JP2003197694A - Apparatus and method for implanting film carrier tape for mounting electronic element, and method for manufacturing the film carrier tape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To perform an implanting method with high productivity and at low cost by speedily and precisely punching a large number of implanting holes at a base film tape and speedily and precisely burying implanting metallic materials into these implanting holes. <P>SOLUTION: This apparatus is provided with an implanting die provided with an implanting hole boring part where implanting hole boring pins for boring by punching are arranged and an implanting part where implanting pins for burying the implanting metallic material into the implanting holes by punching are arranged. The implanting metallic material is supplied crossing the carrying direction of the film carrier tape. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film carrier tape (TAB (Tape Automated Bondin) for mounting electronic parts.
g) Tape, T-BGA (Tape Ball Grid Array) tape,
CSP (Chip Size Package) tape, ASIC (Appli
cation Specific Integrated Circuit) tape, FPC
(Flexible Printed Circuit), COF (Chip On Fil)
m) Tape etc.) (hereinafter, simply referred to as “electronic component mounting film carrier tape”), implant device and method, and electronic component mounting film carrier tape manufacturing method.

[0002]

2. Description of the Related Art With the development of the electronics industry, I
Although the demand for printed wiring boards for mounting electronic components such as C (integrated circuits) and LSI (large-scale integrated circuits) is rapidly increasing, electronic devices are becoming smaller and lighter, more sophisticated, and more reliable.
There is a demand for lower prices.

By the way, in response to recent miniaturization and weight reduction and high functionality, high density of IC wiring is required.
In reality, there is also a demand for higher density on a mounting board on which electronic components are mounted. Therefore, in the conventional TAB tape, only one surface side (front surface side) of the mounting substrate is mainly used for the wiring pattern, but not only one surface side (front surface side) but also both surfaces of the substrate are used for the wiring pattern. There is a need.

A printed circuit board having wiring patterns on the front and back surfaces has been developed as an electronic component mounting method for realizing such characteristics, and minute solder balls arranged in a matrix are formed on a semiconductor mounting package. ,
BGA that connects these solder balls to an external wiring board
(Ball Grid Array) method is becoming popular and this BG
Among the package materials according to the A method, those using a film carrier tape are also increasing.

In addition, the size of the semiconductor mounting package itself is reduced to the size of a semiconductor chip.
ize Package) is being adopted, but in this CSP as well, the size of the film carrier tape package itself called tape type CSP (Chip Size Package) is reduced to the size of the IC (semiconductor chip), and the connection method is used. A film carrier tape, which is the same as the BGA system, is also used.

Further, as a film carrier tape for mounting electronic parts, recently, a two-layer tape composed of a resin film called COF (Chip On Film) and a conductive metal foil, which has no device hole and is I
A film carrier tape for mounting electronic components of the type in which C is mounted has been widespread. By the way, as a method for manufacturing a printed circuit board having wiring patterns on the front and back surfaces, the following method has been conventionally adopted.

As shown in FIG. 17, the circuit pattern 1 on the front and back surfaces of the electronic component mounting film carrier tape 102.
In order to make electrical connection with the substrate 03, a via hole 106 is formed in the insulating resin film 104 such as a polyimide film forming the base material with a drill or the like. Then, there is a method in which a conductive plating layer 108 is formed in the via hole 106 by a plating technique such as electroless plating to electrically connect the front and back surfaces of the electronic component mounting film carrier tape.

However, according to this method, the formation area of the via hole becomes large, and it is not possible to cope with the recent reduction in size and weight of electronic equipment, and moreover, the via hole 106.
There is a problem that the plated layer 108 is not formed well in the inside, resulting in poor conduction. As an alternative method, as shown in FIG. 18, a paste 110 containing conductive particles is filled in the via holes 106 of the electronic component mounting film carrier tape 102 to bond the conductive particles to each other. There is a method for ensuring electrical continuity.

However, in this method, since the conductivity is ensured by the bonding of the conductive particles that exist independently, there is a problem in the reliability of conduction, and the diameter of the via hole 106 becomes small. Along with, beer hole 1
There is also a problem in that it is difficult to uniformly fill the conductive paste 110 in 06. Further, as shown in FIG. 19, a conductive bump 202 is formed by using screen printing, and the bump penetrates the insulating layer 204 to electrically connect with a circuit board 206 provided thereon. This is to ensure continuity.

However, in this method as well, in order to utilize the screen printing technique when forming bumps,
There is a problem that the conductive ink used has to mix a substance having no conductivity. Moreover, the screen printing technique for forming the bumps is also a very difficult technique.

[0011]

Therefore, in the past,
A so-called "implant method" has been proposed. That is, in this method, the molds 302, 30 having the punch 301 and the base having the die hole 303 are provided.
4, the resin film 30 is used as shown in FIG.
0, the conductive metal sheet 306 is punched out after punching the via hole 308, and the conductive metal piece 310 is punched.
Is located in the via hole 308 to electrically connect the front and back surfaces of the electronic component mounting film carrier tape.

Further, if such an implant technique is combined with a conventional TAB tape manufacturing process which is manufactured by reel-to-reel, it is possible to operate continuously and automatically. Since it is possible to improve the production cost and reduce the production cost, the continuous manufacturing method using the reel-to-reel implant technology has been eagerly desired in this field. there were.

Therefore, as shown in FIG. 21, in order to manufacture the reel-to-reel, the delivery reel 40
It is conceivable that the implant device 400 is configured so as to pass through the sprocket hole punching die 402, the implant hole punching die 404, and the implant die 406 and be wound by the take-up reel 408 from 2. . However, in this case, when supplying the copper foil 410 for implants, a method of supplying the film carrier tape T in parallel with the transport direction may be considered. Various equipment such as the mold 404 is an obstacle, and for example, as shown by the alternate long and short dash line in FIG. 21, the equipment such as the mold must be avoided and the implant copper foil supply device 412 must be arranged considerably above. First, it is necessary to provide the guide roll 414, which requires a device having a complicated structure.

In view of such circumstances, the present invention is capable of punching a large number of implant holes in a base film tape quickly and with high precision, and at the same time, a metal material for implant is swiftly and highly punched in the implant holes. To provide an implanting device and an implanting method for a film carrier tape for mounting electronic parts, which can be embedded with high accuracy, and which can perform an implanting method with high production efficiency and low cost, and a method for manufacturing a film carrier tape for mounting electronic parts With the goal.

[0015]

The present invention has been made in order to achieve the problems and objects in the prior art as described above, and an implanting device for a film carrier tape for mounting electronic parts of the present invention comprises: An implant mold is provided, in which an implant hole of a film carrier tape is punched, and an implant metal material of a metal sheet material for implant is buried in the drilled implant hole by punching. An implant device for a film carrier tape for mounting electronic components, comprising a caulking die for caulking the upper and lower surfaces of an implant material embedded in, wherein the implant hole is embedded in the implant metal material by punching. Make sure that the Characterized by being configured to provide a cement metal material.

In the method of implanting a film carrier tape for mounting electronic parts and the method of manufacturing a film carrier tape for mounting electronic parts of the present invention, a metal layer is formed on one side or both sides using an implant mold having a pin. The hole for implant is punched by the pin with respect to the film carrier tape formed, and the pin is inserted into the hole for implant with respect to the film carrier tape with the hole for implant. A method of implanting a film carrier tape for mounting an electronic component, wherein an implant metal material of an implant metal sheet material is embedded by punching, the method comprising: implanting an implant metal material into an implant hole in the implant portion by punching. Carrying film carrier tape Intersects the direction, and supplying the implant metal material.

As described above, since the implant mold provided with the pins is used, the base film tape is punched with a large number of holes for implants, and the metal sheet material for implants is punched into the punched holes for implants. The implant metal material can be embedded by punching. Therefore, the punching of a large number of implant holes in the base film tape and the burying of the implant metal sheet material in the punched implant holes by the implant metal material can be performed quickly and with high accuracy. The implant method can be carried out with good production efficiency and at low cost.

In addition, in the present invention, when the implant metal material is embedded in the implant hole by punching, it intersects with the transport direction of the film carrier tape,
Since it supplies the implant metal material, it does not get in the way, and various equipment such as sprocket hole drilling dies do not get in the way,
Since it is possible to supply the metal sheet material for implants without the need to avoid these various facilities, a device having a complicated structure is not required, and mass production is possible with a simple structure.

Further, in the present invention, the film carrier tape having a plurality of sprocket holes formed therein is configured to pass through the implant mold in a state of being guided by the pilot device. , The sprocket hole formed in the film carrier tape is used to insert the positioning pin provided in the pilot device into the sprocket hole so that the base film tape can be positioned at an accurate position. Is characterized by.

As described above, the locating pin of the pilot device can be used to position the film carrier tape at an accurate position by using the sprocket holes formed in the film carrier tape and supply it to the implant mold. The holes for implants in the implant mold and the burying by implanting the implant metal material can be carried out rapidly and highly accurately for each electronic component mounting unit.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments (examples) of the present invention will be described below with reference to the drawings. FIG. 1 shows an example of a film carrier tape for mounting electronic parts, which is an object of the present invention, as a "COF (Chip On Film
FIG. 3 is a plan view showing a double-sided wiring type film carrier tape such as “On Film))”. Although the double-sided wiring type film carrier tape is shown in this embodiment, it is of course possible to apply it to a single-sided wiring type film carrier tape.

Film carrier tape 1 for mounting electronic parts
Is composed of a base film tape 2 which is an insulating film made of a synthetic resin such as polyimide, and a conductive metal layer 3 made of, for example, an electrolytic copper foil is attached to the front and back surfaces of the base film tape 2. There is. As the electronic component mounting film carrier tape 1, a polyimide film is formed by forming metal thin films on both front and back surfaces of the polyimide film by sputtering or electroless plating, and then plating the surface of the metal thin film with copper. It may be.

The dimensions of the base film tape 2 are as follows.
Although not particularly limited, in consideration of product standards and productivity, it is preferable that the tape width is 35 to 156 mm, and for example, the thickness is 50 μm, the tape width is 48 mm, and the tape length is 50 mm. It is 105 m long and is formed in a long shape. The synthetic resin forming the base film tape 2 is not particularly limited, and for example, polyimide, polyester, polypropylene, polyphenylene sulfide, polyvinylidene chloride, eval, etc. can be used.

As the conductive metal layer 3, an electrolytic copper foil or the like can be used, and the thickness thereof is not particularly limited, but in order to form a fine pattern,
It is desirable that the thickness is 3 to 70 μm, preferably 9 to 12 μm. The base film tape 2 has a plurality of sprocket holes 4 formed on both side edges thereof at a predetermined pitch in the longitudinal direction (longitudinal direction).

Rectangular electronic component mounting portions 6 are formed in a matrix shape in the longitudinal direction and the width direction in the portions sandwiched by the sprocket holes 4 on the both side edges (the central portion of the tape) with a constant interval. It is formed continuously. The electronic component mounting portion 6 is formed with a copper circuit pattern by applying a photosensitive photoresist, exposing a circuit pattern, developing and copper etching according to a conventional method.

Further, each electronic component mounting portion 6 corresponds to one set of electronic components mounted on the electronic component mounting film carrier tape 1, whereby electronic components are mounted on the electronic component mounting portion 6. You can do it. In addition, as shown in FIG. 1, inside the electronic component mounting portion 6, an implant group 8 including an implant portion 7 serving as a via hole for establishing electrical continuity between the wirings on the front and back surfaces is formed.

The diameter of the implant part 7 is not particularly limited, and is, for example, 40 μmφ to 300 μm.
mφ is used. In order to manufacture such a film carrier tape 1 for mounting an electronic component, the film carrier tape 1 for mounting an electronic component of the present invention as described below is used to manufacture.

FIG. 2 is a schematic plan view of a first embodiment of an implant device for a film carrier tape for mounting electronic parts of the present invention, and FIG. 3 is a schematic side view thereof. As shown in FIG. 2, reference numeral 10 generally indicates an implant device for the electronic component mounting film carrier tape of the present invention (hereinafter, simply referred to as "implant device 10").

The implant device 10 is shown in FIGS.
As shown in FIG. 2, the base film tape 2 fed from a delivery roll (not shown) or the like is provided with a plurality of sprocket holes 4 on both side edges thereof at a predetermined pitch in the longitudinal direction (longitudinal direction). Is provided with a sprocket hole drilling portion 12 for drilling. This sprocket hole drilling portion 12 has a sprocket hole drilling pin 14
And a lower mold 18 having a die hole (not shown) corresponding to the sprocket hole drilling pin 14. And these upper mold 1
A plurality of sprocket holes 4 are formed by separating and contacting 6 and the lower mold 18.

Thus, the sprocket hole drilling portion 12
Then, the base film tape 2 having the plurality of sprocket holes 4 formed therein is configured to subsequently pass through the pilot portions 20 and 22. The pilot parts 20 and 22 are
By utilizing the sprocket holes 4 bored in the sprocket hole punching portions 12, the positioning pins 24 and 26 provided in the pilot portion 20 are fitted into the sprocket holes 4, so that the base film tape 2 is accurately positioned. It is configured so that it can be positioned at.

Then, between the pilot parts 20 and 22,
The correctly positioned base film tape 2 is designed to be implanted at the implant part 30. The implant part 30 includes an implant mold 32, as shown in FIG. In this implant mold 32, an implant hole punching portion 32a and an implant portion 32b are arranged symmetrically.

The implant mold 32 is composed of a pair of upper and lower molds 34 and 36.
An implant hole drilling pin 34 for punching an implant hole 40 in the base film tape 2 by punching is provided in the implant hole drilling portion 34 a of the upper mold 34.

Further, the implant portion 34 of the upper mold 34
In b, the implant hole 40 formed in the implant hole forming portion 34a is provided with the implant metal sheet material 64.
The implant pins 42 for burying the implant metal material 68 by punching are provided. In this case, as shown in FIG. 2, the implant hole drilling pin 3
In the implant hole punching portion 34a, a plurality of implant hole punching pins 38 are arranged at positions corresponding to the implant groups 8 of the electronic component mounting portion 6 of the electronic component mounting film carrier tape 1. In the case of the embodiment shown in FIG. 2, an example in which two electronic component mounting portions 6 are provided in the width direction of the electronic component mounting film carrier tape 1 is shown. Is not particularly limited.

Similarly, a plurality of implant pins 42 are arranged in the implant portion 34b at positions corresponding to the implant groups 8 of the electronic component mounting portion 6 of the electronic component mounting film carrier tape 1. There is. The diameters of the implant hole drilling pin 38 and the implant pin 42 may be set according to the diameter of the implant hole 40 described later. The material of the implant hole drilling pin 38 and the implant pin 42 is, for example, cemented carbide, high speed steel, 1
A metal such as 2% chrome tool steel may be used.

The implant hole punching portion 34a of the implant mold 32 is constructed as shown in the sectional view of FIG. That is, the upper mold 34 is provided with the pressing plate 46, and the pressing plate 46 is supported by the movable plate 52 via the spring 50. And the guide rod 54
The movable plate 52 is guided by the pressing plate 46 so that the pressing plate 46 can come into contact with and separate from the movable plate 52.

Further, the movable plate 52 is provided with a punch portion,
A punch plate 58 is fixed via a stopper member 56, and an implant hole drilling pin 38 is attached to the punch plate 58. And the pressing plate 4
6 is a pin hole 62 formed in the punch contacting opening 60.
The implant hole drilling pin 38 is configured to be projectable via the.

Further, a film pressing recess 63 for pressing the base film tape 2 is formed at the lower end of the pressing plate 46. On the other hand, the lower die 36 is formed with a die hole 36a into which the implant hole drilling pin 38 is fitted. The implant portion 34b of the implant mold 32 is configured as shown in the sectional view of FIG.

The implant portion 34b is the implant hole punching portion 34a of the implant mold 32 shown in FIG.
Since the structure is basically the same as the above, in FIG. 5, the same components as those in FIG.
Detailed description thereof will be omitted. That is, for the implant portion 34b, the height h of the stopper member 56 is adjusted to be lower than that for the implant hole punching portion 34a, so that the implant metal of the implant metal sheet material 64, which will be described later, is placed in the implant hole 40. Material 68
Is buried by punching.

Further, the lower mold 3 of the implant portion 34b
6 is different from FIG. 4 in that a die hole into which the implant pin 42 is fitted is not formed. Further, as shown in FIG. 2, the implant portion 34b includes a base film tape 2 in a direction that intersects the transport direction of the base film tape 2, preferably in a direction that intersects perpendicularly to the transport direction of the base film tape 2, that is, the base. In the width direction of the film tape 2, an implant metal sheet material supply unit 66 for supplying the implant metal sheet material 64 is provided on the upper surface of the base film tape 2.

In this case, although not shown, the metal sheet material 64 for implants may be fed in a horizontal direction in a direction perpendicular to the transport direction of the base film tape 2 from diagonally above or diagonally below. It is also possible to supply. Although not shown, the metal sheet material 64 for implant was supplied in a direction perpendicular to the transport direction of the base film tape 2, but it is also possible to change the intersecting angle and supply.

Furthermore, the metal sheet material 64 for implants
The speed of supplying the metal sheet material for implant is not particularly limited, and a new metal sheet material 64 for implant may be supplied in synchronization with the transportation of the base film tape 2 described above so that the implant can be performed. In this case, the metal sheet material 64 for implant is not particularly limited as long as it is a metal material having conductivity, and is, for example, lead, tin, copper, nickel, or a main component of these metals. It is possible to use a sheet made of an alloy such as, a noble metal such as indium, gold, or silver, or a sheet having a solder plating layer formed on the surface of these metals. The thickness is not particularly limited, but is preferably 100 μm to 150 μm in consideration of the processing characteristics of the implant mold and the conduction characteristics of the via hole.

Further, in the implant part 30, the base film tape 2 in which the implant hole 40 is bored and the implant metal material 68 is embedded in the implant hole 40 passes through the pilot part 22, Implant metal material 68 embedded in the implant hole 40
The upper and lower surfaces are conveyed to the caulking portion 70.

As shown in FIGS. 2 and 6, the caulking portion 70 is composed of a pair of upper and lower molds 72 and 74. The upper mold 72 and the lower mold 74 respectively have an upper mold projecting portion 76 and a lower mold projecting portion 78 projecting from positions corresponding to the positions of the implant holes 40. . It is desirable that these protruding portions 76 and 78 be partially cured by electric discharge machining. As described above, by performing the hardening process by the electric discharge machining, the protruding portion 76 corresponding to the fine pitched caulking region,
By performing NC control of only 78, for example, it is possible to easily perform the curing treatment with high precision and spot.

In this case, as the processing conditions for the electric discharge processing, the processing liquid is ion water and the peak current value is 5 to 300.
A, the electric discharge interval may be 10 to 100 μs, and the wire electric discharge machining may be performed with a DC waveform using the wire as a negative electrode. In addition, such a configuration of the caulking portion 70 can be similarly applied to the following embodiments.

The projecting distance between the projecting portions 76 and 78 is not particularly limited, and by pressing the base film tape 2 with a roll press,
It is desirable that the distance is such that the upper and lower surfaces of the implant metal material 68 embedded in the implant hole 40 can be caulked. The implant mold 32 of the implant part 30 configured as described above operates as follows.

A plurality of sprocket holes 4 are bored in the sprocket hole punching portion 12, and the base film tape 2 which has passed through the pilot portion 20 has an implant mold 32.
It is supplied between the upper mold 34 and the lower mold 36. In this state, the implant hole 40 is formed in the implant hole forming portion 34a.

That is, when the upper mold 34 descends, the movable plate 52 moves downward as shown in FIG. 7, and accordingly, the pressing plate 46 moves the lower mold via the spring 50. Abut 36. As a result, the base film tape 2 on the lower die 36 is pressed to a predetermined position in the film pressing recess 63 formed at the lower end of the pressing plate 46.

When the upper mold 34 is further lowered in this state, the movable plate 52 is further lowered against the spring 50, and the implant hole drilling pin 38 mounted on the punch plate 58 is pushed by the pressing plate. Pin hole 62 formed in 46
Project through. As a result, the implant hole drilling pin 38 penetrates the base film tape 2 and the conductive metal layer 3 on the front and back surfaces of the base film tape 2,
By punching into the die hole 36a of the lower mold 36, the hole 40 for implant is formed in the base film tape 2.
Are to be drilled.

In this case, the height h of the stopper member 56 is set so that the implant hole drilling pin 38 is moved to the die hole 36 while the punch plate 58 is in contact with the pressing plate 46.
The height is adjusted so that it fits into a. The diameter of the implant hole 40 is not particularly limited, but is preferably 40 μmφ to 3 in view of the wiring pattern design of the electronic component mounting film carrier tape.
It is desirable to set it to 00 μmφ.

In this way, the implant hole punched portion 34a
In the base film tape 2 having the implant holes 40 formed therein, the implant metal material 68 of the implant metal sheet material 64 is embedded in the implant hole 34 by punching at the implant portion 34b. That is, the base film tape 2 having the implant hole 40 formed therein at the implant hole forming portion 34a is conveyed to the implant portion 34b. At the same time, as shown in FIG. 2, in the metal sheet material supplying portion 66 for implant, the base film tape 2
The base film tape 2 in the direction perpendicular to the transport direction of the base film tape, that is, in the width direction of the base film tape
The metal sheet material 64 for implant is supplied to the upper surface of the.

In this state, the implant hole punched portion 34
In the same manner as a, by lowering the upper mold 34,
As shown in FIG. 8, the implant pin 42 projects through the pin hole 62 of the pressing plate 46. As a result, the implant pin 42 penetrates the implant metal sheet material 64, so that the implant metal material 68 of the implant metal sheet material 64 is embedded in the implant hole 40.

As a result, as shown in FIG. 9, the implant metal material 6 embedded in the implant hole 40 is formed.
Through 8, the electrical continuity with the conductive metal layers 3 on the front and back surfaces of the base film tape 2 is secured. The thickness of the metal sheet material for implant 64 is substantially the same as the thickness of the conductive metal layer 3 on the front and back surfaces of the base film tape 2 or slightly thickened, so that the caulking portion 7 to be described later is formed.
It is preferable that the crimping step at 0 can be easily performed.

In the implant portion 34b, the height h of the stopper member 56 is set to the implant hole punching portion 34.
It is adjusted lower than in the case of a. That is, the height is set such that the implant metal material 68 is embedded in the implant hole 40 in a state where the implant pin 42 projects through the pin hole 62 of the pressing plate 46. The base film tape 2 in which the implant metal material 68 is embedded in the implant hole 40 in this manner passes through the pilot portion 22 and the upper and lower surfaces of the implant metal material 68 embedded in the implant hole 40 are removed. The caulking portion 70 is conveyed to the caulking portion 70.

In the caulking portion 70, as shown in FIG. 10, by lowering the upper mold 72 with respect to the lower mold 74, the upper mold projection 76 and the lower mold projection 78 are formed. Between,
Upper and lower surfaces 68a, 68 of the implant metal material 68 embedded in the implant hole 40 of the base film tape 2
b is pressed. As a result, the peripheral edges of the upper and lower surfaces 68a and 68b of the implant metal material 68 are caulked, and the caulking portions 68c and 6 around the implant hole 40 of the conductive metal layer 3 on the front and back surfaces of the base film tape 2 are caulked.
8d is formed, and the implant part 7 is formed. This prevents the implant metal material 68 from slipping out of the implant hole 40 and ensures continuity.

By the way, the upper die 7 constituting the caulking die
2, the upper mold protrusion 76 and the lower mold protrusion 78 are formed on the surface of the lower mold 74 at positions corresponding to the implant positions. Only the upper and lower surfaces 68a and 68b of the metal material 68 can be reliably caulked. Therefore, the pressing force does not act on the portions other than the caulking area, and the pressing force does not affect the portions. Further, since the caulking area of the caulking die is such protruding portions 76 and 78, even if there is an error in the size of the implant metal material 68 or even if it is implanted obliquely, this protruding portion Since it is pressed by the portions 76 and 78, the caulking process can be accurately performed, and the caulking defect does not occur.

In this embodiment, the upper die 72 forming the caulking die is provided on the surface of the lower die 74, and the upper die projecting portion 76 and the lower die projecting portion are provided at the positions corresponding to the implant positions. 7
8 is formed, but the upper die 72 forming the caulking die is a flat surface corresponding to these implant positions without providing such protrusions 76 and 78 on the surface of the lower die 74. The place can be hardened by electric discharge machining.

As described above, by performing the hardening process by the electric discharge machining, only the part corresponding to the fine pitched caulking region is easily and spot-wise hardened by the NC control, for example. be able to. In this case, as the processing conditions of the electric discharge processing, the processing liquid is ion water, the peak current value is 5 to 300 A,
Wire discharge processing of a direct current waveform with a discharge interval of 10 to 100 µs and a wire as a negative electrode may be performed.

In this case, the surface of the lower mold 74 of the upper mold 72 constituting the caulking mold is partially hardened by the hardening treatment at the portion corresponding to the implant position. Only the upper and lower surfaces of the implant metal material 68 can be securely caulked. Therefore, the pressing force does not act on the portions other than the caulking area, and the pressing force does not affect the portions. Further, since the caulking area of the caulking die is such a hardened portion, even if a large amount of caulking is carried out, the caulking area will not be worn and damaged and a caulking defect will not occur.

The structure of the caulking portion 70 can be similarly applied to the following embodiments. The base film tape 2 thus crimped at the crimping portion 70 is formed by dissolving the entire surface of the copper foil on the fine pattern forming surface with an etching solution to form a fine pattern. After half-etching to a thickness of, for example, 3 μm (half-etching step), after plating the entire surface with copper to improve connection reliability (cover plating step), application of a photosensitive photoresist in accordance with a conventional method, The circuit pattern is exposed, developed and copper-etched to form a copper circuit pattern.

In the case of this embodiment, after the implant is performed by the implant device 10 of the present invention,
Although the copper circuit pattern is formed, it is also possible to previously form the copper circuit pattern on the base film tape 2. In addition, in this example, the base film tape 2 having the conductive metal layers 3 on the front and back surfaces was used.
As shown in (B), as the base film tape 2, it is possible to use the base film tape 2 alone or the one having the conductive metal layer 3 only on the front surface or the back surface. Further, although not shown, it is also possible to project the implant material to form bumps for connection to a multilayer circuit board or an external board.

As described above, the implant metal having the implant hole-perforated portion with the implant hole-perforated pin 38 and the implant portion with the implant pin 42 arranged symmetrically in one mold. Since the mold 32 is used, a large number of implant holes 40 are punched in the base film tape 2 and the implant metal sheet material 64 is embedded in the punched implant holes 40 by the punch punching of the implant metal material 68. Can be performed simultaneously with one punching.

Therefore, a large number of implant holes 40 are punched in the base film tape 2 and the implant metal sheet material 64 is embedded in the drilled implant holes 40 by punching. The implant method can be carried out quickly and with high accuracy, and the implant method can be carried out with high production efficiency and at low cost.

Thus, the implant device 10 of the present invention
After the semiconductor IC and other necessary electronic components are mounted on the film carrier tape 1 for mounting electronic components which has been implanted, potting is performed with an epoxy resin or the like to protect the semiconductor device, if necessary. It is sealed with resin by transfer molding. Although not shown, the electronic component mounting film carrier tape 1 of the present invention on which the implant part 7 is formed can also be used as a multilayer substrate by laminating in multiple layers.

FIG. 12 is a schematic plan view of a second embodiment of an implant device for a film carrier tape for mounting electronic parts according to the present invention. The implant device 10 of this embodiment
Since the basic configuration is the same as that of the implant device 10 shown in FIG. 2, the same components are designated by the same reference numerals, and detailed description thereof will be omitted.

In the implant device 10 of this embodiment,
One implant hole drilling pin 38 is disposed in the implant hole drilling portion 34a. Further, one implant pin 42 is arranged in the implant portion 34b. Further, in correspondence with the implant hole drilling pin, the lower mold 36 is provided with the implant hole drilling pin 38.
Is formed with one die hole 36a.

Then, at the time of the above-mentioned drilling of the implant hole and the implantation, the implant die is moved in the transport direction X of the film carrier tape as shown in FIG. It is configured to perform implant hole drilling and implant while moving in the width direction Y. With this configuration, since a large number of pins are not arranged in the mold, the cost of the mold does not increase, and even if the pins are damaged, one pin 38, This is efficient because it is only necessary to replace 42.

Further, as described above, one implant hole drilling pin 38 and one implant pin 42 are provided, and the implant die 32 is moved in the transport direction and the width direction of the film carrier tape. However, since the implant hole is formed and the implant is performed, it is possible to perform the implant corresponding to the electronic component mounting portions of various wiring patterns.

FIG. 13 is a schematic plan view of a third embodiment of an implant device for a film carrier tape for mounting electronic parts of the present invention. The implant device 10 of this embodiment
Since the basic configuration is the same as that of the implant device 10 shown in FIG. 2, the same components are designated by the same reference numerals, and detailed description thereof will be omitted.

In the implant device 10 of this embodiment,
The implant hole drilling pin 34 has the implant hole drilling pin 38 in the implant hole drilling portion 34a.
Are arranged in a line in the width direction. Further, the implant pins 42 are arranged in a row in the width direction of the electronic component mounting film carrier tape 1 at the implant portion 34b. Further, corresponding to the implant hole drilling pins, the lower mold 36 is provided with die holes 36a into which the implant hole drilling pins 38 are fitted in a row in the width direction of the electronic component mounting film carrier tape 1. ing.

Then, at the time of the above-described drilling of the implant hole and the implant, the implant mold 32 is set as shown in FIG. 13 based on the control of the control device (not shown).
While moving in the transport direction X of the film carrier tape,
It is configured to perform implant hole drilling and implanting on a row-by-row basis. As described above, since the implant hole punching pins 38 and the implant pins 42 are arranged in one row in the width direction of the electronic component mounting film carrier tape 1, the punching is performed once for each row by one punching. Drilling and implanting can be done simultaneously.

Therefore, the base film tape 2 is punched with a number of implant holes 40, and the implant metal sheet material 64 is punched with the implant metal material 68 to be embedded in the punched implant holes 40. In addition, the implant method can be carried out rapidly and highly accurately in a row unit, and the implant method can be carried out with high production efficiency and at low cost.

FIG. 14 is a schematic plan view of a fourth embodiment of an implant device for a film carrier tape for mounting electronic parts of the present invention. The implant device 10 of this embodiment
Since the basic configuration is the same as that of the implant device 10 shown in FIG. 2, the same components are designated by the same reference numerals, and detailed description thereof will be omitted.

In the implant device 10 of this embodiment,
The implant die 32 has an implant hole drilling portion 32.
By disposing only a, the implant hole 40 is formed in the base film tape 2 by the implant hole forming pin 38 of the implant hole forming portion 32 a of the implant mold 32. Then, after the implant holes 40 are formed in the base film tape 2 in this way, the implant mold 32 is moved in the transport direction X of the film carrier tape under the control of a control device (not shown). Implant hole drilling pin 3 of implant hole drilling portion 32a of implant mold 32
8 is used to embed the implant metal material 68 in the implant hole 40 formed at the implant hole forming portion 32a by punching.

With this structure, since only the implant hole punching portion 32a needs to be arranged in the implant mold 32, the mold manufacturing cost can be halved and the cost can be reduced. Suitable for production scale production. FIG. 15 is a schematic plan view of a fifth embodiment of an implant device for a film carrier tape for mounting electronic components of the present invention.

Since the implanting device 10 of this embodiment is similar in basic structure to the implanting device 10 shown in FIG. 14, the same components are designated by the same reference numerals, and detailed description thereof will be given. Omit it. In the implant device 10 of this embodiment, the implant hole drilling portion 34
One implant hole drilling pin 38 is provided in a, and one die hole 36a into which the implant hole drilling pin 38 is fitted is formed in the lower mold 36.

Then, at the time of the above-mentioned implant hole drilling and implanting, as shown in FIG. 15, the implant mold is moved in the transport direction X of the film carrier tape under the control of a control device (not shown). It is configured to perform implant hole drilling and implant while moving in the width direction Y. With this configuration, since a large number of pins are not arranged in the mold, the cost of the mold does not increase, and even if the pins are damaged, one pin 38 is replaced. It is efficient because it only needs to be done.

Further, as described above, one implant hole drilling pin 38 is provided, and the implant die 32 is
Since the implant hole is formed and the implant is performed while moving in the transport direction and the width direction of the film carrier tape, it is possible to perform the implant corresponding to the electronic component mounting portions of various wiring patterns. FIG. 16 is a schematic plan view of a sixth embodiment of the implant device for a film carrier tape for mounting electronic components of the present invention.

Since the implanting device 10 of this embodiment is similar in basic structure to the implanting device 10 shown in FIG. 14, the same components are designated by the same reference numerals, and detailed description thereof will be given. Omit it. In the implant device 10 of this embodiment, the implant hole drilling portion 34
The implant hole drilling pins 38 are arranged in a row in the width direction of the electronic component mounting film carrier tape 1. Further, corresponding to the implant hole drilling pins 38, the lower mold 36 is provided with die holes 36a into which the implant hole drilling pins 38 are fitted, in a row in the width direction of the electronic component mounting film carrier tape 1. Has been done.

Then, at the time of the above-mentioned drilling of the implant hole and at the time of implanting, the implant mold 32 is set as shown in FIG.
While moving in the transport direction X of the film carrier tape,
It is configured to perform implant hole drilling and implanting on a row-by-row basis. In this way, since the implant hole drilling pins 38 are arranged in a row in the width direction of the electronic component mounting film carrier tape 1, the punching and implanting of implant holes are performed simultaneously in a row by punching once. be able to.

Therefore, the base film tape 2 is punched with a large number of implant holes 40, and the implant metal sheet material 64 is embedded in the punched implant holes 40 by punching. In addition, the implant method can be carried out rapidly and highly accurately in a row unit, and the implant method can be carried out with high production efficiency and at low cost.

Although the preferred embodiment of the present invention has been described above, the present invention is not limited to this. For example, in the above embodiment, when one film carrier tape for mounting electronic parts is prepared. However, it is also possible to supply a plurality of film carrier tapes for mounting electronic components side by side in the width direction at the same time, and to produce the film carrier tapes. It is possible.

[0082]

【Example】

[0083]

Example 1 As the base film tape 2, the tape width is 48 mm, the polyimide thickness is 50 μm, and the copper foil thickness is 12 μm.
A double-sided copper-clad polyimide film (trade name: "Espanex" manufactured by Nippon Steel Chemical Co., Ltd.) was used. An implant device 1 as shown in FIG. 2 is formed on the base film tape.
No. 0 was used to form the sprocket holes 4 in the sprocket hole drilling portions 12 at the side edge portions on both sides of the base film tape 2.

Then, the implant hole drilling pin 38 of the implant hole drilling portion 34a of the implant die 32.
Then, the implant hole 40 having a diameter of 100 μm was formed. Then, at the implant portion 34b, the tape width of 20 m from the implant metal sheet material supply portion 66.
A metal sheet material 64 for an implant made of a rolled copper foil having a thickness of 100 μm and a thickness of 100 μm is supplied to the upper surface of the base film tape 2 in a direction perpendicular to the transport direction of the base film tape 2, and at the time of implant pins 42. ,
The implant metal material 68 of the implant metal sheet material 64 was embedded in the implant hole 40 by punching.

Then, in the crimped portion 70, the wire-discharge-processed diameter is 300 μm or more and 500 μm.
The upper and lower surfaces of the implant metal material 68 by the upper mold protrusion 76 having a protrusion distance of 70 mm and the lower mold protrusion 78 having a diameter of 300 μm or more subjected to wire electric discharge machining and a protrusion distance of 500 μm. The implant portion 7 was formed by crimping by pressing 68a and 68b.

In the caulking portion 70, a flat upper die 72 without the upper die protruding portion 76 and the lower die protruding portion 78 is formed by the lower die 74, and the surfaces of these die are covered. The caulking process was performed using a mold in which a portion corresponding to the implant position was partially cured by the curing treatment. The base film tape 2 thus crimped at the crimping portion 70 is formed by dissolving the entire surface of the copper foil on the fine pattern forming surface with an etching solution to form a fine pattern. Is half-etched to a thickness of 3 μm (half-etching step), the entire surface of this copper foil is plated with copper to improve connection reliability (cover plating step), and a photosensitive photoresist is applied according to a conventional method. Following the exposure of the circuit pattern, development and copper etching were performed to form a copper circuit pattern.

Next, the obtained tape was transferred to a plating layer, and the exposed copper foil surface portion not coated with the solder resist of the tape was gold-plated with a thickness of 0.1 μm,
A film carrier tape 1 for mounting electronic parts was produced.
A continuity test was conducted on the film carrier tape 1 for mounting electronic parts thus obtained, but no continuity failure occurred.

[0088]

Example 2 In the same manner as in Example 1, a film carrier tape 1 for mounting electronic parts was produced. However, in this example, the implant device of FIG. 12 was used. Film carrier tape 1 for mounting electronic parts thus obtained
A continuity test was conducted on the above, but no defective continuity occurred.

[0089]

Example 3 In the same manner as in Example 1, a film carrier tape 1 for mounting electronic components was produced. However, in this example, the implant device of FIG. 13 was used. Film carrier tape 1 for mounting electronic parts thus obtained
A continuity test was conducted on the above, but no defective continuity occurred.

[0090]

Example 4 In the same manner as in Example 1, a film carrier tape 1 for mounting electronic parts was produced. However, in this example, the implant device of FIG. 14 was used. Film carrier tape 1 for mounting electronic parts thus obtained
A continuity test was conducted on the above, but no defective continuity occurred.

[0091]

Example 5 A film carrier tape 1 for mounting electronic parts was produced in the same manner as in Example 1. However, in this example, the implant device of FIG. 15 was used. Film carrier tape 1 for mounting electronic parts thus obtained
A continuity test was conducted on the above, but no defective continuity occurred.

[0092]

Example 6 In the same manner as in Example 1, a film carrier tape 1 for mounting electronic parts was produced. However, in this example, the implant device of FIG. 16 was used. Film carrier tape 1 for mounting electronic parts thus obtained
A continuity test was conducted on the above, but no defective continuity occurred.

In each case, a film carrier tape for mounting electronic parts of sufficient quality was obtained.

[0094]

As described above, according to the present invention,
Since an implant mold equipped with pins is used, a large number of implant holes are punched in the base film tape, and the implant metal sheet material is embedded in the drilled implant holes by punching the implant metal material. It can be performed.

Therefore, the punching of a large number of implant holes in the base film tape by punching and the burying of the implant metal sheet material by punching the implant metal material into the drilled implant holes can be carried out quickly and with high efficiency. The implant method can be performed with high accuracy, high production efficiency, and low cost. Moreover,
In the present invention, when the implant metal material is embedded in the implant hole by punching, the implant metal material is supplied by intersecting the transport direction of the film carrier tape, which is an obstacle and causes a sprocket hole punching die or the like. Since various equipments of (1) do not get in the way and there is no need to avoid these equipments, the metal sheet material for implants can be supplied, so that a device having a complicated configuration is unnecessary, and mass production is possible with a simple configuration.

Furthermore, according to the present invention, the locating pin of the pilot device is used to position the film carrier tape at an accurate position by utilizing the sprocket holes formed in the film carrier tape, and to make the implant mold. Since it can be supplied, the punching of implant holes in the implant mold, the embedding of the implant metal material by punching, and the crimping of the implant metal material by the crimping die can be performed quickly and highly accurately in the electronic component mounting unit. It is an extremely excellent invention that has various remarkable effects such as being able to achieve.

[Brief description of drawings]

FIG. 1 is a plan view of essential parts showing an example of a film carrier tape for mounting electronic parts, which is a target of the present invention.

FIG. 2 is a schematic plan view of a first embodiment of an implant device for a film carrier tape for mounting electronic parts of the present invention.

FIG. 3 is a schematic side view of FIG.

FIG. 4 is an implant die 32 of an implant device for a film carrier tape for mounting electronic components of the present invention.
FIG. 4B is a cross-sectional view of the implant hole punching portion 34a of FIG.

FIG. 5 is an implant mold 32 of an implant device for a film carrier tape for mounting electronic components of the present invention.
3 is a cross-sectional view of the implant portion 34b of FIG.

FIG. 6 is a cross-sectional view of a caulking portion 70 of the implant device for the electronic component mounting film carrier tape of the present invention.

FIG. 7 is an implant die 32 of an implant device for a film carrier tape for mounting electronic components of the present invention.
FIG. 13 is a cross-sectional view showing an operating state of the implant hole punching portion 34a of FIG.

FIG. 8 is an implant mold 32 of an implant device for a film carrier tape for mounting electronic components of the present invention.
It is sectional drawing which shows the operating state of the implant part 34b of this.

FIG. 9 is an implant mold 32 of an implant device for a film carrier tape for mounting electronic components of the present invention.
It is sectional drawing which shows the operating state of the implant part 34b of this.

FIG. 10 is a cross-sectional view showing an operating state of the crimp portion 70 of the implant device for an electronic component mounting film carrier tape according to the present invention.

FIG. 11 is a partially enlarged sectional view of the base film tape 2 used in the present invention.

FIG. 12 is a schematic plan view of a second embodiment of an implant device for a film carrier tape for mounting electronic components of the present invention.

FIG. 13 is a schematic plan view of a third embodiment of an implant device for a film carrier tape for mounting electronic parts of the present invention.

FIG. 14 is a schematic plan view of a fourth embodiment of the implant device for a film carrier tape for mounting electronic components of the present invention.

FIG. 15 is a schematic plan view of a fifth embodiment of the implant device for the electronic component mounting film carrier tape of the present invention.

FIG. 16 is a schematic plan view of a sixth embodiment of an implant device for a film carrier tape for mounting electronic components of the present invention.

FIG. 17 is a schematic view showing a method for manufacturing a conventional film carrier tape for mounting electronic components.

FIG. 18 is a schematic view showing a method for manufacturing a conventional film carrier tape for mounting electronic components.

FIG. 19 is a schematic view showing a method for manufacturing a conventional film carrier tape for mounting electronic parts.

FIG. 20 is a schematic view showing a method for manufacturing a conventional film carrier tape for mounting electronic components.

FIG. 21 is a schematic view showing a method for manufacturing a conventional film carrier tape for mounting electronic components.

[Explanation of symbols]

1 Film carrier tape for electronic component mounting 2 Base film tape 3 Conductive metal layer 4 sprocket holes 6 Electronic component mounting department 7 Implant 8 implant groups 10 Implant device 12 Sprocket hole drilling part 14 Sprocket hole drilling pin 16 Upper mold 18 Lower mold 20, 22 Pilot section 24, 26 Positioning pin 30 Implant 32 Implant mold 32a Implant hole drilling portion 32b Implant part 34a Implant hole drilling portion 34b Implant part 34 Upper mold 36 Lower mold 36a Die hole 38 Implant hole drilling pin 40 implant hole 42 Implant Pin 46 Press plate 50 spring 52 movable plate 54 guide rod 56 Stopper member 58 punch plate 60 Punch part contact opening 62 pin hole 63 Holding recess 64 Metal sheet material for implants 66 Metal sheet material supply unit for implants 68 Implant metal material 68a upper surface 68b lower surface 68c, 68d caulking part 70 Caulking part 72 Upper mold 74 Lower mold 76 Upper mold protrusion 78 Lower mold protruding part 80 Semiconductor device 82 Semiconductor device X transport direction Y width direction

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Fumiaki Karasawa             2150-1, Ogawara, Suzaka City, Nagano Stock Association             Company Suzuki (72) Inventor Ichiyanagi Akira             1333-2 Hara-shi, Ageo-shi, Saitama Mitsui Mining & Smelting             Research Institute, Inc. (72) Inventor Katsuhiko Hayashi             1333-2 Hara-shi, Ageo-shi, Saitama Mitsui Mining & Smelting             Research Institute, Inc. F term (reference) 5E317 AA24 BB03 BB12 CC08 CD32                       GG17                 5F044 MM04 MM49

Claims (6)

[Claims] 1. An implant mold for punching an implant hole of a film carrier tape by punching, and embedding the implant metal material of an implant metal sheet material by punching in the drilled implant hole, What is claimed is: 1. An implant device for a film carrier tape for mounting an electronic component, comprising an caulking die for caulking an implant material embedded in the implant die, wherein an implant metal material is embedded in the implant hole by punching. At this time, an implant device for a film carrier tape for mounting electronic parts, characterized in that it is configured so as to supply an implant metal material while intersecting the transport direction of the film carrier tape. 2. A film carrier tape having a plurality of sprocket holes formed therein, configured to pass through the implant mold while being guided by a pilot device, wherein the pilot device is a film carrier tape. The base film tape can be positioned at an accurate position by fitting the positioning pin provided in the pilot device into the sprocket hole by using the sprocket hole formed in the sprocket hole. An implant device for a film carrier tape for mounting electronic components according to claim 1. 3. An implant hole is punched by the pin in a film carrier tape having a metal layer formed on one side or both sides using an implant mold having a pin, and the implant hole is formed by punching. In the method of implanting a film carrier tape for mounting electronic parts, the implant metal material of a metal sheet material for implant is embedded by punching in the hole for implant which is punched, with respect to the film carrier tape formed by punching. In the implant portion, when the implant metal material is embedded in the implant hole by punching, the implant metal material is supplied so as to intersect with the transport direction of the film carrier tape. Method of implanting film carrier tape. 4. A film carrier tape having a plurality of sprocket holes formed therein is configured to pass through the implant mold while being guided by a pilot device, and the pilot device is a film carrier tape. The base film tape can be positioned at an accurate position by fitting the positioning pin provided in the pilot device into the sprocket hole by using the sprocket hole formed in the sprocket hole. The method for implanting a film carrier tape for mounting electronic components according to claim 3. 5. An implant hole is punched by the pin in a film carrier tape having a metal layer formed on one side or both sides using an implant die having a pin, and the implant hole is formed by punching. In the method of implanting a film carrier tape for mounting electronic parts, the implant metal material of a metal sheet material for implant is embedded by punching in the hole for implant which is punched, with respect to the film carrier tape formed by punching. In the implant portion, when the implant metal material is embedded in the implant hole by punching, the implant metal material is supplied so as to intersect with the transport direction of the film carrier tape. Method for manufacturing film carrier tape. 6. A film carrier tape having a plurality of sprocket holes formed therein is configured to pass through the implant mold while being guided by a pilot device, and the pilot device is a film carrier tape. The base film tape can be positioned at an accurate position by fitting the positioning pin provided in the pilot device into the sprocket hole by using the sprocket hole formed in the sprocket hole. A method for manufacturing a film carrier tape for mounting electronic parts according to claim 5.