JP2003165779A - Ceramic joining device and manufacturing method for joined ceramic article using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a ceramic joining device where, when a platelike ceramic sinter is joined with another ceramic sinter or a metal having a smaller outer shape, the platelike ceramic sinter can be joined without generating deformation thereof, and provide a method by which a joined ceramic article is manufactured using the ceramic joining device. <P>SOLUTION: A platelike ceramic sinter 51 is placed on a pedestal 5 set in a furnace 2 and furthermore another ceramic sinter or metal having a smaller outer shape is placed on the sinter 51. A load is applied to the joining part of the platelike ceramic sinter 51 and the other ceramic sinter or metal through a pressurizing jig 18 by a pressurizing shaft 10 and another load is applied to the exposed surface of the platelike ceramic sinter 51 except for the joined area by a weight 21. In a state that both loads are adjusted, the sinter 51 and the other sinter or metal are heated to be joined, thus the joined ceramic article being manufactured. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic joining apparatus for joining a plate-shaped ceramic sintered body to another ceramic sintered body having a smaller outer shape or a metal, and a ceramic joined body using the same. It is about the method.

[0002]

2. Description of the Related Art A plate-shaped ceramic sintered body, a ceramic sintered body having an outer shape smaller than that, or a ceramic bonded body in which metals are bonded is used in various fields. For example, in a semiconductor manufacturing apparatus, a semiconductor wafer is used. A wafer support member such as a ceramic heater or a ceramic electrostatic chuck for holding the wafer is used, in which a cylindrical support is diffusion-bonded. This cylindrical support is used to install the wafer support member in the vacuum processing chamber, and is formed of a ceramic sintered body of the same kind as the plate-shaped ceramic sintered body forming the wafer support member or a metal having a thermal expansion coefficient similar to that of the plate-shaped ceramic sintered body. It had been.

As a method for joining such a plate-shaped ceramic sintered body to another ceramic sintered body or metal, for example, a ceramic joining apparatus disclosed in Japanese Patent Laid-Open No. 6-241662 is used. Is proposed.

As shown in FIG. 3, this ceramic joining apparatus has a furnace body 32 for accommodating the article W to be joined, a pressure shaft 40 for applying a load to the joint portion of the article W, and the pressure shaft 40. And a pressing jig 43 for evenly applying the force from the pressing shaft 40 to the joint portion of the article W to be welded. The furnace body 32 is a metal container. 33
A pedestal 37 made of carbon on which the article W to be joined placed on the bottom surface thereof, a heat insulating cover 34 made of carbon surrounding the article W to be joined on the pedestal 37, and arranged near the side surface inside the heat insulating cover 34 And a heating element 35
The inside of the furnace body 32 is heated by discharging the gas in the container 33 or filling the gas with the gas exhaust filling device 38, and energizing the heating element 35 by supplying electricity from the power supply device 36. . In addition, 39 is a floor plate.

The pressure shaft 40 is hermetically inserted into a through hole of a seal guide 42 provided on the upper wall of the metal container 33, and the pressure shaft 40 is driven by a pressure mechanism 41 such as a hydraulic cylinder. Then, the article W is pressed.

When the plate-shaped ceramic sintered body and the ceramic sintered body having a smaller outer shape or metal are joined by the ceramic joining device 31, the pedestal 3 is used.
After placing the plate-shaped ceramic sintered body, which is the article W, on 7 through the base plate 39, and placing the ceramic sintered body or metal having a small outer shape on the plate-shaped ceramic sintered body through the bonding agent. The heating element 35 heats the inside of the furnace body 32 to a predetermined temperature, the pressing mechanism 41 lowers the pressing shaft 40, and the pressing jig 40 is placed on the plate-shaped ceramic sintered body. By pressing the ceramic sintered body or metal, the plate-shaped ceramic sintered body and the ceramic sintered body or metal having an outer shape smaller than that have been joined.

[0007]

However, when a plate-shaped ceramic sintered body and a ceramic sintered body having a smaller outer shape or metal are joined by the ceramic joining apparatus 31 as shown in FIG. 3, the plate-shaped ceramic sintered body is sintered. The body is deformed,
There is a problem that warpage may occur, and it is not possible to perform the joining while maintaining the dimensional accuracy before joining.

That is, in order to bond the sintered ceramic sintered bodies to each other or the sintered ceramic sintered body and the metal, it is necessary to heat the ceramic sintered bodies to a high temperature at which they are plastically deformed. , The ceramic joining device 31 shown in FIG.
Has a structure in which only the joining region between the plate-shaped ceramic sintered body and another ceramic sintered body or metal is pressed in such a high temperature state, and therefore, as shown in FIG. There is a problem that the portion pressed by the processing jig 43 is deformed and the outer peripheral portion thereof is lifted and warpage occurs.

Therefore, when the plate-shaped ceramic sintered body is required to have a high level of flatness like a wafer support member and is not susceptible to deformation or warpage, the plate-shaped ceramic sintered body is re-formed according to the degree of deformation. Grinding and polishing have to be performed, and the number of processing steps is increased, which complicates the work and raises the manufacturing cost.

Further, when the wafer support member is a ceramic heater or a ceramic electrostatic chuck, the heater electrode and the electrostatic adsorption electrode are embedded in the plate-shaped ceramic sintered body. Ceramic joining device 3 shown
When the bonding is performed by No. 1, the heater electrode and the electrostatic attraction electrode embedded therein are also deformed due to the deformation of the plate-shaped ceramic sintered body, and the heater electrode and the electrostatic electrode are mounted on the mounting surface on which the semiconductor wafer is mounted. Since the distance to the adsorption electrode cannot be kept constant and the product becomes defective, there is a problem that the manufacturing yield is low.

[0011]

In view of the above problems, the ceramic joining apparatus of the present invention is provided with a plate-shaped ceramic sintered body and a ceramic sintered body or metal having an outer shape smaller than that of the plate-shaped ceramic sintered body. A furnace body provided with a pedestal for mounting an object to be joined, a pressing shaft for applying a load to a joint surface between the ceramic sintered body or the metal mounted on the plate-shaped ceramic sintered body, and a pressing shaft. A pressing jig for pressing the ceramic sintered body or the metal placed on the plate-shaped ceramic sintered body, a pressing mechanism for driving the pressing shaft, and a joining region of the ceramic sintered body or the metal are provided. It is characterized in that it is constituted by a weight that applies a load to the exposed surface of the above-mentioned plate-shaped ceramic sintered body except.

Further, according to the present invention, a plate-shaped ceramic sintered body is placed on a pedestal of the above-mentioned ceramic joining apparatus, and a ceramic sintered body or metal having a small outer shape is placed on the plate-shaped ceramic sintered body, and further the above-mentioned ceramic sintered body is placed. A pressure jig is placed on the body or metal, and a weight is placed on the exposed surface of the plate-shaped ceramic sintered body excluding the area where it is joined to the ceramic sintered body or metal. Then, the pressure shaft is lowered by the above-mentioned pressure mechanism and the pressure jig is pressed to form a ceramic sintered body having a small outer shape or a ceramic bonded body in which a metal is bonded to a plate-shaped ceramic sintered body. It is characterized in that it is manufactured.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below.

FIG. 1 is a schematic sectional view showing a ceramic joining apparatus of the present invention.

This ceramic joining apparatus 1 includes a plate-shaped ceramic sintered body 51, and a furnace body 2 for accommodating an article to be joined S made of a metal or a ceramic sintered body having an outer shape smaller than that of the plate-shaped ceramic sintered body 51. , The plate-shaped ceramic sintered body 5
1. A pressure shaft 10 for applying a load to a joint portion with the ceramic sintered body or metal placed on 1, and the ceramic sintered body or metal placed on the plate-shaped ceramic sintered body 51 by the pressure shaft 10. Pressing jig 18 for pressing and the pressing shaft 10
And a weight 21 for applying a load to the exposed surface of the plate-shaped ceramic sintered body 51 excluding the area where the ceramic sintered body or the metal is joined.
Is a pedestal 5 made of carbon on which the article S to be joined placed on the bottom surface of the metal container 3, a heat insulating cover 4 made of carbon surrounding the article S to be joined on the pedestal 5, and the inside of the heat insulating cover 4 are provided. And a heating element 6 disposed in the vicinity of the side surface of the.

The pressurizing shaft 10 is hermetically inserted into a through hole of a seal guide 9 provided on the upper wall of the metal container 3. The pressurizing shaft 10 is driven by a pressurizing mechanism 16 such as a hydraulic cylinder. A load is applied to the article S to be joined.

The pressing jig 18 and the weight 21 are the objects S to be joined.
Various shapes can be adopted according to the shape of the pressurizing region, and when the ceramic bonded body as shown in FIG. 2 is manufactured, the pressurizing jig 18 includes the flange portion 53 of the tubular body 52. It is preferable to use a bottomed cylindrical body 19 that presses almost the entire surface, and the weight 21 is a cylinder that presses almost the entire exposed surface of the plate-shaped ceramic sintered body 51 excluding the joining region with the cylindrical body 52. It is sufficient to use a shape.

As a material for forming the pressure shaft 10, carbon which can withstand a temperature of around 2500 ° C. can be preferably used. However, since carbon is not so large in hardness and is easily worn when used in a sliding portion, as shown in FIG. 1, the shaft rear end portion 11 that slides with the seal guide 9 is made of a super steel alloy or stainless steel (SUS304). It is preferable to use a bonded body which is made of a metal such as) and whose shaft tip portion 12 which is heated to a high temperature by the heating element 6 is made of carbon.

Further, as the material for forming the pressing jig 18, carbon which can withstand a temperature of about 2500 ° C. can be used as in the case of the pressing shaft 10. If the surface is made of carbon, the carbon adheres to the object S to be bonded at the time of pressing and causes a deterioration in quality.
As shown in FIG. 1, it is preferable to use a joined body in which the jig tip portion 20 including at least the contact surface of the jig body 19 is formed of a ceramic sintered body.

As a material for forming the weight 21,
It is preferable that it be able to withstand a temperature of around 2500 ° C. and have a specific gravity as large as possible. For example, a ceramic sintered body containing alumina, silicon nitride, aluminum nitride, silicon carbide or the like as a main component can be used.

Reference numeral 7 is a power supply device for energizing the heating element 6, and 8 is for supplying gas into the metal container 3 or for supplying the gas to the metal container 3.
It is a gas exhaust gas enclosing device for discharging the above gas.

Next, the ceramic bonded body shown in FIG.
A method for manufacturing with the ceramic bonding apparatus 1 shown in will be described.

First, the plate-shaped ceramic sintered body 51, which is the article S, is placed on the pedestal 5, and the ceramic sintered body or metal is placed at a predetermined position on the plate-shaped ceramic sintered body 51 via a bonding agent. Then, the flange portion 53 of the cylindrical body 52 is placed in contact with the flange portion 53. At this time, the base plate 24 made of a ceramic sintered body is placed between the pedestal 5 and the plate-shaped ceramic sintered body 51.
The pedestal 5 has a carbon plate-shaped ceramic sintered body 5
1 to prevent adhesion.

Then, the pressing jig 18 for pressing the flange portion 53 of the tubular body 52 is set. Further, a release agent such as boron nitride is applied to the exposed surface of the plate-shaped ceramic sintered body 51 excluding the bonding region, and a floor plate 22 made of the ceramic sintered body is placed thereon, and a weight 21 is placed thereon. At this time, the weight 21 is added to such an extent as to prevent the exposed surface of the plate-shaped ceramic sintered body 51 other than the bonding region from being deformed when the flange portion 53 of the tubular body 52 is pressed by the pressure shaft 10. It is sufficient if there is pressure, for example, the pressing force applied to the flange portion 53 is 500
If the weight is 0 N or less, the weight 21 having a weight of 10 to 300 N may be used.

Next, the gas in the metal container 3 is exhausted by the gas exhaust enclosing device 8 to reduce the vacuum to 100 Pa or less. Then, while depressurizing the inside of the metal container 3, the power supply device 7
To heat the heating element 6 to heat the article S mounted on the pedestal 5. At this time, the temperature rising rate is preferably 200 ° C./hour or less so that the temperature difference between the outer peripheral portion and the central portion of the object S to be bonded does not become 200 ° C. or more.

Simultaneously with the temperature rise, the pressing mechanism 16 lowers the pressing shafts 10 just before they come into contact with the pressing jigs 18 placed on the pressing surfaces of the objects S to be joined. By doing so, it is possible to prevent the temperature of the furnace body 2 from fluctuating due to the heat capacity of the pressurizing shaft 10.

Next, when the temperature inside the metal container 3 is heated to a temperature at which the plate-shaped ceramic sintered body 51 is plastically deformed, the pressing shaft 10 is brought into contact with the pressing jig 18 to form a cylindrical shape. The flange portion 53 of the body 52 is pressed almost entirely. Here, the temperature at which the heating element 6 is heated is set to the temperature at which the plate-shaped ceramic sintered body 51 can be plastically deformed, because the ceramic sintered body is a brittle material, and the temperature is lower than the plastically deformable temperature. This is because if the pressure is applied, the plate-shaped ceramic sintered body 51 and other ceramic sintered bodies may be damaged.

Thereafter, at the stage where the temperature inside the metal container 3 reaches a predetermined bonding temperature, the plate-shaped ceramic sintered body 51 and the flange portion 5 of the tubular body 52 are pressed by the pressing shaft 10.
The pressure applied to the joint between the plate-shaped ceramic sintered body 51 and the flange 53 of the tubular body 52 by the pressure shaft 10 is A , B is the load applied to the exposed surface of the plate-shaped ceramic sintered body 51 by the weight 21, and the ratio (A
/ B) is pressurized to 10 to 100, and this state is maintained for 1 to 2 hours.

The pressure applied to the joint between the plate-shaped ceramic sintered body 51 and the flange portion 53 of the tubular body 52 by the pressure shaft 10 is set to 1 to 5 MPa because the plate-shaped ceramic sintered body 51. And the pressure depends on the size of the tubular body 52, but the pressure is 1M.
If it is less than Pa, sufficient bonding strength cannot be obtained,
On the contrary, if the pressure exceeds 5 MPa, the plate-shaped ceramic sintered body is deformed.

The load applied to the joint between the plate-shaped ceramic sintered body 51 and the flange portion 53 of the tubular body 52 by the pressure shaft 10 is A, and the weight 21 is used to load the plate-shaped ceramic sintered body 5.
When the load applied to the exposed surface of 1 is B, the ratio (A /
The reason why the pressure is applied so that B) is 10 to 100 is that it is practically difficult to manufacture the weight 21 made of a ceramic sintered body in which the ratio (A / B) is less than 10, and
Conversely, when the ratio (A / B) exceeds 100, the load applied to the exposed surface of the plate-shaped ceramic sintered body 51 becomes smaller than the load A applied to the flange portion 53 of the tubular body 52, and the weight 21 This is because the effect of preventing the deformation of the plate-shaped ceramic sintered body 51 by the pressing force due to is small.

Further, the descending speed after the pressing shaft 10 comes into contact with the pressing jig 18 depends on the material and the thickness of the plate-shaped ceramic sintered body 51, but is made of a nitride such as aluminum nitride or alumina. If the thickness of the plate-shaped ceramic sintered body of (1) and the plate-shaped ceramic sintered body 51 of the joint portion and the flange portion 53 of the tubular body 52 is 50 mm, the thickness is preferably 10 mm / s or less. This is because, when the descending speed after the pressing shaft 10 contacts the pressing jig 18 exceeds 10 mm / s, the pressing force is rapidly transmitted into the plate-shaped ceramic sintered body 51, and the plate-shaped ceramic sintered body is This is because 51 is easily deformed, and is preferably set to 2 mm / s or less.

Thereafter, the heating temperature is gradually lowered, and when the temperature at which the plastic deformation is difficult occurs, the pressurization by the pressurizing shaft 10 is stopped, and further the temperature inside the furnace body 2 is lowered to 200 ° C. or less, so that the plate Cylindrical ceramic sintered body 51 and cylindrical body 5
It is possible to obtain a ceramic bonded body in which the two are bonded.

Further, according to the present invention, a load is applied to the joint between the plate-shaped ceramic sintered body 51 and the tubular body 52 by the pressing shaft 10 and the weight of the plate-shaped ceramic sintered body 51 is applied by the weight 21. Since the load is applied to the exposed portion other than the joining region, the warp of the plate-shaped ceramic sintered body 51 can be suppressed as compared with the conventional example, and the pressing shaft 1
By adjusting the load applied by 0 and the weight 21 to the range described above, it is possible to significantly prevent the warp of the plate-shaped ceramic sintered body 51 and firmly bond it to the tubular body 52.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-mentioned embodiments, but may include improvements and modifications without departing from the scope of the present invention. Needless to say.

[0035]

[Experimental Example] (Experimental Example 1) Hereinafter, as specific examples of the present invention,
A ceramic bonding apparatus and a bonding method of the present invention are applied to a wafer supporting member in which a ceramic heater made of a disk-shaped plate-shaped ceramic sintered body 51 and a cylindrical body 52 made of a cylindrical ceramic sintered body are bonded. An example manufactured by using will be described.

First, in order to manufacture a ceramic heater, 6% by weight of an acrylic binder was added to 100% by weight of raw material powder obtained by adding 0.1% by weight of calcium carbonate to aluminum nitride powder having a purity of 99%. , A slurry was prepared by mixing with a solvent, and a plurality of aluminum nitride green sheets were prepared by a doctor blade method.

Next, the obtained plurality of green sheets are cut into a substantially square sheet shape, and the green sheets are stacked with a contact liquid between them and heated to 80 ° C. for 3M.
By pressing with a force of Pa, the sheets were pressed against each other to produce a sheet laminate.

Then, a conductor paste to be a heater electrode is printed in a predetermined pattern on the surface of the sheet laminate using a screen printer, and the remaining several green sheets are stacked so as to cover the conductor paste. Thermocompression bonded,
Further, a conductor paste serving as an electrostatic attraction electrode was printed in a predetermined pattern using a screen printer, and the remaining green sheets were stacked so as to cover the conductor paste and thermocompression bonded to obtain a sheet laminate.

However, the thickness of the sheet laminate is 18 mm,
The depth of the conductor paste serving as the electrostatic attraction electrode embedded from the surface of the sheet laminate is about 1.0 mm, and the depth of the conductor paste serving as the heater electrode embedded from the surface of the sheet laminate is about 1.0 mm. It was set to 9 mm.

Next, the obtained sheet laminated body is subjected to cutting to form a disc shape, and then, at 300 ° C. in a nitrogen atmosphere.
After degreasing and carbonization by heating to 350 ° C
In an oxygen atmosphere to adjust the carbonization amount to 0.5 wt% or less, and then 2100 ° C., 4.5 MP
By firing in a nitrogen gas atmosphere of a, a plate-shaped ceramic sintered body having an electrostatic attraction electrode and a heater electrode embedded therein was obtained.

Then, the plate-shaped ceramic sintered body 51 is subjected to precision processing so that its outer shape has a diameter of 300 mm and a thickness of 12.5.
Then, the upper surface was polished to form a mounting surface, and the lower surface was perforated with a hole for joining a power supply terminal for energizing the electrostatic attraction electrode and the heater electrode. Then, after joining the tubular body 52, F is inserted into this hole.
A ceramic heater was manufactured by inserting a power supply terminal made of e-Ni-Co and brazing at a temperature of 1000 ° C. The flatness of the mounting surface of the obtained plate-shaped ceramic sintered body 51 was measured and found to be 10 μm.

On the other hand, in order to manufacture the tubular body 52, a purity of 9
6% by weight of an acrylic binder was added to 100% by weight of raw material powder obtained by adding 0.1% by weight of calcium carbonate to 9% of aluminum nitride powder, and kneaded and dried with a solvent to produce granulated powder.

Next, this granulated powder is filled in a rubber mold having a core and rubber press molding is performed at a pressure of 80 MPa to produce a cylindrical molded body, and then the outer shape is processed by cutting. By doing so, a cylindrical molded body having a flange portion at one end was obtained.

Then, like the plate-shaped ceramic sintered body 51, it is heated to 300 ° C. in a nitrogen atmosphere for degreasing and carbonization treatment, and then further heated in an oxygen atmosphere at 350 ° C. to reduce the carbonization amount. It is adjusted so as to be 0.5% by weight or less, and thereafter sintered by firing in a nitrogen gas atmosphere of 2100 ° C. and 4.5 MPa, and the outer shape of the ceramic sintered body is precisely ground to give a cylindrical shape. The outer diameter of the portion is 50 mm, the wall thickness is 5 mm, the outer diameter of the flange portion is 80 mm, and the inner diameter is 7
A tubular body 52 having a flange portion of 0 mm and a length of 500 mm was manufactured.

Then, the obtained plate-shaped ceramic sintered body 5
1 and the tubular body 52 are joined together, the floor plate 24 made of boron nitride is mounted on the pedestal 5 of the ceramic joining apparatus 1 shown in FIG.
The plate-shaped ceramic sintered body 51 serving as a ceramic heater is placed with the lower surface facing upward, and the flange portion of the tubular body 52 is placed in contact with the plate-shaped ceramic sintered body 51 at a predetermined position. On the surface of the flange portion opposite to the joining surface, a ring-shaped jig tip portion 20 made of boron nitride, which is a pressing jig, and a carbon-made bottomed cylindrical pressing jig 19 main body are sequentially arranged. While being placed, on the exposed surface of the plate-shaped ceramic sintered body 51 excluding the joining region, the weight 21 is a ring-shaped jig tip portion 23 made of boron nitride and a cylindrical pressing jig made of carbon. 22 main bodies were loaded in sequence.
A paste obtained by adding 1% by weight of calcium carbonate to 100% by weight of aluminum nitride powder was applied as a bonding agent to the joint between the plate-shaped ceramic sintered body 51 and the cylindrical body 52.

Next, the inside of the furnace body 2 is hermetically closed, the inside of the furnace body 2 is decompressed by the gas exhaust introduction device 8, and the power supply device 7 is energized to heat the heating element 6 to generate a plate which is the object S to be joined. After heating the cylindrical ceramic sintered body 51 and the cylindrical body 52 to remove water and the like, the temperature is raised to 1200 ° C. at a rate of 200 ° C./hour, and nitrogen gas of 100 kPa is introduced into the furnace at 1200 ° C. At the temperature of 1800 ° C. at which the plate-shaped ceramic sintered body 51 and the cylindrical body 52 made of the above-mentioned aluminum nitride sintered body are easily plastically deformed, the pressing shaft 10 moves down at a speed of 1 mm / s. Pressurized. At this time, pressurizing shaft 1
0, a pressure of about 3 MPa is applied between the joint surfaces of the plate-shaped ceramic sintered body 51 and the cylindrical ceramic sintered body 52, and the load of the pressing shaft 10 is applied by the weight 21. It was set to be 50 times the load applied to the exposed surface excluding the joining region of.

Then, from 1800 ° C. to 1900 ° C., 6
The temperature was raised at a rate of 0 ° C./hour, and the temperature was maintained at 1900 ° C. for 1 hour.

Here, the bonding temperature is 1800 ° C. to 1900.
C. If the bonding temperature is lower than 1800.degree. C., the bonding agent cannot be liquefied and cannot be diffused into the plate-shaped ceramic sintered body or the cylindrical body 52, and a strong bonding force cannot be obtained. Further, the high-purity aluminum nitride ceramic sintered body having an AlN purity of 99% or more does not plastically deform, and the plate-shaped ceramic sintered body 51 is pressed by the pressing force of the pressing shaft 10.
Or the cylindrical body 52 is broken, and conversely, when the joining temperature exceeds 1900 ° C., the plastic deformation speed of the high-purity aluminum nitride ceramic sintered body having an AlN purity of 99% or more becomes too high, This is because it is difficult to prevent the plate-shaped ceramic sintered body or the cylindrical body from being deformed by the pressing force of the pressure shaft 10 or the weight 21.

Then, the temperature is increased to 200 ° C./pressurized.
The pressure is reduced at a speed of time, and when the temperature in the furnace body 2 reaches 1600 ° C., the pressing shaft 10 is separated from the pressing jig 18 to make the pressing force zero. And the furnace body 2 at a rate of 200 ° C./hour
After lowering the internal temperature to 800 ° C., nitrogen gas was supplied into the furnace body 2 so that the gas pressure was 200 kPa, and the temperature inside the furnace body 2 was quickly reduced. Then, when the temperature inside the furnace body 2 becomes 200 ° C. or less, the ceramic heater made of the plate-shaped ceramic sintered body 51 and the cylindrical body 52 made of the ceramic sintered body are integrally joined to each other. Got the body

When the flatness of the mounting surface of the obtained ceramic heater was measured, it was 200 μm, which was about 20 times the flatness before bonding.

A silicon wafer having a thermocouple attached thereto is placed on the mounting surface of the ceramic heater to generate heat, and when the surface temperature of the silicon wafer is measured by an infrared thermometer, the average temperature reaches 700 ° C. When the temperature of the silicon wafer was measured with the thermocouple, the temperature variation was as small as 6 ° C., and the wafer could be heated uniformly.

On the other hand, by using the conventional ceramic joining apparatus shown in FIG.
When a product obtained by joining and was also manufactured, the flatness on the mounting surface of the ceramic heater after joining was 500 μm, which was 50 times as deformed as the flatness before joining.

Further, a silicon wafer having a thermocouple attached thereto is placed on the mounting surface of a ceramic heater joined by using the conventional ceramic joining apparatus shown in FIG. 3 to generate heat, and the surface temperature of the silicon wafer is measured by an infrared thermometer. When the temperature of the silicon wafer was measured by the thermocouple when the average temperature reached 700 ° C. while measuring in step 2, there was a temperature variation of 20 ° C., and the wafer could not be heated uniformly. (Experimental Example 2) Next, when the plate-shaped ceramic sintered body 51 and the cylindrical ceramic sintered body 52 manufactured in Experimental Example 1 were joined using the ceramic joining apparatus shown in FIG.
The load (A) applied to the joint between the plate-shaped ceramic sintered body 51 and the flange portion 53 of the tubular body 52 by 0, and the weight 21
After the bonding when the load (B) applied to the exposed surface of the plate-shaped ceramic sintered body is made different by measuring the flatness of the mounting surface of the ceramic heater, the helium leak tester is used to check the presence or absence of helium leak at the bonded portion. It was measured at.

The results are shown in Table 1.

[0055]

[Table 1]

As a result, as in sample No. 1, the pressure shaft 10
The ratio of the load (A) applied to the joint portion between the plate-shaped ceramic sintered body and the flange portion of the cylindrical support by (A) to the load (B) applied to the exposed surface of the plate-shaped ceramic sintered body by the weight 21 ( A
When / B) is less than 10, the flatness of the mounting surface of the ceramic heater can be suppressed, but the weight of the weight becomes too large and the peripheral portion and the center of the plate-shaped ceramic sintered body 51 are heated. The temperature difference between the parts became large and the plate-shaped ceramic sintered body cracked during the temperature rise.

On the other hand, as in Sample Nos. 2 to 12, the load (A) applied to the joint between the plate-shaped ceramic sintered body 51 and the flange portion 53 of the cylindrical body 52 by the pressure shaft 10.
If the ratio (A / B) between the load and the load (B) applied to the exposed surface of the plate-shaped ceramic sintered body 51 by weight is 10 to 100, the plate-shaped ceramic sintered body 51 can be largely deformed. It can be seen that the flatness of the mounting surface of the ceramic heater can be reduced.

Further, the sample No. Pressure shaft 1 as 14
When the descending speed of 0 was large, the plate-shaped ceramic sintered body 51 was damaged. Therefore, the descending speed of the pressurizing shaft 10 is set to 10 mm / s.
It has been found that the amount of warp can be reduced without damaging the plate-shaped ceramic sintered body by setting the following.

[0059]

As described above, according to the ceramic joining apparatus of the present invention, a covered member made of a plate-shaped ceramic sintered body and a ceramic sintered body having a smaller outer shape than the plate-shaped ceramic sintered body or a metal. A furnace body provided with a pedestal for mounting a bonded article, a pressing shaft for applying a load to a joint surface between the ceramic sintered body or the metal mounted on the plate-shaped ceramic sintered body, and the plate-shaped ceramic by the pressure shaft. A pressing jig for pressing the ceramic sintered body or the metal placed on the sintered body, a pressing mechanism for driving the pressing shaft, and the plate shape excluding the joining region between the ceramic sintered body or the metal By configuring with a weight that applies a load to the exposed surface of the ceramic sintered body,
It is possible to firmly join another ceramic sintered body or metal having a small outer shape without causing warpage or deformation of the plate-shaped ceramic sintered body having a large outer shape.

Further, according to the present invention, a plate-shaped ceramic sintered body is placed on the pedestal of the above-mentioned ceramic joining apparatus, and a ceramic sintered body or a metal having a small outer shape is placed on the plate-shaped ceramic sintered body, and further the ceramic firing is carried out. A pressing jig is placed on the bonded body or metal, and a weight is placed on the exposed surface of the plate-shaped ceramic sintered body excluding the area where the ceramic sintered body or metal is joined, and the exposed surface is exposed by the weight of the weight. After pressing the surface and heating the inside of the furnace to the bonding temperature in this state, the pressing shaft is lowered by the pressing mechanism to press the pressing jig, and the pressing force applied to the bonding portion is set to 1 to 5 MPa. In addition, when the load at that time is A and the load applied to the exposed surface of the plate-shaped ceramic sintered body excluding the above-mentioned joining region is B, the ratio (A /
B) is set to 10 to 100, and a ceramic sintered body having a small outer shape or a metal is joined to the ceramic sintered body, thereby causing warpage in the ceramic sintered body. Without deforming
It can be firmly bonded to other ceramic sintered bodies or metals.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing a ceramic joining device of the present invention.

FIG. 2 is a view showing a structure of a ceramic joined body joined by the ceramic joining apparatus of the present invention, in which (a) is a sectional view thereof,
(B) is the bottom view.

FIG. 3 is a schematic cross-sectional view showing a conventional ceramic joining device.

FIG. 4 is an enlarged cross-sectional view showing a joined state of objects to be joined by the ceramic joining apparatus of FIG.

[Explanation of symbols]

1: Ceramic joining device 2: Furnace body 3: Metal container 4: Insulation cover 5: Pedestal 6: heating element 7: Power supply 8: Gas exhaust filling device 9: Seal guide 10: Pressurizing shaft 16: Pressurizing mechanism 18: Pressurizing jig 21: Weight 24: Floor board 31: Ceramic joining device 32: Furnace body 33: Metal container 34: Insulation cover 35: heating element 36: Power supply 37: Pedestal 38: Gas exhaust filling device 39: Floor board 40: Pressure shaft 41: Pressurizing mechanism 42: Seal guide 43: jig for pressing

Claims (3)

[Claims] 1. A furnace body having a pedestal for mounting an article to be joined, which comprises a plate-shaped ceramic sintered body and a ceramic sintered body having a smaller outer shape than the plate-shaped ceramic sintered body or a metal.
A pressing shaft for applying a load to the surface of the plate-shaped ceramic sintered body or a joint surface with a metal, and a ceramic sintered body mounted on the plate-shaped ceramic sintered body by the pressing shaft. Alternatively, a pressing jig that presses a metal, a pressing mechanism that drives the pressing shaft, and a load are applied to the exposed surface of the plate-shaped ceramic sintered body excluding a region where the ceramic sintered body or the metal is joined. A ceramic joining device having a weight. 2. A plate-shaped ceramic sintered body is placed on a pedestal of the ceramic joining apparatus according to claim 1, and a ceramic sintered body or metal having a small outer shape is placed on the plate-shaped ceramic sintered body, and further, A pressure jig is placed on the ceramic sintered body or metal, and a weight is placed on the exposed surface of the plate-shaped ceramic sintered body other than the area where the ceramic sintered body or metal is joined. To a bonding temperature, and then the pressing mechanism is lowered by the above-mentioned pressing mechanism to press the pressing jig to bond the ceramic sintered body or metal with a small outer shape to the plate-shaped ceramic sintered body. A method for manufacturing a ceramic joined body characterized by the above. 3. The method for manufacturing a ceramic joined body according to claim 2, wherein the descending speed of the pressing shaft when pressing the pressing jig is set to 10 mm / s or less.