JP2003197652A - Mounting apparatus of semiconductor element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting apparatus of a semiconductor element whereby a space occupied by the mounting apparatus is reduced and the oxidation of the semiconductor element on a semiconductor supply device due to a heating body is prevented (heat shielding). <P>SOLUTION: Below a heater block 61, a heat shielding body 63 is provided which has an upper area equal to or slightly larger than a bottom area of the heater block 61. The heat shielding body 63 prevents a semiconductor element 23 placed on a semiconductor supply device 20 from being oxidized by the heat of the heater block 61. Namely, the heat shielding body 63 is provided with a space between the heater block 61 and a sheet 22 of the semiconductor supply device 20 moving below the heater block 61. The heat shielding body has a medium path space 64, to which a cooling medium is applied, and a shielding plate 65 which is placed with a space on the side of the heater block 61 near the semiconductor supply device 20. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor element mounting apparatus for mounting a semiconductor element on a work such as a heat sink or a ceramic substrate. More specifically, workpieces such as heat sinks and ceramic substrates that are intermittently fed by the transport device are supplied to the transport path at the supply station by the supply device, solder is applied to the work at the solder application station by the solder application device, and mounting is performed. The present invention relates to a semiconductor device mounting device in which a semiconductor device is mounted on a workpiece by a mounting device at a station via solder, and a work on which the semiconductor device is mounted is taken out by an ejection / ejecting device at an ejection station.

[0002]

2. Description of the Related Art In a conventional mounting apparatus, a suction nozzle for mounting a semiconductor element on a work (heat sink or ceramic substrate) is moved to a position where the semiconductor element on the stationary semiconductor supply apparatus is located, and suction is performed. And moved to the work position on the transport path and placed.

[0003]

However, in the method described above, the suction nozzle takes a long time to mount a work, and it is not possible to mount the work efficiently. The semiconductor element is in a state of being easily oxidized by receiving heat from a heating body such as a heater block. Also,
Since the semiconductor supply device is stationary, it is necessary to take space in terms of location. In order to solve this, the semiconductor supply device is freely moved to shorten the transfer time. However, when the semiconductor element mounted on the sheet of the semiconductor supply device is moved below the heating body, the semiconductor element on the sheet of the semiconductor supply device is affected by the heat of the heating body and is oxidized. Therefore, a heat shield plate for preventing heating can be provided to keep the distance between the heating element and the semiconductor element close to a certain degree. However, as the capacity of the heater increases with the increase in the size of the work such as the heat sink, the semiconductor element on the sheet is not oxidized under the influence of the heat of the heating body, so that the distance between the heat shield plate and the semiconductor element is further increased. I needed to unfold it.

Therefore, an object of the present invention is to provide a mounting device for a semiconductor element which can reduce the space occupied by the mounting device and prevent the semiconductor element on the semiconductor supply device from being oxidized (heat is blocked) by a heating element.

[0005]

Therefore, the first invention is
Workpieces such as heat sinks and ceramic substrates that are intermittently fed by the carrier device are supplied by the supply device onto the carrier path at the supply station, solder is applied on the work by the solder application device at the solder application station, and by the installation device at the installation station. A semiconductor element mounting device in which a semiconductor element taken out from a semiconductor supply device is mounted on the work piece via solder, and a work piece mounted with the semiconductor element is taken out by a discharge and take-out device at a discharge station, wherein A medium in which a semiconductor supply device is movable below a heating body for heating the work on the conveyance path, and a cooling medium is flown between the semiconductor supply device moved below the heating body and the heating body. A heat shield having a passage space is provided.

A second aspect of the invention is characterized in that the heat shield has a heat shield plate which is arranged laterally of the heating body near the semiconductor supply device with a space. To do.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In FIG. 1, reference numeral 1 denotes a semiconductor element mounting apparatus, which performs a predetermined work on the work 3 while intermittently feeding a work 3 such as a heat sink or a ceramic substrate supplied from the outside of the mounting apparatus 1 by a carrier device 2. After that, it is taken out of the mounting apparatus 1.

The mounting apparatus 1 has a supply station I, a solder coating station II, a mounting station III and a discharge station IV from the upstream side. Figure 2
3 is a vertical sectional view of the mounting station III, and FIG.
Shows a vertical side view of the solder coating station II. As shown in FIG. 3, a closed space 4 is formed in the device body 1A.

The transfer device 2 provided in the closed space 4 is provided for transferring the transfer 5 provided along the transfer direction of the work 3 and each work 3 on the transfer path 6 so as to move. A plurality of feed claws 7 provided at predetermined intervals on the transfer 5 and a reciprocating drive source (not shown) for reciprocating the transfer 5 by one pitch of a predetermined length.
Then, the transfer source 5 is moved by one pitch forward operation by the drive source, and is then swung about the lower end as a fulcrum to move the work 3
Swing drive source (not shown) for releasing the locking between the feed claw 7 and the feed claw 7.
It has and.

Reference numeral 8 denotes a plurality of gas supply pipes for supplying nitrogen gas or a mixed gas of nitrogen and hydrogen to the closed space 4 in order to prevent or reduce the oxidation of the work 3 in the closed space 4, Each gas supply pipe 8 is connected to a gas supply source (not shown) through each flow rate controller.

In FIG. 2, a pipe 10 for preventing overrun when the work 3 in the closed space 4 is vacuum-sucked and carried at a predetermined position on the carrying path 6,
A vacuum suction pipe 41 via a switching valve 43, and a gas supply pipe 42 for supplying an antioxidant gas such as nitrogen gas or a mixed gas of nitrogen and hydrogen into the closed space 4 in order to prevent or reduce oxidation. It is connected. Usually, the pipe 10 is connected to the vacuum suction pipe 41 via a switching valve 43 to suck the work 3. Here, when the predetermined position for checking whether or not the work 3 is present is, for example, the mounting station III, when the work 3 is not supplied to the mounting station III, a vacuum sensor (not shown) provided on the pipe 10 is provided. ), The switching valve 43 is switched, and the antioxidant gas is supplied from the supply source (not shown) to the mounting station III through the gas supply pipe 42. Further, as shown in a vertical sectional side view of the mounting device 1 in the mounting station III of FIG. 2, an opening 11 is formed in the upper surface of the closed space 4, and a shutter 13 for opening and closing the opening 11 by a cylinder 12 is provided. This configuration is the same in the supply station I and the solder coating station II as well. In addition, a transparent glass window 14 is provided between each station, and the inside of the apparatus main body 1A is opened through the window 14.
For example, the operator can see the applied state of the wire solder and the attached state of the semiconductor element such as the bare chip.

First, in the supply station I, the tray 1
The work 3 housed in line on 5 is taken out while the suction nozzle 15A of the supply device moves in the plane direction and the vertical direction by a drive source (not shown), and the shutter 12 is moved by the cylinder 12 to open the work 11. Are sequentially supplied to the conveying path 6 via the
3 is moved to close the opening 11. Then, as described above, the work 3 on the transfer path 6 is sequentially transferred by the transfer device 2 one by one.
It will be intermittently fed pitch by pitch.

In the next solder coating station II, the shutter 13 is moved by the cylinder 12 and the wire solder as a bonding material is coated on the work 3 on the transport path 6 through the opening 11 by a solder coating device (not shown). After this application, the shutter 13 is moved to close the opening 11. It should be noted that this solder coating device is configured to be movable in the plane direction and the vertical direction by a drive source (not shown). Further, as shown in FIG. 2, a heater block 61, which is a heating body in which a heater 61A is embedded, is provided in the lower part of the transport path 6, and the work 3 is heated via the formation block 6A of the transport path 6, and the wire The solder is applied while melting. As will be described later, the semiconductor supply device 20 sometimes enters below the transport path 6 (heater block 61) below the heater block 61, so that the semiconductor element 23 mounted on the semiconductor supply device 20 is placed in the heater block 61. A heat shield 63 for preventing oxidation by the heat is provided with an upper area equal to or slightly larger than the bottom area of the heater block 61.

That is, the heat shield 63 moves to a position below the heater block 61, and the semiconductor supply device 20 moves.
Is provided so as to have a space between the seat 22 and the heater block 61, and has a medium passage space 64 through which a cooling medium from a supply source (not shown) flows through a valve 66 and an inlet 64A. A heat shield plate 65 is also provided in the side of the heater block 61 near the apparatus 20 with a space. A fluid such as water or air is used as the cooling medium, and the cooling medium flows into the medium passage space 64 through the valve 66 and is discharged to the outside of the mounting device through the valve 67 on the other end side. is there.

At the next mounting station III, the suction nozzle 16 of the mounting device moves in the plane direction and the vertical direction by a drive source (not shown), and the X of the semiconductor supply device 20
The semiconductor element 23 such as a dicing bare chip arranged on the sheet 22 on the Y table 21 is adsorbed and taken out, and the shutter 13 is moved by the cylinder 12 to move the shutter 13 through the opening 11 and the work 3 on the conveyance path 6. It is mounted via wire solder on top, and after mounting, the shutter 13 is moved to close the opening 11.

A sheet mount 22A is installed on the XY table 21, and the wafer sheet 22 is placed on the seat mount 22A. A push-up device 24 having a push-up needle that pushes up the semiconductor element 23 from below is installed just below the point where the suction nozzle 16 descends.

Next, the semiconductor supply device 20 will be described. When the Y-axis motor 251 fixed to the support body 254 is driven, the Y-axis 25, which is a ball screw, rotates via the coupling 252, and the nut body 253 into which the Y-axis 25 fits moves in the Y direction. Also, the nut body 25
3, a support 264 is fixed, and when the X-axis drive motor 261 fixed to the support 264 is driven, the X-axis 26, which is a ball screw, rotates via the coupling 262,
The nut body 263 with which the X axis 26 is fitted moves in the X direction. Therefore, the X-axis drive motor 261 and the Y-axis motor 2
When 51 is driven, as a result, the XY table 21 moves in the XY directions on the plane, so that the seat mount 22A
Also, the semiconductor element 23 to be taken out on the wafer sheet 22 moves above the immovable (in the plane direction) push-up device 24.

The semiconductor element 23 taken out by the suction nozzle 16 is mounted on the work 3. Therefore,
The XY table 21 is moved in order to take out the semiconductor elements 23 on the wafer sheet 22 one after another.
A part of the semiconductor elements 23 on 2 may enter below the conveying path 6 of the mounting apparatus 1 like the moving range S of the sheet 22 shown by the chain double-dashed line in FIG. Therefore, as shown in FIG. 2, the heat shield 63 is provided so that the semiconductor element 23 on the sheet 22 does not receive heat from the heater block 61 installed in the lower portion of the transport path 6.

That is, the sheet 2 of the semiconductor supply device 20.
Even if 2 moves below the heater block 61, the semiconductor element 23 on the sheet 22 is removed from the heater block 61 by the heat shield 63 having the medium passage space 64 through which the cooling medium flows through the valve 66. Oxidation is prevented because it shields heat. Even if the sheet 22 moves below the heater block 61, the heat shield plate 65 of the heat shield 63 also shields heat toward the semiconductor element 23 on the sheet 22. Therefore, oxidation is surely prevented.

Therefore, the semiconductor element 23 mounted on the seat 22 is hardly affected by the heat of the heater block 61, and the seat 2 on the XY table 21 is not affected.
Furthermore, the space between the semiconductor element 23 and the heater block 61 below the transport path 6 can be narrowed, and the space occupied by the device can be reduced.

Above the transport path 6 in the subsequent step of the mounting station III, the work 3 on which the semiconductor element 23 has been mounted is finished.
In order to prevent oxidation by rapid cooling of the air, an air curtain 30 of an antioxidant gas such as nitrogen gas is formed as shown in FIGS. 1, 5 and 6. The air curtain 3
0 is formed in the closed space 4 over the entire area in the direction orthogonal to the conveying direction, and blows an antioxidant gas onto the workpiece 3 from above the conveying path 6 of the workpiece 3. For example, by making a plurality of holes in the pipe 31 arranged above the transport path 6,
Gas supply valve 44 communicating with a gas supply source (not shown)
The antioxidant gas is ejected from the hole of the pipe 31 through the.

As shown in FIG. 1, the air curtain 30 has a mounting station III and a discharge station IV.
In the middle of the above, it is preferable to be closer to the mounting station III if possible. In this way, the antioxidizing gas, which has both antioxidation and early cooling, is ejected to the work 3 and the mounted semiconductor element 23, so that the oxidation is avoided. As described above, when the air curtain 30 is provided, the heater block 61 is not required on the downstream side of the air curtain 30, and the closed space 4 is not formed above the transport path 6 after the air curtain 30. The air curtain 30 is located at the work outlet (opening) of the closed space 4, and the air curtain 30 prevents outside air from entering the closed space 4 or leakage of the antioxidant gas from the closed space 4.

At the final discharging station IV, the work 3 on the carrying path 6 on which the semiconductor element is mounted is taken out by a suction nozzle 17 of a discharging and taking-out device which moves in a plane direction and a vertical direction by a driving source (not shown), It is stored on the tray 18, which is a storage device.

As described above, each work, that is, the wire solder is applied onto the work 3 while the work 3 on the transfer path 6 supplied at the supply station I is intermittently fed by the transfer device 2 one pitch at a time. Alternatively, the semiconductor element 23 is mounted on the work 3, or the work 3 is taken out from the transport path 6 and stored.

Moreover, the shutter 13 is moved by the cylinder 12 only when the work space supply, wire solder coating, semiconductor element mounting, and work removal work are performed by forming the closed space 4 in the apparatus body 1A. Since the opening 11 is opened by doing so, various operations can be performed without impairing the oxidation preventing / reducing atmosphere.

Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention includes various modifications described above without departing from the spirit of the invention. It is intended to cover alternatives, modifications or variations.

[0027]

As described above, according to the present invention, even if the semiconductor supply device moves below the heating body, the semiconductor element can receive the heat from the heating body by the heat shield having the medium passage space through which the cooling medium flows. Since the heat is shielded, the oxidation is prevented, and since the heat shield plate of the heat shield also shields the heat toward the semiconductor element of the semiconductor supply device, the oxidation is surely prevented. Further, since the heat can be shielded as described above, the space between the heating body and the semiconductor supply device can be narrowed and the space occupied by the device can be reduced.

[Brief description of drawings]

FIG. 1 is a plan view of a mounting device.

FIG. 2 is a vertical sectional view of a mounting station III.

FIG. 3 shows a vertical side view of a solder application station II.

FIG. 4 is a plan view showing a mechanism of a semiconductor supply device.

FIG. 5 is a cross-sectional view of a surface of the air curtain device that is orthogonal to the transport path.

FIG. 6 is a front view of a main part of the mounting device.

[Explanation of symbols]

1 Semiconductor device mounting device 1A device body 2 Conveyor 3 work 4 closed space 6 transport paths 20 Semiconductor supply equipment 23 Semiconductor element 61 Heater block (heating body) 63 Heat shield 64 Coolant passage space 65 heat shield

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Yoshiteru Okamoto             2-5-3 Keihan Hondori, Moriguchi City, Osaka Prefecture             Within Yo Denki Co., Ltd. F-term (reference) 5F047 FA51 FA52

Claims (2)

[Claims] 1. A work such as a heat sink or a ceramic substrate which is intermittently fed by a carrying device is fed by a feeding device onto a feeding path at a feeding station, and solder is applied on the work by a solder applying device at a solder applying station and mounted. A semiconductor device mounting device in which a semiconductor device taken out from a semiconductor supply device by a mounting device in a station is mounted on the work through solder, and a work in which the semiconductor device is mounted is taken out by a discharge / eject device in a discharge station. Where the semiconductor supply device is movable below a heating body for heating the work on the transfer path, and cooling is performed between the semiconductor supply device and the heating body moved below the heating body. Mounting of a semiconductor element, characterized in that a heat shield having a medium passage space through which a medium flows is provided. apparatus. 2. The heat shield comprises a heat shield plate which is disposed laterally of the heating body near the semiconductor supply device with a space therebetween. A mounting device for a semiconductor element as described above.