JP2003189621A - Vehicle powering circuit device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vehicle powering circuit device that can reduce the number of components and the number of steps in operating process while securing excellent connection reliability, and its manufacturing method. <P>SOLUTION: A small power circuit part 8 and a jointing relay terminal 70 are soldered on a printed board 4. A bus bar assembly 6 and the printed board 4 are fixed to a metal base plate 2, on which a semiconductor module 1 is fixed. The main surface electrode terminal 5 of the semiconductor module 1 is connected to the bus bar 9 of the bus bar assembly 6. The signal electrode terminal 7 of the semiconductor module 1 is jointed to the jointing relay terminal 70 so that the jointing work becomes simple. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vehicle power circuit device.

[0002]

2. Description of the Related Art In a conventional electronic circuit device, a flexible cable, a printed circuit board or the like is used as a collective wiring body for a small current between electronic circuit parts (including an electronic circuit part having a single circuit function called an electronic circuit element). Has been adopted.

In all of these small current collective wiring bodies, a main portion of each wiring is integrated with an insulator to secure a relative space arrangement between the wirings and to protect each wiring from insulation. The exposed external connection end of the flexible cable is soldered to a printed circuit board or connected to a mating wiring member by connector coupling.

Among the electronic circuit components, electronic circuit components (high power electronic circuit components) that consume a large amount of power, such as semiconductor modules, are mounted on the surface of a metal base plate (also called a heat sink, base plate, cooling block, etc.) for heat dissipation. It is usually close contact. In addition, a bus bar is usually used for the wiring of the high-power electronic circuit component because a large current needs to flow therethrough. The high-power electronic circuit component is usually fixed to the bus bar by soldering, welding, or screw fastening, and it is difficult to use a flexible cable or a printed circuit board in terms of current capacity.

In a power circuit device such as a motor control device, the main electrode terminal of a high power electronic circuit component such as a power transistor is connected to the bus bar as described above, but the signal electrode terminal is connected to the printed circuit board side. It is necessary to be connected and to exchange signals with the control circuit on this printed circuit board. Therefore, in the power circuit device, the terminals of the high power electronic circuit component must be connected to both the bus bar and the printed circuit board, and moreover, the bottom surface of the high power electronic circuit component must be closely attached to the metal base plate. .

In order to manufacture a power circuit device having such a high power electronic circuit component, conventionally, for example, FIG.
As shown in FIG. 3, the high power electronic circuit component 100 is fixed to the metal base plate 200 with a screw or the like, and the printed circuit board 400 having the window 300 through which the high power electronic circuit component 100 penetrates is fixed above the metal base plate 200. The main electrode terminal 500 of the high power electronic circuit component 100 is connected to the bus bar 600 by screws or soldering, and the signal electrode terminal 700 of the high power electronic circuit component 100 is connected to the printed board 4.
It was soldered or fastened to 00 with a screw. Note that FIG. 5 shows a case where the signal electrode terminal 700 of the high-power electronic circuit component 100 is soldered to the conductive pattern 800 of the printed board 400.

[0007]

However, when the above-described power circuit device is used for a vehicle, it is necessary to eliminate the possibility of loosening due to vibration, and therefore the signal electrode terminal 700 of the high power electronic circuit component 100 is printed. Board 400
It is not preferable to use a screw for fastening, and it is more preferable to adopt a joining technique such as soldering or welding. However, when the signal electrode terminal 700 of the high power electronic circuit component 100 is directly soldered to the conductive pattern on the printed board, a special step of soldering the signal electrode terminal to the printed board is newly required. However, there is a problem that the number of man-hours increases.

To further explain, the work of directly soldering the signal electrode terminals of the high power electronic circuit component to the printed circuit board is performed by simultaneously soldering other small current circuit components on the back side of the printed circuit board by the jet soldering method. It is necessary to perform it in a process different from the attaching process, and it is difficult to perform it in the process of joining the terminals of the high power electronic circuit component to the bus bar.

That is, when this signal electrode terminal soldering work is performed by the back surface jet soldering method of the printed circuit board, the metal base plate is fixed to the high power electronic circuit component after that. However, when the metal base plate is closely attached and fixed to this high-power electronic circuit component, the printed circuit board is finally fixed to the metal base plate (because the relative space arrangement between the two cannot be changed), and thus the error in the dimension of each part Due to the presence, the bus bar and terminals generate elastic stress,
This stress is applied to the soldered portion between the signal electrode terminal of the high power electronic circuit component and the printed circuit board, which causes a problem in durability. Therefore, it is essential to fix the high-power electronic circuit components to the metal base plate and the printed circuit board to the metal base plate, and then fix all the terminals of the high-power electronic circuit components to the printed circuit board. The signal electrode terminals of electronic circuit components must be specially soldered to the printed circuit board at the end.

The present invention has been made in view of the above problems, and provides a power circuit device for a vehicle and a method of manufacturing the same, which can reduce the number of parts and the number of working steps while ensuring excellent connection reliability. Is the purpose.

[0011]

According to a first aspect of the present invention, there is provided an electric power circuit device for a vehicle, wherein a metal base plate for cooling and a large number of bus bars are integrated with each other while being insulated from each other by an insulating material, and above the metal base plate. And a bus bar assembly fixed to the metal base plate in a posture parallel to the metal base plate, and a main electrode terminal and a signal electrode terminal that are connected to the bus bar by protruding to the side surface or exposed on the upper surface. Printed circuit board on which a plurality of high-power electronic circuit components including a semiconductor module whose bottom surface is adhered to the upper surface of the metal base plate and a control circuit for sending a signal to the signal electrode terminals of the semiconductor module to control the semiconductor module are mounted. And the printed substrate is inserted into the through hole of the printed circuit board and is attached to the back surface of the printed circuit board. A joint type relay terminal connected to the control circuit by being soldered to the conductive pattern of the joint type relay terminal, the joint type relay terminal being joined and fixed to the bus bar protruding from the side surface of the bus bar assembly. At the same time, a signal transmission path from the control circuit to the signal electrode terminal of the semiconductor module is configured.

That is, according to the present invention, all the terminals for high current and the signal electrode terminals (terminals for small current) of a high power electronic circuit component (for example, a semiconductor module) tightly fixed to the metal base plate are provided in the bus bar assembly. Connect to each bus bar, solder the junction relay terminal to the back surface of the printed board, and join the junction relay terminal to the bus bar of the bus bar assembly by soldering or welding. The electrical connection with the signal electrode terminal of is completed. With this, the following effects can be obtained.

First, the connecting relay terminals are previously soldered on the back side of the printed circuit board in the same soldering process as other circuit parts on the printed circuit board, and the bus bar assembly is mounted on the metal base plate on which the high power electronic circuit parts are mounted. By fixing the printed circuit board, connecting all terminals of the semiconductor module to the busbars of the busbar assembly, and joining the busbars of the busbar assembly to the junction terminals for joining,
Since the device can be completed, the joining process is
The process of joining the terminals of the semiconductor module or the high power electronic circuit component to each bus bar of the bus bar assembly (which can be performed in parallel or sequentially with the same device and can be regarded as one process) and This can be performed in two steps, that is, a step of soldering the circuit components for small currents and the junction terminals for joining all at once, which simplifies the joining operation.

Further, all the terminals of the high-power electronic circuit component and the busbars of the busbar assembly can be joined after the metal baseplate is attached to the high-power electronic circuit component, and as a result, the above-mentioned respective parts can be joined. Even if there is a large dimensional error, there is no stress caused by the above dimensional error at the soldering point, especially at the soldering point in the electrical path between the printed circuit board and the small current terminal of the high power electronic circuit component. The connection reliability of the soldered portion is not impaired.

Further, the step of providing a thick special conductive pattern on the printed circuit board, which is required when the signal electrode terminals of the semiconductor module are finally directly soldered, is not required, and the manufacturing cost of the printed circuit board can be reduced. .

Further, since all the terminals of the high power electronic circuit component are joined only to the bus bar assembly which is formed by integrating the bus bars into one component, it is possible to further reduce the number of components.

According to a second aspect of the present invention, there is provided a vehicle power circuit device.
A metal base plate for cooling, and a bus bar assembly which is fixed to the metal base plate in a posture parallel to the metal base plate above the metal base plate while being integrated while being insulated from each other by an insulating material. A plurality of semiconductor modules including a main electrode terminal protruding to a side surface or exposed on the upper surface and connected to the bus bar and a signal electrode terminal not connected to the bus bar, and a bottom surface of the semiconductor module adhered to the upper surface of the metal base plate; A high-power electronic circuit component, a printed circuit board on which a control circuit for sending a signal to the signal electrode terminals of the semiconductor module to control the semiconductor module is mounted; By soldering to the conductive pattern of the printed circuit board A joint type relay terminal connected to a control circuit, wherein the printed circuit board is fixed to the metal base plate and arranged in parallel between the metal base plate and the bus bar assembly, and the joint type relay terminal. Is bonded and fixed to the signal electrode terminal of the semiconductor module to form a signal transmission path from the control circuit to the signal electrode terminal of the semiconductor module.

That is, according to the present invention, a terminal for a large current of a high-power electronic circuit component (for example, a semiconductor module) that is tightly fixed to a metal base plate is connected to each bus bar of a bus bar assembly above the printed circuit board, and The relay terminal for joining is soldered to the back side, and the signal electrode terminal of the semiconductor module is joined to the relay terminal for joining by soldering or welding, which allows the electrical connection between the control circuit of the printed circuit board and the signal electrode terminal of the semiconductor module. Complete the connection. With this, the following effects can be obtained.

First, the relay terminal for joining is previously soldered on the back side of the printed circuit board in the same soldering process as other circuit parts on the printed circuit board, and the bus bar assembly is mounted on the metal base plate on which the high power electronic circuit parts are mounted. Also, fix the printed circuit board, connect the main electrode terminal (terminal for large current) of the semiconductor module to the bus bar of the bus bar assembly, and join the signal electrode terminal (terminal for small current) of the semiconductor module to the junction relay terminal. Since it is completed by doing, in the joining process, the terminals for large current of the semiconductor module or high-power electronic circuit parts are joined to each bus bar of the bus bar assembly, and the signal electrode terminals of the semiconductor module are connected to the junction relay terminals. Joining process (which can be performed in parallel or sequentially with the same device and can be regarded as one process) and printing Can be carried out in two steps with the step of soldering in unison circuit components and joining the relay terminal for the small current in the rear surface of the plate, joining work becomes easy.

Further, a metal base plate is attached to the high power electronic circuit component to connect all terminals of the high power electronic circuit component to the bus bar of the bus bar assembly and a junction relay terminal, and the printed circuit board and the bus bar assembly are attached to the metal base plate. It can be carried out after fixing, and as a result, even if the above-mentioned dimensional error of each part is large, the soldering point, especially the electric path between the printed circuit board and the terminal for small current of high power electronic circuit parts No stress is applied to the soldering points due to the above-mentioned dimensional errors, and the connection reliability of the soldered portions is not impaired.

Further, the manufacturing cost of the printed circuit board can be reduced because the step of providing a thick special conductive pattern on the printed circuit board, which is required when the signal electrode terminals of the semiconductor module are finally directly soldered, is not required. .

Further, since all the terminals of the high power electronic circuit component are joined only to the bus bar assembly which is formed by integrating the bus bars into one component, it is possible to further reduce the number of components.

In a preferred aspect of the above-mentioned two inventions, there is provided a resin block for integrally forming a joint type relay terminal which is integrally formed with a plurality of the joint type relay terminals and is mounted on the printed circuit board. In this way, since a large number of junction relay terminals can be used as a terminal block having junction relay terminals, it is easy to attach the junction relay terminals.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION The electric power circuit device for a vehicle and the method for manufacturing the same according to the present invention will be specifically described with reference to the following embodiments.

[0025]

First Embodiment A vehicle power converter according to the present invention is applied to a vehicle DC.
An embodiment applied to a DC converter device will be described below with reference to FIG. (Structure Description) This vehicle DC-DC converter device is
A single-phase inverter module for converting a high-voltage direct-current voltage input from the high-voltage battery into a single-phase alternating-current voltage, which is a direct-current voltage conversion circuit arranged between the high-voltage battery and the low-voltage battery mounted on the vehicle and transmitting the high-voltage battery to the low-voltage battery. 1. Four powers M that make up this single-phase inverter circuit
A controller 2 for performing PWM switching control on a single-phase inverter module (semiconductor module according to the invention) 1 having an OS transistor, a step-down transformer 3 for stepping down the single-phase AC voltage output from the single-phase inverter module 1, and a step-down transformer. A full-wave rectification circuit module 4 for single-phase full-wave rectification of the output voltage of No. 3, a choke coil 5 for smoothing the output voltage of the full-wave rectification circuit module 4, a busbar assembly 6, and a junction relay terminal block 7. Have 8
Is formed integrally with the busbar assembly 6 and is a step-down transformer 3
It is a holder that presses against the choke coil 5. Aluminum base plate (metal base plate in the present invention) 9
3, is arranged below the bus bar assembly 6, and the single-phase inverter module 1, step-down transformer 3, full-wave rectifier circuit module 4, and choke coil 5 are fastened and fixed to the upper surface of the aluminum base plate 9 by screws. Has been done.

Since the circuit configuration and the details of the operation of this type of vehicle DC-DC converter device are well known and have no direct relation to the present invention, further description is omitted.

However, FIG. 1 is a schematic plan view showing only the arrangement state of each of the above-mentioned circuit parts of the DC-DC converter device for a vehicle. The busbar wiring state and the connection state between the busbar and each circuit element are controlled by the controller. Illustrations are omitted except for a connecting portion between 2 and a bus bar assembly 6 described later.

The structure of each part of the vehicular DC-DC converter device of FIG. 1 will be described below with reference to the longitudinal sectional views of FIGS. 2 is a partial vertical cross-sectional view showing the vicinity of the junction type relay terminal block 7, and FIG. 3 is a partial vertical cross-sectional view of the vicinity of the single-phase inverter module 1. Although the single-phase inverter module 1 is used in this embodiment for simplification of the drawing, it goes without saying that the four power switching transistors of the single-phase inverter circuit may be separately modularized.

In FIG. 3, the single-phase inverter module 1 is fixed on the aluminum base plate 9 by screws (not shown) for cooling. Reference numeral 11 denotes one signal electrode terminal (for example, a gate electrode terminal) of the single-phase inverter module 1, which horizontally projects from the side surface of the resin-molded main body of the single-phase inverter module 1.
Similarly, all the terminals (main electrode terminals, signal electrode terminals) of the single-phase inverter module 1 horizontally project from the side surface of the resin-molded main body of the single-phase inverter module 1. The bottom of the single-phase inverter module 1 is
It is in close contact with the upper surface of the aluminum base plate 9, which is the component contact surface.

The bus bar assembly 6 is fixed to the aluminum base plate 9 so as to be parallel to and above the aluminum base plate 9 at a predetermined interval. Bus Bar Assembly 6
Is a large number of bus bars vertically arranged in the thickness direction at predetermined intervals (in FIG. 2, bus bars 61, 62 are arranged).
(Only shown), and a resin plate 63 that integrates these bus bars while insulating them from each other. Bus Bar Assembly 6
May be formed by resin molding using an IC lead frame or may be formed by insert resin molding. The busbar assembly 6 has a window 64. The end portion of the bus bar 61 horizontally projects from the side surface of the resin plate 63 facing the window 64, is bent and then descends, and is further bent beside the signal electrode terminal 11 of the single-phase inverter module 1 to form the signal electrode. It is extended while being in contact with the terminal 11. Similarly, each bus bar (not shown) is hidden by the window 6
After horizontally projecting from the side surface of the resin plate 63 facing the No. 4, it is bent and lowered, and further bent next to each terminal (main electrode terminal, signal electrode terminal) of the single-phase inverter module 1 to be the main electrode terminal. Each of the terminals of the single-phase inverter module 1 is individually soldered to each bus bar.

The controller 2 includes a junction type relay terminal block 7 and various small current circuit components (only the circuit component 21 is shown).
It has a printed circuit board 20 on which and are mounted. The joint-type relay terminal block 7 is formed by integrating five joint-type relay terminals 70 by a resin block 71 by insert molding. The resin block 71 is fixed on the printed circuit board 20, and each joint-type relay terminal 70 is fixed. Is soldered to a conductive pattern (not shown) on the back surface of the printed circuit board 20 by a jet soldering method. Similarly, the terminals of the circuit component 21 are also soldered to the conductive pattern (not shown) on the back surface of the printed circuit board 20 by the jet soldering method. Junction type relay terminal 71
Are welded or soldered to the bus bar 61.

After all, the control circuit (not shown) of the controller 2 is electrically connected to the signal electrode terminal 11 of the single-phase inverter module 1 through the junction type relay terminal 71 and the bus bar 61.

(Assembling Method) First, high-power electronic circuit parts such as the single-phase inverter module 1 (transformer,
1) is fixed to the aluminum base plate 9, the joint type relay terminal 71 and the circuit component are soldered to the printed circuit board 20 by the jet soldering method, and the bus bar assembly 6 is fixed to the aluminum base plate 9 for a high power electronic circuit. The terminal of the component is joined to the busbar of the busbar assembly 6, and the busbar 61 is joined to the joining type relay terminal 71 to complete the assembly.

[0034]

[Embodiment 2] A sectional view of a vehicle power circuit device of this embodiment will be described below with reference to a partial longitudinal sectional view thereof shown in FIG. However, the numbers used in this example are not related to the numbers used in the first example. (Structure Description) This electric power circuit device for a vehicle is a part of a drive motor control device for an electric vehicle.
A semiconductor module such as a transistor) is fixed on the aluminum base plate 2 for cooling, and other circuit components are mounted on the printed board 4.

Reference numeral 1 is a semiconductor module including six power MOS transistors constituting a three-phase inverter circuit, 2
Is an aluminum base plate (metal base plate in the present invention), 3 is a window, 4 is a printed circuit board, 5 is a source electrode terminal of the semiconductor module 1, 6 is an assembly wiring board (bus bar assembly in the present invention), and 7 is a semiconductor module. 1 is a gate electrode terminal (signal electrode terminal), 8 is a capacitor on the printed circuit board 4, 9 is a bus bar for the large current of the assembly wiring board 6, 1
Reference numeral 0 is a junction type relay terminal block.

The source electrode terminal 5, the gate electrode terminal 7, and other terminals of the semiconductor module 1 (not shown) horizontally project from the side surface of the resin-molded main body of the semiconductor module 1. The bottom surface of the semiconductor module 1 is in close contact with the top surface 20 which is the component contact surface of the aluminum base plate 2, and the semiconductor module 1 is fixed to the aluminum base plate 2 with screws (not shown). Printed circuit board 4
Has a window 3 through which the semiconductor module 1 penetrates, and is fixed to the aluminum base plate 2 so as to be parallel to the upper side of the aluminum base plate 2 with a predetermined gap. The collective wiring board 6 is fixed to the aluminum base plate 2 so as to be parallel to and above the printed board 4 with a predetermined interval. A pair of terminals of the capacitor 8 are projected to the back surface of the printed board 4 through through holes (not shown) of the printed board 4 and soldered to a copper wiring pattern (not shown) on the back surface of the printed board 4 by a jet soldering method.

The collective wiring board 6 is constructed by integrating a large number of bus bar wirings formed by the same method as the IC lead frame with a resin plate 12. The collective wiring board 6 has windows 13,
Have fourteen. The bus bar 9 for large current is horizontally bent from the side surface of the resin plate 12 facing the window 13, is bent and then descends, and is further bent beside the source electrode terminal 5 of the semiconductor module 1 to be the source electrode terminal. 5 is extended while being in contact with 5, and is soldered to the source electrode terminal 5.

The joint type relay terminal block 10 has essentially the same structure as the joint type relay terminal block 7 of the first embodiment, and a predetermined number of joint type relay terminals 70 are integrated by a resin block 71. , Is fixed to the printed circuit board 4. One end of the joint-type relay terminal 71 is soldered to a copper wiring pattern (not shown) on the back surface of the printed board 4 at the same time as the pair of terminals of the capacitor 8 by a jet soldering method.
The other end of the is soldered to the gate electrode terminal 7 of the semiconductor module 1.

The other end of the bus bar 9 for large current is
Preferably, it is exposed on the upper surface of the resin plate 12, and the end portion of the other bus bar is fastened to the other end portion of the bus bar 9 for large current. (Description of Manufacturing Method) First, a method of manufacturing the collective wiring board 6 will be described below.

First, a thin metal plate is punched out to form a busbar frame in which a large number of busbars are connected in one plane, and a resin plate 12 for covering a predetermined portion of the busbar frame is molded with a resin by insert resin molding or resin molding. Form. The resin plate 12 has openings 13 to 14, and one end of the bus bar 9 for large current projects from the side surface of the resin plate 12 facing the opening 13. Next, both ends of one end of the bus bar 9 are bent downward, and tie bars (not shown) connecting the bus bars are cut off to complete the collective wiring board 6 having the bus bars for one circuit. This manufacturing method is essentially the same as the IC lead frame manufacturing method. Of course, in addition, the collective wiring board 6 may be formed by setting each bus bar in a mold and performing a usual insert molding method.

Next, all the high power electronic circuit components including the semiconductor module 1 are fixed on the aluminum base plate 2 and fastened with screws.

Next, all the small power circuit components and the joint type relay terminal block 10 are temporarily attached to the printed circuit board 4, and the terminals of the small power circuit component and one end of the joint type relay terminal 70 are attached to the printed circuit board 4. Is soldered to the back surface of the printed circuit board 4 by the jet soldering method. At this time, it is preferable to cover the window 3 of the printed circuit board 4 with a shielding plate. As a result, the printed circuit board 4 is completed.

Next, the printed circuit board 4 and the collective wiring board 6 are fastened and fixed to the semiconductor module 1 integrated with the aluminum base plate 2.

Next, the tip portion of the source electrode terminal 5 of the semiconductor module 1 and the tip portion of the bus bar 9 for large current are soldered from the window 13 of the collective wiring board 6. Similarly, the tip portion of the gate electrode terminal 7 of the semiconductor module 1 and the junction type relay terminal 70 are soldered from the window 14 of the collective wiring board 6. As a result, the printed circuit board 4 and the bus bar assembly 6 are electrically wired to the semiconductor module 1. The wiring of the other high-power electronic circuit components is also the same as that of the semiconductor module 1. Windows 13 and 14 are soldering work,
It is also used for confirmation during the subsequent visual inspection work. The vehicle power circuit device is completed as described above.

[Brief description of drawings]

FIG. 1 is a schematic plan view of a vehicle power circuit device according to a first embodiment.

FIG. 2 is a partial vertical cross-sectional view of the vicinity of the junction relay terminal block in FIG.

FIG. 3 is a partial vertical cross-sectional view of the vicinity of the single-phase inverter module in FIG.

FIG. 4 is a cross-sectional view of essential parts of a vehicle power circuit device according to a second embodiment.

FIG. 5 is a cross-sectional view of a main part of a conventional vehicle power circuit device.

[Explanation of symbols]

(Example 1) 1 single-phase inverter module (semiconductor module, high-power electronic circuit component) 9 aluminum base plate (metal base plate), 20 printed circuit board 61 bus bar 6 bus bar assembly 11 gate electrode terminal (signal electrode terminal) 7 junction relay Terminal block 70 Joint type relay terminal 71 Resin block (Example 2) 1 Semiconductor module (high-power electronic circuit component) 2 Aluminum base plate (metal base plate), 4 Printed circuit board 9 Busbar 6 Busbar assembly 7 Gate electrode terminal (Signal electrode terminal) ) 10 joint type relay terminal block 70 joint type relay terminal 71 resin block

Claims (3)

[Claims] 1. A metal base plate for cooling and a large number of bus bars are integrated with each other while being insulated from each other by an insulating material, and fixed to the metal base plate above the metal base plate in a posture parallel to the metal base plate. A plurality of bus bar assemblies, and a plurality of semiconductor modules, each of which has a main electrode terminal and a signal electrode terminal protruding to a side surface or exposed on the upper surface and all connected to the bus bar, and a bottom surface of which is closely attached to the upper surface of the metal base plate. A high-power electronic circuit component, a printed circuit board on which a control circuit that sends a signal to the signal electrode terminals of the semiconductor module to control the semiconductor module is mounted, and a back surface of the printed circuit board that is inserted into a through hole of the printed circuit board. By soldering to the conductive pattern of the printed circuit board with A junction-type relay terminal connected to the path, wherein the junction-type relay terminal is jointed and fixed to the bus bar protruding from a side surface of the bus bar assembly, and together with the bus bar, the signal electrode of the semiconductor module from the control circuit. A vehicle electric power circuit device comprising a signal transmission path to a terminal. 2. A metal base plate for cooling and a large number of bus bars are integrated with each other while being insulated from each other by an insulating material, and fixed to the metal base plate above the metal base plate in a posture parallel to the metal base plate. A semiconductor having a bus bar assembly, a main electrode terminal protruding to a side surface or exposed on the upper surface and connected to the bus bar, and a signal electrode terminal not connected to the bus bar, the bottom surface of which is closely attached to the upper surface of the metal base plate. A plurality of high-power electronic circuit components including a module, a printed circuit board on which a control circuit for sending a signal to the signal electrode terminals of the semiconductor module to control the semiconductor module is mounted, and a printed circuit board inserted into a through hole of the printed circuit board Soldered to the conductive pattern of the printed circuit board on the back side of the printed circuit board A junction-type relay terminal connected to the control circuit by means of the printed circuit board, the printed circuit board being fixed to the metal base plate and arranged in parallel between the metal base plate and the bus bar assembly; The junction type relay terminal is joined and fixed to the signal electrode terminal of the semiconductor module to form a signal transmission path from the control circuit to the signal electrode terminal of the semiconductor module. 3. A vehicle power circuit device according to claim 1, wherein the joint type relay terminals are integrally formed with a plurality of the joint type relay terminals and are mounted on the printed circuit board. A vehicle power circuit device comprising a block.