JP2003197651A - Die attach film, method of manufacturing semiconductor device using the same, and the semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive sheet which has an excellent expanding property and high resistance against chipping in a wafer processing step to simplify the step and reduce the cost in a semiconductor assembling step, and to provide a die attach film which can be used as a die attach film in an IC chip bonding step. <P>SOLUTION: In a film composed of a protective film, an adhesive layer, and a light-transmitting substrate, a die attach film with a dicing sheet function is provided, in which peeling strength between the protective film and the adhesive layer is 0.1 to 0.9 times larger than peeling strength between the light- transmitting substrate and the adhesive layer. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die attach film, a semiconductor device manufacturing method using the same, and a semiconductor device. More specifically, the present invention relates to a die attach film for wafer processing used when processing a semiconductor wafer of silicon, gallium, arsenic, etc., a method for manufacturing a semiconductor device using the same, and a semiconductor device.

[0002]

2. Description of the Related Art In recent years, in response to higher functionality of electronic equipment and expansion to mobile applications, demands for higher density and higher integration of semiconductor devices have been increased, and high capacity and high density of IC packages have been advanced. . As a method for manufacturing these semiconductor devices, a pressure-sensitive adhesive sheet is attached to a semiconductor wafer made of silicon, gallium, arsenic, etc., and cut and separated into individual semiconductor elements by dicing, expanding, and individual chip pickup performed. Then, the semiconductor chip is transferred to a process for assembling a semiconductor device in which a semiconductor chip is die-bonded to a metal lead frame, a tape substrate or an organic hard substrate.

The semiconductor chip thus picked up is bonded to a lead frame or a substrate via a die attach material such as a liquid epoxy adhesive in a die bonding process to manufacture a semiconductor device. However, if the chip is small for mobile use, it is difficult to apply an appropriate amount of adhesive, and if the adhesive sticks out of the chip or if it is a large chip for large capacity applications,
On the other hand, there is a problem that the adhesive strength cannot be sufficient because the amount of the adhesive is insufficient. In addition, since the adhesive application process is complicated, improvements and improvements are required in order to simplify the process.

To solve this problem, it has been proposed to use a film adhesive as a die attach material instead of the liquid die attach material, and in some cases, a film adhesive is used. A device to attach to a die,
A new die mount device for film is required, resulting in complicated processes and higher production costs. Therefore, it is required to simplify the semiconductor device assembling process while using the existing infrastructure.

As a method of solving such a problem, there is a pressure-sensitive adhesive sheet for wafer sticking, which has both a wafer fixing function at the time of processing a semiconductor wafer and a die attach function in a die bonding process. That is, using the existing dicing film infrastructure, a film that is a composite of a dicing film and a die attach film is attached,
After dicing, only the base material is peeled off to obtain a die with a die attach material.

When the die attach film with a dicing sheet function is used, the protective film attached for protecting the adhesive layer is peeled off before use. However, there were cases where the protective film did not peel off well due to the adhesion with the adhesive layer.

[0007]

DISCLOSURE OF THE INVENTION In order to improve and improve the above-mentioned conventional techniques, the present invention makes it possible to smoothly remove a protective film from an adhesive when using a film having the functions of a dicing film and a die attach film. It is a technology for peeling, and it brings about easy peeling from the protective film by adding a filler to the adhesive layer, and a dicing sheet with excellent chipping resistance and crack characteristics as a dicing film during dicing after peeling of the protective film. And a die attach film that can be used as an adhesive at the time of die mounting, has excellent thickness uniformity, adhesive strength, and shear strength characteristics, and can withstand severe wet heat conditions, and a semiconductor device using the same. To provide a manufacturing method and a semiconductor device.

[0008]

Means for Solving the Problems The present invention provides (1) a film comprising a protective film, a tacky adhesive layer, and a light-transmissive substrate, wherein the peel strength between the protective film and the tacky adhesive layer is light transmissive. A die attach film with a dicing sheet function, which is 0.1 times or more and 0.9 times or less the peel strength between the base material and the adhesive layer, and (2) the peel strength between the protective film and the adhesive layer is 10 g. / 25mm or more and 70g / 25mm
The die attach film with a dicing sheet function according to item (1) below, and (3) the adhesive layer has an average particle size of 0.
The die attach film with a dicing sheet function according to item (1) or (2), which contains a filler of 1 to 25 μm. (4) The adhesive layer is silver, titanium oxide, silica,
And a die attach film with a dicing sheet function according to item (3), which contains one or more fillers selected from the group consisting of mica and (5) an adhesive layer,
375 including (A) a resin component having an imide ring, (B) an ultraviolet curable adhesive component, and (C) a thermosetting adhesive component
The die attach film with a dicing sheet function according to any one of (1) to (4), which has a transmittance of ultraviolet light having a wavelength shorter than nm of 20% or less, (6) (A) (1) to
A step of peeling the protective film from the adhesive layer of the die attach film with a dicing sheet function according to any one of the items (5) and bonding the back surface of the silicon wafer to each other.
(B) a step of dicing the silicon wafer into individual dies, and (C) irradiating ultraviolet rays on the surface of the die attach film after dicing to cure the contact interface of the adhesive layer with the light-transmitting substrate. A step of: (D) picking up the die having the die attach film left on the back side thereof after removing the die from the light transmissive substrate after (D) curing the adhesive layer with ultraviolet rays; Or a step of heating and adhering to a substrate via a die attach film, the method of manufacturing a semiconductor device, (7), (1)
A semiconductor device obtained by bonding a semiconductor element and a lead frame or a substrate with the die attach film with a dicing sheet function according to any one of (5) to (5).

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention is a film comprising a protective film, an adhesive layer and a light-transmitting substrate. Examples of the protective film used in the present invention include polyethylene terephthalate film, polyethylene film, polypropylene film, polyester film, polyimide film, polyetherimide film, polyether naphthalate film and methylpentene film. These films may be treated with a silicone-based or silica-based release agent.

The thickness of the protective film and the light-transmitting substrate used in the present invention is preferably 20 to 200 μm, and particularly preferably 25 to 100 μm.

Examples of the light-transmitting substrate used in the present invention include polypropylene film, polyethylene film, polybutadiene film, polyvinyl chloride film and the like, but 30 to 70 parts by weight, preferably 40 to 60 parts by weight of polypropylene. A mixture of a resin and 70 to 30 parts by weight, preferably 60 to 40 parts by weight of a polystyrene block and a copolymer of vinyl isoprene block is preferable.

The peel strength between the adhesive layer and the protective film of the present invention is 10 g / 25 mm or more and 70 g / 25 mm.
It is preferably not more than 20 g / 2, particularly preferably 20 g / 2.
It is 5 mm or more and 60 g / 25 mm or less. 10 g /
If it is less than 25 mm, the protective film tends to peel off too easily, and if it exceeds 70 g / 25 mm, the peel strength is large and the adhesive layer may remain on the protective film side.

The peel strength between the adhesive layer of the present invention and the light-transmitting substrate is preferably 80 g / 25 mm or more, and particularly preferably 90 g / 25 mm or more. 8
If it is less than 0 g / 25 mm, the adhesive layer may be brought to the protective film side.

The adhesive layer of the present invention has an average particle size of 0.1 to 2
It preferably contains a filler of 5 μm. If the average particle diameter is less than 0.1 μm, the effect of adding a filler is small, and if it exceeds 25 μm, the adhesive strength as a film may be reduced.

The filler used in the adhesive layer of the present invention is preferably silver, titanium oxide, silica, mica or the like.

The content of the filler is 0.1% to 30% by weight.
If it exceeds 30%, the film becomes brittle, and if it is less than 0.1%, the effect of adding a filler cannot be expected.

In the present invention, the tacky-adhesive used in the tacky-adhesive layer contains a component that has sufficient tackiness when uncured and is cured by irradiation with ultraviolet rays of 370 nm or less,
It is preferable that it has a characteristic that it loses tackiness at the interface between the adhesive layer cured by irradiation with ultraviolet rays and the adherend.

The adhesive layer preferably has an absorptance of ultraviolet light having a wavelength of 370 nm or less of 60% or more, and curing proceeds only on the surface irradiated with ultraviolet light. The absorption rate is more preferably 7
It is 0% or more, more preferably 80% or more.

The tacky-adhesive agent used in the present invention preferably contains a resin having an imide ring. By having an imide ring, absorption of ultraviolet light is further promoted, and the absorption rate of ultraviolet light is at least the above value. The light is absorbed on the surface irradiated with ultraviolet light. Further, it is preferable that the tacky-adhesive agent further contains an ultraviolet curable adhesive component and a thermosetting adhesive component.

Examples of the resin having an imide ring used in the present invention include a polyimide resin, a polyamideimide resin, a polyetherimide resin, a polyetheretherimide resin and the like. Among them, the polyimide resin is preferable.

As the polyimide resin, an aromatic tetracarboxylic dianhydride, a diaminopolysiloxane represented by the general formula (1), and an aromatic or aliphatic diamine are reacted to give a compound of the general formula ( The polyimide resin represented by 2) is more preferable.

[0022]

[Chemical 1]

[0023]

[Chemical 2]

(In the formulas (1) and (2), R ₁ and R ₂ are divalent aliphatic groups or aromatic groups having 1 to 4 carbon atoms,
R ₃ , R ₄ , R ₅ and R ₆ are monovalent aliphatic groups or aromatic groups, R ₇ and R ₈ are tetravalent aliphatic groups or aromatic groups, R
₉ represents a divalent aliphatic or aromatic group, and m: n is 5
-80: 95-20. k is an integer of 1 to 50, and both formulas (1) and (2) represent the same integer. )

The diaminopolysiloxane is preferably a diaminopolysiloxane having 1 to 9 and / or 10 to 50 repeating units as k in the general formula (1).

The aromatic tetracarboxylic dianhydride used in the present invention includes 3,3,4,4'-biphenyltetracarboxylic dianhydride and 3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride. Anhydride, pyromellitic dianhydride, 4,4'-oxydiphthalic dianhydride, ethylene glycol bistritomet dianhydride, 4,4 '-(4,
4'-isopropylidenediphenoxy) phthalic acid dianhydride and the like. The above aromatic tetracarboxylic dianhydrides may be used alone or in combination of two or more.

Examples of the diaminopolysiloxane represented by the general formula (1) used in the present invention include 1,3-bis (3-aminopropyl) tetramethylsiloxane and α, ω-bis (3-aminopropyl) polydimethyl. Examples include siloxane. Among them, in the general formula (1), k is 1 to 9
And / or 10 to 50 is preferable. Adhesiveness is improved by using 1 to 9 and fluidity is improved by using 10 to 50, and it can be selected according to the purpose, but it is more preferable to use both in combination.

The aromatic or aliphatic diamine used in the present invention includes 3,3'-dimethyl-4,4'-diaminobiphenyl, 4,6-dimethyl-m-phenylenediamine and 2,5-dimethyl-p-. Phenylenediamine,
2,4-diaminomesitylene, 4,4'-methylenedi-
o-toluidine, 4,4'-methylenediamine-2,6
-Xylidine, 4,4'-methylene-2,6-diethylaniline, 2,4-toluenediamine, m-phenylenediamine, p-phenylenediamine, 4,4'-diaminodiphenylpropane, 3,3'-diaminodiphenyl Propane, 4,4'-diaminodiphenylethane, 3,
3'-diaminodiphenylethane, 4,4'-diaminodiphenylmethane, 3,3'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulfide, 3,
3'-diaminodiphenyl sulfide, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl ether, 3,3'-diaminodiphenyl ether, benzidine, 3 , 3'-diaminobiphenyl, 3,3'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dimethoxybenzidine, bis (p-aminocyclohexyl) methane, bis (p-β-amino-t-butyl) Phenyl) ether, bis (p-β-methyl-δ-aminopentyl)
Benzene, p-bis (2-methyl-4-aminopentyl) benzene, 1,5-diaminonaphthalene, 2,6-
Diaminonaphthalene, 2,4-bis (β-amino-t-
Butyl) toluene, 2,4-diaminotoluene, m-xylene-2,5-diamine, p-xylene-2,5-diamine, m-xylylenediamine, p-xylylenediamine, 2,6-diaminopyridine, 2,5-diaminopyridine, 2,5-diamino-1,3,4-oxadiazol, 1,4-diaminocyclohexane, piperazine,
Methylenediamine, ethylenediamine, tetramethylenediamine, pentamethylenediamine, hexamethylenediamine, 2,5-dimethylhexamethylenediamine, 3
-Methoxyhexamethylenediamine, heptamethylenediamine, 2,5-dimethylheptamethylenediamine, 3
-Methylheptamethylenediamine, 4,4-dimethylheptamethylenediamine, octamethylenediamine, nonamethylenediamine, 5-methylnonamethylenediamine,
Decamethylenediamine, 1,3-bis (3-aminophenoxy) benzene, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 1,3-bis (4-aminophenoxy) benzene, bis- 4- (4-aminophenoxy) phenyl sulfone, bis-4- (3-aminophenoxy) phenyl sulfone and the like can be mentioned. The above diamines may be used alone or in combination of two or more.

Usually, when synthesizing a polyimide resin, the solvent used is a solvent having a very high boiling point such as N-methylpyrrolidone. Therefore, it has been difficult to use it in the manufacture of semiconductor devices. is there. However, by using a low boiling point solvent such as anisole as the solvent of the polyimide resin used in the present invention, the drying temperature during film processing can be set low.

In the present invention, a silicone-modified polyimide resin such as the polyimide resin represented by the general formula (2) is more preferable, but it is more preferable that it is soluble in a low boiling point solvent such as anisole. As the ratio of silicone modification, from the solubility in solvent and the film characteristics,
The ratio of m to n in the general formula (2) is 5 to 80:95.
It is preferably -20.

The ultraviolet-curable adhesive component used in the present invention is preferably an acrylic compound (A-1), and examples thereof include acrylic acid or methacrylic acid ester monomers and copolymers of acrylic acid or methacrylic acid derivatives. . Examples of the acrylic acid or methacrylic acid ester include alkyl esters such as methyl acrylate, methyl methacrylate, butyl acrylate, and butyl methacrylate, benzyl esters, cycloalkyl esters, ethylene glycol diacrylate, ethylene glycol dimethacrylate, and diacrylic acid. 1,6-hexanediol, 1,6-hexanediol dimethacrylate,
Glycerin diacrylate, glycerin dimethacrylate,
Difunctional acrylates such as 1,10-decanediol diacrylate and 1,10-decanediol dimethacrylate,
Examples thereof include polyfunctional acrylates such as trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, dipentaerythritol hexaacrylate, and dipentaerythritol hexamethacrylate. Of these, alkyl esters are preferable, and particularly preferably the ester moiety has 1 to 1 carbon atoms.
Acrylic acid and methacrylic acid alkyl ester of No. 5.

The molecular weight of the acrylic compound (A-1) other than the monomer used in the present invention is preferably 80,000 or more, and particularly preferably 150,000 to 500,000. Further, the glass transition temperature of the acrylic compound is usually 30 ° C. or lower, preferably about −50 to 0 ° C., and a compound that exhibits adhesiveness in a temperature range near room temperature is preferable.

The copolymer having an acrylic acid or methacrylic acid derivative as a constitutional unit used in the present invention is a copolymer of at least one type of acrylic acid or methacrylic acid alkyl ester and bisphenol A type (meth) acrylic acid ester. Coalescence is preferred. A combination of a bifunctional di (meth) acrylic acid ester and glycidyl (meth) acrylate is also preferable.

The content of the component unit derived from acrylic acid or methacrylic acid ester is usually 20 to 55 mol%, preferably 30 to 40 mol% with respect to 100 parts by weight of the resin having an imide ring. Examples of acrylic acid and methacrylic acid alkyl ester include methyl acrylate, methyl methacrylate, butyl acrylate, butyl methacrylate and the like. If it is less than 20 mol%, the adhesive strength will be poor, and if it exceeds 55 mol%, the adhesion to the protective film will be unnecessarily high.

Further, by introducing an acrylic acid or methacrylic acid ester of an ultraviolet curable resin having a hydroxyl group such as a hydroxy group in the molecule, it is possible to easily control the adhesiveness to the adherend and the characteristics of the adhesive. be able to.

By further mixing a photopolymerization initiator (A-2) in the UV-curable pressure-sensitive adhesive component, the curing time at the time of UV irradiation and the amount of light irradiation can be reduced. It is also an important component for peeling from the substrate and using it as a die attach film.

Specific examples of such a photopolymerization initiator (A-2) include benzophenone, acetophenone, benzoin, benzoin isobutyl ether, methyl benzoin benzoate, benzoin benzoic acid, benzoin methyl ether, benzylfinyl sulfide, Benzyl,
Examples thereof include dibenzyl and diacetyl.

The UV-curable pressure-sensitive adhesive component used in the present invention is preferably composed of the above-mentioned components (A-1) to (A-2), and their compounding ratio is appropriately set according to the characteristics of each component. However, generally, the component (A-2) is preferably 3 to 30 parts by weight, relative to 100 parts by weight of the component (A-1),
It is more preferable to use about 5 to 15 parts by weight. If it is less than 3 parts by weight, the effect of the photoinitiator is weakened.
If it exceeds the weight part, the reactivity becomes high and the storage stability becomes poor.

The thermosetting adhesive component used in the present invention is not cured by irradiation with ultraviolet rays, but a thermosetting reaction proceeds by heating to form a three-dimensional mesh, and a metal lead frame and tape or an organic hard substrate as an adherend. Firmly adhere.

Such thermosetting adhesive components are generally epoxy resin, phenol resin, urea resin,
It is formed of a thermosetting resin such as a melamine resin and a curing accelerator suitable for each. Various kinds of such thermosetting adhesive components are known, and various known thermosetting adhesive components can be used in the present invention without any particular limitation. Examples of such an adhesive component include a resin composition of an epoxy resin (B-1) and a heat-activatable latent epoxy resin curing agent (B-2).

Various well-known epoxy resins are used as the epoxy resin (B-1), but the molecular weight is usually 3
The epoxy resin having a molecular weight of 300 to 800, which is liquid at room temperature, and the molecular weight of 400 to 2000, preferably 500 to 15, are preferable.
It is desirable to use it in the form of a blend with a normal temperature solid epoxy resin of 00. The epoxy equivalent of the epoxy resin particularly preferably used in the present invention is usually 50 to 8
It is 000 g / eq.

Specific examples of such epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins and other bisphenol type epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, polyethylene glycol type epoxy resins. Resin etc. can be mentioned. These are 1
They may be used alone or in combination of two or more. Among the above, bisphenol type epoxy resin, cresol novolac type epoxy resin and phenol novolac type epoxy resin are particularly preferable.

In the present invention, the heat-activatable latent epoxy resin curing agent (B-2) is a type of curing which does not react with the epoxy resin at room temperature but is activated by heating above a certain temperature and reacts with the epoxy resin. It is an agent.

Thermally active latent epoxy resin curing agent (B-
As the activation method of 2), a method of generating an active species (anion or cation) by a chemical reaction by heating, a method of compatibilizing with an epoxy resin at room temperature to dissolve and start a curing reaction, and encapsulation of molecular sieves. There is a method of initiating a curing reaction by elution at a high temperature with a type of curing agent and a method of using microcapsules.

The heat-activatable latent epoxy resin curing agent is preferably dicyandiamide, an imidazole compound or a mixture thereof, and may be an adduct of 2-methylimidazole and isocyanate. These may be used alone or in combination of two or more.

In the thermosetting adhesive component used in the present invention, the above-mentioned heat-activatable latent epoxy resin curing agent (B-
2) is generally preferably 1 to 20 parts by weight, and particularly preferably 5 to 15 parts by weight, based on 100 parts by weight of the epoxy resin (B-1). If it is less than 1 part by weight, the effect of the resin curing agent is small, and if it exceeds 20 parts by weight, the reactivity becomes high and the storability deteriorates.

The pressure-sensitive adhesive used in the present invention preferably contains 20 to 80 parts by weight, and particularly preferably 30 to 30 parts by weight of an ultraviolet-curable adhesive component with respect to 100 parts by weight of the resin having an imide ring.
60 parts by weight is added, and the thermosetting adhesive component is preferably 20
˜80 parts by weight, particularly preferably 30 to 50 parts by weight can be added to develop tackiness, adhesiveness and heat resistance.

In the method for producing the die attach film having a dicing sheet function of the present invention, first, a pressure-sensitive adhesive resin composition containing the above components in the form of a varnish is formed on a release sheet by a comma coater, a die coater or a gravure coater. And the like, and the adhesive layer is formed by drying according to a generally known method. After that, the release sheet is removed to form an adhesive / adhesive film, which is laminated on a light-transmitting base material, and a protective film is further laminated on the adhesive film to form a protective film, an adhesive / adhesive layer, and a light-transmitting layer. It is possible to obtain a die attach film having a dicing sheet function, which is composed of a base material. Alternatively, a dicing sheet including a protective film (release sheet), a pressure-sensitive adhesive layer, and a light-transmissive substrate, which is laminated on a light-transmissive substrate on a pressure-sensitive adhesive layer formed on the release sheet. A functional die attach film can be obtained.

Alternatively, the adhesive composition is directly coated on a light-transmissive substrate by the same method, dried, and a protective film is laminated on the adhesive film to form a protective film and adhesive. It is possible to obtain a die attach film having a dicing sheet function, which comprises a layer and a light-transmitting substrate.

The thickness of the adhesive / bonding layer thus formed is preferably 3 to 100 μm, and more preferably 10 to 75 μm. If the thickness is less than 3 μm, the effect as a tacky adhesive is reduced, and if it exceeds 100 μm, it is difficult to produce a product, and the thickness accuracy deteriorates.

In the method of manufacturing a semiconductor device of the present invention, first,
After the protective film is peeled off from the adhesive layer of the die attach film with a dicing sheet function of the present invention on the back surface of the silicon wafer and the adhesive layer is attached, the silicon wafer with the die attach film is inserted through the die attach film as the dicing film. Then, the die attach film-attached silicon wafer is cut into individual pieces using a cutting means such as a dicing saw to obtain semiconductor chips.

Subsequently, the surface of the light-transmitting substrate of the die attach film attached to the semiconductor chip obtained as described above is irradiated with ultraviolet rays (center wavelength = about 365 nm).
Usually, the illuminance is set to 20 to 500 mJ / cm ² , and the irradiation time is set to the range of 5 to 600 seconds. Various conditions can be set according to the case of the above ultraviolet irradiation.

Next, only the light transmissive base material is peeled off while the die attach film is fixedly left on the back surface of the semiconductor chip.

In this way, the semiconductor chip to which the adhesive / bonding layer of the die attach film is fixed is directly heated to the metal lead frame or substrate via the adhesive / adhesive layer.
By pressure bonding, die bonding can be performed.
The heating / pressing condition is usually a heating temperature of 100 to 300 ° C. and a pressing time of 1 to 10 seconds, preferably 1
The heating time is 00 to 200 ° C. and the pressure bonding time is 1 to 5 seconds. Subsequently, when the die attach film contains a thermosetting adhesive component, as a post-treatment, by further heating, the thermosetting adhesive component in the die attach film is cured,
It is possible to obtain a semiconductor device in which a semiconductor chip and a lead frame, a substrate or the like are firmly bonded. The heating temperature in this case is usually about 100 to 300 ° C., preferably 1
The temperature is about 50 to 250 ° C., and the heating time is usually 1 to 24.
It is 0 minutes, preferably 10 to 60 minutes.

The finally hardened die-attach film has high heat resistance, and at the same time, a resin component having an imide ring which does not participate in heat curing contained in the die-attach film, for example, a polyimide resin having high heat resistance is hardened. The material has low brittleness, excellent shear strength and high impact resistance,
Has heat resistance.

[0056]

EXAMPLES Examples of the present invention will be described below, but the present invention is not limited to these examples.

(A) UV-curable adhesive component [(A-1) (meth) acrylic acid ester monomer]
1,6-hexanediol dimethacrylate (manufacturer: Kyoeisha Chemical Co., Ltd.) [(A-2) Photopolymerization Initiator] 2,2-dimethoxykey
1,2-Diphenylethan-1-one (Manufacturer: Ciba-Geigy Co., Ltd.)

(B) Thermosetting adhesive component [(B-1) Epoxy resin] (B-1-1) Bisphenol A type epoxy resin (trade name: Epicoat 1001, epoxy equivalent: 460 g / e)
q, manufacturer: Yuka Shell Epoxy Co., Ltd. (B-1-2) Cresol novolac epoxy resin (trade name: EOCN-1020-80, epoxy equivalent: 20)
0 g / eq, manufacturer: Nippon Kayaku Co., Ltd. [(B-2) Thermally active latent epoxy resin curing agent] Imidazole compound (trade name: 1B2MZ, manufacturer: Shikoku Kasei)

(C) Resin component containing imide group (C-1) Silicone-modified polyimide resin, more specifically,
As the diamine component, 1,3-bis (3-aminophenoxy) benzene (0.15 mol) and α, ω-bis (3-
Aminopropyl) polydimethylsiloxane (average molecular weight 837) (0.15 mol), with 4,4 'as the acid component
Anisole-soluble polyimide resin using oxydiphthalic acid dianhydride (0.30 mol) was obtained. Molecular weight is M
w = 60,000. (C-2) Silicone-modified polyimide resin, more specifically,
1,3-bis (3-aminophenoxy) benzene (0.09 mol) as a diamine component and α, ω-bis (3-aminopropyl) polydimethylsiloxane (average molecular weight 8
37) (0.21 mol), the acid component is 4,4'-
(4,4'-isopropylidenediphenoxy) phthalic acid 2
Anisole-soluble polyimide resin using an anhydride (0.30 mol) was obtained. The molecular weight is Mw = 50,000.

(D) Filler (D-1) Silver SF-65 (average particle size 3 μm) (Manufacturer: DMC ² Japan Co., Ltd.) (D-2) Silica filler SP-4B (average particle size 2 μm
m) (Manufacturer: Fuso Chemical Co., Ltd.)

Light-transmitting substrate Hibra 60 parts by weight Cleartec CT-H817 (manufactured by Kuraray) consisting of 40 parts by weight of polypropylene was formed into a film having a thickness of 100 μm by an extruder.

Example 1 The components were mixed in the proportions shown in Table 1 to obtain an adhesive composition. This adhesive composition was applied to 100 μm of polyethylene terephthalate substrate and dried to obtain an adhesive film. A die attach film with a dicing sheet function consisting of a protective film (polyethylene terephthalate substrate), an adhesive layer, and a light transmissive substrate is obtained by laminating a light transmissive substrate to this adhesive film. It was made. After peeling off the protective film of this die attach film, a semiconductor wafer is attached to the adhesive layer surface, fixed and held, and a dicing saw is used to rotate at a spindle speed of 50,000 rpm and a cutting speed of 50 mm / sec. It was cut to the chip size. Then, after irradiating the integrated light amount of 250 mJ / cm ² with ultraviolet rays for 20 seconds, the light-transmissive base material is peeled off from the semiconductor chip remaining on the die attach film, and then the semiconductor chip is attached via the adhesive layer. 42
-Alloy alloy lead frame, 180 ℃ -1MPa
Each item was evaluated as a dicing sheet and a die attach film by pressure bonding under the condition of -1.0 sec and die bonding. The results are shown in Table 2.

Example 2 The same operation as in Example 1 was carried out except that the mixing ratio of the tacky-adhesive component was changed as shown in Table 1.

<< Comparative Example 1 >> The mixing ratio of the adhesive component was
The same operation as in Example 1 was performed except that the changes were made as shown in Table 1.

[0065]

[Table 1]

[0066]

[Table 2]

The following evaluation methods were used to evaluate the examples and comparative examples. (1) Scattering of chips after dicing After dicing a semiconductor wafer, the number of semiconductor chips peeled off from the die attach film due to weak adhesion was evaluated. Chipping characteristics ○: Chips with a maximum width of 30 μm or less. Δ: The maximum width of the chip is 30 to 50 μm. ×: The maximum width of the chip is 50 μm or more. (2) Pickup property It was evaluated whether the semiconductor chip with the die attach film could be picked up (picked up) from the light-transmitting substrate by irradiating with ultraviolet rays after dicing the semiconductor wafer. ◯: Almost all chips can be picked up Δ: 50 to 90% of dicing chips can be picked up ×: Pickup 50% or less (3) With initial adhesive die attach film as die attach film A semiconductor chip is mounted on a lead frame of 42-alloy alloy at 180 ° C-1MPa-1.0s.
Die bonding was performed under the condition of ec, and the shear strength between the chip and the lead frame was measured and evaluated in the untreated state. (4) Adhesion after absorption of moisture 85
After moisture absorption treatment at 850 ° C./85% RH for 168 hours, the shear strength between the chip and the lead frame was measured and evaluated. ◯: Shear strength is 1 MPa or more Δ: Shear strength is 0.5 to 1.0 ×: Shear strength is less than 0.5 (5) UV absorptivity The UV absorptivity is measured by an ultraviolet absorptivity of 200.
UV light from nm to 375 nm was applied to the adhesive layer, and the absorptance was measured by an absorptiometer. (6) Adhesive force ratio The ratio of the 180 ° peel strength of the protective film and the adhesive layer to the 180 ° peel strength of the light transmissive substrate and the adhesive layer.

In the comparative example, the adhesion ratio is 1.5 times,
When the protective film was peeled off, an adhesive layer remained on the protective film side and could not be evaluated.

[0069]

According to the present invention, it has a function as a dicing sheet having excellent chipping resistance and crack characteristics as a dicing film at the time of dicing, can be used as an adhesive at the time of die mounting, and has a large thickness. It is possible to provide a die attach film which has excellent uniformity, adhesive strength, and shear strength characteristics and can withstand severe wet heat conditions. Further, a semiconductor device using the same has impact resistance and heat resistance equal to or higher than those of the liquid epoxy die attach material up to now.

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 4J004 AA01 AA16 AA18 AB01 AB05                       AB07 CA03 CA04 CA05 DA04                       DA05 DB02 DB03 FA05 FA08                 4J040 DF012 DF042 DF052 EB032                       EB112 EB132 EC002 EC062                       EC072 EH031 HA066 HA136                       HA306 HA356 JA09 JB02                       JB08 JB09 KA42 NA20 PA23                 5F047 BA33 BB03 BB19

Claims (7)

[Claims] 1. A film comprising a protective film, a tacky adhesive layer, and a light-transmitting substrate, wherein the peel strength between the protective film and the tacky adhesive layer is the peel strength between the light-transmitting substrate and the tacky adhesive layer. 0.1 times or more and 0.9 times or less of the die attach film with a dicing sheet function. 2. The die attach film with a dicing sheet function according to claim 1, wherein the peel strength between the protective film and the adhesive layer is 10 g / 25 mm or more and 70 g / 25 mm or less. 3. The die attach film with a dicing sheet function according to claim 1, wherein the tacky adhesive layer contains a filler having an average particle size of 0.1 to 25 μm. 4. The die attach film with a dicing sheet function according to claim 3, wherein the adhesive layer contains at least one filler selected from the group consisting of silver, titanium oxide, silica and mica. 5. An ultraviolet light having a wavelength shorter than 375 nm, wherein the adhesive layer contains (A) a resin component having an imide ring, (B) an ultraviolet curable adhesive component, and (C) a thermosetting adhesive component. The die attach film with a dicing sheet function according to claim 1, which has a transmittance of 20% or less. 6. A step of: (A) peeling the protective film from the tacky adhesive layer of the die attach film with a dicing sheet function according to any one of claims 1 to 5 and adhering it to the back surface of the silicon wafer; A step of dicing the silicon wafer into individual dies, and (C) a step of irradiating ultraviolet rays to the surface of the die attach film after dicing to cure the contact interface of the adhesive layer with the light-transmitting substrate.
(D) A pick-up step in which the die having the die attach film left on the back surface is peeled from the light-transmissive substrate and taken out after the adhesive layer is cured by ultraviolet light, and (E) the die is used as a lead frame or a substrate. And a step of heating and adhering through a die attach film, the method for manufacturing a semiconductor device. 7. A semiconductor device in which a semiconductor element and a lead frame or a substrate are bonded together by the die attach film with a dicing sheet function according to any one of claims 1 to 5.