JP2003168704A - Semiconductor manufacturing device and method of manufacturing semiconductor device using it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make a tape carrier, particularly, a thinned tape carrier to be transported more surely. <P>SOLUTION: In a method of manufacturing semiconductor device, a semiconductor manufacturing device having a chute which becomes the transporting route of a flexible film and a feeding mechanism which drives the film by means of drive rollers press-contacting the film is used. Idling sprockets respectively having teeth which are fitted in holes formed in both edge sections of the film are attached to the chute and, at the time of moving the film, the lateral displacement of the film is prevented by the sprockets. When this constitution is used, the tape carrier can be transported more surely, because both edge sections of the carrier are not deviated from the drive rollers and the carrier does not come off the driving rollers during transportation. Since no driving force is applied to the idling sprockets, the tape carrier is not damaged. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus using a flexible film or a method of manufacturing a semiconductor device using the same, and is particularly applied to manufacturing a semiconductor device using a thin film. And effective technology.

[0002]

2. Description of the Related Art In the manufacture of semiconductor devices, semiconductor elements or wiring patterns are collectively formed in a plurality of element forming regions provided on a wafer such as single crystal silicon to form a predetermined circuit, and adjacent elements are formed. The wafer is cut in the scribing region between the formation regions, and dicing is performed to separate each element formation region into individual semiconductor chips, and the individual semiconductor chips thus separated are fixed to, for example, a base substrate or a lead frame. The semiconductor device is completed through a mounting process such as die bonding and wire bonding, and a sealing process such as resin sealing.

An apparatus for performing such die bonding is called a chip mounter. In the chip mounter,
A mount head that picks up a semiconductor chip from a wafer that has undergone dicing press-bonds the semiconductor chip to a predetermined position.

Further, as one of the methods for meeting the demands for downsizing and thinning of electronic devices, a tape carrier made of a flexible film such as polyimide having a conductive film such as copper foil formed on the surface thereof is used for a semiconductor chip or the like. There is a TCP (Tape Carrier Package) type semiconductor device as a tape-shaped semiconductor device in which parts are fixed and the conductive film is connected to an external terminal such as a semiconductor chip.

Since such tape-shaped parts are easy to handle and suitable for automation, they are usually manufactured and handled in the form of a long film in which a plurality of parts are continuously formed in the length direction. , Finally, it is cut and separated into individual parts at the stage of being incorporated into an electronic device. Such a tape-shaped component is handled in a reel-packed state in which one end is fixed to the hub of the reel, the other end is fixed and the other end is fixed during transportation or conveyance between processes. At that time, a spacer tape is wound around the tape carrier so as to prevent the semiconductor devices adjacent in the radial direction from rubbing against each other, and the spacer tape prevents the semiconductor devices from directly contacting each other.

The tape carrier is provided with sprocket holes at a constant pitch at both edges along its length.
A sprocket system that supports the tape carrier by chutes that become the transport path of the tape carrier, meshes the sprocket of the feeding mechanism provided on each chute with this sprocket hole, and regularly transports the tape carrier at a fixed pitch is adopted. Has been done.

In addition, in the roller feeding system shown in FIG. 1, a feeding mechanism consisting of a driving roller 2 and a holding roller 3 is attached to each of a pair of chutes which serve as a conveyance path of the tape carrier, and the holding roller 3 feeds the tape carrier. The tape carrier 4 is driven and rotated by the rotation of the drive roller 2 that rotates integrally with the drive shaft 5 in a state of being pressed against the drive roller 2 and sandwiching the tape carrier 4 between the drive roller 2 and the pressing roller 3.

There are several types of such tape carriers depending on the application. For example, the width of the tape is 35m
There are three types, m, 48 mm, and 70 mm, and there are two types of spacing in the width direction of the sprocket holes, wide and super wide, and the size of each sprocket hole is also different.

In order to cope with such a difference in tape width, the chute constitutes a conveyance path by a pair of front chutes and rear chutes, and by changing the interval between the front chutes and the rear chutes, the width of the chute can be changed by the same device. Processing using different tapes.

Further, by supporting the edge portions on both sides of the tape carrier with a pair of chutes, the tape carrier has a central portion on which wiring and the like are formed, or a semiconductor chip mounted on the central portion and a conveying path. It is possible to prevent the wiring or the semiconductor chip from being damaged by the contact.

[0011]

However, in the above-mentioned sprocket system, the driving force by the gears of the feeding mechanism is concentrated on one side of the sprocket hole of the thin tape carrier, so that large stress is applied to this part and the tape carrier is damaged. There is something to do.

In recent years, in order to reduce the thickness of semiconductor devices, tape carriers have been reduced in thickness and have a conventional thickness of 50 μm.
From 35 μm to 25 μm, a film having a thickness of 18 μm is being considered.
Such thinning reduces the strength of the tape carrier and increases the damage of the tape carrier due to sprocket drive.

In order to prevent the damage of the tape carrier due to the driving of the sprocket, it is considered that the diameter of the sprocket is increased to increase the number of teeth meshing with the sprocket holes to disperse the driving force. The occupancy area of the device increases due to the diameter.

In addition, in the sprocket system, when processing is performed using tape carriers having different sprocket hole sizes, it is necessary to replace with a sprocket with teeth formed in accordance with the size, resulting in a reduction in work efficiency. It will be.

On the other hand, these problems do not occur in the roller feeding method. However, since the tape carrier has different conditions such as the presence or absence of a metal film to be wiring or a solder resist for protecting the metal film, the temperature expansion coefficient is different between the front surface and the back surface. Therefore, as shown in FIG. At the central portion of the carrier 4, a peculiar curve such as a warp in the width direction or a deformation due to the weight of the tape carrier 4 occurs.

Due to such deformation of the tape carrier 4, in the roller feeding method, as shown in FIG. 2, the bending of the central portion of the tape carrier 4 may cause both edges of the tape carrier 4 to be displaced from the drive roller 2 during transportation. is there.
Due to the displacement of the tape carrier 4, an error may occur in the mounting of the semiconductor chip or the like.

Further, when the tape carrier 4 is largely bent or the relative accuracy of the drive rollers 2 of the front chute 1 and the rear chute 1 is low, as shown in FIG. It may be out of 2.

Since the processing is interrupted by such a transportation trouble, work efficiency may be reduced, or a product defect may occur due to the transportation trouble. Such a problem becomes a serious problem because when the strength of the tape carrier is reduced due to the thinning of the tape carrier described above, the tape carrier is more easily bent.

The object of the present invention is to solve these problems,
It is an object of the present invention to provide a technique that enables more reliable transport of a tape carrier, and in particular, a reliable transport of a thin tape carrier. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0020]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows. In a method of manufacturing a semiconductor device using a manufacturing apparatus having a chute that serves as a conveyance path of a flexible film and a feed mechanism that drives the film by a drive roller that is in pressure contact with the film, the chute is provided at an edge portion of the film. An idling sprocket with teeth formed that fits into the formed hole is attached to prevent lateral displacement of the film as it moves.

According to the present invention described above, the lateral displacement of the film is prevented by the idling sprocket.
It does not slip off and the tape carrier does not come off the drive roller. Therefore, the tape carrier during transportation is more reliably transported, and the driving force is not applied to the idling sprocket, so that the tape carrier is not damaged and is reliably transported even if it is a thin tape carrier. It will be possible.

Embodiments of the present invention will be described below. In all the drawings for explaining the embodiments, the same reference numerals are given to those having the same function, and the repeated description thereof will be omitted.

[0023]

(Embodiment 1) FIG. 4 is a plan view showing a chip mounter according to an embodiment of the present invention. The chip mounter is roughly classified into a tape supply system that supplies a tape carrier, a chip supply system that supplies a fine semiconductor device such as a semiconductor chip or a CSP (Chip Size Package) type, and a semiconductor chip for a tape carrier. It is composed of a mount system for bonding etc.

The tape supply system includes a loader section 7 for supplying a long film such as a tape carrier accommodated in a reel 6, a chute 1 serving as a tape carrier transport path, and a tape carrier for which die bonding has been completed. An unloader section 9 for accommodating the reel 8 again is provided, and the tape carrier wound around the reel 6 in the state of a long film has both edges supported by the chute 1 and is attached to the chute 1. The tape carrier, which is driven by the mechanism and conveyed on the chute 1, is die-bonded, and the tape carrier which has been die-bonded is rewound on the reel 8 by the unloader section 9.

As a chip supply system, a wafer cassette 11 accommodating a wafer ring 10 in which individual semiconductor chips separated after dicing are adhered to a sheet in a wafer state is set, and a wafer cassette is set. A wafer cassette lifter 12 that adjusts the vertical position of the wafer 11, a wafer ring holder 13 that sequentially takes out the wafer ring 10 from the wafer cassette 11, and an optical system 14 for wafer recognition are provided.

Further, a push-up unit 15 for peeling the semiconductor chip of the wafer ring 10 moved to the chip supply position from the sheet and a transfer head 16 for sucking the semiconductor chip peeled from the sheet are provided. A mount stage 18 for mounting the semiconductor chip attracted to the transfer head 16 and an optical system 19 for recognizing the semiconductor chip mounted on the mount stage 18 are provided. The mount stage 18 is moved according to the position information of the chip obtained by the chip recognition optical system 19.

Further, instead of mounting the semiconductor chip on the mount stage 18, it also has a function of reversing the transfer head 16 and causing the mount head 17 to adsorb the semiconductor chip.

As a mount system, a mount head 17 and an optical system 20 mounted on the mount head 17 for recognizing the tape and inspecting the appearance are provided. The tape carrier is moved to the bonding position according to the transfer of the semiconductor chip, and the optical system 20
After recognizing the tape and correcting the position with a camera or the like, the semiconductor chip is pressed against the lower surface of the tape by the load head of the mount head 17 and the mount stage 18 lowered onto the tape, and the die bonding is performed. To do.

In the apparatus of the present embodiment, a tape feeding system feed mechanism is provided at the portion a in FIG. 4, the details of which are shown in FIG. 5. The feed mechanism of the present embodiment is a roller feed system. It has a structure in which an idling sprocket 22 is added.

A pair of chutes 1 serving as a conveyance path of the tape carrier are provided so as to face each other in accordance with the width of the tape carrier, support both edges of the tape carrier, and drive rollers are provided to each of the pair of chutes. A feeding mechanism consisting of 2 and a pressing roller 3 is attached, and the pressing roller 3 attached to the chute 1 via the arm 21 is biased by a spring or the like to press the tape carrier against the drive roller 2.

Therefore, with the tape carrier sandwiched between the drive roller 2 and the pressing roller 3, the drive shaft 5
The tape carrier is driven and conveyed by the rotation of the drive roller 2 which rotates integrally with the tape carrier. The restraining roller 3 is made of metal, and the drive roller 2 is mainly made of metal, and the surface in contact with the tape carrier is covered with silicone rubber or the like in order to protect the tape carrier and increase the frictional force with the tape carrier.

The idling sprocket 22 is attached to the chute 1 via the arm 23 and has teeth provided at a pitch corresponding to the sprocket holes formed at the edge of the tape carrier. No driving force is applied to the idling sprocket 22, and the idle sprocket 22 is pivotally supported by the arm 23 so as to rotate freely. A groove is formed in the chute 1 so as to match the teeth of the idling sprocket 22.

The idling sprocket 22 is pressed by the tape carrier by its own weight of the idling sprocket 22 and the arm 23, and the teeth fitted into the sprocket holes move as the tape carrier moves, thereby being driven and rotated. When moving the tape carrier,
Since the teeth of the idling sprocket 22 restrict the lateral movement of the tape carrier, it is possible to prevent the tape carrier from displacing and being displaced.

As the sprocket holes of the tape carrier, there are two kinds of sizes, but the pitches along the carrying direction are the same, and even if the widths of the tape carriers are different, from the side end of the tape carrier to the outer edge of the sprocket hole. The distances are the same.

Since the idling sprocket 22 of this embodiment is not driven, it is not necessary to accurately match the size of the sprocket hole. Therefore, it is possible to apply the idling sprocket 22 having teeth adapted to a small sprocket hole to a tape carrier having a large sprocket hole size by switching the sprocket mounting position.

Even if the widths of the tape carriers are different, the distance from the side end of the tape carrier to the outer edge of the sprocket hole is the same. The idle sprocket 22 at a distance corresponds to the position of the sprocket hole.

The teeth of the idling sprocket 22 are tapered in the thickness direction toward the tip, and even if the position of the tape carrier is slightly displaced, the tips of the teeth engage with the sprocket holes and the idling sprocket 22 Since the tape carrier moves to the root of the tooth with the rotation of, the position of the tape carrier can be corrected.

Further, since the idling sprocket 22 of this embodiment does not need to be driven and controlled and has a simple structure, the idling sprocket 22 is attached to a plurality of positions of the chute 1 serving as a carrying path to make the carrying of the tape carrier more stable. It is also possible.

Next, die bonding, which is a method of manufacturing a semiconductor device using this chip mounter, will be described. The wafer ring 10 in which the semiconductor chips are adhered to the sheet in a wafer state is carried into the wafer cassette lifter 12 while being accommodated in the wafer cassette 11. First, the wafer ring for processing from the wafer cassette 11. Wafer ring holder 13
Set to. The wafer ring holder 13 moves to the chip supply position, performs chip recognition from the image of the wafer recognition optical system 14 by the camera, etc., aligns based on the data, and is pushed up by the needle protruding from the gap of the push-up unit 15. The semiconductor chip is attracted to the transfer head 16. The transfer head 16 that has adsorbed the semiconductor chip moves, transfers the adsorbed semiconductor chip to the mount stage 18, performs chip recognition from the image of the camera of the chip recognition optical system 19, and moves the mount stage 18 based on this data. To correct the position.

Along with the transfer of the semiconductor chip, the tape carrier is driven by the driving roller 2 and conveyed to a predetermined position. By this conveyance, the tape carrier moves and is sequentially drawn from the reel 6. In the chip mounter of the present embodiment, the movement of the tape carrier is stabilized by the idling sprocket 22, so it is possible to prevent displacement of the tape carrier or damage to the tape carrier.

The transported tape carrier is recognized by the image of the camera of the tape recognition optical system 20,
Based on this data, the mount head 17 is moved to the bonding position, and the semiconductor chip is bonded to the lower surface of the tape carrier and die-bonded. The tape carrier after the bonding is driven by the drive roller 2, is sequentially transported, and is accommodated in the reel 8 of the unloader unit 9.

Further, in the case of flip chip bonding for bonding a semiconductor chip onto a tape carrier, the semiconductor chip sucked by the transfer head 16 is transferred to the mount head 17 by reversing the transfer head 16. Then, the mount head 17 that has adsorbed the semiconductor chip is moved onto the tape carrier at the bonding position, and the load head of the mount head 17 and the mount stage 18 that are lowered in a state where the tape carrier and the semiconductor chip are superposed on each other. Then, the semiconductor chip is bonded to the upper surface of the tape and die-bonding is performed.

(Embodiment 2) FIG. 6 is a perspective view showing a feed mechanism of a chip mounter used in another embodiment of the present invention, and FIG. 7 is a vertical cross section showing a carrier tape transport state of the chip mounter. It is a figure. In the chip mounter of this embodiment, the tape carrier feeding mechanism is different from that of the above-described embodiment, but the other configurations are the same.

In the feed mechanism of the chip mounter according to the present embodiment, the pair of chutes 1 serving as the transport path of the tape carrier are provided so as to face each other according to the width of the tape carrier and support both edge portions of the tape carrier. A feed mechanism composed of a drive roller 2 and an idling sprocket 22 is attached to each of the pair of chutes 1, and the idling sprocket 22 is attached to the chute 1 via an arm 23 and is urged by a spring or the like to drive the tape carrier. Is pressed against the drive roller 2.

Therefore, while the tape carrier is sandwiched between the drive roller 2 and the idling sprocket 22, the tape carrier is driven and conveyed by the rotation of the drive roller 2 rotating integrally with the drive shaft 5. A metal is used for the idling sprocket 22 and a metal is mainly used for the driving roller 2. The surface of the drive roller 2 in contact with the tape carrier is covered with silicone rubber or the like in order to protect the tape carrier and increase the frictional force with the tape carrier.

The idle sprocket 22 is provided with teeth at a pitch corresponding to the sprocket holes formed at the edge of the tape carrier. No driving force is applied to the idling sprocket 22, and the idle sprocket 22 is rotatably supported by the arm. A groove is formed in the drive roller 2 so as to match the teeth of the idling sprocket 22.

The idling sprocket 22 is driven to rotate by the movement of the teeth fitted in the sprocket holes as the tape carrier moves. When the film moves, the teeth of the idling sprocket 22 restrict the lateral movement of the tape carrier.
It is possible to prevent the tape carrier from being displaced and causing a shift.

The teeth of the idling sprocket 22 are tapered in the thickness direction toward the tip as shown in FIG. 7, as in the case of the above-described embodiment.
Even if the position of the tape carrier is slightly displaced, the tip of the tooth engages with the sprocket hole, and the tape carrier moves to the root of the tooth as the idling sprocket 22 rotates, so the position of the tape carrier can be corrected. it can.

In the feed mechanism of the present embodiment, the idling sprocket 22 also serves as the pressing roller 3 of the above-mentioned embodiment, so that the mechanism can be simplified, the feed mechanism can be downsized, and the number of parts can be reduced. It is possible.

Although the present invention has been specifically described based on the above-described embodiments, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention. Of course.

For example, in the above-mentioned embodiments, the case where the present invention is applied to the chip mounter has been described, but the present invention may be applied to other techniques involving the conveyance of the flexible film such as wire bonding or potting. It is possible.

[0052]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows. (1) According to the present invention, there is an effect that the lateral displacement of the film can be prevented by the idling sprocket. (2) According to the present invention, due to the above effect (1), it is possible to prevent both edges of the tape carrier from being displaced from the drive roller during transportation. (3) According to the present invention, due to the above effect (1), there is an effect that it is possible to prevent the tape carrier from coming off from the drive roller during transportation. (4) According to the present invention, due to the above effects (2) and (3),
The tape carrier can be more reliably transported. (5) According to the present invention, due to the above effect (1), no driving force is applied to the idling sprocket, so that the tape carrier can be prevented from being damaged. (6) According to the present invention, due to the above effect (5), there is an effect that even a thin tape carrier can be reliably transported.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view showing a carrier tape conveyance state of a conventional chip mounter.

FIG. 2 is a vertical sectional view showing a conventional carrier tape transportation state.

FIG. 3 is a vertical cross-sectional view showing a conventional carrier tape transportation state.

FIG. 4 is a plan view showing a chip mounter used in an embodiment of the present invention.

FIG. 5 is an enlarged perspective view showing a main part of a chip mounter used in an embodiment of the present invention.

FIG. 6 is an enlarged perspective view showing a main part of a chip mounter used in another embodiment of the present invention.

FIG. 7 is a vertical cross-sectional view showing a carrier tape conveyance state of a chip mounter used in another embodiment of the present invention.

[Explanation of symbols]

1 ... Shoot, 2 ... Drive roller, 3 ... Holding roller, 4 ...
Tape carrier, 5 ... Drive shaft, 6 ... Reel, 7 ... Loader, 8 ... Reel, 9 ... Unloader, 10 ... Wafer ring, 11 ... Wafer cassette, 12 ... Wafer cassette lifter, 13 ... Wafer ring holder, 14 ... Wafer recognition optical system, 15 ... Push-up unit, 16 ... Transfer head, 17
... mount head, 18 ... mount stage, 19 ... chip recognition optical system, 20 ... tape recognition and visual inspection optical system, 21, 23 ... arm, 22 ... idling sprocket.

Claims (5)

[Claims] 1. A manufacturing apparatus for a semiconductor device, comprising: a chute that serves as a conveyance path for a flexible film; and a feed mechanism that drives the film by a drive roller that is in pressure contact with the film. An apparatus for manufacturing a semiconductor device, wherein an idling sprocket having teeth formed to fit into the formed holes is attached to prevent lateral displacement of the film by the idling sprocket when the film is moved. 2. A method of manufacturing a semiconductor device using a manufacturing apparatus having a chute that serves as a conveyance path of a flexible film and a feeding mechanism that drives the film by a drive roller that is in pressure contact with the film, A semiconductor device characterized in that an idling sprocket having teeth formed to fit into a hole formed at an edge of the film is attached to prevent lateral displacement of the film by the idling sprocket when the film is moved. Manufacturing method. 3. The method of manufacturing a semiconductor device according to claim 2, wherein the manufacturing device having the feeding mechanism is a chip mounter. 4. The method of manufacturing a semiconductor device according to claim 2, wherein the film is pressed against the drive roller by a pressing roller paired with the drive roller. 5. The method of manufacturing a semiconductor device according to claim 2, wherein the driving roller and an idling sprocket form a pair, and the film is pressed against the driving roller by the idling sprocket.