JP5445259B2 - IC chip supply device, IC chip mounting body manufacturing device - Google Patents

Description

  The present invention relates to an IC chip supply device capable of supplying IC chips with the same orientation to the next process, and an IC chip mounting apparatus including the IC chip supply device.

  Conventionally, for example, as an IC chip supply device applied to an apparatus for manufacturing an IC chip mounting body in which an IC chip is mounted on an antenna sheet (also referred to as “film substrate”), the orientation is recovered by a predetermined recovery unit. A device (part feeder) that conveys a large number of irregularly arranged IC chips along the traveling surface in a spiral or linear conveying path (also referred to as “trough”) and conveys them to the next process. Are known.

  The present applicant has developed an apparatus for manufacturing an IC chip mounting body including the above-described parts feeder for the purpose of manufacturing the IC chip mounting body at high speed (see Patent Document 1). This manufacturing apparatus supplies an IC chip whose orientation is aligned by a parts feeder to an IC chip mounting mechanism (a mechanism component called “synchronous roller” in the same document), and the IC chip mounting mechanism uses a predetermined position of the antenna sheet, specifically, The IC chip mounting body manufactured by mounting the antenna circuit on the antenna sheet at the location where the antenna circuit is formed and thermosetting the adhesive is wound into a roll.

  By the way, the following processing is performed in the previous process in which a large number of IC chips are put into the parts feeder described above. Normally, each IC chip is cut by cutting a wafer affixed on an IC chip holder such as an adhesive dicing tape into a square shape with a circular diamond blade that rotates at high speed, for example. The wafer is held on the dicing tape in a state (a wafer in this state is referred to as a “diced wafer”). Then, the IC chip detached from the diced wafer has been put into a housing part of a parts feeder, for example, a bowl feeder part.

JP 2006-309541 A

  Therefore, when a large number of IC chips are inserted into the parts feeder, the orientations of the respective IC chips are not uniform, and such IC chips are conveyed while being vibrated along the conveying path of the parts feeder to align the directions. There was a need. Each IC chip is provided with bumps formed of metal such as copper or gold on either surface, and the IC is connected to the antenna circuit on the antenna sheet. It is necessary to align the top and bottom of the chip.

  When an IC chip in a posture in which the bump and the antenna circuit cannot be electrically connected is mounted on the antenna sheet by the IC chip mounting mechanism, it becomes a defective product, and a problem that the yield decreases may occur.

  In addition, the processing time from when the IC chip is detached from the diced wafer to when it is supplied to the IC chip mounting mechanism which is the next process in a state where the directions are aligned, and as a result, a predetermined location on the antenna sheet (antenna Not only does it take a long time to mount it on the circuit formation location), but it also has a dedicated sorter (such as a camera, image analysis software, air blowing mechanism, etc.) on the transport path to align the orientation of each IC chip. In addition, a high-cost parts feeder had to be applied.

  The present invention has been made paying attention to such a problem, and its main purpose is to separate each IC chip from an IC chip holder such as a dicing tape and supply it to the IC chip mounting mechanism. Providing an IC chip supply device that can shorten the processing time and, in turn, reduce the processing time until the individual IC chips detached from the IC chip holder such as a dicing tape are mounted on the antenna sheet. In addition, an IC chip mounting body that includes such an IC chip supply device and that can manufacture an IC chip mounting body in which an IC chip and an antenna circuit are appropriately connected can be manufactured, and the yield can be improved. It is to provide a manufacturing apparatus.

  That is, the present invention relates to an IC chip supply device for supplying an IC chip to an IC chip mounting mechanism for mounting an IC chip on an antenna sheet (also referred to as a film substrate). IC chip detachment mechanism for detaching a plurality of IC chips held on the IC chip holder, and IC chips detached from the IC chip holder by the IC chip detachment mechanism are directly received and transported to the IC chip mounting mechanism. And an IC chip transport mechanism for delivery.

  In such an IC chip supply apparatus, it is necessary to put an IC chip detached from an IC chip holder such as a dicing tape into a housing part (such as a bowl feeder) of the parts feeder. It is not necessary, and the processing time until the IC chip detached from the IC chip holding body is delivered to the IC chip mounting mechanism while maintaining the posture (orientation) on the IC chip holding body is greatly reduced compared to the conventional case. be able to. Here, the IC chip detachment mechanism is a mechanism that detaches a plurality of IC chips from the IC chip holder in order, or a mechanism that detaches a plurality of IC chips from the IC chip holder, or a plurality of ICs. Any of these may be used which allows the chip to be detached from the IC chip holder at once. Further, as the IC chip detachment mechanism, the IC chip held by the IC chip holder is pushed out and released from the IC chip holder, or the IC chip held by the IC chip holder is sucked to hold the IC chip. Examples include those that are removed from the body.

The IC chip supply device according to the present invention has an IC chip reversing unit that delivers the IC chip received from the IC chip detaching mechanism to the IC chip mounting mechanism in an inverted orientation as the IC chip transport mechanism. Is applied to the reverse running surface having a gradually twisted shape from the start to the end, and the IC chip C conveyed along the reverse running surface while being vibrated is reversed by the weight of the IC chip itself and reversed. It is characterized in der Rukoto those with road.

  The present inventors paid attention to the following two points in the process of devising the present invention. The first point is that each IC chip held on an IC chip holder such as a dicing tape in a cut state has the same orientation (orientation) in plan view, and such IC chip is oriented in plan view. If the IC chip holder is sequentially detached from the IC chip holder in the same direction without changing the position, and then only the front and back postures of the IC chip are aligned, the IC chip is supplied to the IC chip mounting mechanism in an appropriate posture. It is a point that can be done. The second point is that each IC chip held on the IC chip holding body is a surface in a direction of separating from the IC chip holding body (specifically, a surface of the IC chip that does not contact the adhesive surface of the IC chip holding body). For example, bumps made of metal such as copper or gold for connecting to the antenna circuit on the antenna sheet on the IC chip held by the IC chip holding body with the adhesive surface facing upward are provided on the antenna sheet on the antenna sheet). When an IC chip having a posture in which the formed bump surface (hereinafter referred to as “bump forming surface”) is directed upward is delivered to the IC chip mounting mechanism, the IC chip is maintained in that posture by the IC chip mounting mechanism. If mounted on the antenna sheet, the surface on which the bumps are not formed will come into contact with the antenna circuit, and an electrically defective IC chip mounting body will be manufactured. That.

  Focusing on this point, the present inventors have, as an IC chip transport mechanism, an IC chip reversing unit that delivers the IC chip received from the IC chip detaching mechanism to the IC chip mounting mechanism in an inverted orientation. I came up with an IC chip supply device.

  With such an IC chip supply device, various sorting means (for example, a narrowed portion, an air blowing mechanism, hardware such as a camera, image analysis, etc.) are arranged on the conveyance path to align the orientation of the IC chip in plan view. It is not necessary to apply a dedicated parts feeder with software, etc., and the cost can be reduced, and the posture at the time when the IC chip reversing unit receives it from the IC chip detachment mechanism is reversed. The IC chip can be transferred to the IC chip mounting mechanism. When the IC chip is mounted at a predetermined position on the antenna sheet by the IC chip mounting mechanism, the bump of the IC chip can be connected to the antenna circuit. .

  An apparatus for manufacturing an IC chip mounting body according to the present invention manufactures an IC chip mounting body in which an IC chip is connected to an antenna circuit on an antenna sheet, and includes the above-described IC chip supply apparatus. It is characterized by that. In such a case, the various functions and effects described above obtained by the IC chip supply device are exhibited, and the processing time from when the IC chip is detached from the IC chip holder to when it is mounted on the antenna sheet is shortened. In addition, the cost can be reduced, and an IC chip mounting body in which the IC chip and the antenna circuit are electrically connected appropriately can be manufactured, so that the yield can be improved.

  According to the present invention, it has sorting means (hardware such as a camera, image analysis software, etc.) for aligning the posture (orientation) of the IC chip in plan view while conveying the IC chip detached from the IC chip holder. A parts feeder is not required, and the cost can be reduced. In addition, it is possible to effectively shorten the processing time until the IC chip detached from the IC chip holder is delivered to the IC chip mounting mechanism. Further, since the IC chip received from the IC chip detaching mechanism is turned over by the IC chip reversing unit and inverted, the IC chip is transferred to the IC chip mounting mechanism. The mounting process on the antenna sheet can be performed appropriately and efficiently.

The plane schematic diagram of the IC tag provided with the IC chip supplied with the IC chip supply apparatus which concerns on one Embodiment of this invention. FIG. 2 is a schematic cross-sectional view taken along the line aa in FIG. 1. The plane schematic diagram of the antenna sheet used in the embodiment. The plane schematic diagram of the IC chip mounting body manufactured with the IC chip mounting body manufacturing apparatus concerning the embodiment. The whole structure schematic diagram of the IC chip mounting body manufacturing apparatus provided with the IC chip supply apparatus which concerns on the same embodiment. The principal part plane schematic diagram of the IC chip mounting body manufacturing apparatus which concerns on the same embodiment. FIG. 7 is a schematic cross-sectional view taken along the line aa in FIG. 6. Bb line cross-sectional schematic diagram of FIG. The principal part exploded view of the IC chip inversion mechanism used in the embodiment.

  As shown in FIGS. 1 to 5, an IC chip supply device 3 according to the present invention is an IC that manufactures an IC chip mounting body J in which an IC chip C is connected to an antenna circuit A formed on an antenna sheet S. The present invention is applied to a chip mounting body manufacturing apparatus X.

  As shown in FIGS. 1 to 4, the IC chip mounting body J manufactured by the IC chip mounting body manufacturing apparatus X is preliminarily provided with the antenna circuit A at intervals in the longitudinal direction (for example, can be set at equal intervals). An antenna sheet S (also referred to as a film substrate) continuously formed by printing, etching, or the like, and an IC chip C mounted on the antenna sheet S at a position connected to the antenna circuit A It is. In addition, as shown in FIG. 2, the IC chip C is provided with bumps C1 made of a metal such as copper or gold for connection to the antenna circuit A on the surface facing the antenna circuit A. For example, the antenna circuit A is connected via an adhesive Z made of an insulating paste, an anisotropic conductive paste, or the like. The “IC chip mounting body J” in the present embodiment refers to a long sheet-like one before being cut into individual IC tags T. 1 is a schematic plan view of one IC tag T cut from a long IC chip mounting body J, and FIG. 2 is a schematic cross-sectional view taken along the line aa of FIG. FIG. 4 is a plan view schematically showing a partially cut long sheet-like IC chip mounting body J before being cut out as an IC tag T. 1 and the like, the thickness of each part is exaggerated, but the actual IC chip mounting body J is extremely thin as a whole. In addition, an IC chip C mounted on an antenna circuit A formed on a long antenna sheet S and cannot be handled as a product (cannot be used) is called an inlet or inlay. A long sheet having a plurality of such inlets in the longitudinal direction is also called a roll inlet, and a number of IC tags T can be obtained by cutting the roll inlet into a predetermined size.

  The IC chip mounting body manufacturing apparatus X of this embodiment applies an adhesive Z to a predetermined portion of the antenna sheet S, specifically, a portion where the antenna circuit A is formed, and mounts the IC chip C on the applied portion. The adhesive Z is thermally cured, and the IC chip C is pressed against the antenna sheet S by the release film 6F, and the IC chip mounting body J in which the IC chip C is adhered to the antenna sheet S is wound in a roll shape. Process to take.

  And this IC chip mounting body manufacturing apparatus X is the antenna which becomes the starting point of the conveyance path | route of the antenna sheet S, winds the antenna sheet S in roll shape, accommodates it, and sends it out sequentially, as the whole structure is typically shown in FIG. The sheet supply unit 1, the adhesive application unit 2 that applies the adhesive Z to the position where the IC chip C is mounted on the antenna sheet S, and the orientation in which the IC chip C can be connected to the antenna circuit A by the bump C 1. The IC chip supply device 3 that is transferred to the next process while being aligned, and the IC chip C supplied from the IC chip supply device 3 can be mounted on the antenna sheet S by rotating while adsorbing and holding the IC chip C. The synchronizing roller unit 4 (corresponding to the “IC chip mounting mechanism” of the present invention), the heater 5 for thermosetting the adhesive Z, and the IC chip C are adhered to the antenna sheet S. Therefore, an IC chip pressurizing unit 6 that presses the IC chip C from above with a release film 6F, a product inspection / winding unit 7 that inspects and sequentially winds the IC chip mounting body J, and a control unit 8 that controls these units. As a main component mechanism.

  The antenna sheet supply unit 1 accommodates the antenna sheet S wound in a roll shape, and is controlled by the control unit 8 to continuously feed and supply the antenna sheet S at a constant speed and a constant tension. Specifically, the antenna sheet supply unit 1 includes a clock roller 11 (main roller) that is rotated by a motor (not shown) and whose rotation speed is controlled by the control unit 8, and an upstream auxiliary provided at a position sandwiching the clock roller 11. A roller 12 and a downstream auxiliary roller 13 are provided, and the antenna sheet S is supplied in a predetermined direction along the peripheral surfaces of the upstream auxiliary roller 12, the clock roller 11, and the downstream auxiliary roller 13.

  The adhesive application unit 2 includes an application unit main body 21 that applies the adhesive Z to the antenna sheet S conveyed along the clock roller 11. The application process of the adhesive Z to the antenna sheet S is continuously performed without stopping the conveyance of the antenna sheet S. Note that a camera that images the adhesive application position of the antenna sheet S on the clock roller 11 may be disposed at an appropriate location.

  The IC chip supply device 3 is shown in FIGS. 6 to 9 (FIG. 6 is a schematic plan view of an essential part of the IC chip mounting body manufacturing apparatus X, FIG. 7 is a schematic cross-sectional view taken along the line aa in FIG. FIG. 9 is a schematic cross-sectional view taken along the line bb of FIG. 6, and FIG. 9 is an exploded view of the main part of the IC chip reversing unit 34 described later). The dicing tape DT (“ IC chip holding mechanism 31 for extruding the IC chips C held on the chip in order and releasing them from the dicing tape DT, and the IC chip released from the dicing tape DT by the IC chip releasing mechanism 31 An IC chip transport mechanism 32 that receives and transports C and delivers it to the synchronous roller unit 4 is provided.

  The IC chip detachment mechanism 31 separates the IC chips C one by one from a diced wafer D formed by arranging a plurality of IC chips C on a dicing tape DT. Here, as shown in FIG. 6, the diced wafer D is cut into a square shape (die) by, for example, a high-speed rotating diamond blade in a state where the wafer W is attached to the adhesive dicing tape DT, Each IC chip C is held in a separated state. In the diced wafer D, the wafer W is not attached to a region near the outer edge of the dicing tape DT, and the region near the outer edge is supported by an annular ring portion DR. The IC chip detachment mechanism 31 includes a push-up portion 311 that can push up the IC chips C held on the dicing tape DT one by one from the lower side of the dicing tape DT in a state of being cut into a dice shape. The actuator 312 is provided for causing the push-up portion 311 to project and retract and to move back and forth and right and left. In the present embodiment, the push-up portion 311 is configured by a single push-up pin. However, if there is no structural problem, a configuration in which a plurality of IC chips are pushed up simultaneously or substantially simultaneously may be employed. The IC chip detachment mechanism 31 includes a ring support portion 313 that supports the ring portion DR of the diced wafer D in a height direction, and a region corresponding to the vicinity of the outer edge portion of the wafer W of the dicing tape DT. Is provided with a dicing tape support 314 (see FIG. 7). 6 and 7 show the IC chips C in an exaggerated and simplified manner, and it goes without saying that the number is much smaller than the actual number of IC chips C.

  The IC chip transport mechanism 32 has a pickup roller portion 33 for picking up the IC chip C pushed up in the direction of lifting from the dicing tape DT by the IC chip removal mechanism 31 and the posture of the IC chip C released from the pickup roller portion 33 as an IC chip. An IC chip reversing unit 34 for turning over and reversing before passing to the mounting mechanism is provided.

  As shown in FIGS. 6 and 7, the pickup roller unit 33 is mainly composed of a pickup roller unit main body 331, and an IC chip is formed by a suction unit 332 (not shown in FIG. 6) provided on the outer peripheral surface of the pickup roller unit main body 331. The IC chips C pushed upward by the detachment mechanism 31 are sucked and held one by one and transferred to the IC chip reversing unit 34. In the present embodiment, the pickup roller section main body 331 is provided with a plurality of suction sections 332 at equal intervals in the circumferential direction. FIG. 7 illustrates a mode in which a nozzle-like suction portion 332 that protrudes from the outer peripheral surface of the pickup roller unit main body 331 is integrally provided on the outer peripheral surface of the pickup roller unit main body 331. A body part accommodated in the main part 331 and a suction part body projecting from the outer peripheral surface of the pickup roller part body 331 in a state where the body part is accommodated in the pickup roller part body 331 Or a suction hole formed in a size that can accommodate the IC chip C on the outer peripheral surface of the pickup roller portion main body 331 may be applied. The pickup roller unit 33 according to the present embodiment forms a suction through hole 333 that penetrates from the tip to the inside of the pickup roller unit main body 331 inside the suction unit 332, and is sucked through by a pneumatic control device such as a solenoid valve (not shown). The negative pressure from the hole 333 can be switched to atmospheric pressure. With such a configuration, the pickup roller unit 33 sucks and holds the IC chip C pushed up by the IC chip removing mechanism 31 by the negative pressure from the suction through hole 333 at the tip of the suction unit 332 and holds the held IC chip. When the chip C abuts or approaches the first linear transport path 341 of the IC chip reversing unit 34 described below, the negative pressure from the suction through hole 333 is switched to atmospheric pressure to weaken the suction force, thereby reducing the IC chip C. Is released, and the IC chip reversing unit 34 is transferred onto the first linear conveyance path 341.

  The IC chip detachment mechanism 31 includes the above-described push-up portion 311, actuator 312, ring support portion 313, and dicing tape support portion 314 provided on a common XY stage 315, and the IC chip pushed upward by the push-up portion 311. C is always set to a position where suction can be performed by the suction portion 332 of the pickup roller portion 33.

  The IC chip reversing unit 34 has a first linear conveyance path 341 relatively disposed on the IC chip detachment mechanism 31 side and a second linear conveyance path 343 relatively disposed on the IC chip mounting mechanism (synchronization roller unit 4) side. And a reversal conveyance path 342 that is disposed at a connection portion between the first linear conveyance path 341 and the second linear conveyance path 343 and reverses the front and back of the IC chip C. In the present embodiment, the IC chip C is vibrated in the order of the first linear conveyance path 341, the reverse conveyance path 342, and the second linear conveyance path 343 while vibrating the IC chip C by a constant vibration given through each conveyance path from a vibration applying unit (not shown). It is configured as follows.

  As shown in FIGS. 6 and 7, the first linear transport path 341 forms a first traveling surface 341 a and a second traveling surface 341 b in which the lower ends intersect substantially at right angles so as to form a substantially V shape in cross section. It is a thing. The IC chip C takes a posture lying on the first traveling surface 341a in the first linear transport path 341 (see FIG. 7).

  The reverse conveyance path 342 is gradually twisted (twisted) from the start end that can be connected to the downstream end (end) of the first linear transfer path 341 toward the end that can be connected to the upstream end (start) of the second linear transfer path 343. ) Having an inverted running surface 342a. In the present embodiment, a reverse running surface 342a having a depth corresponding to the thickness of the IC chip C is formed on the outer peripheral surface of the semi-cylindrical or substantially semi-cylindrical protrusion 342b extending in the conveyance direction of the IC chip C. Yes. The reversal running surface 342a is formed in a state in which the reverse conveyance path main body 342c having the protrusion 342b and the cover body 342e having the concave groove 342d that can be fitted to the protrusion 342b are assembled to each other. And the groove 342d formed in a twist shape. Specifically, the start end 342f side of the reverse running surface 342a is set to a position relatively higher than the end end 342g side. As a result, the IC chip C transported from the start end 342f side to the end 342g side along the reverse running surface 342a can be turned upside down by the weight of the IC chip C itself. The cover body 342e has a function of preventing dust, water droplets, and the like from adhering to the reversing traveling surface 342a, and a function of preventing the IC chip C passing through the reversing transport path 342 from dropping from the reversing traveling surface 342a. Demonstrate. In the present embodiment, a screw hole 342h is formed in a part of the reverse conveyance path main body 342c, and the concave groove 342d of the cover body 342e is fitted to the protrusion 342b of the reverse conveyance path main body 342c so that the reverse conveyance path main body 342c is fitted. In the state where the cover body 342e is mounted, the reverse conveying path main body 342c and the cover body 342e are integrated with each other by tightening the screw 342j into the screw hole 342h opened to the outside through the screw insertion hole 342i provided in the cover body 342e. Is assembled.

  As shown in FIGS. 6 and 8, the second linear conveyance path 343 forms a first traveling surface 343 a and a second traveling surface 343 b in which the lower ends intersect substantially at right angles so as to form a substantially V shape in cross section. It is a thing. The IC chip C takes a posture lying on the first traveling surface 343a in the second linear transport path 343. Here, as shown in FIGS. 6 and 8, the first travel surface 341a and the second travel surface 341b in the first linear transport path 341, and the first travel surface 343a and the second travel surface in the second linear transport path 343, respectively. The relative positional relationship with 343b is reversed left and right across the reverse conveyance path 342. Accordingly, the IC chip reversing unit 34 according to the present embodiment can support the IC chip C reversed on the reversing conveyance path 342 in a posture lying on the first traveling surface 343 a of the second linear conveyance path 343.

  The synchronization roller unit 4 is mainly composed of a synchronization roller unit body 41 that rotates in synchronization with the conveyance speed of the antenna sheet S (in this embodiment, in synchronization with the rotation speed of the clock roller 11) under the control of the control unit 8. The suction chip 42 (not shown in FIG. 6) provided so as to protrude from the outer peripheral surface of the synchronous roller body 41 sucks and holds the IC chips C supplied from the IC chip supply device 3 one by one. The antenna sheet S on the roller 11 is mounted at a position where the adhesive Z is applied. In the present embodiment, the synchronous roller unit body 41 is provided with a plurality of suction units 42 at equal intervals in the circumferential direction. FIG. 8 illustrates a mode in which a nozzle-like suction portion 42 that protrudes from the outer peripheral surface of the synchronous roller portion main body 41 is integrally provided on the outer peripheral surface of the synchronous roller portion main body 41. A body part accommodated in the body part 41 and a suction part body projecting from the outer peripheral surface of the synchronization roller part body 41 in a state where the body part is housed in the synchronization roller part body 41 Or a suction hole formed in the outer peripheral surface of the synchronous roller main body 41 with a size capable of accommodating the IC chip C may be applied. The synchronous roller portion 4 of the present embodiment forms a suction through hole 43 that penetrates from the tip to the inside of the synchronous roller portion main body 41 inside the suction portion 42, and is sucked through by an air pressure control device such as an external electromagnetic valve. The negative pressure from the hole 43 can be switched to atmospheric pressure. With such a configuration, the synchronization roller unit 4 allows the IC chip C reaching the supply end of the IC chip reversing unit 34 (the downstream end or the vicinity of the downstream end of the second linear transport path 343) to be drawn from the suction through hole 43. At the time when the held IC chip C is brought into contact with or close to the antenna sheet S, the negative pressure from the suction through-hole 43 is switched to the atmospheric pressure and the suction force is held. The function of releasing the IC chip C and mounting it at a predetermined position (position where the adhesive Z is applied) on the antenna sheet S is exhibited.

  The synchronous roller unit body 41 is configured to perform an index operation by a predetermined angle (for example, 72 ° in the case where five suction units 42 are provided) by a drive motor (not shown) and is suctioned by an XY stage (not shown). A position where the rotation locus of the portion 42 is on the downstream end of the IC chip reversing portion 34 (a downstream end (end) of the second linear conveyance path 343) and the rotation locus of the suction portion 42 are conveyed along the clock roller 11. It is configured to be movable between positions on the antenna sheet S. It should be noted that a camera (not shown) that can image the position on which the IC chip C is placed is arranged at an appropriate position, and if there is an error from a predetermined position based on the captured image, it can be corrected by communicating with the control unit 8 as needed. It may be. Further, the process of mounting the IC chip C on the antenna sheet S is continuously performed without stopping the conveyance of the antenna sheet S.

  The heater 5 heats the adhesive Z applied on the antenna sheet S by directly or indirectly heating the antenna sheet S on which the IC chip C is mounted. In the present embodiment, as shown in FIG. 5, the antenna sheet S conveyed while being in contact with the cure unit 61 is heated by heating the cure unit 61 of the release film pressurizing unit 6 described below with the heater 5. It is configured to be able to.

  As shown in FIG. 5, the release film pressurizing section 6 is a release film that sequentially feeds a cure section 61 that can pressurize the antenna sheet S on which the IC chip C is mounted and a release film 6 </ b> F wound in a roller shape. A feeding part 62 and a peeling film winding part 63 for sequentially winding the peeling film 6F that has passed through the curing part 61 are provided. In addition, the release film 6F should just be what the surface which contacts the antenna sheet S with which the IC chip C was mounted has at least peelability.

  The product inspection / winding unit 7 inspects the manufactured IC chip mounting body J, winds it into a roll shape, and accommodates it.

  Next, a process and an operation of manufacturing an IC chip mounting body J (IC tag T formed continuously in a strip shape) by such an IC chip mounting body manufacturing apparatus X will be described.

  First, the IC chip mounting body manufacturing apparatus X according to the present embodiment conveys the antenna sheet S from the antenna sheet supply unit 1 to the adhesive application unit 2 while controlling the antenna sheet S at a constant speed by the control unit 8, and the adhesive application unit 2 2, the adhesive Z is applied to the position where the IC chip C is mounted on the antenna sheet S conveyed along the rotating clock roller 11 by the application unit main body 21. In addition, when apply | coating the adhesive agent Z on the antenna sheet S, the antenna sheet S is conveyed at a fixed speed, without stopping. In the present embodiment, the adhesive Z is applied by the adhesive application unit 2 to the antenna sheet S that has passed through the upstream auxiliary roller 12 of the antenna sheet supply unit 1 (see FIG. 8). A recess 13a that avoids interference with the adhesive Z and the IC chip C is formed in the central portion in the width direction of the downstream side auxiliary roller 13 (see FIG. 6).

  Next, the IC chip mounting body manufacturing apparatus X of the present embodiment supplies the IC chip C supplied from the IC chip supply apparatus 3 in a state in which the plane view is aligned in a predetermined position on the antenna sheet S by the synchronization roller unit 4, That is, the IC chips C are sequentially mounted on the place where the adhesive Z is applied.

  Specifically, the IC chip supply device 3 supports the ring portion DR of the diced wafer D by the ring support portion 313 of the IC chip removal mechanism 31 and corresponds to the vicinity of the outer edge portion of the wafer W in the dicing tape DT. The area is supported by a dicing tape support 314. Thus, the IC chip supply device 3 according to this embodiment is held on the dicing tape DT in a state of being cut into dice by driving the actuator 312 while holding the entire diced wafer D in a flat shape. The IC chips C are pushed up one by one from the lower side of the dicing tape DT by the push-up portion 311 (see FIG. 7). When one IC chip C is pushed up from below the dicing tape DT by the push-up portion 311, this pushed-up IC chip C (push-up target IC chip C) is a peripheral IC chip with a cut portion formed during the dicing process as a boundary. It floats above C, and can be detached from the dicing tape DT. In addition, the dicing tape DT is appropriately deformed flexibly during the push-up process so that it is not torn or torn. Further, the dicing wafer D may include an IC chip C (defective product IC chip) that is defective in appearance or electrical failure, but the bit pattern ( The coordinates) are specified by performing a predetermined test at the time of dicing (during dicing) or at the time of dicing (after dicing). Therefore, the IC chip detachment mechanism 31 of the IC chip supply device 3 according to the present embodiment uses the bit pattern of the defective IC chip in the diced wafer D as a target IC chip C to push up only the non-defective IC chip. It is set to push up one by one. Further, in the diced wafer D, the surface of each IC chip C that is pushed up by the pushing-up portion 311 (the surface that is detached by the IC chip removing mechanism 31 and does not contact the adhesive surface of the dicing tape) ), That is, the bump C1 is formed on the upward surface. In FIG. 6, the formation location of the bump C1 in each IC chip C is schematically shown by a black circle. In the following description, the surface of the IC chip C on which the bump C1 is formed is referred to as “bump forming surface Ca”. Further, among the plurality of IC chips C held in a state of being cut on the dicing tape DT, all the IC chips C except the IC chip C that can form the vicinity of the outer edge portion of the wafer W are all the same in a plan view. It has a rectangular shape or a substantially rectangular shape (see FIG. 6).

  Next, the IC chip supply device 3 of the present embodiment performs dicing by the IC chip detachment mechanism 31 while the rotational driving of the pickup roller unit main body 331 is temporarily stopped by, for example, an index operation that rotates by a predetermined angle by a drive motor. The IC chip C in a state where it can be detached from the tape DT is sucked and held by the suction portion 332 of the pickup roller portion 33. At this time, as shown in FIG. 7, the IC chip C has a posture in which the bump forming surface Ca faces the pickup roller portion main body 331 (a posture in which the bump forming surface Ca faces inward (center side of the pickup roller portion main body 331)). ) Is sucked and held by the suction portion 332. Further, the orientations of the IC chips C that are detachable from the dicing tape DT in the plan view are all the same, and are held by suction by the suction portion 332 of the pickup roller portion 33 in the same posture.

  Subsequently, the IC chip supply device 3 of the present embodiment rotates the pickup roller unit main body 331 in a predetermined direction (the direction of arrow y in FIG. 7) while the IC chip C is sucked and held by the suction unit 332, and the IC chip is reversed. When reaching the upstream end (starting end) of the first linear conveyance path 341 constituting the part 34, the negative pressure from the suction through hole 333 is switched to atmospheric pressure, and the IC chip C is released from the suction part 332.

  The IC chip supply device 3 according to the present embodiment has the IC chip C released from the suction unit 332 of the pickup roller unit 33 lying on the first traveling surface 341a of the first linear conveyance path 341 in the first linear conveyance path 341. receive. At this time, as shown in FIG. 7, the IC chip C has a posture in which the bump forming surface Ca faces upward and the bump forming surface Ca does not face the first running surface 341 a of the first linear transport path 341.

  The IC chip supply device 3 of the present embodiment is configured so that the IC chip C transferred from the pickup roller unit 33 to the upstream end (starting end) of the first linear transport path 341 is in its posture (the bump forming surface Ca faces the first running surface 341a. The first linear transport path 341 is transported to the downstream end (end), and the reverse travel surface 342a having the twisted shape of the reverse transport path 342 is subsequently passed. In the process of passing along the reverse running surface 342a of the reverse conveyance path 342, the IC chip C is reversed from the posture in which the bump forming surface Ca is directed upward to the direction in which the bump forming surface Ca is directed downward, and the front and back posture is reversed. To do. As a result, the IC chip C that has reached the upstream end (starting end) of the second linear conveyance path 343 from the reverse conveyance path 342 faces the bump formation surface Ca downward, and the bump formation surface Ca is the second linear conveyance path 343. It is delivered to the second linear conveyance path 343 in a posture lying on its side so as to face the first traveling surface 343a (see FIG. 8). The IC chip supply device 3 according to the present embodiment has the posture (bump formation) of the IC chip C that has passed through the first linear transport path 341 and the reverse transport path 342 and transferred to the upstream end (starting end) of the second linear transport path 343. The surface Ca is conveyed to the downstream end (termination) of the second linear conveyance path 343 while maintaining the position where the surface Ca faces the first traveling surface 343a. Note that the IC chip supply device 3 of the present embodiment is configured so that each conveyance path (first linear conveyance path 341, reversal) constituting the IC chip reversing unit 34 while vibrating the IC chip C by vibration applied from a vibration applying unit (not shown). The conveyance path 342 and the second linear conveyance path 343) are conveyed, but a gradient of a predetermined angle is set over the entire conveyance path constituting the IC chip reversing unit 34, and the IC chip C itself is conveyed by its own weight. Can also be set.

  As described above, the IC chip supply device 3 according to the present embodiment is configured so that the posture of the IC chip C that has passed through the reverse conveyance path 342 and conveyed to the supply end that is the downstream end (tip) of the second linear conveyance path 343 is As shown in FIG. 8, the bump forming surface Ca can be corrected to a posture facing the first traveling surface 343a of the second linear transport path 343, and all subsequent IC chips C following this IC chip C are also in the same posture. The synchronous roller unit 4 can be supplied in an aligned state in which the directions are aligned.

  Then, the IC chip mounting body manufacturing apparatus X of the present embodiment is supplied in a state in which the orientation is aligned and aligned with the supply end of the IC chip reversing unit 34 (downstream end of the second linear transport path 343) through the above steps. The first IC chip C among the IC chips C to be formed is sucked by the suction unit 42 of the synchronous roller unit 4 and mounted on the antenna sheet S.

  The operation of adsorbing the IC chip C by the synchronous roller unit 4 and mounting the IC chip C on the antenna sheet S is as follows. For example, the synchronization roller unit 4 temporarily stops the rotation driving of the synchronization roller unit main body 41 by an index operation that is rotated by a predetermined angle by a drive motor, while the IC chip supply device 3 supplies the supply end of the IC chip reversing unit 34. Of the IC chips C transferred to the downstream end of the first linear transport path 341, the leading IC chip C is sucked and held by the suction unit 42. At this time, as shown in FIG. 8, the IC chip C has a posture in which the bump forming surface Ca faces away from the synchronizing roller unit main body 41 (the bump forming surface Ca is on the outer side (on the opposite side of the synchronizing roller unit main body 41)). Is held by the suction portion 42 in a facing orientation).

  Subsequently, the synchronous roller unit main body 41 performs an index operation by a drive motor, rotationally drives the synchronous roller unit main body 41 in a predetermined direction (the arrow y direction in FIG. 8), and is sucked and held at the tip of the suction unit 42. At the position where the IC chip C facing the antenna sheet S (position where it contacts), the negative pressure from the suction through-hole 43 is switched to atmospheric pressure to release the IC chip C, and the adhesive Z on the antenna sheet S is removed. The IC chip C is mounted at a position where the antenna circuit A (not shown in FIG. 8) is formed. Then, the IC chip C held by the suction part 42 with the bump forming surface Ca facing outward is released from the suction part 42 at a position (contact position) facing the antenna sheet S, whereby the IC chip C is removed. The bump forming surface Ca can be mounted at a predetermined position on the antenna sheet S where the adhesive Z is applied in a state where the bump forming surface Ca can be electrically connected to the antenna circuit A on the antenna sheet S.

  When the IC chip C is mounted on the antenna sheet S, the IC chip C is mounted on the antenna sheet S in a state where the IC chip C continues to rotate by the indexing operation of the synchronous roller body 41 (without temporarily stopping). . Further, the antenna sheet S is conveyed and supported non-stop in a predetermined direction by the clock roller 11 even when the IC chip C is mounted.

  According to the IC chip mounting body manufacturing apparatus X configured as described above, the IC chip C can be mounted without temporarily stopping the antenna sheet S, and the manufacturing efficiency of the IC chip mounting body J is improved.

  After mounting the IC chip C on the antenna sheet S, the IC chip mounting body manufacturing apparatus X according to the present embodiment heats the antenna sheet S by the heater 5 and cures the adhesive Z to thereby fix the IC chip C to the antenna sheet. Simultaneously or substantially simultaneously with fixing to S, the IC chip C and the antenna sheet S are pressurized by the release film 6F of the release film pressurizing section 6. Finally, the manufactured IC chip mounting body J is inspected by the product inspection / winding unit 7 and wound into a roll and accommodated. A large number of IC tags T can be obtained by cutting the long IC chip mounting body J taken up by the product inspection / winding unit 7 for each predetermined size by an appropriate means.

  As described above, the IC chip supply device 3 according to the present embodiment includes the IC chip detachment mechanism 31 that sequentially pushes the IC chips C held on the dicing tape DT in a separated state and separates them from the dicing tape DT. An IC chip transport mechanism 32 that directly receives and transports the IC chip C detached from the dicing tape DT by the IC chip removal mechanism 31 and directly transfers it to the synchronous roller unit 4 that is an IC chip mounting mechanism is provided. The time and time required to transfer the IC chip C released from the dicing tape DT to the synchronous roller unit 4 is not required since the processing and work process for putting the IC chip C released from the dicing wafer D into the housing part of the parts feeder are unnecessary. Shortening can be achieved. Further, the IC chip supply device 3 according to the present embodiment causes the individual IC chips C that are aligned in the plan view direction on the dicing tape DT to be detached from the dicing tape DT by the IC chip removing mechanism 31 in the same direction. Since the IC chip reversing unit 34 for reversing the front / back posture of the IC chip C before it is transferred to the synchronous roller unit 4 is provided in the IC chip transport mechanism 32, the planar posture and the front / back posture direction of the IC chip C are provided. It is necessary to apply a dedicated and high-cost parts feeder that has various sorting means (for example, a narrowed part, an air blowing mechanism, a hard wafer such as a camera, and software for image analysis) on the conveyance path. In addition, the cost can be reduced, and the IC roller C is placed on the antenna sheet S by the synchronous roller portion 4. It becomes possible to perform appropriate and efficient mounting process.

  Further, since the IC chip mounting body manufacturing apparatus X according to the present embodiment includes the IC chip transport mechanism 32 having the IC chip reversing unit 34 and the synchronization roller unit 4, the IC chip C and the antenna circuit A are provided. Can be manufactured, and the yield can be improved.

In addition, this invention is not limited to embodiment mentioned above. For example, an IC chip holder other than a dicing tape can be applied.

  In the above-described embodiment, the push-up portion of the IC chip detachment mechanism is exemplified by a mode in which one IC chip is configured by one push-up pin. However, the push-up portion that pushes up one IC chip by a plurality of push-up pins. May be configured. Furthermore, a member having a flat surface at the tip that can come into surface contact with the IC chip via the IC chip holder may be applied as the push-up portion. Further, as the IC chip detaching mechanism, a mechanism capable of detaching a plurality of IC chips from the IC chip holder simultaneously or substantially simultaneously can be adopted.

  Further, the IC chip detachment mechanism may further include a suction part that sucks downward the peripheral part of the IC chip to be pushed up by the push-up part (push-up target IC chip). With such an IC chip detachment mechanism, it is possible to prevent an IC chip existing around the push target IC chip from being detached from the IC chip holder together with the push target IC chip. In addition, the IC chip detachment mechanism does not have a push-up portion, and sucks a peripheral IC chip that sucks the peripheral portion of the IC chip to be detached from the IC chip holder (detachment target IC chip) in a direction in close contact with the IC chip holder. And a detachment target IC chip suction part that sucks the detachment target IC chip in a direction of detachment from the IC chip holder.

  Moreover, the IC chip mounting body manufactured by the IC chip mounting body manufacturing apparatus of the present invention may include a cover film that can cover the antenna sheet and the IC chip from above the antenna sheet and the IC chip. Examples of the cover film include those having adhesiveness only on the surface facing the antenna sheet and the IC chip and capable of being bonded onto the antenna sheet having the IC chip mounted at a predetermined position.

  Further, it is possible to apply an IC chip mounting mechanism other than the synchronous roller unit.

  In addition, the specific configuration of each part is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

DESCRIPTION OF SYMBOLS 3 ... IC chip supply apparatus 31 ... IC chip detachment mechanism 32 ... IC chip conveyance mechanism 34 ... IC chip inversion part 4 ... IC chip mounting mechanism (synchronous roller part)
C ... IC chip DT ... IC chip holder (dicing tape)
S ... Antenna sheet X ... IC chip mounting body manufacturing apparatus

Claims (2)

An IC chip supply device for supplying an IC chip to an IC chip mounting mechanism for mounting an IC chip on an antenna sheet,
An IC chip detachment mechanism for detaching a plurality of IC chips held by the IC chip holder in a separated state from the IC chip holder while maintaining the posture;
An IC chip transport mechanism that directly receives and transports the IC chip detached from the IC chip holder by the IC chip removal mechanism, and delivers the IC chip to the IC chip mounting mechanism;
The IC chip transport mechanism state, and it is not having the IC chip IC chip reversing portion that passes to the IC chip mounting mechanism in a posture obtained by inverting upside down the IC chip received from the releasing mechanism,
The IC chip reversing portion has a reversing traveling surface gradually twisted from the start end to the end, and the IC chip C conveyed along the reversing traveling surface while being vibrated is turned over by the weight of the IC chip itself. IC chip supply device according to claim der Rukoto those with reverse conveyance path for. An IC chip mounting body manufactured by connecting an IC chip to an antenna circuit on an antenna sheet, comprising the IC chip supply device according to claim 1. apparatus.

Images