JP2003174292A - Method and device for mounting part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide part mounting method and device where repetition of image signal transfer for each electronic part is not necessary and electronic part measuring time is shortened. <P>SOLUTION: A moving head 31 provided with a plurality of suction nozzles 37 arranged in parallel and an image pickup device 71 are relatively moved in the parallel arrangement direction of the nozzles 37, the image of each part 73 sucked and held by the respective nozzle 37 is picked up, the sucked states of the parts 73 to the nozzles 37 are recognized by the photographed images, and the parts 73 are mounted on a circuit board while correcting the packaging directions and packaging positions of the parts 73 based on the recognized results. In this case, the image pickup device 71 moves relatively to the head 31 while maintaining an exposure available state, irradiates each of the parts 73 sucked and held by the nozzles 37 at prescribed timing when each part 73 passes the image pickup device and the images of these parts 73 are collected on one picture by the irradiation of light to obtain picked-up images. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting method and a component mounting apparatus for recognizing a component suction-held by a plurality of suction nozzles and correcting the mounting direction and position on a board. Related to the technology to speed up.

[0002]

2. Description of the Related Art In recent years, in a component mounting apparatus for producing a high-density and precise circuit board at high speed, the position and orientation of the electronic component mounted on the circuit board are controlled in order to perform feedback control of the electronic component mounting operation. Visual recognition devices that measure in real time are becoming popular.

A component mounting apparatus for performing this type of control has a plurality of suction nozzles in a transfer head for suction-holding electronic components. The visual recognition device images and measures the sucked and held electronic component, and includes a lighting device and an imaging device, and the electronic device illuminated by the lighting device is imaged by the imaging device. The image picked up by the image pickup device is converted into an image signal, restored into a two-dimensional digital image and recorded in the image memory. The image signal recorded in the image memory is subjected to predetermined image processing by the image processing device, and the attitude, position, etc. of the sucked electronic component are measured.

The operation of this visual recognition device will be described in more detail. The transfer head moves the electronic component sucked and held by the suction nozzle from the component supply unit to the mounting position on the circuit board via the visual recognition device. At this time, in the visual recognition device, while the transfer head moves on the visual recognition device,
The lighting device is turned on to illuminate the electronic component, and the imaging device captures an image of the electronic component. The imaging device converts the captured image into an image signal and outputs it to the visual recognition control device. The image signal output from the imaging device is input to the image memory. The image processing apparatus waits for the completion of input of the image signal to the image memory, executes predetermined image processing on the two-dimensional digital image stored in the image memory, and measures the posture and position of the electronic component. In this way, the measurement result processed by the image processing apparatus is communicated to the operation control unit of the component mounting apparatus and used as a correction value for the mounting direction and position of the electronic component on the circuit board.

Here, for example, as shown in FIG.
When the individual electronic components 1, 3, 5 are imaged, the lighting device is turned on and the exposure of the imaging device is made one to one, so that three images are sequentially output to the visual recognition control device. Usually, an industrial electronic camera is often used as an image pickup device, but the industrial electronic camera has a fixed time to output an image signal of one image from the image pickup device to the visual recognition control device. When the electronic components are continuously imaged, the second and subsequent electronic components are imaged after waiting the time required for the output from the imaging device to the visual recognition control device. For example,
In the case of a 250,000-pixel electronic camera driven at 12 MHz, the number of images that can be captured is 30 per second, so the time required to output an image signal for one image from the imaging device to the visual recognition control device. Is about 33ms, 18MH
In the case of a z-driving 1-megapixel electronic camera, the number of images that can be picked up per second is 15, and therefore the time spent for outputting an image signal for one image from the image pickup device to the visual recognition control device. Is about 67 ms, and the image pickup is performed after waiting this time.

[0006]

However, in the component mounting method by the above-described conventional component mounting apparatus, as shown in FIG. 16, for example, a head holding three electronic components 1, 3, 5 is moved by suction. In order to perform the measurement process of the electronic components, it is necessary to complete the storage of the image signals of the individual electronic components in the image memory. For this reason, the transfer operation of the image signal must be repeated every time the individual electronic components are imaged,
It has been difficult to reduce the measurement processing time of electronic components.

Further, as shown in the example of FIG. 17, the lighting time of the illumination device and the exposure time a of the image pickup device are 62.5 μs.
ec is required, and the time b required to transfer the first line of data from the image pickup device after the exposure is 1.3 m
It takes about sec. Furthermore, the image signal transfer time c of one frame (one screen) from the imaging device to the image memory is
It requires about 16.7 msec. Here, for example, if the exposure interval d of 22.7 msec of the conventional imaging device is shortened, the time b required for data transfer for one line and the image signal transfer time c are constant as shown in FIG. Before the transfer of the image signal is completed, the lighting and exposure of the next electronic component is required. Thus, in the conventional component mounting method using the component mounting apparatus,
Since it was necessary to store the image signals of the individual electronic components in the image memory each time, the transfer head could not move between adjacent electronic components in a short time, and as a result, the imaging device and the transfer head could not be moved. The relative movement speed cannot be increased,
This also regulated the speedup of measurement processing.

The present invention has been made in view of the above circumstances, and provides a component mounting method and a component mounting apparatus that do not require the image signal transfer operation to be repeated for each individual electronic component, and thus, the electronic component measuring process. The purpose is to reduce the time.

[0009]

According to a first aspect of the present invention, there is provided a component mounting method, comprising: a transfer head having a plurality of suction nozzles arranged side by side; A plurality of components that are moved relative to each other in parallel are suctioned and held by each of the suction nozzles are imaged, the suction state of the components to the suction nozzles is recognized from the obtained captured image, and mounting is performed based on the recognition result. A component mounting method for correcting a direction and a mounting position to mount the component on a circuit board, wherein the image pickup device is moved relative to the transfer head while maintaining the exposure state, and the suction nozzle is attached to the transfer head. Illumination light is emitted at a predetermined timing each time each of the suction-held components passes through the imaging device, and images of a plurality of components exposed by irradiating the illumination light are stored in one screen to display a captured image. Profit It is characterized in.

In this component mounting method, the illumination light is emitted at a predetermined timing each time the component suction-held by the suction nozzle passes through the image pickup device, and while the illumination light is emitted,
The image pickup device substantially performs the exposure operation. Since the component and the image pickup device move relative to each other and the illumination light is emitted at a predetermined timing, the images of the plurality of components sequentially exposed are exposed at different positions in one screen. Then, since the suction state of the components is recognized from the captured image in which a plurality of components are stored in one screen, it is possible to collectively perform the image signal transfer operation which has been repeatedly performed for each component in the past. , The part recognition processing time can be greatly shortened. Further, since it is not necessary to complete the transfer operation of the image signal for each individual component, the moving speed between the components can be increased, and the relative moving speed between the imaging device and the transfer head can be increased. Further, the mounting process can be further speeded up.

According to a second aspect of the present invention, in the component mounting method, the predetermined timing is such that the positions of the components exposed by the irradiation of the illumination light with respect to the imaging device do not overlap each other in the captured image. The timing is to adjust to different positions.

In this component mounting method, the irradiation timing of the illumination light is adjusted to a different position for each component,
Each component can be exposed at different positions in the captured image without overlapping, and recognition processing can be performed without being affected by images of adjacent components.

The component mounting method according to a third aspect is characterized in that the irradiation of the illumination light is performed under different illumination conditions depending on the component to be exposed.

In this component mounting method, it is possible to stably and accurately perform component recognition by capturing an image under optimum illumination conditions that differ for each component.

According to a fourth aspect of the present invention, in the component mounting method, the illumination condition includes at least one of an illumination light amount, an illumination color, and an illumination direction.

In this component mounting method, the component is illuminated under the illumination condition including at least one of the illumination light amount, the illumination color, and the illumination direction, so that an image can be picked up in an optimum illumination state.

According to a fifth aspect of the component mounting method, the plurality of suction nozzles are arranged in a zigzag pattern along the moving direction of the transfer head, and the components are arranged at different positions in a direction orthogonal to the moving direction. It is characterized by exposing.

In this component mounting method, the components are suction-held by the suction nozzles arranged in a zigzag manner so that the exposure position of each component passing through the image pickup device is orthogonal to the moving direction of the transfer head. Different positions in different directions,
Images of multiple parts are displayed on one screen in the moving direction of the transfer head.
It will be aligned with the direction orthogonal to this moving direction. Thus, for example, when a plurality of parts having a large aspect ratio are imaged, even if the image pickup size in the moving direction of the transfer head is short, the image pickup areas of the electronic parts are distributed in the direction orthogonal to the moving direction. Thus, one captured image can be effectively used.

According to a sixth aspect of the present invention, there is provided a component mounting apparatus, wherein a transfer head having a plurality of suction nozzles arranged side by side and an image pickup device are relatively moved in a direction in which the suction nozzles are arranged side by side, and each of the suction nozzles is moved. And a visual recognition device for recognizing the suction state of the component to the suction nozzle from the captured image obtained by picking up a plurality of components that have been suction-held, and determining the mounting direction and mounting position of the component based on the recognition result. A component mounting apparatus for correcting and mounting the component on a circuit board,
The visual recognition device illuminates a plurality of components sucked and held by each of the suction nozzles with illumination light, an imaging device that images the components illuminated by the lighting device, and an exposure for the imaging device. A signal control that sends a signal for maintaining the enabled state and sends an illumination light irradiation signal at a predetermined timing each time each of the components suction-held by the suction nozzles passes through the imaging device with respect to the lighting device. An image memory for storing a captured image in which a plurality of component images exposed by irradiation of the illumination light are stored in one screen, and the suction of the component using the captured image of the image memory. The feature is that the suction state to the nozzle is recognized.

In this component mounting apparatus, each time the component suctioned and held by the suction nozzle passes the image pickup device by the moving means, the visual recognition device emits illumination light at a predetermined timing, and this illumination light is emitted. During this period, the image pickup device is substantially exposed. Since the component and the image pickup device move relative to each other and the illumination light is emitted at a predetermined timing, the image pickup device exposes the images of the plurality of sequentially exposed components at different positions in one screen. Then, since the suction state of the components is recognized from the captured image in which a plurality of components are stored in one screen, it is possible to collectively perform the image signal transfer operation which has been repeatedly performed for each component in the past. , The part recognition processing time can be greatly shortened. Further, since it is not necessary to complete the transfer operation of the image signal for each individual component, the moving speed between the components can be increased, and the relative moving speed between the imaging device and the transfer head can be increased. Further, the mounting process can be further speeded up.

According to a seventh aspect of the present invention, there is provided a component mounting apparatus including a database section in which information on illumination conditions for each of the components is stored in advance, and the plurality of light emitting elements capable of lighting the respective illumination apparatuses at different light intensity levels. The signal control device, based on the illumination condition for the component to be imaged obtained from the database unit, the number of the light emitting elements to be turned on, among the light amount level of the light emitting elements to be turned on,
It is characterized in that any one of them or a combination thereof is controlled.

In this component mounting apparatus, one light emitting element can be turned on at different light intensity levels of n steps, and m of these light emitting elements are grouped into one group and the number of individual light emitting elements to be turned on within the group and , N × by controlling by combining with the light amount level of the light emitting element that is turned on.
Brightness can be controlled in m steps, and the optimal amount of illumination light can be finely set according to the part to be illuminated.

The component mounting apparatus according to claim 8 comprises a database unit in which information on illumination conditions for each of the electronic components is stored in advance, and the illumination apparatus is composed of a plurality of types of light emitting elements that emit different colors. The signal control device controls the color of the irradiation light to the component based on the illumination condition for the component to be imaged, which is obtained from the database unit.

In this component mounting apparatus, illumination light of an arbitrary color can be obtained by selectively lighting a plurality of types of light emitting elements that emit different colors. For example, red (R), By appropriately combining and illuminating each of the light emitting elements that emit green (G) and blue (B),
Irradiation light of a desired color can be emitted. As a result, an image with a high contrast ratio can be obtained, and the measurement accuracy can be improved.

According to a ninth aspect of the present invention, there is provided a component mounting apparatus, which comprises a database unit in which information on illumination conditions for each of the components is stored in advance, and the illumination device includes a plurality of light emitting elements having different irradiation angles with respect to the component. The signal control device controls the irradiation angle to the component based on the illumination condition for the component to be imaged, which is obtained from the database unit.

In this component mounting apparatus, the light emitting element of the irradiation angle according to the component to be irradiated is turned on, the contour of the component,
It is possible to irradiate optimal illumination light according to the recognition target such as electrodes and printed characters. As a result, the measurement accuracy of the component can be improved.

A component mounting apparatus according to a tenth aspect is characterized in that a plurality of suction nozzles of the transfer head are arranged in a staggered pattern along a moving direction of the transfer head.

In this component mounting apparatus, the components are sucked and held by the suction nozzles arranged in a zigzag manner, so that the exposure position of each component passing through the image pickup device is orthogonal to the moving direction of the transfer head. Different positions in different directions,
Images of multiple parts are displayed on one screen in the moving direction of the transfer head.
It will be aligned with the direction orthogonal to this moving direction. Thus, for example, when a plurality of parts having a large aspect ratio are imaged, even if the image pickup size in the moving direction of the transfer head is short, the image pickup areas of the electronic parts are distributed in the direction orthogonal to the moving direction. Thus, one captured image can be effectively used.

[0029]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of a component mounting method and a component mounting apparatus according to the present invention will be described in detail below with reference to the drawings. 1 is an external perspective view of a component mounting apparatus according to the present invention, FIG. 2 is a plan view showing the component mounting work surface of FIG. 1, FIG. 3 is an enlarged perspective view of the transfer head of FIG. 2, and FIG. FIG. 5 is a block diagram showing an outline of the configuration of the component mounting apparatus.
FIG. 2 is an enlarged view of a transfer head and a visual recognition device provided in the component mounting device of FIG.

As shown in FIGS. 1 and 2, the loader section 15 and the board holding section 1 on the upper surface of the base 13 of the component mounting apparatus 100.
7. The unloader unit 19 is provided with a pair of guide rails 23 for carrying the circuit board 21, respectively, and the circuit board 21 is driven by the synchronous drive of the carrying belts provided on the pair of guide rails 23, respectively. From the loader unit 15 on one end side, it is carried to the substrate holding unit 17 on which a component such as an electronic component is mounted, and from the substrate holding unit 17 to the unloader unit 19 on the other end side. The board holding unit 17 positions and holds the conveyed circuit board 21 to prepare for component mounting. In the component mounting apparatus 100 of this embodiment, the board holding portions 17 are provided at two locations, and the components are individually mounted at each position.

Y-axis robots 25 and 27 are provided on both sides of the upper surface of the base 13 above the circuit board 21, respectively.
X-axis robots 28 and 29 are suspended between these two Y-axis robots 25 and 27, and Y-axis robots 25 and 27 are suspended.
The X-axis robots 28 and 29 can be moved back and forth in the Y-axis direction by driving. Further, transfer heads 31 and 31 are attached to the X-axis robots 28 and 29, respectively, so that the transfer heads 31 and 31 can move back and forth in the X-axis direction.
As a result, the transfer heads 31 and 31 can be moved within the XY plane. Each robot is configured, for example, by rotating a ball screw forward and backward by a motor so that a nut member screwed on the ball screw can be moved back and forth in the respective axial directions, and a member to be moved back and forth is fixed to the nut member.

The robot is placed on an XY robot (moving means) composed of the X-axis robots 28 and 29 and the Y-axis robots 25 and 27, and is a plane substantially parallel to the XY plane (for example, a horizontal plane or the upper surface of the base 13). ) Transfer head 31, which moves freely on the top,
Reference numeral 31 denotes a plurality of parts feeders 33 as an example of a parts supply unit to which electronic parts such as chip resistors and chip capacitors are supplied, or SOPs (“SOP” means Small Outl).
ine Package) or QFP (“QFP” is Quad Flat P
ACKAGE), a desired electronic component is sucked from a parts tray 35 (FIG. 3) as another example of a component supply unit to which a relatively large electronic component such as a connector is supplied.
It is configured so that it can be mounted on the component mounting position of the circuit board 21 by suction. The mounting operation of such an electronic component is controlled by the control unit 39 shown in FIG. 4 based on a mounting program set in advance.

A large number of parts feeders 33 are arranged in parallel on both sides (the upper right side and the lower left side in FIG. 1) of the pair of guide rails 23 in the conveying direction. Tape-shaped component rolls containing electronic components such as chip capacitors are attached. The parts tray 35 has a tray 35a on which a large number of electronic parts such as QFPs are placed,
The transfer robot 35b transfers and supplies the electronic components from the tray 35a to the shuttle conveyor 35c.

On the side of the circuit board 21 positioned on the pair of guide rails 23, a two-dimensional displacement (suction posture) of the electronic component sucked by the suction nozzle 37 is detected, and this displacement is detected. Transfer head 3 to cancel
A visual recognition device 41 is provided for correction on the first side. The visual recognition device 41 is disposed below the transfer head 31, and is a parts feeder 33 that is an electronic parts supply unit.
The suction nozzle 3 is passed through during the movement from the parts tray 35 to the mounting position without stopping the transfer head 31.
The plurality of electronic components sucked and held by 7 are imaged at once. The visual recognition device 41 is not limited to this configuration,
For example, a transfer head capable of moving in a plane is provided with a suction nozzle,
A transfer head 3 equipped with a recognition device, which is provided with a recognition device for recognizing the posture of the component sucked by the suction nozzle.
The configuration may be such that the recognition device moves within 1. Further, the visual recognition device 41 may move with respect to the transfer head 31, or both the transfer head 31 and the visual recognition device 41 may move with respect to each other.

As shown in FIG. 3, the transfer heads 31 include a plurality of (four in the illustrated example) mounting heads (first mounting head 31a, second mounting head 31b, third mounting head 31).
c, the fourth mounting head 31d) are connected side by side to form a multiple head. Four mounting heads 31a,
31b, 31c, and 31d have the same structure, and each mounting head includes a suction nozzle 37, an actuator 43 for causing the suction nozzle 37 to perform a vertical movement, and a pulley 45. The pulley 45 and the third of the first mounting head 31a
The timing belt 4 is attached to the pulley 45 of the mounting head 31c.
The forward / reverse rotational driving force of the θ rotation motor 49a is transmitted by 7 to cause both suction nozzles 37 to perform θ rotation (rotation around the axis of the suction nozzle 37). In addition, the pulley 45 of the second mounting head 31b and the fourth
The timing belt 4 is attached to the pulley 45 of the mounting head 31d.
The forward / reverse rotational driving force of the θ rotation motor 49b is transmitted by 7 to cause both suction nozzles 37 to perform θ rotation.

Each actuator 43 is composed of, for example, an air cylinder, and the suction nozzle is moved up and down by turning the air cylinder on and off to selectively perform component holding or component mounting operation. In addition, as shown in FIG.
The power of the rotation motor 49a is transmitted by the timing belt 47, and the suction nozzles 37 of the mounting heads 31a and 31c can be rotated by θ. Further, the power of the θ rotation motor 49b is transmitted by the timing belt 47,
The suction nozzles 37 of the mounting heads 31b and 31d can be rotated by θ. Such a configuration is an example, and each of the mounting heads 31a, 31b, 31c, 31d may be provided with a θ rotation drive motor for individually performing θ rotation. However, in order to reduce the weight of the transfer head 31, it is preferable that the number of θ-rotation drive motors that rotate by θ is small.

The suction nozzle 37 of each mounting head is replaceable, and the spare suction nozzle to be replaced is the component mounting apparatus 10.
It is previously stored in a nozzle stocker (not shown) on the base 13 of No. 0. The suction nozzle 37 has, for example, 1.0 × 0.
There are an S size nozzle that adsorbs a minute chip component of about 5 mm, an M size nozzle that adsorbs a 12 mm square QFP, and the like, and these are used according to the type of electronic component to be mounted.

As shown in FIGS. 4 and 5, the visual recognition device 41 includes a visual recognition control device 61. The visual recognition control device 61 includes a signal control device 63 and an image memory 6.
5 and the image processing device 67. The lighting device 69 and the imaging device 71 are connected to the signal control device 63. The illumination device 69 irradiates the electronic component 73 sucked and held by the suction nozzle 37 with illumination light, and the image pickup device 71.
Provides sufficient illuminance for imaging. Imaging device 71
Has an optical system 75 and forms an image of an area including the electronic component 73 on the image receiving unit of the image pickup device 71.

The image pickup device 71 converts the picked-up image into an image signal 77 and outputs it to the visual recognition control device 61. The signal control device 63 outputs control signals 79 and 81 for controlling the lighting device 69 and the imaging device 71. The image memory 65 is
The image signal 77 output by the imaging device 71 is restored to a two-dimensional digital image and recorded. The image processing device 67 executes surface image processing on the two-dimensional digital image recorded in the image memory 65.

Next, the component mounting method according to the present invention will be described together with the operation of the component mounting apparatus 100 described above. FIG. 6 is an operation explanatory view showing a moving state of the transfer head, FIG. 7 is an operation explanatory view of the transfer head and the visual recognition device, and FIG. 8 is a timing chart explaining an imaging operation of the visual recognition device shown in FIG. 9 is a timing chart for explaining the relationship between the imaging operation and the moving speed.

The circuit board 21 carried in from the loader section 15
When the substrate is transferred to the substrate holding unit 17, the transfer head 31 moves X
Moved in the XY plane by the Y robot, and as shown in FIG. 6, the parts feeder 33 (or the parts tray 35).
Then, a desired electronic component is sucked and is moved onto the image pickup device 71 of the visual recognition device 41 to confirm the suction posture of the electronic component 73.

The transfer head 31 moves the electronic component 73 sucked and held by the suction nozzle 37 to a predetermined mounting position on the circuit board 21 via the visual recognition device 41.
The transfer head 31 moves from the electronic component supply unit to the visual recognition device 41.
The signal control device 63 outputs a control signal to the illumination device 69 and the imaging device 71 from the time when the position is reached to the time when the visual recognition device 41 is linearly moved and passed. As a result, the lighting device 69 is turned on a plurality of times (three times in the example of FIG. 7) so that the image pickup device 71 provides sufficient illuminance to pick up the images of the electronic components 73a, 73b, 73c, as shown in FIG. Illumination light is sequentially irradiated to each of the electronic components 73a, 73b, 73c. Further, the imaging device 71 maintains the shutter in the open state while the transfer head 31 linearly moves on the visual recognition device 41, and sets the exposure possible state at all times. Then, in synchronization with the movement of the transfer head 31, the electronic component 73 sucked by the suction nozzle 37 is transferred to the imaging device 71.
The lighting device 6 at a predetermined timing when passing directly above
9 is lit, and the electronic component 73 at the moment of lighting is substantially exposed to the imaging device 71. This is the electronic component 73
Repeat for each of a, 73b, 73c,
Image all electronic components.

More specifically, the timing for turning on the illumination device 69 is the electronic component 73a which is the first exposure.
7A, when the component 73a reaches the position displayed on the right side of the captured image 78, as shown in FIG. 7A, for the electronic component 73b which is the second exposure,
As shown in FIG. 7B, the electronic component 7 is placed at the position shown in the center of the captured image 78 that does not overlap the component 73a.
3b is reached, and for the electronic component 73c that is the third exposure, a captured image 78 that does not overlap the electronic components 73a and 73b as shown in FIG. 7C.
This is performed when the electronic component 73c reaches the position projected on the left side of the. As a result, the electronic components 73a, 73b, 73
The electronic components 73a, 73b, 73c are included in a single captured image 78 without the positions of c on the captured image overlapping each other.
Will be exposed. That is, as shown in FIG. 8, during the exposure of the image pickup device, the illumination light is irradiated a plurality of times (here, 3 times).
Electronic component 7 by irradiation of multiple times.
The images of 3a, 73b, and 73c are sequentially exposed in one captured image 78.

The transfer head 31 is continuously moved without stopping at each exposure position, and the light emission timing of the illumination device 69 is adjusted by the signal control device 63. The signal control device 63 inputs the movement position of the transfer head 31 by the XY robot from the control unit 39 and controls the light emission of the illumination device 69 at a predetermined timing.
In addition to this, for example, a detection sensor that detects arrival of a component suction-held by the suction nozzle 37 is provided in the visual recognition device 41, and the light emission of the lighting device 69 is controlled based on the detection signal output timing from the detection sensor. It may be configured to.

Then, the image pickup device 71 converts the single picked-up image 78 that has been picked up into an image signal and outputs it to the visual recognition control device 61 as shown in FIG. Imaging device 71
The image signal 77 output from is input to the image memory 65, restored to a two-dimensional digital image and stored.
The image processing device 67 sends the image signal 77 to the image memory 65.
After completion of the input, the predetermined image processing is executed on the two-dimensional digital image stored in the image memory 65, and the position and orientation of the electronic component 73 are measured. Image processing device 6
The measurement result processed by 7 is communicated to the control unit 39 of the component mounting apparatus 100 shown in FIG. 4 and used as a correction value for the mounting direction and position of the electronic component 73 on the circuit board 21.

Based on the measurement result, the transfer head 31 drives the θ rotation motors 49a and 49b to rotate the suction nozzle 37 by θ to correct the suction posture (direction), and the component mounting position on the circuit board 21. Then, the XY robot corrects the mounting destination coordinates and mounts the electronic component 73.

Here, each mounting head 31a, 31b, 3
The electronic components 7c and 31d are attached to the electronic component 7 when the electronic component 73 is sucked from the parts feeder 33 or the parts tray 35 by the suction nozzle 37 and at the component mounting position of the circuit board 21.
3 when mounting the suction nozzle 37 to the actuator 4
By the operation of No. 3, it is lowered in the vertical direction (Z direction) from the XY plane. In addition, the suction nozzle 37 is appropriately replaced according to the type of the electronic component 73, and the mounting operation is performed. The electronic component 73 is completely mounted on the circuit board 21 by repeating the suction operation of the electronic component, the recognition operation of the suction component, and the mounting operation on the circuit board 21. The circuit board 21 that has been mounted is transferred from the board holding portion 17 to the unloader portion 19
The new circuit board 21 is transferred to the loader unit 15 while being unloaded to the loader unit 15.
The substrate is carried into the substrate holding unit 17 from above, and the above operation is repeated.

As described above, the component mounting apparatus 100 described above.
According to the component mounting method described above, the illumination device 69 is turned on at a predetermined timing each time the electronic component 73 passes through the imaging device 71, and the imaging device 71 is exposed while the illumination device 69 is turned on. Since the image of the electronic component 73 is captured in one captured image 78 and is collectively stored in the image memory 65, the imaging operation and the transfer operation of the image signal 77 which are conventionally repeated for each electronic component are omitted. As a result, the measurement processing time of the electronic component 73 can be significantly shortened.

Further, according to the component mounting method described above, FIG.
Unlike the conventional method shown in FIG. 6, it is not necessary to complete the storage of the image signal 77 of each electronic component in the image memory. Therefore, as shown in FIG. 9, without being restricted by the imaging system,
The illumination time (exposure time) t and the interval of the illumination time t can be shortened, and the electronic components can be moved in a short time. As a result, the imaging device 71 and the transfer head 31
The relative movement speed between and can be increased, and the measurement processing and the mounting processing can be further speeded up. In this case, the moving speed can be increased up to the mechanical limit speed of the moving mechanism of the transfer head (for example, about 2000 mm / sec).

Next, a second embodiment of the component mounting apparatus according to the present invention will be described. FIG. 10 is an enlarged view of the visual recognition device showing the second embodiment of the component mounting device according to the present invention. Hereinafter, members having the same functions as those described above will be designated by the same reference numerals and the description thereof will be omitted.
In the present embodiment, information on the optimum illumination condition (light quantity) for each electronic component 73 is stored in advance in the database unit 80 (see FIG. 4) provided in the component mounting apparatus 100. In addition, the lighting device 69 includes one light emitting element (for example, L
(ED, etc.) is composed of a plurality of light emitting element groups capable of lighting at different light intensity levels. The illumination device 69 is not limited to the case where one light emitting element is turned on at different light intensity levels all at once,
For example, a plurality of light emitting elements L capable of lighting at different light intensity levels
The first group may be composed of ₁ , L ₂ , and L ₃ , and a plurality of groups may be arranged. And
The signal control device 63 combines the number of light-emitting elements to be turned on and the light amount of the light-emitting elements to be turned on so as to irradiate the illumination light with the light amount corresponding to each electronic component 73 obtained from the database unit 80. The signal can be sent to the lighting device 69.

According to this embodiment, one light emitting element is lit at different light intensity levels of n levels, m of these light emitting elements are grouped into one group, and the number of individual light emitting elements to be lit in the group and , And the light amount level of the light emitting element that is turned on are combined to control the brightness in n × m stages, and the electronic component 73 to be irradiated is controlled.
It is possible to finely set the optimum amount of illumination light according to.

Next, a third embodiment of the component mounting apparatus according to the present invention will be described. FIG. 11 is an enlarged view of the visual recognition device showing the third embodiment of the component mounting device according to the present invention. In the present embodiment, information on the optimum illumination condition (color of illumination light) for each electronic component 73 is stored in advance in the database unit 80 provided in the component mounting apparatus 100. Also,
The lighting device 69 is composed of a plurality of light emitting elements that emit different colors. Then, the signal control device 63 sends a control signal for irradiating the illumination device 69 with illumination light of a color corresponding to each electronic component 73 based on the illumination color condition for the component to be imaged, which is obtained from the database unit 80. It is supposed to do.

According to this embodiment, a lighting device 69 having a plurality of types of light emitting elements that emit different colors, for example, a combination of light emitting elements that emit red (R), green (G), and blue (B). By turning on the light, the irradiation light of the color corresponding to the electronic component 73 to be irradiated can be irradiated, an image with a high contrast ratio can be obtained, and the measurement accuracy can be improved.

Next, a fourth embodiment of the component mounting apparatus according to the present invention will be described. FIG. 12 is a plan view of a lighting device showing a fourth embodiment of the component mounting device according to the present invention, and FIG.
2 is a sectional view taken along line AA of 2. In the present embodiment, the information on the optimum illumination condition (illumination angle of illumination light) for each electronic component 73 is stored in advance in the database unit 80 provided in the component mounting apparatus 100. The lighting device 69 is composed of a plurality of light emitting elements having different irradiation angles.

The illumination device 69 in this case is, for example, a rectangular tube 9
It can be configured by arranging light emitting elements having different irradiation angles on the inner circumference of the upper opening, the inner circumference of the upper part, and the inner circumference of the bottom part of the device 1. As a light emitting element with different irradiation angles,
For example, the light emitting element L in the irradiation direction near the irradiation surface 93
g, a light emitting element Lh inclined at 45 degrees with respect to the irradiation surface 93, and a light emitting element Lq in an irradiation direction substantially perpendicular to the irradiation surface 93. It should be noted that the light emitting element Lg in the irradiation direction near the irradiation surface 93 has its irradiation direction changed by using a mirror 95 as shown in FIG. In FIG. 12, 94 is
Represents a spot irradiated with illumination light.

According to this embodiment, the light emitting element of the irradiation angle corresponding to the electronic component 73 to be irradiated is turned on, and the optimum illumination light according to the recognition target such as the outline of the electronic component, the electrode, the printed character, etc. Irradiation becomes possible. As a result, the electronic component 7
The measurement accuracy of 3 can be improved.

Next, a fifth embodiment of the component mounting apparatus according to the present invention will be described. FIG. 14 is an explanatory view of a transfer head showing a fifth embodiment of the component mounting apparatus according to the present invention, and FIG. 15 is an explanatory view of an image pickup operation in the fifth embodiment. In this embodiment, the plurality of suction nozzles 37 provided on the transfer head 31 are provided.
In the direction orthogonal to the moving direction of the transfer head 31 by an interval L
Are arranged alternately in a zigzag pattern and the signal control device 63 adjusts the timing of illumination light and exposure according to the position of each electronic component 73 sucked and held by the suction nozzle 37. There is. Accordingly, it is possible to obtain an image in which the images of the plurality of electronic components 73 are arranged in one captured image 78 in the moving direction of the transfer head 31 and the direction orthogonal to the moving direction.

That is, the suction nozzles 37 arranged in a staggered manner.
Each of the electronic components 73 sucks and holds the electronic component 73, and at first, the illumination timing of each electronic component 73 passing through the image pickup device 71, that is, the exposure timing is kept constant, and the individual electronic components are set to the image pickup device. The imager continues to expose throughout the passage. Thereby, for example, the first electronic component 73a is illuminated and exposed at the normal timing as shown in FIG. 15A, and the next electronic component 73b is exposed as shown in FIG. 15B. In the captured image 78 of one sheet, the electronic components 73a are arranged at the first position with the interval L. This interval L corresponds to the interval L in the direction orthogonal to the moving direction of the staggered suction nozzles 37.
Then, the electronic component 73c is exposed by changing the irradiation timing of the illumination light. As a result, as for the electronic component 73c, as shown in FIG.
It will be lined up in a position away from.

As described above, the electronic components 73 are arranged in a staggered arrangement.
By repeating such an imaging operation for a, 73b, 73c, and 73d, as shown in FIG. 15D, the images of the plurality of electronic components 73 are transferred to the transfer head as shown in FIG. 31 can be arranged in the moving direction and the direction orthogonal to this. Accordingly, for example, when a plurality of electronic components 73 having a large aspect ratio are imaged, even if the image pickup size in the moving direction of the transfer head 31 is short, the image pickup area of the electronic component is set in the direction orthogonal to the moving direction. By allocating, one captured image 78 can be effectively used.

[0060]

As described in detail above, according to the component mounting method of the present invention, the illumination light is emitted at a predetermined timing every time the component sucked and held by the suction nozzle passes through the image pickup device. During the irradiation of the illumination light, the image pickup device substantially performs the exposure operation, so that the images of the plurality of sequentially exposed components are exposed at different positions in one screen. Then, since the suction state of the components is recognized from the captured image in which a plurality of components are stored in one screen, it is possible to collectively perform the image signal transfer operation which has been repeatedly performed for each component in the past. , The part recognition processing time can be greatly shortened. Further, since it is not necessary to complete the transfer operation of the image signal for each individual component, the moving speed between the components can be increased, and the relative moving speed between the imaging device and the transfer head can be increased. Further, the mounting process can be further speeded up.

According to the component mounting apparatus of the present invention, every time the component sucked and held by the suction nozzle passes the image pickup device by the moving means, the visual recognition device emits illumination light at a predetermined timing, and this illumination light is emitted. Since the image pickup device substantially performs the exposure operation while being irradiated with light, the image pickup device is exposed with images of a plurality of sequentially exposed components at different positions in one screen. This makes it possible to collectively perform the image signal transfer operation, which has been repeatedly performed for each component in the past, once, and it is possible to significantly reduce the component recognition processing time. Further, since it is not necessary to complete the transfer operation of the image signal for each individual component, the moving speed between the components can be increased, and the relative moving speed between the imaging device and the transfer head can be increased. Further, the mounting process can be further speeded up.

[Brief description of drawings]

FIG. 1 is an external perspective view of a component mounting apparatus according to the present invention.

FIG. 2 is a plan view showing a component mounting work surface of FIG.

FIG. 3 is an enlarged perspective view of the transfer head of FIG.

FIG. 4 is a block diagram showing an outline of a configuration of the component mounting apparatus of FIG.

5 is an enlarged view of a transfer head and a visual recognition device provided in the component mounting apparatus of FIG.

FIG. 6 is an operation explanatory view showing a moving state of the transfer head.

FIG. 7 is an operation explanatory diagram of a transfer head and a visual recognition device.

8 is a timing chart for explaining an image pickup operation of the visual recognition device shown in FIG.

FIG. 9 is a timing chart illustrating a relationship between an imaging operation and a moving speed.

FIG. 10 is an enlarged view of the visual recognition device showing the second embodiment of the component mounting device according to the present invention.

FIG. 11 is an enlarged view of the visual recognition device showing the third embodiment of the component mounting device according to the present invention.

FIG. 12 is a plan view of an illumination device showing a fourth embodiment of the component mounting device according to the present invention.

13 is a cross-sectional view taken along the line AA of FIG.

FIG. 14 is an explanatory diagram of a transfer head showing a fifth embodiment of the component mounting apparatus according to the present invention.

FIG. 15 is an explanatory diagram of an image capturing operation according to the fifth embodiment.

FIG. 16 is a timing chart illustrating an image capturing operation of a conventional visual recognition device.

FIG. 17 is a timing chart illustrating a conventional image pickup operation.

FIG. 18 is a timing chart illustrating a relationship between a conventional imaging operation and a moving speed.

[Explanation of symbols]

21 ... Circuit board 31 ... Transfer head 37 ... Suction nozzle 63 ... Signal control device 65 ... Image memory 69 ... Lighting device 71 ... Imaging device 73 ... Electronic components 77 ... Image signal 80 ... Database section 100 ... Component mounting device

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor's emblem             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Tamaki Ogura             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Seishiro Ryoike             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F term (reference) 5B047 AA12 AB04 BA01 BB04 BC11                       BC14 BC23 CA04 CA19 CB22                       DC06 EA01                 5E313 AA01 AA11 CC04 EE02 EE03                       EE24 EE25 FF24 FF28

Claims (10)

[Claims] 1. A transfer head in which a plurality of suction nozzles are arranged in parallel and an image pickup device are relatively moved in a direction in which the suction nozzles are arranged, and a plurality of components suction-held in each of the suction nozzles are imaged and obtained. A component mounting method for recognizing a suction state of the component to a suction nozzle from the captured image, correcting the mounting direction and the mounting position based on the recognition result, and mounting the component on a circuit board, The imaging device is moved relative to the transfer head while maintaining the exposure possible state, and each of the components sucked and held by the suction nozzle irradiates with illumination light at a predetermined timing every time the parts pass through the imaging device. A component mounting method, wherein images of a plurality of components exposed by illuminating with illumination light are stored in one screen to obtain a captured image. 2. The predetermined timing is a timing at which a position of a component exposed by irradiation of the illumination light with respect to the imaging device is adjusted to a different position so that the components do not overlap each other in the captured image. The component mounting method according to claim 1, wherein the component mounting method is provided. 3. The component mounting method according to claim 1, wherein the irradiation of the illumination light is performed under different illumination conditions depending on the component to be exposed. 4. The component mounting method according to claim 3, wherein the illumination condition includes at least one of an illumination light amount, an illumination color, and an illumination direction. 5. The plurality of suction nozzles are arranged in a zigzag pattern along the moving direction of the transfer head, and the parts are exposed at different positions in a direction orthogonal to the moving direction. The component mounting method according to any one of claims 1 to 4. 6. A moving means for relatively moving a transfer head having a plurality of suction nozzles arranged side by side and an image pickup device in a direction in which the suction nozzles are arranged side by side, and imaging a plurality of components sucked and held by each of the suction nozzles. And a visual recognition device that recognizes the suction state of the component to the suction nozzle from the obtained captured image, corrects the mounting direction and the mounting position of the component based on the recognition result, and circuitizes the component. A component mounting device to be mounted on a board, wherein the visual recognition device illuminates a plurality of components sucked and held by each of the suction nozzles with illumination light, and images the components illuminated by the lighting device. And an image pickup device that sends a signal for maintaining the exposure possible state to the image pickup device, and the components that are suction-held to the illumination device by the suction nozzle are respectively the image pickup device. A signal control device that sends an irradiation signal of illumination light at a predetermined timing each time it passes, and an image memory that stores a captured image in which a plurality of component images exposed by the irradiation of the illumination light are contained in one screen. And a component mounting apparatus for recognizing a suction state of the component to the suction nozzle by using a captured image of the image memory. 7. A database unit preliminarily storing information on lighting conditions for each of the parts, wherein the lighting device includes a plurality of light-emitting elements that can be turned on at different light intensity levels, and the signal control device includes: A number of the light emitting elements to be turned on, a light amount level of the light emitting elements to be turned on, or a combination thereof is controlled based on an illumination condition for a component to be imaged obtained from the database unit. The component mounting apparatus according to claim 6. 8. A database unit preliminarily storing information on lighting conditions for each of the electronic parts, wherein the lighting device includes a plurality of types of light emitting elements that emit different colors, and the signal control device includes: 7. The component mounting apparatus according to claim 6, wherein the color of the irradiation light to the component is controlled based on the illumination condition for the component to be imaged, which is obtained from the database unit. 9. A database unit preliminarily storing information on lighting conditions for each of the parts, wherein the lighting device includes a plurality of light emitting elements having different irradiation angles with respect to the parts, and the signal control device includes: 7. The component mounting apparatus according to claim 6, wherein the irradiation angle to the component is controlled based on the illumination condition for the component to be imaged obtained from the database unit. 10. The plurality of suction nozzles of the transfer head are arranged in a zigzag pattern along the moving direction of the transfer head, according to any one of claims 6 to 9. The component mounting apparatus according to the item.