JP2003163424A - Electronic-component mounting board and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic-component mounting board in which an electronic component can be placed on an electronic-component mounting part in a short time and with satisfactory accuracy, which reduces the deviation in the direction of rotation of the mounted electronic component, and in which the mounting position of the electronic component can be confirmed in a short time and precisely. <P>SOLUTION: The electronic-component mounting board is provided with a group of a plurality of marks 2 which are formed in two corners of the electronic-component mounting part 1b by a printing method nearly symmetrically to the center line F, and in which the plurality of nearly quadrangular marks 2 are arranged by surrounding each nearly quadrangular center height 2b with each recess 2a having a nearly definite width. Three or more rows C of the group of the marks 2 formed at prescribed intervals along each side parallel to the center line F on the mounting part 1b are directed to the center line F, in such a way that sides on one side of the plurality of marks 2 become nearly parallel to the sides parallel to the center line F in the mounting part 1b. The rows C are formed so as to be deviated to a direction parallel to the center line F by nearly definite interval each shorter than the sides of one side, in such a way that they are away from the sides nearly perpendicular to the center line F on the mounting part 1b when they are directed to the center line F. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting substrate on which electronic components are mounted, and an electronic device having the electronic components mounted on the electronic component mounting substrate.

[0002]

2. Description of the Related Art Conventionally, IC, LSI, semiconductor laser (LD), CCD (Char
When mounting an electronic component such as a ge coupled device) at a predetermined position, the electronic component is held by an arm of a mounting machine, transported to a predetermined position, and aligned at a predetermined position on an insulating substrate. Alignment is important. As shown in FIG. 4, the electronic component mounting substrate A is printed with a conductor paste containing a metal powder such as tungsten (W) or molybdenum (Mo) as a main component on the upper surface 11a of the substantially rectangular insulating substrate. A substantially rectangular electronic component mounting portion 11b made of a metallized layer formed by printing and baking by a method or the like is provided. This electronic component mounting unit 11
In b, a mark 12 formed of an L-shaped cut pattern (a pattern including non-printed portions) is formed,
The electronic parts are aligned by the mark 12.

For example, when mounting an electronic component 14 such as a CCD, the electronic component 14 is placed on the electronic component mounting portion 11b via a bonding material such as a gold (Au) -silicon (Si) brazing material and heated. Before the bonding material is solidified by the image recognition device, the electronic component 14 is moved in the X direction (for example, the electronic component mounting portion 1).
1b long side direction, Y direction (for example, electronic component mounting portion 11)
The electronic component 1 while confirming the respective deviations in the short side direction of b) and the θ direction (the rotation direction of one side of the electronic component 14).
The position of 4 is adjusted to a predetermined position.

At this time, a trial product of an electronic device on which the electronic component 14 is mounted may be manufactured to investigate the influence of the positional deviation of the electronic component 14. In this case, when the electronic component 14 is mounted on the upper surface 11a of the electronic component mounting substrate A, a bonding material such as Au-Si brazing material is interposed between the electronic component 14 and the electronic component mounting portion 11b to enlarge the size. After manually placing the electronic component 14 with respect to the L-shaped mark 12 by using a mirror, the electronic component 14 is heated and bonded to the electronic component mounting portion 11b.

Then, in order to confirm how much the electronic component 14 mounted by being displaced is displaced from a predetermined position, the magnitude of the displacement in the XY direction and the θ direction is measured as shown in FIG. . At this time, the measuring table is equipped with a measuring device having a measuring table movable in the XY direction and the θ direction, for example, an illuminating device and a TV camera, and the measuring table can be viewed while looking through the microscope or looking at the screen showing the object. By using a measuring microscope or the like that measures the moving distance and the rotation angle by moving the reference line temporarily set in the electronic component mounting board A, for example, the XY with respect to the side of the mark 12 farthest from the electronic component 14 or the like. Direction and θ
The deviation in the direction was measured. And since this measurement is often done visually, it requires a lot of time and labor,
Contrary to the recent shortening of manufacturing cycle time, a great deal of time and labor was lost at the trial production stage.

As another conventional example, as shown in FIG. 6, in a printed wiring board 20 on which a multi-terminal electronic component is mounted by soldering, the lead terminals of the multi-terminal electronic component are soldered on the printed wiring board 20. On land 21 of
There is one in which a convex portion 22 serving as a reference indicating the positional deviation of the multi-terminal electronic component mounted by soldering is formed. In the conventional example shown in FIG. 6, after soldering and mounting, the projection 22 as the reference position display means and the lead terminal of the multi-terminal electronic component are simply visually compared to each other, so that the multi-terminal electronic can be easily performed without high skill. It is possible to know the positional deviation of the parts (Japanese Patent Application Laid-Open No. 20-29200).
00-77835). For example, when aligning a multi-terminal electronic component with the land 21 in manufacturing a prototype, the multi-terminal electronic component is moved to a predetermined position with the convex portion 22 as a reference while looking through a magnifying glass. The position of multi-terminal electronic components can be finely adjusted.

However, in the conventional example shown in FIG.
The magnitude of the deviation with respect to 2 is a rough estimated value by visual observation, and it is difficult to accurately read the placement position. When this technique is used for the mark 12 in FIG. 4, it is extremely difficult to perform accurate positioning and confirm the magnitude of positional deviation.

Therefore, as shown in FIG. 7, when the electronic component mounting portion 11b is formed on the upper surface 11a of the insulating substrate for the purpose of highly accurate positioning, in addition to the L-shaped mark 12, for example, several tens of tens. A graduation R for alignment in which substantially square cut patterns are arranged in a line so as to obtain a positional accuracy of about 100 μm is conceivable. This scale R is for electronic component 1
When mounting 4 on the electronic component mounting portion 11b, for example, 80
If a positional accuracy of approximately μm is required, the blanking pattern should be a square with 80 μm on each side, and this should be 80 μm in a row.
It is formed by printing as graduations arranged at m intervals.

[0009]

However, in the conventional example shown in FIG. 7, when an attempt is made to print a blank pattern of the scale R by the screen printing method, the blank pattern is moved from the edge or side of the blank pattern toward the center during printing. As a result, the conductor paste oozes out, and the shape of the punched pattern is likely to collapse. Therefore, even if an attempt is made to place a part of the edge of the electronic component 14 so as to overlap the edge or side of the punching pattern, the edge or side of the punching pattern is broken, and the electronic component 14 is placed with high positional accuracy. I couldn't. Further, even if an attempt is made to obtain an accurate distance from the reference line provided on the electronic component mounting board A in order to confirm the position where the electronic component 14 is placed, the scale R formed by such a punching pattern can accurately I couldn't figure it out.

Therefore, the present invention has been completed in view of the above problems, and an object thereof is to mount an electronic component on an electronic component mounting portion of an electronic component mounting board in a short time and accurately. It is possible to place a component, reduce the displacement of the mounted electronic component in the rotating direction, and provide a component that can accurately confirm the position where the electronic component is mounted in a short time. is there.

[0011]

An electronic component mounting substrate of the present invention is an insulating substrate having a substantially square electronic component mounting portion formed of a conductor layer on an upper surface thereof, and an electronic substrate mounting portion at two corners of the electronic component mounting portion. A mark group in which a plurality of substantially rectangular marks formed by enclosing a substantially rectangular central convex portion with a concave portion having a substantially constant width, which are formed by a printing method substantially symmetrically with respect to the center line of the electronic component mounting portion, are arranged. A board for mounting electronic parts, comprising:
In the mark group, a plurality of marks at a corner of the electronic component mounting portion are arranged at predetermined intervals along one side of the marks so as to be substantially parallel to a side parallel to the center line of the electronic component mounting portion. Are provided so as to form three or more rows toward the center line of the electronic component mounting portion, and these rows are arranged in the electronic component mounting portion toward the center line. It is characterized in that the marks are formed so as to be apart from a side substantially perpendicular to the center line by a substantially constant interval shorter than the one side of the mark in a direction parallel to the center line.

According to the present invention, by forming a substantially square mark in which a substantially square central convex portion is surrounded by a concave portion having a substantially constant width, a concave pattern which surrounds the central convex portion with a substantially constant width is not necessarily clear. Since it does not need to be a printed part), even if the conductor paste is bleeding, one side is several tens of μ depending on the printing method.
It is possible to form extremely small marks of about m or less. As a result, highly accurate alignment can be performed using the small mark. That is, when recognizing the mark, the step between the central convex portion and the concave portion can be easily visually recognized, and therefore the concave portion does not have to be a clear cut pattern. By appropriately adjusting the viscosity of the conductor paste, the step can be formed into a shape faithful to the pattern of the printing original plate. Further, since a similar step is formed between the recess and its surroundings, similarly, the step can be easily visually recognized to perform highly accurate alignment.

Further, as the mark rows are shifted toward the center line of the electronic component mounting portion in the row direction by a substantially constant interval shorter than one side in the row direction of the marks, a position higher than the size of the marks. Positioning can be performed with high accuracy. Furthermore, since the central convex portion in the mark and the concave portion around the central convex portion can be used for alignment, the alignment can be performed with higher accuracy.

Further, since the marks having the above structure are formed at the two corners of the electronic component mounting portion substantially symmetrically with respect to the center line of the electronic component mounting portion, the two groups of marks are used to rotate the electronic component. It is possible to accurately recognize the deviation in the direction (θ direction).

Therefore, according to the present invention, when the electronic component is mounted on the electronic component mounting portion of the insulating substrate, it is possible to accurately recognize the position in the XY directions by visual observation and to mount it. It is possible to achieve alignment with almost no deviation. As a result, even when the skill level of the operator is insufficient, the positioning in the XY directions can be performed quickly, and the placement position of the electronic component can be determined in a short time. Further, as a result that the distance from the reference line of the electronic component mounting board to the mounting position can be recognized in a short time, the cycle time in manufacturing including trial manufacture can be shortened.

In the present invention, preferably, the length of one side of the mark is 200 to 400 μm.

According to the present invention, according to the above-mentioned structure, even when the conductive paste is bleeding when the substantially rectangular mark formed by enclosing the substantially rectangular central convex portion with the concave portion having the substantially constant width is formed by the printing method. The bleeding width becomes smaller than the size of the entire mark, and the shape of the mark can be maintained by using a concave pattern that surrounds the central convex portion with a substantially constant width as a blank pattern. As a result, it is possible to finely align the electronic components, and it is possible to accurately recognize the magnitude of the displacement when the electronic components are placed on a trial-shifted basis, which effectively functions in evaluating the characteristics in that case. It will have a mark.

An electronic device of the present invention comprises the electronic component mounting substrate of the present invention, and an electronic component mounted on the electronic component mounting portion and electrically connected to the electrodes. .

According to the present invention, with the above structure, the positional accuracy of the electronic component is high and the workability of manufacturing is good.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION The electronic component mounting substrate and electronic device of the present invention will be described in detail below. 1 and 2 are a plan view showing an embodiment of an electronic component mounting board according to the present invention, and an enlarged plan view of an essential part.

In these figures, A is a substantially rectangular electronic component mounting substrate, P is a short side of the electronic component mounting substrate A, and Q is
Is a long side of the electronic component mounting substrate A, 1 is an insulating substrate made of ceramics, 1a is an upper surface of the insulating substrate 1, and F is an upper surface 1a.
The center line 1b in the long side direction of the electronic component mounting portion 1b is an electronic component mounting portion including a metallized layer and the like formed on the upper surface 1a. Further, 2 is a mark, 2c is a side of the mark 2, E is a length of the side 2c, 2a is a frame-shaped recess, and M is a recess 2.
The width of a, 2b is the central convex portion, N is the length of the side 2d of the central convex portion 2b, and 3 is the bleeding of the conductor paste. Further, C is a row of marks 2, D is a group of rows of marks 2, 4 is a substantially rectangular electronic component, 5 is a contact portion where both ends of the sides of the electronic component 4 contact the row group D, 6 is an electrode, θ Is a rotation angle indicating a deviation in the rotation direction. 3 shows an electronic device B of the present invention.

The electronic component mounting board A of the present invention comprises an insulating substrate 1 on the upper surface of which a substantially rectangular electronic component mounting portion 1b made of a conductor layer and an electrode 6 electrically connected to the electronic component 4 are formed. A substantially quadrangular central convex portion 2b formed by a printing method at two corners of the electronic component mounting portion 1b in a substantially symmetrical manner with respect to the center line F of the electronic component mounting portion 1b is formed as a concave portion (groove portion) 2a having a substantially constant width. A mark 2 group in which a plurality of substantially rectangular marks 2 that are surrounded are arranged. The mark 2 group includes a plurality of marks 2 at a corner of the electronic component mounting portion 1b, one side of which is the electronic component mounting portion 1b. So that the rows C, which are formed substantially parallel to the side parallel to the center line F of the electronic component mounting portion 1b and are formed at predetermined intervals, are three or more rows toward the center line F of the electronic component mounting portion 1b. It is installed, and the row C is It is formed by shifting a short substantially constant intervals one by the column direction than the length in the column direction of one side of the mark 2 away from the substantially vertical sides to the center line F of the component mounting portion 1b.

The insulating substrate 1 of the present invention is made of ceramics such as alumina ceramics. When it is made of alumina ceramics, it is manufactured as follows. A raw material powder of aluminum oxide (Al ₂ O ₃ ), silicon oxide (SiO ₂ ), magnesium oxide (MgO), calcium oxide (CaO), etc. is mixed with an appropriate organic binder, solvent, etc. to form a slurry. This slurry is formed into a ceramic green sheet by a doctor blade method or a calendar roll method, and cut into an appropriate size. Next, this ceramic green sheet is subjected to an appropriate punching process to prepare a plurality of the sheets, and a conductor paste containing a metal powder such as W as a main component is printed and applied to a predetermined portion to make an electronic component 4 Printed layers that will become the component mounting portion 1b, the electrodes 5, and internal electrodes (not shown) are formed. Then, these green sheets are sequentially laminated and fired at a maximum temperature of about 1600 ° C., whereby the insulating substrate 1 is manufactured.

On the surface of the conductor layer of the produced insulating substrate 1, a metal having excellent corrosion resistance and wettability with the brazing material,
Specifically, a Ni layer having a thickness of 0.5 to 9 μm and a thickness of 0.
It is preferable to sequentially deposit an Au layer of 5 to 9 μm by a plating method. For example, when another member such as a frame is joined to the outer peripheral portion of the upper surface 1a of the insulating substrate 1 by a brazing material such as silver brazing. A strong bond can be realized.

On the upper surface 1a of the insulating substrate 1, a substantially quadrangular central convex portion 2b and a frame-shaped concave portion 2a to be the marks 2 are formed at the same time when the electronic component mounting portion 1b is formed, and the electronic component 4 is mounted thereon. At the time of contact, both ends of the short side of the electronic component 4 come into contact with the contact portion 5 and function as the alignment mark 2. The shape of the central convex portion 2b and the mark 2 is a substantially quadrangle such as a square or a rectangle, but in that the alignment accuracy in the column direction of the mark 2 and the direction perpendicular to the column direction can be the same,
Square is good. When the central convex portion 2b and the mark 2 are square, the width M of the concave portion 2a and the length N of the side 2d of the central convex portion 2b are both 1/3 of the length E of the side 2c of the mark 2. Good, it is possible to obtain a precision three times higher than the alignment precision due to the outer dimensions of the mark 2. In the present embodiment, the case where five marks 2 are arranged in a line is shown.

In the mark 2 of the present invention, since it is not necessary to form the concave portion 2a surrounding the central convex portion 2b with a substantially constant width as a blank pattern (non-printed portion), even if the conductor paste is bleeding, one side is formed by the printing method. It is possible to form extremely small marks of about 80 μm or less. That is, when recognizing the mark 2, the step between the central convex portion 2b and the concave portion 2a can be easily recognized visually by shining oblique light or the like, and therefore the concave portion 2a does not need to be a clear cut pattern. By appropriately adjusting the viscosity of the conductor paste, the step can be formed into a shape faithful to the pattern of the printing original plate.
The viscosity of the conductor paste is preferably about 1200 to 4000 poise, and if it is less than 1200 poise, the step due to the bleeding 3 is not substantially vertical, and the shape of the central convex portion 2b is likely to collapse. When it exceeds 4000 poise, it becomes difficult to form by a printing method.

The height of the central convex portion 2b is 20 to 30 μm.
When m is less than 20 μm, the step between the concave portion 2a and the concave portion 2a becomes small, and it becomes difficult to visually recognize the central convex portion 2b. When it exceeds 30 μm, the thickness of the printing original plate is increased by the application of the sealing agent, so that the ink may not pass through the screen during printing.

When the concave portion 2a is used as a blank pattern, the length E of the side 2c of the mark 2 is preferably 200 to 400 μm. If the thickness is less than 200 μm, the width and thickness of the bleeding 3 generated along the outer periphery of the central convex portion 2 increase, and the shape of the central convex portion 2 tends to collapse or become blurred. Further, in this case, the recess 2a to be the cut pattern may be filled with the conductive paste and may not be the cut pattern. As a result, accurate positioning cannot be performed. Further, if it exceeds 400 μm, the accuracy of alignment deteriorates.

The distance between the marks 2 is the side 2 of the mark 2.
It should be the same as the length E of c. This allows the sides 2c of the adjacent marks 2 to be aligned with each other with the accuracy of the outer shape of the marks 2. When the length E of the side 2c is, for example, 240 μm, the total length of the row C of the marks 2 is 2160 μm with the five marks 2. This row C
However, as the distance from the side of the electronic component mounting portion 1b substantially perpendicular to the center line F increases with increasing distance to the center line F, a substantially constant interval smaller than one side in the column direction of the mark 2 (length E of the side 2c). Each, preferably 2/3 of the length E (eg 160 μm)
Each of them is formed by shifting in a direction parallel to the center line F. The distance between the marks 2 is the same as the length E of the side 2c of the mark 2,
In addition, by setting the shift interval between the columns C to 2/3 of the length E, the positional accuracy between the marks 2 can be tripled by using the marks 2 in the adjacent columns.

Then, at the two corners of the electronic component mounting portion 1b,
The column groups D and D ′ are respectively formed, and the column groups D and D ′ are formed symmetrically with respect to the center line F. Accordingly, by aligning the adjacent corners of the electronic component 4 with the row groups D and D ′, the shift amount of the electronic component 4 in the θ direction can be easily recognized.

Here, the length N of the side 2d of the central convex portion 2b is 1/3 (8) of the length E (240 μm) of the side 2c of the mark 2.
0 μm), as shown in FIG. 2, the mark 2 at the farthest position in the row direction from the center of the electronic component mounting portion 1b.
The position of the side 2c close to the short side P of the upper surface 1a in
As a position of μm, it is possible to set a position up to 2240 μm in steps of 80 μm, starting from a position 40 μm away from this position.

If the concave portion 2a is formed by a printing method as a square having one side of 80 μm and the entire pattern is a blank pattern, the concave portion 2 is caused by the bleeding 3 at the time of printing the conductor paste.
Although the shape of a is distorted or blurred, the central convex portion 2 is formed at the center of the concave portion 2a which is formed as the punch pattern as in the present invention.
By forming b to form the mark 2 having a size three times larger, the central convex portion 2b and the concave portion 2a can be formed as a clear pattern with less bleeding 3. Further, since the central convex portion 2b is formed at the center of the mark 2, the central convex portion 2b floats in an island shape in the concave portion 2a, and even if bleeding occurs around the central convex portion 2b due to the large area of the concave portion 2a. The entire recess 2a is not covered. Then, for example, it is possible to check the outer shape of the central convex portion 2b by applying oblique light without requiring skill. Therefore, by configuring the mark 2 with the concave portion 2a and the central convex portion 2b, it is possible to perform fine alignment in steps of several tens of μm to hundreds of several tens of μm, which was difficult with the conventional mark.

Further, the column C consisting of the marks 2 is marked with the marks 2
The position accuracy between the marks 2 can be improved by forming the column group D of 3 columns by shifting the length E of the side 2c of each by 2/3.
By using the marks 2 of the adjacent columns C together, the accuracy can be tripled.

In this embodiment, the shift between the columns C is set to ⅔ of the length E of the side 2c of the mark 2, for example, 160 μm. At this time, when the electronic component 4 is displaced in parallel to the long side Q of the upper surface 1a, the electronic component 4 can be placed with a high positional accuracy from 0 μm to 1040 μm in increments of 80 μm with reference to the side 2c of the mark 2 close to the long side Q. .

The difference between the columns C is the length E of the side 2c of the mark 2.
If it is 1/3 of that, the accuracy between the marks 2 becomes uneven,
Further, even if the marks 2 in the adjacent column C are used, the accuracy cannot be tripled. Furthermore, in the case of evaluating the electronic component 4 with a large shift, it cannot be handled unless the number of columns C is increased. Further, when the shift between the columns C is equal to the length E of the side 2c of the mark 2, the precision is three times the same as when the shift between the columns C is ⅔ of the length E of the side 2c of the mark 2. can do. However, since the area of the row groups D and D ′ becomes large, if the number of marks 2 in one row becomes too large, when the electronic component 4 is placed on the electronic component mounting portion 1b and joined, the electronic component mounting portion 1b is formed. There is a tendency for the bondability in to become uneven.

By performing alignment using the column groups D and D'which are symmetrical with respect to the center line F,
Higher precision alignment is possible. That is, the row group D,
Due to D ′, the rotational deviation of the electronic component 4 can be made extremely small. The distance between the row groups D and D ′ is such that when the electronic component 4 is placed, the two ends of one side of the electronic component 4 are the row groups D and D ′.
It is preferable that the contact points are set so as to be in contact with substantially the center of each D '. In this case, even if the electronic component 4 is placed in parallel with the short side P in the parallel direction, the side of the mark 2 serving as the reference for alignment is arranged in the row groups D and D ′ as shown in FIG.
In any of the above cases, there is a margin in the XY directions, and even if it is slightly deviated, both ends of one side of the electronic component 4 will be caught by any of the marks, which is suitable when manufacturing a misaligned prototype. .

Since the set of the sides 2c of the mark 2 which is selected from the column groups D and D'and which is aligned in the column direction can be used as a reference for positioning and position shifting, positioning with extremely high accuracy is possible. And it becomes possible to shift the position. Further, the mounting position of the electronic component 4 can be obtained in an extremely short time by using these sides 2c. For example, when the placement position of the electronic component 4 with respect to the mark 2 is predetermined, the position where the electronic component 4 is placed can be visually determined using the mark 2 accurately and in a short time. Further, the distance between the row groups D and D ′ can be arbitrarily set according to the size of the electronic component 4 and the evaluation content.

Further, the angle of rotation deviation θ (FIG. 5) that may occur in the conventional mark is set so that one side of the electronic component 4 is in contact with the left and right column groups D and D ', and the side 2c of the mark 2 is detected.
By aligning with the side 2d of the central convex portion 2b, it can be eliminated to a negligible extent. Since θ can be made extremely small in this way, it becomes extremely easy to visually confirm the mounting position of the electronic component 4 with respect to the reference line, the time required for evaluation of the prototype is greatly shortened, and the manufacturing cycle time is greatly increased. It can be shortened. Further, the distance from the reference line can be set on the order of several tens of μm to several hundreds of μm, and the electronic component 4 can be accurately placed in an arbitrary position in increments of 80 μm in an extremely short time. it can.

The present invention is not limited to the above embodiment, and various changes can be made without departing from the gist of the present invention.

[0040]

According to the present invention, an insulating substrate having a substantially quadrangular electronic component mounting portion formed of a conductor layer on the upper surface thereof, and two corners of the electronic component mounting portion with respect to the center line of the electronic component mounting portion are formed. And a mark group in which a plurality of substantially rectangular marks each having a substantially rectangular central convex portion surrounded by concave portions having a substantially constant width, which are symmetrically formed by a printing method, are arranged. A row of a plurality of marks at the corners of the mounting portion is formed at a predetermined interval along one side of the mark so that one side thereof is substantially parallel to the side parallel to the center line of the electronic component mounting portion. There are three or more rows toward the center line of the part, and these rows are one side of the mark so as to move away from the side substantially perpendicular to the center line of the electronic component mounting part as it goes to the center line. Shorter than each other, shifted in a direction parallel to the center line by approximately constant intervals Since the substantially rectangular mark is formed by surrounding the central convex portion of the substantially rectangular shape with a concave portion having a substantially constant width, the concave pattern surrounding the central convex portion with a substantially constant width is formed as a pattern (non-printed portion). Therefore, even if the conductor paste is bleeding, one side may be several tens depending on the printing method.
It is possible to form extremely small marks of about μm or less. As a result, highly accurate alignment can be performed using the small mark.

That is, when recognizing the mark, the step between the central convex portion and the concave portion can be easily visually recognized.
It is not necessary to make the recesses into clear cut patterns. By appropriately adjusting the viscosity of the conductor paste, the step can be formed into a shape faithful to the pattern of the printing original plate. Further, since a similar step is formed between the recess and its surroundings, similarly, the step can be easily visually recognized to perform highly accurate alignment.

Further, as the row of marks is shifted toward the center line of the electronic component mounting portion in the row direction by a substantially constant interval shorter than one side in the row of the marks, a position higher than the size of the mark is located. Positioning can be performed with high accuracy. Furthermore, since the central convex portion in the mark and the concave portion around the central convex portion can be used for alignment, the alignment can be performed with higher accuracy.

Further, since the marks having the above-mentioned structure are formed at the two corners of the electronic component mounting portion substantially symmetrically with respect to the center line of the electronic component mounting portion, the rotation of the electronic component is performed by using the two groups of marks. It is possible to accurately recognize the deviation in the direction (θ direction).

Therefore, according to the present invention, when the electronic component is mounted on the electronic component mounting portion of the insulating substrate, it is possible to accurately recognize the position in the XY directions by visual observation and to mount it. It is possible to achieve alignment with almost no deviation. As a result, even when the skill level of the operator is insufficient, the positioning in the XY directions can be performed quickly, and the placement position of the electronic component can be determined in a short time. Further, since the distance from the reference line of the electronic component mounting board to the mounting position can be recognized in a short time, the cycle time of manufacturing including trial manufacture can be shortened.

In the present invention, preferably, the length of one side of the mark is 200 to 400 μm, so that a substantially rectangular mark formed by enclosing a central convex portion of the substantially square with a concave portion of a substantially constant width is formed by a printing method. In this case, even if there is bleeding of the conductor paste, the bleeding width is smaller than the size of the entire mark, and the shape of the mark is maintained by using a concave pattern that surrounds the central convex portion with a substantially constant width as a pattern. be able to. As a result, electronic components can be finely aligned using large marks, and the magnitude of the deviation can be accurately recognized when the electronic components are shifted and placed on a trial basis, and the characteristics in that case are evaluated. At this time, it has a mark that functions effectively.

Since the electronic device of the present invention includes the electronic component mounting substrate of the present invention and the electronic component mounted on the electronic component mounting portion and electrically connected to the electrodes, the position of the electronic component can be improved. The accuracy is high and the workability of manufacturing is good.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of an embodiment of an electronic component mounting substrate of the present invention.

FIG. 2 is an enlarged plan view of an essential part of the electronic component mounting board of FIG.

FIG. 3 is a plan view of the electronic device of the present invention.

FIG. 4 is a plan view of a conventional electronic component mounting board.

FIG. 5 is a plan view of the electronic component for explaining the rotational deviation of the electronic component on the electronic component mounting portion.

FIG. 6 is a plan view showing a conventional printed wiring board, in which a protrusion 22 is provided on a land for soldering a lead terminal of a multi-terminal electronic component.

FIG. 7 is a plan view of a conventional electronic component mounting board on which an L-shaped mark is formed.

[Explanation of symbols]

1: Insulating substrate 1a: upper surface 1b: Electronic component mounting section 2: Mark 2a: concave portion 2b: central convex portion 4: Electronic components 6: Electrode A: Electronic component mounting board B: Electronic device C: Row

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Claims (3)

[Claims] 1. An insulating substrate having a substantially quadrangular electronic component mounting portion formed of a conductor layer on an upper surface thereof, and substantially symmetrical with respect to a center line of the electronic component mounting portion at two corners of the electronic component mounting portion. A substrate for mounting an electronic component, comprising: a mark group in which a plurality of substantially square marks, each of which is formed by a printing method and surrounds a substantially square central convex portion with a concave portion having a substantially constant width, are arranged. The group is formed at a predetermined interval along a side of a plurality of marks at a corner of the electronic component mounting portion such that one side thereof is substantially parallel to a side parallel to the center line of the electronic component mounting portion. Are provided so as to be three or more rows toward the center line of the electronic component mounting portion, and these rows are the center of the electronic component mounting portion as they approach the center line. The mark should be moved away from the side that is almost perpendicular to the line. A board for mounting electronic parts, wherein the board is formed by shifting in a direction parallel to the center line by a substantially constant interval shorter than the one side of the groove. 2. The length of one side of the mark is 200 to 40.
The electronic component mounting substrate according to claim 1, wherein the substrate has a thickness of 0 μm. 3. The electronic component mounting substrate according to claim 1 or 2, and an electronic component mounted on the electronic component mounting portion and electrically connected to the electrode. Electronic device to do.