JP2003176408A5 - - Google Patents
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- Publication number
- JP2003176408A5 JP2003176408A5 JP2002273474A JP2002273474A JP2003176408A5 JP 2003176408 A5 JP2003176408 A5 JP 2003176408A5 JP 2002273474 A JP2002273474 A JP 2002273474A JP 2002273474 A JP2002273474 A JP 2002273474A JP 2003176408 A5 JP2003176408 A5 JP 2003176408A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002273474A JP2003176408A (ja) | 2001-09-21 | 2002-09-19 | 電気・電子部品封止用ポリアミド組成物 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001-288000 | 2001-09-21 | ||
| JP2001288000 | 2001-09-21 | ||
| JP2002273474A JP2003176408A (ja) | 2001-09-21 | 2002-09-19 | 電気・電子部品封止用ポリアミド組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003176408A JP2003176408A (ja) | 2003-06-24 |
| JP2003176408A5 true JP2003176408A5 (zh) | 2005-06-23 |
Family
ID=26622646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002273474A Pending JP2003176408A (ja) | 2001-09-21 | 2002-09-19 | 電気・電子部品封止用ポリアミド組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003176408A (zh) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005350501A (ja) * | 2004-06-08 | 2005-12-22 | Toyobo Co Ltd | 強靭性に優れた難燃性ポリアミド系樹脂組成物 |
| US20060293435A1 (en) | 2005-06-10 | 2006-12-28 | Marens Marvin M | Light-emitting diode assembly housing comprising high temperature polyamide compositions |
| US20090012229A1 (en) * | 2006-03-08 | 2009-01-08 | Basf Aktiengesellschaft | Partially aromatic copolyamides with a high crystallinity |
| JPWO2008081878A1 (ja) * | 2007-01-02 | 2010-04-30 | 旭化成ケミカルズ株式会社 | 難燃性高耐熱樹脂組成物 |
| JP5347930B2 (ja) * | 2009-12-04 | 2013-11-20 | 宇部興産株式会社 | 電子写真用部材 |
| JP2013163709A (ja) * | 2012-02-09 | 2013-08-22 | Daicel-Evonik Ltd | 粉末状封止剤及び封止方法 |
| JP2013163754A (ja) * | 2012-02-10 | 2013-08-22 | Daicel-Evonik Ltd | 粉末状封止剤及び封止方法 |
| KR20140127302A (ko) * | 2012-02-09 | 2014-11-03 | 다이셀에보닉 주식회사 | 분말 상태 밀봉제 및 밀봉 방법 |
| JP7141016B2 (ja) * | 2018-08-24 | 2022-09-22 | 株式会社クラレ | ポリアミド組成物 |
| JP7300843B2 (ja) * | 2019-02-12 | 2023-06-30 | 株式会社クラレ | 繊維強化ポリアミド樹脂組成物及び成形品 |
| WO2022196711A1 (ja) | 2021-03-16 | 2022-09-22 | 三井化学株式会社 | ポリアミド樹脂組成物およびポリアミド成形体 |
| EP4317253A1 (en) | 2021-03-30 | 2024-02-07 | Mitsui Chemicals, Inc. | Polyamide resin composition and polyamide molded body |
| CN114656784B (zh) * | 2022-03-30 | 2023-11-28 | 珠海万通特种工程塑料有限公司 | 一种阻燃半芳香族聚酰胺复合材料及其制备方法和应用 |
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2002
- 2002-09-19 JP JP2002273474A patent/JP2003176408A/ja active Pending