JP2003203821A - Method of manufacturing laminated ceramic electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a method of manufacturing a laminated ceramic electronic component, with which a highly reliable laminated ceramic electronic component can be obtained, even if the coating rate of ceramic slurry on a carrier film is raised, in order to reduce the film thickness of a ceramic green sheet. <P>SOLUTION: A carrier film 14 is drawn out from a carrier-film roll 12, is coated with a ceramic slurry 18 by a coater 16, dried by a dryer 20 and wound by a winder 26, to form a ceramic green sheet 22. After the carrier film is re-wound, inner electrode patterns are printed by a printer 24, and after drying, the film is wound by the winder 26. The wound carrier film 12 is unwound, and ceramic green sheets 22 are peeled off, laminated, and after cutting are fired. Then, outer electrodes are formed. In this manufacturing process, a film, in which R<SB>max</SB>of the coated surface layer of the ceramic slurry is 30% of or smaller than the ceramic-layer thickness and an antistatic layer is formed on the face opposite to it, is used for the carrier film 14. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a monolithic ceramic electronic component, and more particularly to a method for manufacturing a monolithic ceramic electronic component such as a monolithic ceramic capacitor, a monolithic inductor, and a monolithic LC filter.

[0002]

2. Description of the Related Art FIG. 1 is a conceptual diagram showing a process of manufacturing a monolithic ceramic electronic component such as a monolithic ceramic capacitor, which is described, for example, in Japanese Patent Application Laid-Open No. 5-92406. In the manufacturing apparatus 10, first, a carrier film roll 12 around which a carrier film made of synthetic resin or the like is wound is prepared. The carrier film 14 is pulled out from the carrier film roll 12, and the ceramic slurry 18 is applied onto the carrier film 14 by the applying device 16.

The carrier film 14 coated with the ceramic slurry 18 is sent to a drying device 20, where the ceramic slurry 18 is dried, and a winding device 26 is temporarily provided.
Wound up by. In this way, the ceramic green sheet 22 is formed on the carrier film 14. Next, the wound carrier film is rewound, and an internal electrode pattern to be an internal electrode of the laminated ceramic capacitor is printed on the ceramic green sheet 22 in the printing device 24. The carrier film 14 on which the internal electrode pattern is formed is dried by the drying device 25, and then wound again into a roll by the winding device 26. It should be noted that, after forming the ceramic green sheet on the carrier film 14, the internal electrode pattern may be continuously printed and dried without being wound, and then wound.

The wound carrier film 14 is then pulled out again, the ceramic green sheets 22 are cut into a suitable size, and a plurality of them are laminated. The laminated body in which the ceramic green sheets 22 are laminated is individually cut and fired to form a ceramic sintered body having internal electrodes. By forming an external electrode on the outer surface of this ceramic sintered body and connecting the internal electrode to the external electrode,
A monolithic ceramic capacitor is produced.

[0005]

In recent years, along with the miniaturization of electronic equipment, miniaturization of monolithic ceramic electronic components has been required, and for example, monolithic ceramic capacitors are also being miniaturized and increased in capacity. Therefore, the multilayered ceramic sintered body and the thinned ceramic layers constituting the ceramic sintered body are being advanced. However, a synthetic resin film used as a carrier film for forming a ceramic green sheet usually has unavoidable irregularities on its surface. Due to such unevenness, local depressions or pinholes may occur in the thinned ceramic green sheet. Therefore, in the finally obtained multilayer ceramic capacitor or the like, problems such as a short circuit between internal electrodes and a decrease in reliability occur. As described above, when the ceramic layer is made thin, it is easily affected by the irregularities on the surface of the carrier film.

Therefore, it is considered to suppress the unevenness of the carrier film surface as much as possible to reduce the influence of the unevenness. By the way, when a roll-formed carrier film was used as the carrier film for applying the ceramic slurry, the ceramic green sheet had local dents or pinholes even though the surface was smoothed. . Therefore, as a result of diligent studies by the present inventors, it was found that these are the effects of static electricity described below. In the carrier film roll, the contact area between the overlapping carrier films becomes large, and when the carrier film is pulled out, the carrier film is easily charged, and the unwinding charge amount generated at that time becomes large.
Further, since the contact area between the carrier film and the ceramic green sheet is large, the carrier film is easily charged when the ceramic green sheet is peeled from the carrier film, and the amount of peeling charge generated at this time is large. Due to the static electricity due to these electrifications, the amount of foreign matter mixed in the ceramic green sheet and the laminated body increases.

Further, when the static electricity due to charging is discharged, the ceramic green sheet and the release layer formed on the carrier film are deteriorated, and scratches and wrinkles are generated on the ceramic green sheet at the time of peeling. In particular, when the coating speed of the ceramic slurry is increased, the drawing speed of the carrier film is also increased, so that the unwinding charge amount is increased and the influence of static electricity as described above is increased.
As a result, the finally obtained monolithic ceramic capacitor has problems such as a short circuit between internal electrodes and a decrease in reliability.

When forming a thin ceramic green sheet for thinning the ceramic layer, it is possible to reduce variations in the thickness of the ceramic green sheet by increasing the coating speed of the ceramic slurry on the carrier film. it can. Further, since the productivity of the monolithic ceramic electronic component is also improved, increasing the coating speed of the ceramic slurry is a necessary technique.

Therefore, the main object of the present invention is to obtain a highly reliable laminated ceramic electronic component even if the coating speed of the ceramic slurry on the carrier film is increased in order to reduce the thickness of the ceramic green sheet. It is to provide a method of manufacturing a monolithic ceramic electronic component capable of manufacturing.

[0010]

The present invention comprises a step of drawing a carrier film from a carrier film roll,
A step of applying a ceramic slurry on one surface of a carrier film at a coating speed of 30 m / min or more, a step of drying the applied ceramic slurry to form a ceramic green sheet, and a step of forming an internal electrode pattern on the ceramic green sheet. And a step of obtaining a laminated body by laminating the ceramic green sheets on which the internal electrode patterns are formed, a step of individually cutting and firing the laminated body to obtain a ceramic sintered body, and an external surface of the ceramic sintered body. In a method for manufacturing a laminated ceramic electronic component including a step of forming electrodes, a carrier film having a maximum height R _max defined by JIS B0601 of a ceramic slurry coating surface is 30 times the thickness of a ceramic layer constituting a ceramic sintered body. % Or less, and a release layer is formed on the ceramic slurry coated surface. A method of manufacturing a monolithic ceramic electronic component, which comprises using a carrier film that is formed and has an antistatic layer formed on the surface opposite to the ceramic slurry application surface. In such a method for manufacturing a laminated ceramic electronic component, the antistatic layer is formed of, for example, an antistatic agent containing acryloyloxytrimethylammonium chloride as a main component. Further, the antistatic layer may be formed of an antistatic agent containing diallyldimethylammonium chloride as a main component. Furthermore, the thickness of the ceramic layer constituting the ceramic sintered body is 0.7.
It is preferable that it is not less than 2 μm and not less than μm, and the maximum height R _max defined by JISB0601 on the surface of the carrier film on which the ceramic slurry is applied is not more than 0.2 μm.

JISB06 on the surface coated with ceramic slurry
The maximum height R _max defined by 01 is defined as 3 of the thickness of the ceramic layer constituting the sintered body obtained by firing the ceramic laminated body.
When the content is 0% or less, when the ceramic slurry is applied and dried, the ceramic green sheet is less likely to have dents or pinholes. Further, by forming the antistatic layer on the surface of the carrier film opposite to the surface on which the ceramic slurry is applied, the unwinding charge amount and the peeling charge amount can be reduced, and the influence of charging can be reduced. As a material for such an antistatic layer,
An antistatic agent containing acryloyloxytrimethylammonium chloride as a main component or an antistatic agent containing diallyldimethylammonium chloride as a main component can be used. Further, when the thickness of the ceramic layer constituting the ceramic sintered body is 0.7 μm or more and 2 μm or less, J of the surface of the carrier film coated with the ceramic slurry is J.
The maximum height R _max defined by ISB0601 is 0.2μ
When the thickness is m or less, it is possible to suppress the occurrence of dents and pinholes in the ceramic green sheet.

The above-mentioned objects, other objects, features and advantages of the present invention will become more apparent from the following detailed description of the embodiments of the invention with reference to the drawings.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Here, a method for manufacturing a laminated ceramic capacitor will be described as an example of a laminated ceramic electronic component. The manufacturing method of the monolithic ceramic capacitor is not limited to this, but includes the steps described with reference to FIG. 1, and in particular, a carrier film having a characteristic is used. In this manufacturing process,
The coating speed of the ceramic slurry 18, that is, the drawing speed of the carrier film 14 from the carrier film roll 12 is set to be 30 m / min or more. With such a coating speed, it is possible to reduce variations in the thickness of the ceramic green sheet 22 even when the ceramic layer is thinned.

In this regard, the relationship between the coating speed and the variation in film thickness when the ceramic slurry 18 is applied onto the carrier film 14 so that the thickness of the ceramic layer constituting the ceramic sintered body is 2.0 μm. Is shown in FIG. As can be seen from FIG. 2, the ceramic slurry 18
When the coating speed of (3) was 30 m / min or more, the variation in film thickness was reduced.

In the manufacturing apparatus 10 shown in FIG. 1, for example, a carrier film 14 whose main component is polyester is used. Here, the polyester refers to a polyester in which 70% or more of the repeating structural units have ethylene terephthalate units, ethylene-2,6-naphthalate units, or 1,4-cyclohexanenaphthalate.

As such a carrier film 14,
JISB06 on the coated surface of the ceramic slurry 18
A material having a surface whose maximum height R _max defined by 01 is 30% or less of the thickness of the ceramic layer constituting the ceramic sintered body is used. By using the carrier film 14 having such a surface, the ceramic green sheet 22 is less likely to have dents or pinholes, and a multilayer ceramic capacitor having less problems such as short circuit of internal electrodes and deterioration of reliability is obtained. You can In particular, when the thickness of the ceramic layer constituting the ceramic sintered body is 0.7 μm or more and 2 μm or less, the one having R _max of 0.2 μm or less on the coated surface of the ceramic slurry 18 of the carrier film 14 is used. To be A release layer is formed on the surface of the carrier film 14 on which the ceramic slurry is applied. By forming the release layer, the ceramic green sheet 22 can be easily separated from the carrier film 14.

Further, an antistatic layer is formed on the carrier film 14 on the surface opposite to the ceramic slurry application surface. By forming the antistatic layer, the unwinding charge amount and the peeling charge amount can be reduced. Therefore, even when the ceramic slurry 18 is applied at a high speed of 30 m / min or more, the unwinding charge amount of the carrier film 14 can be reduced.

Therefore, by using such a carrier film 14, the carrier film 14 can be operated at high speed.
The ceramic slurry 18 can be applied on the top, and a thinned ceramic green sheet 22 with less variation in thickness can be obtained. In addition, it is possible to reduce the influence of static electricity and prevent the ceramic green sheet 22 from being damaged or wrinkled. Due to these effects, finally, it is possible to obtain a highly reliable multilayer ceramic capacitor without causing a short circuit of the internal electrodes.

[0019]

Example 1 A synthetic resin film containing polyester as a main component was prepared as a carrier film.
In this example, particles were contained in the synthetic resin film in order to evaluate by varying R _max , the unevenness of the surface of the carrier film. As such particles, inorganic particles, organic particles, precipitated particles generated during polyester polymerization, and the like can be used.

An antistatic layer was formed on the surface of the synthetic resin film opposite to the surface on which the ceramic slurry was applied. As the antistatic layer, an antistatic agent containing acryloyloxymethylammonium chloride having a molecular weight of 6000 was used.
The antistatic agent contains 95% by weight of acryloyloxymethylammonium chloride and 5% by weight of a polyvinyl alcohol-based binder having a degree of polymerization of 500 as solid ingredients. This antistatic agent was applied to a synthetic resin film to a thickness of 0.1 μm to form an antistatic layer.

On the surface of the thus obtained synthetic resin film to which the ceramic slurry is applied, the ceramic slurry containing barium titanate-based ceramic powder as a main raw material is mixed, and the average thickness of the ceramic layers constituting the ceramic sintered body is 3 It was applied so as to have a thickness of 0.0 μm and dried to form a ceramic green sheet. Ni paste was printed and dried on this ceramic green sheet. And Ni
While peeling the ceramic green sheet on which the paste was printed from the synthetic resin film, 100 sheets were laminated to obtain a laminated body. This laminated body was cut into individual chips and fired to form a ceramic sintered body, and external electrodes were formed to form a laminated ceramic capacitor.

The amount of peeling charge generated by peeling off the ceramic green sheet was measured at a temperature of 25 ° C. and a humidity of 50% R.
It was measured in an H 2 atmosphere. The peeling charge is measured by KASU
GADENKI INC. KSD0103 of. In addition, with respect to the obtained monolithic ceramic capacitor, short circuit failure of the internal electrode was evaluated. Short circuit failure is evaluated by HP-427 of Yokogawa Hewlett-Packard Co.
8A, temperature 25 ℃, humidity 50% RH, frequency 1
It was performed under the conditions of kHz and voltage of 0.5V. In this evaluation, the number of samples was 100. The evaluation results are shown in FIGS. 3 and 4.

FIG. 3 shows the relationship between R _{max on} the ceramic slurry coated surface of the synthetic resin film and the amount of peeling charge for the synthetic resin film having the antistatic layer and the synthetic resin film having no antistatic layer. It was As can be seen from FIG. 3, when a synthetic resin film without an antistatic layer is used, as R _max decreases, the contact area between the synthetic resin film and the ceramic green sheet increases, and the amount of peeling charge increases. . On the other hand, when the synthetic resin film having the antistatic layer is used, the peeling charge amount can be reduced.

Furthermore, the short-circuit defect rate, as can be seen from FIG. 4, when a synthetic resin film without an antistatic layer, can reduce the short-circuit defect rate by lowering R _max, R _max Even if it is lowered to 0.1 μm, the short circuit failure rate cannot be made 0%. On the other hand, when a synthetic resin film having an antistatic layer is used, it is possible to prevent the occurrence of short circuit defects when R _{max is} 0.9 μm or less. It is considered that this is because by forming the antistatic layer, the amount of charge of the synthetic resin film can be reduced and scratches and wrinkles of the ceramic green sheet caused by static electricity can be suppressed. As described above, when the synthetic resin film having the antistatic layer is used, the height of R _max is 30% or less, that is, the height of R _{max is} 0.9 μm or less with respect to the thickness of the ceramic layer after firing of 3 μm. Therefore, short circuit failure can be suppressed.

Example 2 An antistatic layer was formed on the side of the synthetic resin film opposite to the surface coated with the ceramic slurry by using an antistatic agent containing diallyldimethylammonium chloride. As the antistatic layer, an antistatic agent containing diallyldimethylammonium chloride having a molecular weight of 3000 was used. This antistatic agent comprises, as solid components, 90% by weight of diallyldimethylammonium chloride and 10% by weight of a polyvinyl alcohol-based binder having a degree of polymerization of 500.
It includes and. This antistatic agent was applied to a synthetic resin film to a thickness of 0.1 μm to form an antistatic layer.

The ceramic slurry containing the barium titanate-based ceramic powder as a main raw material was applied to the surface of the thus obtained synthetic resin film on which the ceramic slurry was applied, and dried to form a ceramic green sheet. Ni paste was printed and dried on this ceramic green sheet. Then, 100 sheets were laminated while separating the ceramic green sheet on which the Ni paste was printed from the synthetic resin film to obtain a laminated body. This laminated body was cut into individual chips and fired to form a ceramic sintered body, and external electrodes were formed to form a laminated ceramic capacitor.

In this example, a laminated ceramic capacitor was manufactured by setting the R _max of the ceramic resin coated surface of the synthetic resin film to 0.6 μm and changing the thickness of the ceramic layer after firing. The obtained monolithic ceramic capacitor was evaluated by conducting a high temperature load test. In a high temperature load test, at a temperature of 150 ° C, the ceramic thickness is 1 μm
The laminated ceramic capacitor was acceleratedly tested by applying 10 V per unit. Then, such a high temperature load test was performed for the case where a synthetic resin film having no antistatic layer was used and the case where a synthetic resin film having an antistatic layer was used, and the short-circuit failure rate after 100 hours was elapsed. The number of defective high temperature load tests was determined. 2 samples for high temperature load test
The number was set to 00 and the result is shown in FIG.

As can be seen from FIG. 5, when a synthetic resin film having no antistatic layer was used, when the R _{max on} the surface of the synthetic resin film was 0.6 μm, the number of defective high temperature load tests was 4 μm or more in the thickness of the ceramic layer. It will be 0%. On the other hand, when the synthetic resin film having the antistatic layer is used, the ceramic layer has a thickness of 2 μm or more, and no defect occurs in the high temperature load test.

Next, the R _max of the surface of the synthetic resin film was changed from 0.1 μm to 1.0 μm, and the thickness of the ceramic layer after firing was changed from 0.3 μm to 4.0 μm to obtain a laminated ceramic capacitor. It was made. Then, the obtained multilayer ceramic capacitors were evaluated for the number of defective high temperature load tests under the above-mentioned conditions. An antistatic layer was formed on the synthetic resin film by using an antistatic agent containing diallyldimethylammonium chloride as described above. The evaluation results are shown in FIG.

As can be seen from FIG. 6, when R _{max of the} synthetic resin film is 0.1 μm, the thickness of the ceramic layer is 0.5 μm.
The number of defectives in the high temperature load test becomes 0% at m or more. When R _{max of the} synthetic resin film is 0.2 μm, the number of defective high temperature load tests becomes 0% when the thickness of the ceramic layer is 0.7 μm or more. Similarly, when the R _max of the synthetic resin film is 0.3 μm, the thickness of the ceramic layer is 1.0 μm or more, and when the R _max of the synthetic resin film is 0.5 μm, the thickness of the ceramic layer is 1.8 μm.
When the synthetic resin film has an R _{max of} 0.6 μm, the ceramic layer has a thickness of 2.0 μm or more, and when the synthetic resin film has an R _{max of} 0.7 μm, the ceramic layer has a thickness of 2.5 μm.
From the above, it can be confirmed that when the R _max of the synthetic resin film is 1.0 μm, the number of defects in the high temperature load test becomes 0% when the thickness of the ceramic layer is 3.5 μm or more.

As can be seen from the above results, the R _{max of the} synthetic resin film is different from the thickness of the ceramic layer after firing.
By setting the height to 30% or less, it is possible to suppress the occurrence of a high temperature load test failure. Further, when the thickness of the ceramic layer after firing is 0.7 μm or more and 2.0 μm or less, by using a synthetic resin film having R _{max of} 0.2 μm or less, the number of defective high temperature load tests can be stably suppressed to 0%. be able to.

From this example, an antistatic layer was formed on the surface of the synthetic resin film opposite to the surface on which the ceramic slurry was applied.
_{When max} is 0.6 μm, a high temperature load test failure occurs when the thickness of the fired ceramic layer is 2 μm or more, that is, when R _max is 30% or less with respect to the thickness of the fired ceramic layer. Can be suppressed. Moreover, when the thickness of the ceramic layer after firing is 0.7 μm or more and 2.0 μm or less, the high temperature load test failure rate can be suppressed to 0% by setting the R _{max of the} synthetic resin film to 0.2 μm or less. .

(Example 3) In this example, the relationship between the thickness of the antistatic layer formed on the synthetic resin film and the amount of unwound charge by pulling out the synthetic resin film from the carrier film roll was evaluated. Here, the thickness of the antistatic layer formed on the synthetic resin film was changed, and the relationship between the coating speed of the ceramic slurry on the synthetic resin film, that is, the drawing speed of the synthetic resin film, and the unwinding charge amount was investigated. . And the result was shown in FIG.

From FIG. 7, when the antistatic layer was not formed on the synthetic resin film and when the thickness of the antistatic layer was 0.
In the case of 05 μm, when the coating speed of the ceramic slurry exceeded 20 m / min, the unwinding charge amount sharply increased. On the other hand, when the thickness of the antistatic layer formed on the synthetic resin film was 0.1 μm or more, the unwinding charge amount was 4 kV / cm or less even when the coating rate of the ceramic slurry was 30 m / min or more. . From the above results, the thickness of the antistatic layer on the synthetic resin film was 0.
It is preferably 1 μm or more.

In each of the above-mentioned embodiments, the method of laminating the ceramic green sheet while peeling it from the carrier film was shown, but the same effect can be obtained by the method of peeling from the carrier film after laminating and pressure bonding. However, the lamination method is not limited.

[0036]

According to the present invention, by setting the coating speed of the ceramic slurry on the carrier film to 30 m / min or more, the ceramic green sheet can be formed with a uniform thickness, and further, the laminated body can be formed. It is possible to reduce the thickness of the ceramic layer after firing. At this time,
As the carrier film, R _max on the ceramic slurry coated surface is 30% or less of the thickness of the ceramic layer,
By forming an antistatic layer on the surface opposite to the ceramic slurry application surface, local depressions and pinholes are eliminated,
The unwinding charge amount and peeling charge amount can be reduced,
It is possible to suppress the occurrence of defects when forming the ceramic green sheet. Therefore, the reliability of the finally obtained monolithic ceramic electronic component can be improved.

[Brief description of drawings]

FIG. 1 is a conceptual diagram showing a manufacturing apparatus used in one step of a method for manufacturing a monolithic ceramic capacitor, which is the background of the present invention.

FIG. 2 is a graph showing the relationship between the coating speed of a ceramic slurry on a carrier film and the variation in film thickness.

FIG. 3 is a graph showing the relationship between R _{max on the} surface of a carrier film coated with ceramic slurry and the amount of peeling charge in Example 1 relating to the presence or absence of an antistatic layer in a carrier film.

FIG. 4 is a graph showing a relationship between R _max on a surface of a carrier film coated with a ceramic slurry and a short-circuit failure rate of a laminated ceramic capacitor in Example 1 relating to the presence or absence of an antistatic layer in a carrier film.

FIG. 5 is a graph showing the relationship between the thickness of a ceramic layer after firing and the failure rate of a high temperature load test of a laminated ceramic capacitor in Example 2 relating to the presence or absence of an antistatic layer in a carrier film.

FIG. 6 is a graph showing the relationship between the thickness of the ceramic layer after firing and the failure rate of the high temperature load test of the laminated ceramic capacitor in Example 2 in which carrier films having an antistatic layer and different R _max were used. is there.

FIG. 7 is a graph showing a relationship between a coating speed of a ceramic slurry on a carrier film and an unwinding electrification amount in Example 3 using a carrier film in which a thickness of an antistatic layer is changed.

[Explanation of symbols]

10 Manufacturing equipment 12 Carrier film roll 14 Carrier film 16 Coating device 18 Ceramic slurry 20, 25 dryer 22 Ceramic green sheet 24 Printer 26 Winding device

Continued front page    (72) Inventor Nagamori Omori             2-10-10 Tenjin, Nagaokakyo, Kyoto Stock             Murata Manufacturing Co., Ltd. (72) Inventor Yasunobu Yoneda             2-10-10 Tenjin, Nagaokakyo, Kyoto Stock             Murata Manufacturing Co., Ltd. F term (reference) 5E082 AB03 BC38 EE04 EE35 FG06                       FG26 FG46 FG54 GG10 JJ03                       LL01 LL02 LL03 MM12 MM24                       PP09 PP10

Claims (4)

[Claims] 1. A process of pulling out a carrier film from a carrier film roll, a coating speed of 30 m / min on one side of the carrier film.
The step of applying the ceramic slurry as described above, the step of drying the applied ceramic slurry to form a ceramic green sheet, the step of forming an internal electrode pattern on the ceramic green sheet, the step of forming the internal electrode pattern Lamination including a step of laminating ceramic green sheets to obtain a laminated body, a step of individually cutting and firing the laminated body to obtain a ceramic sintered body, and a step of forming an external electrode on an outer surface of the ceramic sintered body In the method for manufacturing a ceramic electronic component, as the carrier film, the maximum height R _{max of the} surface coated with the ceramic slurry defined by JIS B0601.
Is 30% or less of the thickness of the ceramic layer constituting the ceramic sintered body, a release layer is formed on the ceramic slurry application surface, and an antistatic layer is formed on the opposite surface of the ceramic slurry application surface. A method of manufacturing a laminated ceramic electronic component, which comprises using a carrier film. 2. The method for manufacturing a laminated ceramic electronic component according to claim 1, wherein the antistatic layer is formed of an antistatic agent containing acryloyloxytrimethylammonium chloride as a main component. 3. The method for manufacturing a laminated ceramic electronic component according to claim 1, wherein the antistatic layer is formed of an antistatic agent containing diallyldimethylammonium chloride as a main component. 4. The ceramic layer constituting the ceramic sintered body has a thickness of 0.7 μm or more and 2 μm or less, and a maximum height R _max defined by JISB0601 of the carrier slurry application surface of the carrier film is 0. .2
The method for producing a monolithic ceramic electronic component according to claim 1, wherein the laminated ceramic electronic component has a thickness of μm or less.