the output and input terminals 8a and 9a even when connecting the IC for use with the active matrix wiring substrate.
Therefore, it is not necessary to design a new active matrix wiring substrate, and the manufacturing cost can be reduced by reducing the member cost.

Further, since the plurality of bump electrodes 13 of the driving IC 6a can be brought into contact with the conductive layer 11 in each opening 15 of the output and input terminals 8a and 9a, the bump electrode 13 and the conductive layer 11 can be separated from each other. The connection resistance of can be reduced. In particular, the bump electrode 13 in contact with the input terminal 9a
Is required to be supplied with power and to have low resistance, it is preferable to dispose a plurality of bump electrodes 13 in the opening 15 of the input terminal 9a as shown in FIG.

The active matrix wiring substrate of this embodiment can be manufactured, for example, by the following method.
The description of the manufacturing process of the TFT formed in the display region 3 is omitted. First, a conductive metal film (thickness: 500 nm) such as tantalum (Ta) or aluminum (Al) is formed on an insulating substrate by sputtering or the like. By patterning the conductive metal film, each wiring 4a, 4b, 5
A conductive layer 11 of a, 5b and terminals 8a, 8b, 9a, 9b is formed. On the entire surface of the insulating substrate, the insulating film 12 (thickness 30
0 nm) is formed. The insulating film 12 in the region of the opening 15 formed in each terminal 8a, 8b, 9a, 9b is removed by etching. After forming a metal film (film thickness: 150 nm) made of ITO, aluminum (Al), or the like on the entire surface of the insulating substrate, the metal film other than the region of the opening 15 is removed, and the conductive layer 11 in the opening 15 is formed. A metal layer 16 is formed on top.

Next, a process of mounting the driving IC on the active matrix wiring substrate of this embodiment will be described. Prior to mounting the driving IC, a counter substrate is bonded to the display area 3 of the active matrix wiring substrate, and a liquid crystal material is injected between both substrates to form a liquid crystal panel.

First, A is placed on the terminals 8a, 8b, 9a, 9b.
CF14 is arranged, and drive IC6 is further mounted on ACF14.
Superimpose a and 6b. The alignment marks provided in advance are automatically aligned by the image processing device to align the terminals 8a, 8b, 9a, 9b with the driving ICs 6a, 6b. At this time, the terminals 8a, 8b,
Alignment is performed so that the plurality of bump electrodes 13 (group of bump electrodes 13) provided in each of the driving ICs 6a and 6b are located in the region of the opening 15 provided in 9a and 9b.

The source and gate input terminals 9a and 9b are 300 μm × 310 μm, and the opening 15 has a long side (103 in FIG. 3) of 300 μm and a short side (102 in FIG. 3).
Is 140 μm, the long side (101 in FIG. 3) connected to the cutout side 100 is 250 μm, and the short side (104 in FIG. 3) connected to the cutout side 100 is 90 μm. Further, the metal layer 16 of each terminal 8a, 8b, 9a, 9b has a similar shape to each opening 15, for example, the metal layer 16 of the source input terminal 9a has a pentagonal shape in which the opening 15 is enlarged by 10 μm. .

The bump electrodes 13 provided on the driving ICs 6a and 6b have bump electrodes 13 of 120 μm × 50 μm which come into contact with the source and gate input terminals 9a and 9b, and bumps which come into contact with the source and gate output terminals 8a and 8b. The electrode 13 is 40 μm × 80 μm.

In this embodiment, gold (A
Although the polygonal bump electrode 13 made of u) is used, the material of the bump electrode 13 is not particularly limited as long as it is a conductive material. The shape of the bump electrode 13 is not limited to the polygonal column shape, and may be a spherical shape, a hemispherical shape, a cylindrical shape, an elliptic shape, a conical shape, or the like, and the connection with the metal layer 16 of the terminals 8a, 8b, 9a, 9b. Any shape is acceptable as long as it has a surface.

Next, a tool made of a SUS (stainless steel) material heated to 180 ° C. is pressed against the back surfaces of the driving ICs 6a and 6b to pressurize the ACF 14, and at the same time, to the ACF 14 via the driving ICs 6a and 6b. Transfer heat to. As a result, each bump electrode 13 and each terminal 8a, 8
The drive ICs 6a and 6b are fixed to the connection region 2 of the active matrix wiring substrate 1 while the electrical connection with the b, 9a and 9b is achieved.

When the driving ICs 6a and 6b are rectangular in shape, the heat from the tool is difficult to be transferred to the corner portions 61 of the driving ICs 6a and 6b, and the peripheral edge 141 of the heat-cured area of the ACF 14 is the driving IC 6a. , 6b does not accurately reflect the shape of the drive ICs 6a, 6b.
The peripheral edge of the hardened region near the corner 61 of b has an arc shape.

In this embodiment, from the peripheral edge 141 of the hardening region near the corners of the driving ICs 6a, 6b to the opening 15
The distance M to the cutout side 100 is set to be equal to or more than the distance L from one side (for example, 101) other than the cutout side 100 of the opening 15 to the peripheral edge 141 of the hardening region. Similarly, the distance S from the peripheral edge 141 of the hardening region in the vicinity of the corners of the driving ICs 6a and 6b to the cutout side 200 of the metal layer 16 is set from one side other than the cutout side 200 of the metal layer 16 (for example, 201). The distance T to the peripheral edge 141 of the area is set to be not less than T. The distances L and S from the peripheral edge 141 of the hardened region to the opening 15 or the metal layer 16 can be obtained empirically or experimentally, so that the distances M and T are equal to or longer than the distances L and S. The size and shape of the opening 15 and the metal layer 16 are set.

By setting the distance M to a distance L or more or the distance S to a distance T or more, the driving ICs 6a and 6b, the terminals 8a, 8b, 9a and 9b and the ACF 14 in the thermosetting region inside the peripheral edge 141 are set. It becomes difficult for moisture in the air to invade from the connection interface with. Therefore, the metal film 16 and the terminals 8a,
It is possible to prevent the corrosion of 8b, 9a and 9b and the occurrence of defective connection between the bump electrode 13 of the driving ICs 6a and 6b and the metal film 16. In the present embodiment, the pentagonal metal layer 16 having the notched side 200 in the plan view is provided, but even if the metal layer 16 is not provided, the distance M is set to be equal to or greater than the distance L, so that the terminal 8a, 8
b, 9a, 9b and bump electrodes 1 of the driving ICs 6a, 6b
It is possible to prevent the connection failure with 3.

Similarly, by interposing the ACF 14 between the FPC input terminal 10 and the FPC 7, and heating the ACF 14 with a tool, the FPC input terminal 10 and the FPC 7 are connected. Through the above steps, the driving ICs 6a and 6b and the FPC 7 are connected to the liquid crystal panel of this embodiment to form a liquid crystal display device.

[0046]

According to the wiring board of the present invention, it is possible to prevent the corrosion of the input and output terminals due to the water entering from the peripheral edge of the adhesive layer such as ACF. Therefore, a highly reliable electrical connection between the wiring board and the driving IC becomes possible.

[Brief description of drawings]

FIG. 1 is a plan view schematically showing a liquid crystal panel 1 of an embodiment.

FIG. 2 is a plan view schematically showing the liquid crystal panel 1 in a state where a driving IC and an FPC are connected.

FIG. 3 is an enlarged view of a portion surrounded by A shown in FIG.

4 is a sectional view taken along line IV-IV in FIG.

FIG. 5 is a schematic plan view of a conventional liquid crystal panel 21.

FIG. 6 is a schematic plan view of a liquid crystal panel to which a driving IC and an FPC are not connected.

FIG. 7 is an enlarged view of a portion surrounded by B shown in FIG.

8 is a sectional view taken along line VIII-VIII of FIG.

[Explanation of symbols]

1 liquid crystal panel 2 connection area 3 display area 4a signal wiring 4b scanning wiring 5a source input wiring 5b gate input wiring 6a source electrode driving IC 6b gate electrode driving IC 7 FPC 8a source output terminal 8b gate output terminal 9a source input terminal 9b Gate input terminal 10 FPC input terminal 11 Conductive layer 12 Insulating layer 13 Bump electrode 14 ACF (anisotropic conductive film) 15 Opening 16 Metal layer 17 Resin mold 100 Cutout side 141 of opening Opening edge of hardened area 200 Metal layer Notch side M Distance from the edge of the hardened area to the notch side of the opening L Distance from one side 101 of the opening to the edge of the hardened area T Distance from the edge of the hardened area to the notch side of the metal layer S Metal layer From side 201 to the edge of the cured area

Claims (2)

[Claims] 1. A plurality of electrodes, a plurality of output wirings for outputting a signal to the plurality of electrodes, a plurality of output terminals respectively connected to the plurality of output wirings, and a signal output to the plurality of output terminals. And a plurality of input terminals for inputting signals to the driving circuit board, wherein the plurality of output terminals and the plurality of input terminals have a polygonal opening. And a driving circuit board provided with a plurality of bump electrodes corresponding to each of the insulating layers, and the driving circuit board having a plurality of bump electrodes corresponding thereto are connected via an adhesive layer. Is a polygonal adhesive layer having a size including the area of the circuit board for use and in which conductive particles are dispersed, which is cured by heating through the drive circuit board, and the output terminal and / or the Input terminal Then, the opening of the terminal in the vicinity of the corner of the driving circuit board has a notched side where the corner in the vicinity of the corner of the driving circuit board is cut out, and the adhesive layer is heated. The subsequent cured region of the adhesive layer includes at least the formation region of the opening, and the distance from the peripheral edge of the cured region in the vicinity of the corner of the drive circuit board to the cutout side of the opening, A wiring board having a distance from a side of the opening other than the cutout side to a peripheral edge of the cured region, which is equal to or greater than a distance. 2. A display comprising: the wiring substrate according to claim 1, a counter electrode facing the wiring substrate, a plurality of electrodes formed on the wiring substrate, and a display medium layer interposed between the counter electrodes. apparatus.