JP2003163237A - 点在する剛性カラムを使用してハンダカラムアレイ相互接続部を有する回路構成要素を支持する方法及び装置 - Google Patents

点在する剛性カラムを使用してハンダカラムアレイ相互接続部を有する回路構成要素を支持する方法及び装置

Info

Publication number
JP2003163237A
JP2003163237A JP2002331827A JP2002331827A JP2003163237A JP 2003163237 A JP2003163237 A JP 2003163237A JP 2002331827 A JP2002331827 A JP 2002331827A JP 2002331827 A JP2002331827 A JP 2002331827A JP 2003163237 A JP2003163237 A JP 2003163237A
Authority
JP
Japan
Prior art keywords
integrated circuit
solder
column
rigid
circuit package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002331827A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003163237A5 (https=
Inventor
Jeffrey L Deeney
ジェフレイ・エル・ディーネイ
David W Mayer
デイビッド・ダブリュー・メイヤー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of JP2003163237A publication Critical patent/JP2003163237A/ja
Publication of JP2003163237A5 publication Critical patent/JP2003163237A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10242—Metallic cylinders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2002331827A 2001-11-16 2002-11-15 点在する剛性カラムを使用してハンダカラムアレイ相互接続部を有する回路構成要素を支持する方法及び装置 Pending JP2003163237A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/991430 2001-11-16
US09/991,430 US6541710B1 (en) 2001-11-16 2001-11-16 Method and apparatus of supporting circuit component having a solder column array using interspersed rigid columns

Publications (2)

Publication Number Publication Date
JP2003163237A true JP2003163237A (ja) 2003-06-06
JP2003163237A5 JP2003163237A5 (https=) 2005-05-19

Family

ID=25537208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002331827A Pending JP2003163237A (ja) 2001-11-16 2002-11-15 点在する剛性カラムを使用してハンダカラムアレイ相互接続部を有する回路構成要素を支持する方法及び装置

Country Status (2)

Country Link
US (1) US6541710B1 (https=)
JP (1) JP2003163237A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6683375B2 (en) * 2001-06-15 2004-01-27 Fairchild Semiconductor Corporation Semiconductor die including conductive columns
US7372147B2 (en) * 2003-07-02 2008-05-13 Hewlett-Packard Development Company, L.P. Supporting a circuit package including a substrate having a solder column array
KR101267182B1 (ko) * 2010-01-22 2013-05-24 센주긴조쿠고교 가부시키가이샤 땜납 칼럼의 제조 방법, 땜납 칼럼의 제조 장치 및 땜납 칼럼
CN110142481B (zh) * 2019-05-22 2021-07-06 中国科学院长春光学精密机械与物理研究所 一种植柱工装

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4545610A (en) * 1983-11-25 1985-10-08 International Business Machines Corporation Method for forming elongated solder connections between a semiconductor device and a supporting substrate
US5222014A (en) * 1992-03-02 1993-06-22 Motorola, Inc. Three-dimensional multi-chip pad array carrier
US5244143A (en) 1992-04-16 1993-09-14 International Business Machines Corporation Apparatus and method for injection molding solder and applications thereof
US5615735A (en) 1994-09-29 1997-04-01 Hewlett-Packard Co. Heat sink spring clamp
US5541450A (en) * 1994-11-02 1996-07-30 Motorola, Inc. Low-profile ball-grid array semiconductor package
US5557503A (en) 1995-05-12 1996-09-17 International Business Machines Corporation Circuit card having a large module strain relief and heat sink support
US6231333B1 (en) 1995-08-24 2001-05-15 International Business Machines Corporation Apparatus and method for vacuum injection molding
US5805427A (en) * 1996-02-14 1998-09-08 Olin Corporation Ball grid array electronic package standoff design
US6235996B1 (en) 1998-01-28 2001-05-22 International Business Machines Corporation Interconnection structure and process module assembly and rework
US6084178A (en) 1998-02-27 2000-07-04 Hewlett-Packard Company Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU)
US5926370A (en) 1998-10-29 1999-07-20 Hewlett-Packard Company Method and apparatus for a modular integrated apparatus for multi-function components
US6061235A (en) 1998-11-18 2000-05-09 Hewlett-Packard Company Method and apparatus for a modular integrated apparatus for heat dissipation, processor integration, electrical interface, and electromagnetic interference management
US6198630B1 (en) 1999-01-20 2001-03-06 Hewlett-Packard Company Method and apparatus for electrical and mechanical attachment, and electromagnetic interference and thermal management of high speed, high density VLSI modules
US6276596B1 (en) 2000-08-28 2001-08-21 International Business Machines Corporation Low temperature solder column attach by injection molded solder and structure formed

Also Published As

Publication number Publication date
US6541710B1 (en) 2003-04-01

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