JP2003174063A - Semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a tape carrier having such a structure as a plurality of semiconductor elements can be mounted on one tape carrier. <P>SOLUTION: Among a base tape 11 having a device hole 14, a plurality of leads 16 provided on the base tape 11, and these leads 16, inner leads projecting from the device hole edge 15 of the device hole 14 toward the central direction thereof have a plurality of different lengths. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a tape carrier package (Tape Carrier Pac).
kage) (hereinafter sometimes referred to as TCP) for a tape carrier.

[0002]

2. Description of the Related Art The development of semiconductor integrated circuit technology
In particular, with the increasing demand for high-density packaging due to the increase in the number of pins, various package forms of semiconductor devices have been developed.

A tape carrier package (TCP) is one of such package forms. The tape carrier mentioned here means that after forming a device hole in a flexible base tape, a lead (circuit pattern) is formed by, for example, photolithography, and a solder resist for protecting the formed lead is applied. It is a semiconductor device. The tape carrier package is a package in which a semiconductor element is mounted on the tape carrier and then sealed with resin or the like. Further, in this specification, the semiconductor element is mounted on the tape carrier,
The structure that is not molded may be simply referred to as a structure.

A conventional tape carrier is provided in a long photographic film base tape formed of, for example, a film of polyimide or the like, and a large number of device holes are provided so as to be in series in the longitudinal direction of the base tape. . In addition, in the vicinity of both ends in the short axis direction of the base tape, in order to facilitate transportation in the base tape manufacturing process and the like, a plurality of arrays are arranged in parallel with the device holes in the long axis direction of the base tape. A sprocket hole is provided. A plurality of leads are formed so as to project as inner leads in each of the device holes. The leads are generally made of a conductive metal such as aluminum or copper. Further, a solder resist is applied to the leads for the purpose of protecting the wiring pattern within the range where the leads are placed on the base tape.
The entire surface of the lead is plated with Sn (tin), Au (gold), solder or the like for protection and bonding of the lead.

The semiconductor element mounted on the tape carrier is bonded to the inner lead by using, for example, a metal eutectic method or a thermocompression bonding method. After that, a mold is formed with resin or the like. Finally, cut out from the base tape piece by piece to complete the package. This package is surface-mounted on a printed circuit board or the like by bonding its outer leads.

Compared with other package forms, such a TCP can be easily made smaller and thinner, and is extremely suitable for high-density surface mounting, so that its range of use will be further expanded. Is expected.

However, the conventional tape carrier is
Only one semiconductor element can be mounted on one tape carrier, and a plurality of semiconductor elements, especially a plurality of semiconductor elements of different sizes, can be mounted on one tape carrier at a high density to realize a higher functionality of the package. Was difficult.

A package form called a ball grid array (BGA) is known as a package form on a printed circuit board that allows multiple pins per same mounting area. In this structure, metal balls are provided in a grid pattern on the bottom surface side of the semiconductor element for connection with an external circuit such as a printed circuit board. According to this structure, the external connection terminals, that is, the metal balls can be arranged in the two-dimensional plane of the tape carrier, so that the number of pins can be increased without increasing the size of the package.

For example, a package form in which a tape carrier and a ball grid array are combined is also known. According to this configuration, it is possible to draw many external terminals from a package of the same size, but it is possible to improve the functionality of the package itself by mounting a plurality of semiconductor elements on one tape carrier with high density. It was very difficult to realize.

[0010]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems of the prior art, and a plurality of semiconductor elements, particularly a plurality of semiconductor elements having different sizes, are provided in one device hole of a tape carrier. By enabling mounting, it is an object to achieve higher functionality and higher added value without impairing the advantages of TCP that is small and thin.

[0011]

In order to solve the above-mentioned problems, the tape carrier of the present invention has a base tape having a device hole, a plurality of leads provided on the base tape, and a plurality of leads. The inner lead protruding from the device hole edge of the device hole toward the center of the device hole has a plurality of different lengths.

With this structure, a plurality of semiconductor elements are integrated into one.
Since it can be efficiently mounted in the device hole of two tape carriers, it is small and thin.
It is possible to achieve higher functionality and higher added value of TCP without impairing the advantages of CP.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. It should be noted that the drawings only schematically show the sizes and arrangements of the constituent elements to the extent that the present invention can be understood, and the present invention is not particularly limited thereby. Further, in each of the drawings used in the following description, the same components are denoted by the same reference numerals, and the duplicate description thereof may be omitted. It is to be understood that in the cross-sectional views, only the contour of the mold is shown by broken lines and hatching (diagonal line) showing the cross-sections of the constituents may be omitted in order to facilitate understanding of the internal structure.

<First Embodiment> FIG. 1 is a diagram schematically showing a configuration of a first embodiment of the present invention. Figure 1
(A) is a schematic plan view showing an example of a structure in which three semiconductor elements are mounted on the tape carrier of the present invention.
FIG. 1B is a schematic cross-sectional view of the cross section of the structure of FIG. 1A taken along the broken line CC ′ as seen from the arrow direction.

A first embodiment of the present invention will be described with reference to FIGS. 1 (A) and 1 (B). The tape carrier 10 of the present invention is formed by forming a sprocket hole 12 for transfer in a long base tape 11 provided with a plurality of device holes 14. Further, as the lead 16, a lead having inner leads of three different lengths, that is, a first lead 16a, a second lead 16b shorter than the first lead 16a, and a third lead shorter than the second lead 16b. As a rule, one set of leads 16c is arranged in this order, and a plurality of sets are regularly arranged along the peripheral edge of the device hole edge 15 of the device hole 14. Here, the first lead 16a, the second lead 16b, and the third lead 16c are distinguished by the length of their inner leads, not by the total length of the leads (hereinafter The same applies to the embodiment). In the configuration of FIG. 1A, two sets of leads 16 are provided when viewed from the device hole edge 15 on the outer lead side toward the center of the device hole. Further, the third end is provided on the right end of the lead 16 which constitutes the set.
1 lead 16c is added.

The inner lead referred to in the present invention means a partial region of the lead 16 from the device hole edge 15 to the tip of the lead 16 protruding into the space of the device hole 14.

The lead 16 is protected by a solder resist 18 within the range of being placed on the base tape 11.

In FIG. 1A, the lead 16 is actually used.
The solder resist 18 provided so as to cover the above is shown only in its outline in order to facilitate understanding of the positional relationship of the leads 16 (the same applies in the following figures).

First lead 16a and second lead 16b
And the length of the inner lead of each of the third leads 16c is determined in consideration of the semiconductor element size of the semiconductor element to be bonded to each inner lead, the thickness of the semiconductor element, and the electrode arrangement for bonding with the inner lead. (Details will be described later).

Three semiconductor elements, that is, a first semiconductor element 20, a second semiconductor element 30, and a third semiconductor element 40 are mounted in the device hole 14. A plurality of first protruding electrodes 22 are formed as bonding pads on the upper surface of the first semiconductor element 20.
Is provided along the side that constitutes the upper surface of the. Second
A plurality of second protruding electrodes 32 are formed on the upper surface of the semiconductor device 30.
Are provided so as to extend along the sides that form the upper surface. Similarly, a plurality of third protruding electrodes 42 are provided on the upper surface of the third semiconductor element 40.

These three semiconductor elements mounted on the tape carrier 10 are in the shape of a rectangular parallelepiped whose upper and lower surfaces have the same rectangular shape. Each of the three semiconductor elements has a shape similar to each other. The thickness of each semiconductor element is the same. Comparing the size of these three semiconductor elements, that is, the area of the upper surface, the area of the upper surface of the first semiconductor element 20 is the smallest. Further, the area of the upper surface of the third semiconductor element 40 is the maximum. The area of the upper surface of the second semiconductor element 30 is between these two semiconductor elements. That is, these three semiconductor elements are mounted on the tape carrier 10 in a step pyramid shape.

A plurality of semiconductor elements mounted, that is, the first semiconductor element 20 in this embodiment,
If the three semiconductor elements of the second semiconductor element 30 and the third semiconductor element 40 can be stacked without impairing their functions with each other and securing the bonding pad region in each semiconductor element, In order to minimize the thickness of TCP, it is preferable that the three semiconductor elements are bonded by an adhesive (not shown). For example, the bottom surface of the first semiconductor element 20 may be replaced with the second semiconductor element 30.
It is adhered to the upper surface of the with an adhesive. Second semiconductor element 30
The bottom surface of the is bonded to the upper surface of the third semiconductor element 40 with an adhesive. However, these semiconductor elements may be separated from each other in the mold 60 in order to prevent malfunctions due to, for example, interference between the plurality of mounted semiconductor elements due to noise.

The lower surface of the tip portion of the first lead 16a is bonded to a bonding pad existing in the bonding area provided on the surface of the first semiconductor element 20, that is, the first protruding electrode 22. Second lead 1
The second protruding electrode 32 of the second semiconductor element 30 is bonded to the lower surface of the tip portion of 6b. Third lead 1
The third protruding electrode 42 of the third semiconductor element 40 is bonded to the lower surface of the tip portion of 6c.

In the first embodiment, when three semiconductor elements are mounted, the inner leads having three different lengths are set as one set, and in principle, the inner leads are regularly arranged in parallel on the tape carrier. did. However, it is possible to mount more semiconductor elements than the number of pairs of inner lead lengths by devising the arrangement of semiconductor elements and the like.

Therefore, the present invention comprises a set of inner leads having a length of 2 or 3 or more, and a tape carrier capable of mounting as many semiconductor elements as the number of the lengths or more. The configuration example of TCP to which this tape carrier is applied is disclosed.

As described above, the length of the inner lead is set to a plurality of types according to the number of semiconductor elements mounted on the tape carrier of the present invention, the size thereof, the arrangement of bonding pads, etc. Since it is possible to easily mount a plurality of semiconductor elements, especially a plurality of semiconductor elements having different sizes, it is possible to further increase the T
It is possible to realize multi-functionality and high added value of CP.

At this time, the arrangement of the bonding pad provided on the uppermost first semiconductor element 20, that is, the protruding electrode 22, is particularly considered as long as the first lead 16a of the tape carrier 10 can be bonded. Does not need However, when laminating and bonding a plurality of semiconductor elements, a bonding pad provided on the upper surface of the second semiconductor element 30 mounted on the bottom surface side of the first semiconductor element 20, that is, the second protruding electrode 32. The first semiconductor element 20 and the second lead 16b bonded to the second protruding electrode 32 of the second semiconductor element 30 are prevented from being electrically short-circuited, and the second semiconductor element 30 has a second The protruding electrode 32 and the first semiconductor element 20 of the first
It is necessary to set the protruding electrodes 22 so as to be spatially and electrically separated from each other. However, this is not the case when a plurality of semiconductor elements are separated from each other without adhering to each other. Second semiconductor element 30 and third
The same applies to the relationship with the semiconductor element 40 of
The bonding pad, that is, the position where the protruding electrode is arranged is set on the surface of the semiconductor element 40.

Generally, in order to prevent the leads from being electrically short-circuited, the semiconductor element to be bonded to the inner leads of the tape carrier is offset and bonded so as to be sunk vertically to the plane of the tape carrier. It is often done.

Therefore, when the semiconductor element to be mounted on the tape carrier is already completed and the tape carrier of the present invention is manufactured accordingly, the lengths of a plurality of inner leads of the tape carrier are properly set. Specific requirements for setting include semiconductor element sizes and semiconductor element thicknesses to be bonded to inner leads having a plurality of lengths, and inner lead length margins necessary for a desired offset. To be In other words, the total thickness of the completed package can be reduced in thickness and size so that a defect does not occur when the package is mounted on a printed circuit board or the like.
It is better to set it so that the original characteristics are not impaired.

Regarding the shape of the inner leads of the tape carrier of the present invention, the length thereof should be as short as possible in order to prevent an electrical short circuit between the inner leads within the range of the above-mentioned setting requirements. . Further, in order to facilitate the bonding to the bonding pad of the semiconductor element, it is preferable that the width of the tip portion of the inner lead be as wide as possible.

In the first embodiment and all the embodiments described below, the material of the base tape is not particularly limited as long as the object of the present invention is not impaired.

In the configuration example of the first embodiment shown in FIG. 1, the planar shape of the device hole 14 and the semiconductor element is rectangular, but according to the configuration example of the present invention, it is not necessary. The shape is not limited, and may be, for example, a circular shape, an elliptical shape, or the like (the same applies to the following embodiments).

In the first embodiment, the thickness of each of the plurality of semiconductor elements mounted on the tape carrier 10 is the same, but within the range that does not impair the object of the present invention.
The structure of the tape carrier package of the present invention is not limited to this. That is, the tape carrier 10 of the present invention
The thickness of each of the plurality of semiconductor elements mounted on the semiconductor device may be different (the same applies to the following embodiments).

The shape of the upper surface of the semiconductor element mounted on the tape carrier 10 of the present invention has been described by taking a rectangular shape as an example, but the respective shapes are the first semiconductor element 20 and the second semiconductor element 30. The third semiconductor element 40 and the third semiconductor element 40 may be different from each other as long as they are mounted on the tape carrier so as not to impair their functions (the same applies to the following embodiments).

In the above-described embodiment, an example of designing the tape carrier, especially the inner lead structure, according to the structure of the semiconductor element has been described. For example, in the design stage of the semiconductor element, a plurality of sets of inner leads are used. The electrode arrangement and the like of the semiconductor element to be mounted may be optimized according to the existing tape carrier having.

Next, the bonded semiconductor element and inner lead are sealed by forming a mold 60 of resin or the like. For example, when a thermosetting adhesive is applied to the semiconductor element, it is hardened by the heat applied when the mold 60 is formed (the same applies to the following embodiments).

According to the structure of the tape carrier of the first embodiment, a plurality of semiconductor elements having different sizes are integrated into one.
It can be mounted on two tape carriers, without compromising the advantages of TCP that it is small and thin.
It is possible to achieve higher functionality and higher added value in the same mounting area.

Next, with reference to FIG. 1, an example of a method of manufacturing the tape carrier and TCP of the present invention will be described.

First, the sprocket hole 12 and the device hole 14 are formed in the flexible base tape 11 formed of a polyimide film, a polyester film or the like. Preferably, it is mechanically formed using a mold and a puncher.

Then, a copper foil is attached to the upper surface of the base tape 11. After that, for example, the length, width, and arrangement of the inner leads are set in consideration of the size of the mounted semiconductor element, the electrode arrangement, the arrangement of the semiconductor element itself in the package, and the photoresist process and A plurality of leads 16 (wiring patterns) are formed by performing an etching process or the like.

Next, the entire exposed surface of the lead 16 is plated with a metal such as Au (gold), Sn (tin) or solder for bonding of the mounted semiconductor element and protection of the lead. Then, the leads 16 formed on the upper surface of the base tape 11, that is, the solder resist 18 for protecting the leads 16 in the wiring pattern within the range placed on the base tape 11 are formed. In this way
The tape carrier 10 of the present invention is manufactured.

Next, the TCP manufacturing process will be described. When the semiconductor element is bonded to the tape carrier 10, the metal plating material applied to the leads 16 and the bonding pad on the semiconductor element side, that is, the Au bump or the like are subjected to metal eutectic or thermocompression bonding. It is common. Specifically, at least the upper surface of the lead 16,
In some cases, by further melting the metal plating present on the lower surface and / or the side surface (one or both side surfaces),
The inner lead and the semiconductor element are bonded by metal eutectic or thermocompression bonding to a bonding pad of the semiconductor element, that is, a bump electrode such as an Au bump.

First, the first lead 16a and the first protruding electrode 22 of the first semiconductor element 20 are aligned with each other, and then bonded to each other using a bonding apparatus. Then, after aligning the second protruding electrode 32 of the second semiconductor element 30 with the second lead 16b, they are bonded to each other using a bonding apparatus. At the time of this alignment, an adhesive or the like is applied to the lower surface of the first semiconductor element 20, and the first semiconductor element 20 and the second semiconductor element 3
You may adhere 0 and. Similarly, the third semiconductor element 40 is also bonded to the third lead 16c.
At this time, if desired, an adhesive or the like may be applied to the lower surface of the second semiconductor element 30 to form a stack of three semiconductor elements. When mounting four or more semiconductor elements on the tape carrier of the present invention, basically the same steps can be adopted.
In this way, the structure as shown in FIG. 1 is obtained.

After that, a mold 60 is formed of resin or the like to seal a plurality of semiconductor elements and inner leads to be mounted. At this time, one or two or more surfaces of the respective semiconductor elements mounted on the tape carrier 10 may be exposed in consideration of heat dissipation of the semiconductor elements and improvement of cost performance by saving the molding material. When the semiconductor elements have different thicknesses, for example, one or more of the surfaces of the plurality of semiconductor elements may be exposed in accordance with the total thickness of the stacked semiconductor elements.

<Second Embodiment> FIG. 2 is a diagram schematically showing the configuration of a second embodiment of the present invention. Figure 2
(A) is a schematic plan view showing an example of a structure in which three semiconductor elements are mounted on the tape carrier 10 of the present invention in an arrangement different from that of the first embodiment. Figure 2 (B)
FIG. 3 is a schematic cross-sectional view of a cross-section cut along a broken line CC ′ of FIG.

A second embodiment of the present invention will be described with reference to FIGS. 2 (A) and 2 (B). The tape carrier 10 according to the second embodiment is different from the tape carrier according to the first embodiment in that the lead 16 has inner leads of two different lengths, that is, the first lead. 16a and the second lead 16b having a length shorter than that of the first lead are provided as a set of two. A plurality of sets are provided side by side on the base tape 11. In the configuration of FIG. 2A, when viewed from the device hole edge 15 on the outer lead side toward the center of the device hole, three sets of leads 1 are formed on the base tape 11.
6 is provided. Further, one second lead 16b is added to the right end of the lead 16 forming the set.
Plural sets of these one set of leads 16 are arranged along the periphery of the device hole edge 15 of the device hole 14 in a direction extending toward the center of the device hole 14.

Three semiconductor elements, that is, a first semiconductor element 20, a second semiconductor element 30 and a third semiconductor element 40 are mounted in the device hole 14. A plurality of first protruding electrodes 22 are provided as bonding pads on the upper surface of the first semiconductor element 20. The second protruding electrode 32 is provided on the upper surface of the second semiconductor element 30. A third protruding electrode 42 is provided on the upper surface of the third semiconductor element 40. That is, all the semiconductor elements are mounted in the same direction with respect to the position where the protruding electrodes are provided, that is, the respective protruding electrodes face upward.

Each of these three semiconductor elements has a rectangular parallelepiped shape whose upper and lower surfaces are the same, and in particular, the upper and lower surfaces of the third semiconductor element 40 are the same square shape. There is. The thickness of each semiconductor element is the same. Comparing the size of these three semiconductor devices, that is, the area of the upper surface,
The area of the upper surface of the semiconductor element 20 is the smallest. The area of the upper surface of the second semiconductor element 30 is larger than that of the first semiconductor element 20 but smaller than that of the third semiconductor element 40. The area of the upper surface of the third semiconductor element 40 is maximum. The length of the long axis of the rectangle on the upper surface of the first semiconductor element 20 is equal to the length of the long axis of the rectangle on the upper surface of the second semiconductor element 30. The length of this major axis is smaller than the length of the outer peripheral side of the upper surface of the third semiconductor element 40. Also, the first
The sum of the length of the short axis of the rectangle on the upper surface of the semiconductor element 20 and the length of the short axis of the rectangle on the upper surface of the second semiconductor element 30 is
Of the major axis of the semiconductor element 30 and the third semiconductor element 4
The length is set to be smaller than the length of the outer peripheral side of the rectangle of the upper surface of 0. Then, the first semiconductor element 20 and the second semiconductor element 30 are arranged in parallel on the upper surface side of the third semiconductor element 40 such that their long axes face each other. In this embodiment, the first semiconductor element 20 and the second semiconductor element 30 are mounted on the upper surface side of the third semiconductor element 40 so that their functions are not impaired. That is, the third semiconductor element 40
Bonding pads on the surface of the first semiconductor element 20 and / or the second semiconductor element 30
Is installed so as not to infringe and impair its function. At this time, these three semiconductor elements are preferably bonded by an adhesive (not shown) in order to minimize the thickness of TCP. That is, the first semiconductor element 20 and the second semiconductor element 20
It is preferable that the bottom surface of the semiconductor element 30 is adhered to the top surface of the third semiconductor element 40 with an adhesive.

The first lead 16a is bonded to the protruding electrode 22 of the first semiconductor element 20 and the protruding electrode 32 of the second semiconductor element 30. Second lead 16b
Are bonded to the protruding electrodes 42 of the third semiconductor element 40.

The method of manufacturing the tape carrier 10 and the TCP of this embodiment is almost the same as that of the first embodiment, and the description thereof will be omitted.

According to the second embodiment, three semiconductor elements can be mounted on a tape carrier having a set of inner leads having two different lengths. That is, the package can be made thinner than the case where three semiconductor elements are sequentially stacked. Therefore, TCP more efficiently
It is possible to realize multi-functionalization and high added value.

FIG. 3 is a diagram schematically showing the configuration of a modification of the second embodiment of the present invention. FIG. 3A is a schematic plan view showing an example of a structure body included in the structure body of the second embodiment. FIG. 3B is C- of FIG.
It is a schematic sectional drawing which saw the cut end of the section in a C'broken line from the arrow direction.

A modified example of the second embodiment of the present invention will be described with reference to FIGS. 3 (A) and 3 (B).

The form of the tape carrier of FIG. 3 and the semiconductor element laminated thereon is the same as that of the second embodiment described above, except that the first semiconductor element 20 and the second semiconductor element 30 are made of metal. It is characterized in that they are connected by wiring 44. First semiconductor element 20 and second semiconductor element 30
The projecting electrodes provided along the respective sides facing each other, that is, the first projecting electrode 22 and the second projecting electrode 32 are connected by the metal wiring 44. The structure, arrangement, and connection of the tape carrier 10, the first semiconductor element 20, the second semiconductor element 30, and the third semiconductor element 40 are the same as those of the second embodiment, except for the points described above. The description is omitted, and only the characteristic part will be described.

The three semiconductor elements are the device holes 14
It is provided inside. That is, the first semiconductor element 20 and the second semiconductor element 30 are mounted on the upper surface side of the third semiconductor element 40. The first protruding electrode 22 of the first semiconductor element 20 and the second protruding electrode 32 of the second semiconductor element 30 are further provided along the sides of these two semiconductor elements facing each other. The first projecting electrode 22 and the second projecting electrode 32 of two different semiconductor elements arranged with two opposite sides sandwiched therebetween are connected to each other by bonding a metal wiring 44 to each.

The shape such as the width and length of the metal wiring 44 and the material thereof are not particularly limited as long as the object of the present invention is not impaired. However, considering the manufacturing process, it is preferable to set it within a range in which the device used for bonding the inner lead and the protruding electrode of the semiconductor element can be applied.

According to this structure, for example, the first semiconductor element 20 and the second semiconductor element 30 are directly connected, so that the operation of the package can be speeded up. Further, since two semiconductor elements can cooperate in the package, higher functionality can be achieved.

Since the method of manufacturing the tape carrier 10 of this embodiment is substantially the same as that of the first embodiment, the description thereof will be omitted, and the method of manufacturing the TCP characteristic of this embodiment will be described.

First, the first lead 16a in the device hole 14 and the first protruding electrode 22 of the first semiconductor element 20 are aligned with each other, and then bonding is performed using a bonding apparatus. Then, the second protruding electrode 3 of the second semiconductor element 30.
2 and the third protruding electrode 42 of the third semiconductor element 40
After being aligned with the lead 16b, the bonding is performed using a bonding device. At the time of this alignment, an adhesive or the like is applied to the lower surface of the first semiconductor element 20, and the first semiconductor element 20, the second semiconductor element 30, and the third semiconductor element 40 are separated from each other. To glue.

Bonding of the metal wiring 44 is preferably performed by using a bonding apparatus at the stage where each semiconductor element is positioned in the device hole 14. Further, it may be performed after all the bonding of the inner leads is completed. In addition, three semiconductor elements before being mounted on the tape carrier are adhered and laminated, and then the first semiconductor element 20 and the second semiconductor element 30 are connected by the metal wiring 44, and then the plurality of semiconductor elements are connected. You may bond a laminated body to an inner lead. In this way, the structure shown in FIG. 3 is obtained.

After that, the mold 60 may be applied in the same manner as in the first embodiment.

<Third Embodiment> FIG. 4 is a diagram schematically showing a configuration of a third embodiment of the present invention. Figure 4
FIG. 3A is a schematic plan view showing an example of a structure in which three semiconductor elements are mounted on the tape carrier 10 of the present invention. FIG. 4B is a schematic cross-sectional view of a cross-section cut along a broken line CC ′ of FIG.

A third embodiment of the present invention will be described with reference to FIGS. 4 (A) and 4 (B).

The tape carrier 10 of the third embodiment
However, two leads 16 each having two different lengths of inner leads, that is, a first lead 16a and a second lead 16b shorter than the first lead are two sets, and a plurality of sets are formed on the base tape 11. The second one is installed in parallel with
This is the same as the embodiment. 3 in device hole 14
The same applies to mounting two semiconductor elements. The third embodiment differs from the second embodiment in the size and arrangement of the semiconductor elements mounted on the tape carrier 10.

The three semiconductor elements mounted on the tape carrier 10 have a rectangular parallelepiped shape in which the upper surface and the lower surface are the same rectangular shape. Especially the first semiconductor element 2
The shape of the upper surface and the lower surface of 0 is a square having the same shape. The thickness of each semiconductor element is the same. The length of the long axis of the rectangle on the upper surface of the second semiconductor element 30 is equal to the length of the long axis of the rectangle on the upper surface of the third semiconductor element 30. Then, the second semiconductor element 30 and the third semiconductor element 40 are arranged in parallel on the lower surface side of the first semiconductor element 20 so that their long axes face each other and are electrically and spatially separated from each other. Has been done.

In this embodiment, the second semiconductor element 30 and the third semiconductor element 40 are mounted on the lower surface side of the first semiconductor element 20 so that their functions are not impaired. The first semiconductor element 20 is, for example, brought into contact with the bonding pads on the surfaces of the second semiconductor element 30 and the third semiconductor element, that is, the second protruding electrode 32 and the third protruding electrode 42 to electrically short-circuit them. It is installed so as not to impair its function. Therefore, the first semiconductor element 20 is located inside the bonding pads for the inner leads of the second semiconductor element 30 and the third semiconductor element 40.
It is better to install so that In order to minimize the thickness of TCP, these three semiconductor elements are preferably adhered by an adhesive (not shown). That is, by using an adhesive, the lower surface of the first semiconductor element 20 is spread over only the areas which are the upper surfaces of the second semiconductor element 30 and the third semiconductor element 40 and do not impair their functions. The three semiconductor elements are bonded together. At this time, the second semiconductor element 30 and the third semiconductor element 40 are arranged so as to be spatially and electrically separated from each other as described above, and this distance is, for example, that of the first semiconductor element 20. It can be appropriately changed according to the size. Although the three semiconductor elements have the same thickness, the three semiconductor elements to be mounted may have different thicknesses.

The first lead 16a is bonded to the protruding electrode 22 of the first semiconductor element 20. The second lead 16b serves as the protruding electrode 32 of the second semiconductor element 30.
And is bonded to the protruding electrode 42 of the third semiconductor element 40.

Since the method of manufacturing the tape carrier 10 of this embodiment is substantially the same as that of the first embodiment, the description thereof will be omitted, and the method of manufacturing the TCP characteristic of this embodiment will be described.

First, the inner lead end portion of the first lead 16 a in the device hole 14 and the first semiconductor element 20.
After aligning the first protruding electrodes 22 of the above, they are bonded to each other using a bonding apparatus. Then, after aligning the second protruding electrode 32 of the second semiconductor element 30 and the third protruding electrode 42 of the third semiconductor element 40 with the inner lead end portion of the second lead 16b, they are bonded to each other using a bonding apparatus. To do. At the time of this alignment, an adhesive or the like is applied to the lower surface of the first semiconductor element 20, and the first semiconductor element 20, the second semiconductor element 30, and the third semiconductor element 40 are separated from each other. You may adhere. In this way, the structure shown in FIG. 4 is obtained.

After that, a semiconductor element is sealed by forming a mold with resin or the like. At this time, one or two or more surfaces of the respective semiconductor elements mounted on the tape carrier 10 may be exposed in consideration of heat dissipation of the semiconductor elements and improvement of cost performance by saving the molding material. At this time, if the respective semiconductor elements have different thicknesses, for example, one or more of the surfaces of the plurality of semiconductor elements are exposed according to the total thickness of the stacked semiconductor elements. Is good.

Also with this configuration, the same effect as that of the second embodiment can be obtained.

<Fourth Embodiment> FIG. 5 is a diagram schematically showing a configuration of a fourth embodiment of the present invention. Figure 5
(A) is a schematic plan view showing an example of a structure in which two semiconductor elements are mounted on the tape carrier 10 of the present invention. The second semiconductor element 30 mounted on the lower side
For easy understanding of the arrangement and connection of the above, only the outline is shown for the first semiconductor element 20 mounted on the upper side. FIG. 5B is a schematic cross-sectional view of the cross-section cut along the broken line CC ′ of FIG.

A fourth embodiment of the present invention will be described with reference to FIGS. 5 (A) and 5 (B). The tape carrier 10 according to the fourth embodiment has a lead 16 having inner leads of two different lengths, that is, a first lead 16a and a second lead 16 shorter than the first lead.
It is the same as the tape carrier of the second embodiment and the third embodiment that two sets of b are provided in parallel on the base tape 11. The fourth embodiment differs from the first to third embodiments in that
The relationship is the number of semiconductor elements mounted on the tape carrier 10 and the arrangement.

Two semiconductor elements, that is, the first semiconductor element 20 and the second semiconductor element 30 are mounted in the device hole 14 in the tape carrier 10 of this embodiment.

These two semiconductor elements are in the shape of a rectangular parallelepiped in which the upper surface and the lower surface are the same square. The thickness of each semiconductor element is the same. Comparing the areas of the upper surfaces, the first semiconductor element 20
Is larger than the second semiconductor element 30.

A plurality of first protruding electrodes 22 are formed on the first semiconductor element 20 along the peripheral edge of the lower surface thereof. A second protruding electrode 32 is formed on the second semiconductor element 30 along the peripheral edge of the upper surface thereof. Therefore,
In these two semiconductor elements, the first projecting electrode 22 of the first semiconductor element 20 and the second projecting electrode 32 of the second semiconductor element 30 are mounted in mutually facing directions, that is, in mutually different directions. .

The first lead 16a is bonded at its lower end side to the protruding electrode 32 arranged on the upper surface side of the second semiconductor element 30 in a mounting form so-called face down. The second lead 16b is bonded to the bump electrode 22 whose upper end side is arranged on the lower face side of the first semiconductor element 20 in a so-called face-up mounting form.

At this time, the first semiconductor element 20 and the second semiconductor element 30 are electrically short-circuited if their respective protruding electrodes come into contact with each other, impairing the function of the mounted semiconductor element and eventually the function of the package itself. Therefore, it is necessary to be spatially separated and held. In this example, the semiconductor elements are prevented from being electrically short-circuited by holding them so as to be spatially separated by the distance d1.

Although the two semiconductor elements have the same thickness, the two semiconductor elements may have different thicknesses.

In the method of manufacturing the tape carrier 10 of this embodiment, when designing the inner leads, a set of two lengths is optimized and set according to the mounted semiconductor element. The description is omitted because it is almost the same as that of the first embodiment, and a TCP manufacturing method that is characteristic of this embodiment will be described.

First, the inner lead end portion of the first lead 16 a in the device hole 14 and the second semiconductor element 30.
After the second protruding electrodes 32 of 1 are aligned, they are bonded to each other using a bonding device. Then, the tape carrier 10 is turned inside out. After aligning the first protruding electrode 22 of the first semiconductor element 20 with the second lead 16b, they are bonded to each other using a bonding apparatus. In this way, the structure shown in FIG. 5 is obtained.

Although the example including the step of turning the tape carrier 10 inside out has been described here, for example, the tape carrier 1
If an apparatus capable of bonding inner leads from both sides of 0 is used, this step can be omitted.

After that, a semiconductor element is sealed by forming a mold with resin or the like. At this time, the mold 60 is formed by holding the first semiconductor element 20 and the second semiconductor element 30 so as to be separated by the distance d1.

Similar to the above-mentioned embodiment, in consideration of the heat dissipation of the semiconductor element, the cost performance improvement by saving the molding material, etc., the surface of each of the semiconductor elements mounted on the tape carrier 10 is It may be configured to expose two or more.

According to this structure, the protruding electrode of the mounted semiconductor element, that is, the bonding pad can be protected inside the package. Therefore, since the strength of the TCP against external impact can be increased, the TCP can be highly functional as in the above-described embodiment,
The yield can be improved.

FIG. 6 is a sectional view schematically showing the structure of a modified example of the structure of the fourth embodiment of the present invention. The plan view is almost the same as that in FIG.

The tape carrier 10 includes a set of two leads 16 each having a set of two inner leads of different lengths, that is, a first lead 16a and a second lead 16b shorter than the first lead 16a. As in the fourth embodiment, a plurality of sets are provided side by side on the base tape 11. The same applies to mounting two semiconductor elements in the device hole 14. The difference between this example and the sixth embodiment lies in the optimization of the distance d2 between the first semiconductor element 20 and the second semiconductor element 30 and the setting of the inner lead length accordingly. That is, the distance d2 between the first semiconductor element 20 and the second semiconductor element 30 is made wider. Therefore, d1 and d2 are
The relationship is d1 <d2. When setting the separation distance d2, it is preferable to set d2 wider than d1 within a range that does not impair the characteristic of TCP that is thin.

The first semiconductor element 20 is offset slightly above the device hole 14. The second semiconductor element 30 is offset slightly below the device hole 14. Therefore, along with this, the first lead 16
The lengths of a and the second lead 16b are optimized to be slightly longer so as to have a margin necessary to cope with these offsets.

The requirements regarding the shape and arrangement of these two semiconductor elements to be mounted are the same as those in the fourth embodiment, and therefore their explanations are omitted.

The method of manufacturing the tape carrier 10 of this embodiment is the same as that of the fourth embodiment except that the above-mentioned inner leads, that is, the length margins of the first lead 16a and the second lead 16b are set. Since it is the same as the form, it is omitted. Also in the TCP manufacturing method, the fourth method is used except that the mold 60 is formed while holding the separation distance d2.
The description is omitted because it is the same as the embodiment.

Although an example of mounting two semiconductor elements has been described here, three or more semiconductor elements can be mounted. For example, using a tape carrier 10 having a lead having a set of three lengths, a third semiconductor element (not shown) is adhered and laminated on the upper surface of the second semiconductor element 30, and The semiconductor device 20 may be mounted spatially separated from the semiconductor device 20.

According to this structure, in addition to the effect obtained in the fourth embodiment, the surfaces of the semiconductor elements are further separated from each other, so that mutual interference due to noise or the like generated by the semiconductor elements can be reduced. Therefore, it is possible to reduce defects such as malfunction of the semiconductor element.

<Fifth Embodiment> FIG. 7 is a diagram schematically showing the structure of a fifth embodiment of the present invention. Figure 7
FIG. 3A is a schematic plan view showing an example of a structure in which two semiconductor elements are mounted on the tape carrier 10. Figure 7
FIG. 7B is a schematic cross-sectional view of the cross-section cut along the broken line CC ′ of FIG.

A fifth embodiment of the present invention will be described with reference to FIGS. 7 (A) and 7 (B). The tape carrier 10 of the fifth embodiment has two leads 16
Lead 16 comprising a set of inner leads of different lengths, namely first lead 16a and first lead 1.
As a set of two second leads 16b shorter than 6a,
A plurality of sets are provided side by side on the base tape 11. This is similar to, for example, the second embodiment. The same applies to mounting three semiconductor elements in the device hole 14. The fifth embodiment differs from the second embodiment in that the outer lead side end of the lead 16 is a land 50, and a metal ball 52 as an electrode is connected to the land 50. Therefore, this embodiment relates to a tape carrier having a BGA type external connection terminal.

Specifically, the end portion of the lead 16 on the outer lead side is directly used as the land 50 in the setting region to which the metal ball 52 as the external connection electrode can be connected. The land 50 surrounds the periphery of the device hole 14 and is centered on the center point of the device hole 2
They are regularly arranged on the sides of two concentric rectangles at the same interval in a so-called lattice pattern. In this embodiment, eleven lands 50 are provided on each side of the outer rectangle. Nine lands 50 are provided on each side of the inner rectangle. Therefore, the lands 50 are arranged on the base tape 11 in an 11 × 11 grid pattern, and the outside 2
It can be said that the device holes 14 are formed by leaving only the rows. The total number of lands 50 is set larger than the total number of leads 16. The end of the first lead 16a opposite to the inner lead, that is, the outer lead side, is connected to the land 50 arranged on the inner side of the above-described two rectangles. The second lead 16b is
Of the two rectangles, they are connected to the lands 50 arranged on the outer side. Metal balls 52 as electrodes are connected to the lands 50. Similar to the above-described embodiment, the lead 16 is protected by the solder resist 18 within the range of being placed on the base tape 11.
Therefore, the area of the base tape 11 excluding the land 50 and the metal balls 52 is covered and protected by the solder resist 18. That is, the solder resist 18 is provided with an opening 19a for exposing the upper surface 50a of the land 50. Specifically, it is performed by a step of applying a solder resist only on a required portion by a screen mask printing method, or a step of applying a photo solder resist on the entire surface and leaving the solder resist only on a desired area by exposure and etching. The metal ball 52 is connected to the upper surface 50a of the land 50 through the opening 19a. Specifically, the metal balls 52 are mounted on the land 50 using flux, and then connected by reflow. Therefore, the metal balls 52 are provided so as to project from the solder resist 18. The metal ball 52 is formed of a metal such as Au or solder. Using this metal ball 52,
For example, it is mounted on a printed circuit board or the like.

In this embodiment, the first lead 16a
The structure of the second lead 16b and the number, size, and arrangement of the semiconductor elements mounted on the second lead 16b are the same as those of the second embodiment described above. However, the connection form to the inner leads of the semiconductor elements of all the above-described embodiments and all modifications included in the present specification is not limited to this, and the tape carrier 10 of the sixth embodiment can be used.
It can be applied to the mounting configuration of the semiconductor element. For example, as shown in the first embodiment, it is possible to form a set of inner leads having three different lengths and mount three semiconductor elements in the same direction.

In this embodiment, the leads 16 are connected to the lands 50 that are as close to each other as possible.
However, the present invention is not limited to this, and does not cause an electrical short circuit between the leads 16 or a short circuit between the leads and the metal ball,
In addition, the lands 50 connecting the leads 16 can be appropriately selected within a range that does not cause a problem such as signal delay.

According to this structure, in addition to the effects obtained by the above-described embodiment, the degree of freedom in arranging the leads on the outer lead side is improved, so that a problem such as an electrical short circuit of the wiring or a signal delay is caused. The position of the terminal that outputs the output signal of the mounted semiconductor element can be set as appropriate within the range where the above does not occur.

The manufacturing steps of the tape carrier 10 and TCP of this embodiment are substantially the same as those of the above-mentioned embodiment, and therefore only a brief description will be given. However, when forming the land 50 by a conventionally known method, The solder resist may be provided so that the opening 19a is opened without covering the upper surface 50a of the land 50.

With the structure of this TCP, a plurality of semiconductor elements are mounted to further enhance the functionality and added value of the TCP, and when mounting the TCP on a printed circuit board or the like, at the same time as other components. A so-called reflow method for mounting can be adopted. Therefore, the manufacturing process can be simplified, which contributes to further cost reduction. Further, the output position of the output signal of the semiconductor element mounted on this TCP can be assigned to an arbitrary land to some extent.

<Sixth Embodiment> FIG. 8 is a diagram schematically showing the structure of a sixth embodiment of the present invention. Figure 8
FIG. 3 is a schematic cross-sectional view showing a cross section of a structure body in which three semiconductor elements are mounted on the tape carrier 10.

As for the plan view, in FIG.
The solder resist 18 covers the land 50 and the opening 1
Since it is almost the same as FIG. 7 except that 9a is not provided, it is omitted.

A sixth embodiment of the present invention will be described with reference to FIG. In the tape carrier 10 of the sixth embodiment, as the lead 16, a lead 16 having inner leads of two different lengths, that is, a first lead 16a and a second lead shorter than the first lead 16a is used. 16b is a set of two, and a plurality of sets is the base tape 11
It is the same as that of the fifth embodiment in that it is provided side by side. The same applies to mounting three semiconductor elements in the device hole 14. Similarly, the end of the outer lead of the lead 16 is a land 50, and this land 50 is connected to a metal ball 52 as an electrode. The sixth embodiment differs from the fifth embodiment in that the metal balls 52 are provided on the lower surface 10b side of the tape carrier 10.

Only differences from the fifth embodiment will be described here. The upper surface 50 a of the land 50 is covered with the solder resist 18. Tape carrier 1
When 0 is viewed from the lower surface 10b side, the base tape 11 has
An opening 19b reaching the lower surface 50b of the land 50 is provided. The metal ball 52 is connected downward to the lower surface 10b side of the tape carrier 10 through the opening 19b.

Except for these points, the structure of the tape carrier 10 of the sixth embodiment and the mounting form of the semiconductor elements mounted thereon are the same as those of the fifth embodiment, and therefore their explanations are omitted.

In this embodiment, the first lead 16a
The structure of the second leads 16b and the number, size, and arrangement of the semiconductor elements mounted on the second leads 16b are the same as those of the fifth embodiment described above. However, the present invention is not limited to this, and the embodiment of the inner lead of the tape carrier 10 of all of the above-described embodiments and the modifications included in the present specification and the embodiment of mounting the semiconductor element mounted on the inner lead are also the same. The present invention can be applied to the tape carrier 10 of the above embodiment and the mounting form of the semiconductor element mounted thereon.

In this embodiment, in consideration of the signal transmission delay and the like, the lead 16 is connected to the land 50 as close as possible.
It is preferable to have a configuration in which is connected. However, the present invention is not limited to this, and the lands 50 to which the leads 16 are connected can be appropriately selected within a range in which a defect such as an electrical short circuit between the leads 16 or a short circuit between the leads and the metal ball does not occur. .

The steps of manufacturing the tape carrier 10 and the TCP of the sixth embodiment are almost the same as those in the above-mentioned embodiments. Here, only the manufacturing process of the TCP of this embodiment will be outlined.

First, at the same time when the device hole 14 and the sprocket hole 12 are provided in the base tape 11, the lower surface 50b of the land 50 is removed from the lower surface 10 of the tape carrier 10.
An opening 19b is formed so as to be exposed on the side b. Next, after forming the land 50 and the lead 16 connected thereto by a conventionally known method, a solder resist 18 is provided. Then, the metal balls 52 may be connected to the lands 50 via the openings 19b.

According to the structure of the TCP of the sixth embodiment, the downward offset of the device hole 14 of the mounted semiconductor element and the connecting direction of the metal ball 52 can be made to be the same. In addition to the effects obtained in the embodiment, a thinner TCP can be formed.

<Seventh Embodiment> FIG. 9 is a diagram schematically showing the structure of a seventh embodiment of the present invention. Figure 9
FIG. 3 is a schematic cross-sectional view showing a cross section of a structure body in which three semiconductor elements are mounted on the tape carrier 10.

The plan view is substantially the same as that of FIG. 7 except that the metal ball 52 is not connected to the opening 19a, and therefore the description thereof is omitted.

The seventh embodiment of the present invention will be described with reference to FIG. The tape carrier 10 of this embodiment is the same as the tape carrier 10 of the sixth embodiment except that an opening 19a for connecting the metal ball 52 to the upper surface 50a side of the land 50 is further provided in the solder resist 18. is there. Therefore, since it can be said that the fifth and sixth embodiments are combined, detailed description thereof will be omitted.

The leads 16 of the tape carrier 10 of the seventh embodiment are protected by the solder resist 18 within the range of being placed on the base tape 11. Therefore, the area of the base tape 11 excluding the upper surface 50a side of the land 50 is
It is covered and protected by the solder resist 18. That is, the upper surface 50 of the land 50 is formed on the solder resist 18.
An opening 19a for exposing the a side is provided.
Further, similarly to the sixth embodiment, the base tape 11 is provided with an opening 19b for exposing the lower surface 50b side of the land 50. Then, the metal ball 52 passes through the opening 19b and the lower surface 10 of the tape carrier 10
It is connected downward to the side b, that is, to the lower surface 50b side of the land 50. In this example, the metal balls 52 are connected to the lower surface 50b side of the land 50, but the upper surface 5
The metal balls 52 can be connected to only 0a or both surfaces (the upper surface 50a and the lower surface 50b).

Except for these points, the configuration of the tape carrier 10 of the seventh embodiment and the mounting form of the mounted semiconductor element are the same as those of the fifth embodiment, and therefore their explanations are omitted.

In this embodiment, the first lead 16a
The structure of the second leads 16b and the number, size, and arrangement of the semiconductor elements mounted on the second leads 16b are the same as those of the fifth embodiment described above. However, the present invention is not limited to this, and the configuration of the tape carrier 10 of the seventh embodiment is also applicable to the tape carrier 10 of the above-described embodiment and the modifications included therein and the mounting form of the semiconductor element mounted therein. Is applicable to.

In this embodiment, in consideration of signal transmission delay and the like, the leads 16 are connected to the land 50 as close as possible.
It is preferable to have a configuration in which is connected. However, the present invention is not limited to this, and an electrical short circuit between the leads 16 or the lead 1 may occur.
As in the previous embodiment, the lands 50 connected to the leads 16 can be appropriately selected within a range that does not cause a problem such as an electrical short circuit between the metal balls 52 and the metal balls 52.

According to the structure of the tape carrier 10,
When mounting a TCP using this tape carrier 10 on a printed circuit board or the like, the upper surface 1 of the tape carrier 10
The metal ball 52 connected to the land 50 exposed on the 0a side or the lower surface 10b side can be surface-mounted on the substrate. That is, when the tape carrier 10 is mounted on the substrate, the metal balls 52 can be selectively provided on either the upper surface 10a side or the lower surface 10b side of one tape carrier 10. Therefore, it can be selectively mounted on a printed circuit board or the like by using both front and back surfaces. It is possible to further enhance the functionality of TCP.

Since the manufacturing steps of the tape carrier 10 and the TCP of the seventh embodiment are almost the same as those of the above-mentioned embodiments, only the characteristic part of the manufacturing steps of the tape carrier 10 will be outlined.

First, the base tape 11 is provided with the device hole 14 and the sprocket hole 12, and at the same time, the opening 19b for exposing the lower surface of the land 50 to the lower surface of the tape carrier 10 is provided. Next, after forming the land 50, that is, the lead 16 by a conventionally known method,
An opening 19a is provided in the solder resist 18 so that the land 50 is exposed. It suffices to select either the opening 19b of the base tape 11 or the opening 19a of the solder resist 18 and connect the metal ball 52 to the land 50 via this.

<Application Example of Seventh Embodiment> FIG.
It is a figure which shows roughly the structure of the application example of the 7th Embodiment of this invention. FIG. 10 is a schematic cross-sectional view showing a cut end of a cross section in which two TCPs of the seventh embodiment are vertically stacked.

The plan view is almost the same as that shown in FIG.

Although this application example will be described with reference to FIG. 10, the configuration and manufacturing method of the tape carrier 10 and the TCP are the same as those in the seventh embodiment, and therefore the description thereof is omitted.

In this example, the metal balls 52 of the two tape carriers 10 are connected downward to the lower surface side of the tape carrier via the opening 19b of the base tape 11.

The metal ball 52a of the first tape carrier 10aa located on the upper side of the two TCPs passes through the opening 19a provided in the solder resist 18 on the upper surface of the second tape carrier 10bb located on the lower side. Second
Is connected to the land 50bb of the tape carrier 10bb.

In this example, an example in which two TCPs are laminated has been described, but two or more TCPs may be laminated in a range that does not impair the object of the present invention. Also the 7th
As described in the embodiment, the metal balls 52a and 52b may be provided on the upper surfaces of the lands 50aa and 50bb of the two tape carriers 10aa and 10bb, and these may be laminated.

FIG. 10 shows an example in which two TCPs of the same form are laminated, but the invention is not limited to this. That is, the number of sets of lengths of the plurality of inner leads, the number of mounted semiconductor elements, and the mounting form thereof may be different from each other. At this time, when the output signal is directly transmitted from the upper TCP to the board to be mounted, the T located in the middle is transmitted.
A metal ball may be provided on the CP land so as to conduct electricity.

According to this configuration, two or three or more TCP
It is possible to collect the output terminals and the input terminals of the above in only one TCP mounting area and connect them to the mounting board. Further, since the semiconductor devices mounted on the respective tape carriers can be connected to each other, the T
It is possible to further enhance the functionality of the CP.

[0129]

As described above, according to the structure of the tape carrier of the present invention, it is possible to mount a plurality of semiconductor elements, in particular, a plurality of semiconductor elements having different sizes, on one tape carrier, and thus the tape carrier is small and thin. It is possible to further enhance the functionality and add value of the TCP in the same mounting area without impairing the advantage of the TCP.

The structure in which the surfaces of the plurality of semiconductor elements are separated from each other can reduce the interference between the plurality of semiconductor elements due to noise generated by the semiconductor elements, thus preventing malfunction of the semiconductor elements. At the same time, the above effects can be obtained.

The external connection terminal on the outer lead side is BGA
With this configuration, the degree of freedom in routing the leads is improved, so that the position of the terminal that outputs the output signal of the mounted semiconductor element can be appropriately set, and the degree of freedom in designing the device can be increased. Therefore, without sacrificing the advantages of the small and thin TCP, the synergistic effect with BGA further enhances the functionality of the TCP in the same mounting area.
High-density integration and high added value are possible. With the structure in which a plurality of TCPs having the BGA structure are stacked, the output terminals and the input terminals of two or more tape carriers can be connected to the mounting board only with the mounting area of one tape carrier. Also, since it is possible to connect the semiconductor devices mounted on each tape carrier,
It is possible to achieve higher integration and higher functionality in the same mounting area.

Further, the tape carrier and TC of the present invention
According to the manufacturing method of P, these manufacturing can be efficiently performed.

[Brief description of drawings]

FIG. 1A is a plan view of a first embodiment, and FIG. 1B is a cross-sectional view of a cut end thereof.

FIG. 2A is a plan view of the second embodiment, and FIG. 2B is a sectional view of a cut end thereof.

FIG. 3A is a plan view showing a modification of the second embodiment, and FIG. 3B is a cross-sectional view of a cut end thereof.

FIG. 4A is a plan view showing a third embodiment,
(B) is a sectional view thereof.

FIG. 5A is a plan view showing a fourth embodiment,
(B) is a sectional view thereof.

FIG. 6 is a cross-sectional view showing a modified example of the fourth embodiment.

FIG. 7A is a plan view showing a fifth embodiment,
(B) is a sectional view.

FIG. 8 is a sectional view showing a sixth embodiment.

FIG. 9 is a sectional view showing a seventh embodiment.

FIG. 10 is a cross-sectional view showing an application example of the seventh embodiment.

[Explanation of symbols]

10: Tape carrier 10a: upper surface 10b: lower surface 10aa: first tape carrier 10bb: second tape carrier 11: Base tape 12: Sprocket Hall 14: Device hole 15: Device hole edge 16: Lead 16a: first lead 16b: second lead 16c: Third lead 18: Solder resist 19, 19a, 19b: openings 20: First semiconductor element 22: First protruding electrode 30: Second semiconductor element 32: Second protruding electrode 40: Third semiconductor element 42: Third protruding electrode 44: Metal wiring 50: Land 50a: upper surface 50b: bottom surface 50aa: first land 50bb: Second land 52: Metal ball 52a: first metal ball 52b: second metal ball 60: Mold

─────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] January 15, 2003 (2003.1.1
5)

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be amended] Claims

[Correction method] Change

[Correction content]

[Claims]

[Procedure Amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0011

[Correction method] Change

[Correction content]

[0011]

In order to solve the above problems, a tape carrier package of the present invention is provided on a base tape and a first semiconductor element having a first electrode formed on an upper surface thereof. A first lead having a first length connected to the first electrode, a second semiconductor element having a second electrode formed on an upper surface thereof, and a base tape, A second lead connected to the second electrode and having a length shorter than the first lead; a third semiconductor element having a third electrode formed on the upper surface; and a base tape. A third lead connected to the third electrode and having a length shorter than the second lead, the first semiconductor element, the second semiconductor element and the third semiconductor element, and the first lead. , For sealing the second lead and the third lead And a Rudo member.

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0129

[Correction method] Change

[Correction content]

[0129]

As described above, according to the structure of the tape carrier package of the present invention, it becomes possible to mount a plurality of semiconductor elements, in particular, a plurality of semiconductor elements of different sizes, on one tape carrier, which is small in size. T in the same mounting area without compromising the advantage of TCP that is thin
It is possible to further enhance the functionality and add value to CP.

[Procedure amendment 4]

[Document name to be amended] Statement

[Name of item to be corrected] 0131

[Correction method] Delete

[Procedure Amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0132

[Correction method] Delete

Claims (16)

[Claims] 1. A base tape having a device hole, a plurality of leads provided on the base tape, of the leads, from a device hole edge of the device hole toward a center direction of the device hole. A tape carrier characterized in that the protruding inner leads have different lengths. 2. The tape carrier according to claim 1, wherein the inner leads having a plurality of different lengths are regularly arranged for each group including the plurality of different lengths. . 3. The tape carrier according to claim 2, wherein the plurality of different lengths of the inner lead are three different lengths. 4. A first electrode having a first electrode formed on an upper surface thereof.
A semiconductor element, a first lead provided on the base tape and having a first length connected to the first electrode, and a second electrode having a second electrode formed on the upper surface thereof. A semiconductor element, a second lead provided on the base tape and connected to the second electrode, the second lead having a shorter length than the first lead; and a third electrode formed on the upper surface. A third semiconductor element, a third lead provided on the base tape and connected to the third electrode, the third lead having a shorter length than the second lead, and the first lead. A tape carrier comprising a semiconductor element, a second semiconductor element and a third semiconductor element, and a molding member for sealing the first lead, the second lead and the third lead. package. 5. The lower surface of the first semiconductor device and the second semiconductor element.
5. The upper surface of the semiconductor element, the lower surface of the second semiconductor element, and the upper surface of the third semiconductor element are held so as to be separated from each other, and a mold is formed. Tape carrier package described in. 6. The lower surface of the first semiconductor element and the second surface of the first semiconductor element.
5. The tape carrier package according to claim 4, wherein the upper surface of the semiconductor element, the lower surface of the second semiconductor element, and the upper surface of the third semiconductor element are laminated by being adhered to each other. 7. A first electrode having a first electrode formed on an upper surface thereof.
Of the semiconductor element, a first lead provided on the base tape and having a first length connected to the first electrode, and side surfaces of the first lead and the first semiconductor element face each other. A second electrode having a second electrode formed on the upper surface spaced apart from the second electrode
A semiconductor element, and the first lead provided on the base tape and connected to the second electrode, and arranged on the lower surface side of the first semiconductor element and the second semiconductor element. A third electrode having a third electrode formed on its upper surface
And a second semiconductor element provided on the base tape and connected to the third electrode, the second element having a length shorter than that of the first lead.
For sealing the first semiconductor element, the second semiconductor element and the third semiconductor element, and the first lead and the second lead connected to these semiconductor elements. A tape carrier including a molding member, wherein the lower surface of the first semiconductor element and the lower surface of the second semiconductor element are both bonded and laminated on the upper surface of the third semiconductor element. package. 8. A plurality of the first electrodes and a plurality of the second electrodes are provided, and a part of the first electrode and a part of the second electrode are connected to each other. The tape carrier package according to claim 5, wherein: 9. A first electrode having a first electrode formed on an upper surface thereof.
A semiconductor element, a first lead provided on the base tape and having a first length, connected to the first electrode, and a second electrode having a second electrode formed on an upper surface thereof. Semiconductor element, a second lead provided on the base tape and connected to the second electrode, the second lead having a length shorter than that of the first lead, the second semiconductor element, and A third semiconductor element having side surfaces facing each other and separated from each other and having a third electrode formed on an upper surface; and a third semiconductor element provided on the base tape and connected to the third electrode. The second lead, the first semiconductor element, the second semiconductor element, and the third semiconductor element, and the first lead and the second semiconductor element connected to these semiconductor elements. Mold member for sealing the lead of Wherein, said the lower surface of the first semiconductor device, a tape carrier package, characterized in that the second and the upper surfaces of the third semiconductor element of the semiconductor elements are laminated by bonding together. 10. A first semiconductor element having a first electrode formed on a lower surface thereof, and a first semiconductor element provided on a base tape and having a first length connected to the first electrode. A first lead, a second semiconductor element having a second electrode formed on the upper surface thereof, and a first lead provided on the base tape and connected to the second electrode. To seal a second lead having a short length, the first semiconductor element and the second semiconductor element, and the first lead and the second lead connected to these semiconductor elements And the second semiconductor element is held so as to be spatially separated from the lower surface side of the first semiconductor element. 11. The tape according to claim 4, wherein the mold is formed so that one or more of the plurality of surfaces forming the semiconductor element are exposed. Carrier package. 12. The base tape comprises a plurality of lands provided in a grid pattern, leads having outer lead sides connected to the lands, and an opening exposing the lands. A solder resist provided on a lead, and a metal ball connected to the land through the opening, and from the device hole edge of the device hole in the lead, toward the center direction of the device hole A tape carrier characterized in that the protruding inner leads have different lengths. 13. A plurality of lands provided in a grid pattern on a base tape, an opening provided so that the plurality of lands are exposed on the lower surface side of the base tape, and a plurality of lands on the plurality of lands. A lead connected to the outer lead side, a solder resist provided on the lead, and a metal ball connected to the land through the opening, and among the leads, from a device hole edge of a device hole A tape carrier, wherein inner leads protruding toward the center of the device hole have a plurality of different lengths. 14. The tape carrier according to claim 13, wherein the solder resist further comprises an opening exposing an upper surface of the land. 15. The inner leads having a plurality of different lengths are regularly arranged for each set including the plurality of different lengths.
The tape carrier according to any one of 1. 16. A semiconductor device comprising a plurality of the tape carriers according to claim 14 laminated.