JP2003159708A - Resin impregnating device - Google Patents

Resin impregnating device

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Publication number
JP2003159708A
JP2003159708A JP2001362700A JP2001362700A JP2003159708A JP 2003159708 A JP2003159708 A JP 2003159708A JP 2001362700 A JP2001362700 A JP 2001362700A JP 2001362700 A JP2001362700 A JP 2001362700A JP 2003159708 A JP2003159708 A JP 2003159708A
Authority
JP
Japan
Prior art keywords
resin varnish
resin
impregnation tank
viscosity
varnish
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001362700A
Other languages
Japanese (ja)
Inventor
Masanori Iizuka
正則 飯塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2001362700A priority Critical patent/JP2003159708A/en
Publication of JP2003159708A publication Critical patent/JP2003159708A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin impregnating device which is the most suitable to manufacture a prepreg having a front and a back faces both with a uniform resin content, while stabilizing viscosity of resin varnish in an impregnation tank. <P>SOLUTION: In the resin impregnating device, the resin varnish is supplied to an impregnation tank from a resin varnish supply device, and a substrate is impregnated with the resin varnish in the impregnation tank. The device is provided with a resin varnish supply opening on a bottom wall surface of the impregnation tank, and also has an outlet to remove the resin varnish of a high viscosity at a central part of the place where the resin varnish in the impregnation tank is apt to stagnate. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、表裏両面の樹脂分
が均一なプリプレグを製造するのに最適な樹脂含浸装置
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optimum resin impregnating apparatus for producing a prepreg having a uniform resin content on both front and back surfaces.

【0002】[0002]

【従来の技術】金属張り積層板に使用するプリプレグ
は、図3に示すような樹脂含浸装置を用いて製造されて
いる。含浸槽1内へ樹脂ワニスの供給装置2から温度、
粘度の管理された樹脂ワニス3が供給され、図中A方向
からガラス布などの基材6が含浸槽1内へ送りこまれ
る。含浸槽1内へ送りこまれたガラス布などの基材6
は、含浸槽1内の樹脂ワニス3に浸漬されながら槽内ロ
ール4によってB方向へ搬送され、含浸槽1からB方向
へ送り出された基材6は、余分に付着された樹脂ワニス
分が塗布量制御装置5により欠き落とされて除去され、
次の工程において半硬化状態に乾燥処理されてプリプレ
グとなる。一般に樹脂ワニスの温度、粘度は、プリプレ
グの樹脂分に対する影響が大きいため、供給装置2から
供給される樹脂ワニス3は、所定の温度、粘度に管理さ
れて供給されている。また、含浸槽1内でもオーバーフ
ロー方式による液面コントロールや温度制御などが行わ
れ、含浸槽1内における樹脂ワニス3の粘度が均一とな
るように循環されている。
2. Description of the Related Art A prepreg used for a metal-clad laminate is manufactured by using a resin impregnation apparatus as shown in FIG. From the resin varnish supply device 2 into the impregnation tank 1, the temperature,
The resin varnish 3 whose viscosity is controlled is supplied, and the base material 6 such as glass cloth is fed into the impregnation tank 1 from the direction A in the drawing. Base material 6 such as glass cloth sent into the impregnation tank 1
Is conveyed in the B direction by the in-tank roll 4 while being immersed in the resin varnish 3 in the impregnation tank 1, and the base material 6 sent out from the impregnation tank 1 in the B direction is coated with the excessive resin varnish. It is cut off and removed by the quantity control device 5,
In the next step, a semi-cured state is dried to form a prepreg. In general, the temperature and viscosity of the resin varnish have a great influence on the resin content of the prepreg, so the resin varnish 3 supplied from the supply device 2 is supplied while being controlled at a predetermined temperature and viscosity. Liquid level control and temperature control by the overflow method are also performed in the impregnation tank 1, and the resin varnish 3 is circulated so that the viscosity of the resin varnish 3 in the impregnation tank 1 becomes uniform.

【0003】ところで、塗布量制御装置5により欠き落
とされた樹脂ワニス3は、含浸槽1まで流れ落ちる際
に、樹脂ワニス3中に含まれている溶剤分が揮発するた
め、含浸槽1内に供給される樹脂ワニス3よりも粘度の
高い樹脂ワニスとなる。このような樹脂含浸装置では、
含浸槽1に供給される樹脂ワニス3は、含浸槽1の下面
側に設けられている供給装置2の送液口7から行われる
ため、含浸槽1内の一部に樹脂ワニス3が循環しにくい
箇所、つまり樹脂ワニス3が停滞し易い箇所が発生す
る。例えば、図3に斜線で示したように、槽内ロール4
と接する側の基材6に囲まれた部分8(槽内ロール接触
側)は、基材6自体が邪魔板となるため、含浸槽1内を
樹脂ワニス3が循環しにくい箇所となる。しかし、この
部分8では、塗布量制御装置5から除去されてくる粘度
の高い樹脂ワニスは、循環・拡散性が悪いので、高粘度
の樹脂ワニスの停滞箇所となってしまうが、槽内ロール
非接触側の部分9では、温度、粘度の管理された樹脂ワ
ニス3が良好に循環でき、目標とする粘度の樹脂ワニス
状態を維持することができる。特開平08−22994
3号公報には、含浸槽内に基材が邪魔板となって形成さ
れる樹脂ワニスが循環しにくい箇所を解消する手段とし
て、温度、粘度の管理された補助用の樹脂ワニス供給装
置を付設した樹脂含浸装置が開示されている。
By the way, when the resin varnish 3 cut off by the coating amount control device 5 flows down to the impregnation tank 1, the solvent content contained in the resin varnish 3 is volatilized, so that it is supplied into the impregnation tank 1. The resin varnish has a viscosity higher than that of the resin varnish 3 to be formed. In such a resin impregnation device,
Since the resin varnish 3 supplied to the impregnation tank 1 is supplied from the liquid supply port 7 of the supply device 2 provided on the lower surface side of the impregnation tank 1, the resin varnish 3 circulates in a part of the impregnation tank 1. A difficult place, that is, a place where the resin varnish 3 is likely to stagnate occurs. For example, as shown by hatching in FIG.
The portion 8 (the in-tank roll contact side) surrounded by the base material 6 on the side that comes into contact with the base material 6 serves as a baffle plate, and thus the resin varnish 3 is less likely to circulate in the impregnation tank 1. However, in this portion 8, the resin varnish having a high viscosity removed from the coating amount control device 5 has poor circulation and diffusibility, and thus becomes a stagnation point of the resin varnish having a high viscosity. In the portion 9 on the contact side, the resin varnish 3 whose temperature and viscosity are controlled can satisfactorily circulate, and the resin varnish state of the target viscosity can be maintained. Japanese Patent Laid-Open No. 08-22994
No. 3 gazette is provided with an auxiliary resin varnish supply device whose temperature and viscosity are controlled as means for eliminating a portion where the resin varnish formed by the base material serving as a baffle in the impregnation tank is difficult to circulate. A resin impregnating device is disclosed.

【0004】[0004]

【発明が解決しようとする課題】上記のように含浸槽1
内で基材6の表裏両面、つまり槽内ロール接触側と槽内
ロール非接触側において、含浸される樹脂ワニスの粘度
が異なると、表裏両面の樹脂分が異なるプリプレグとな
り、積層板とした場合、そり等が発生する原因になる。
このような現象は、特にフィラー入りワニスを使用した
場合に影響が大きく現れ、積層板の特性を悪化させてい
る。本発明は、このような事情に基づいてなされたもの
であり、含浸槽内の樹脂ワニスの粘度の安定化を図り、
表裏両面における樹脂分が均一なプリプレグを製造する
のに最適な樹脂含浸装置を提供する。
As described above, the impregnation tank 1
When the viscosity of the resin varnish to be impregnated is different between the front and back surfaces of the base material 6, that is, the in-tank roll contact side and the in-tank roll non-contact side, the resin content on both front and back surfaces becomes different, resulting in a laminated plate. It may cause warpage.
Such a phenomenon has a great influence particularly when a varnish containing a filler is used, and deteriorates the properties of the laminated plate. The present invention has been made based on such a situation, the viscosity of the resin varnish in the impregnation tank is stabilized,
Provided is a resin impregnating apparatus most suitable for producing a prepreg having a uniform resin content on both front and back surfaces.

【0005】[0005]

【課題を解決するための手段】本発明は、上記目的を達
成するために、 [1]樹脂ワニス供給装置から含浸槽内に樹脂ワニスを
供給し、基材に前記樹脂ワニスを含浸する樹脂含浸装置
において、前記含浸槽の底部壁面に樹脂ワニス供給口が
設けられ、前記含浸槽内の樹脂ワニスが滞留し易い箇所
の中央部分に高粘度の樹脂ワニスを取り出す抜き取り口
を有する樹脂含浸装置である。 [2]樹脂ワニス供給装置から含浸槽内に温度、粘度の
管理された樹脂ワニスを供給し、基材に前記含浸槽内の
樹脂ワニスを含浸する樹脂含浸装置において、前記含浸
槽の壁面に設けられた樹脂ワニス注入口から樹脂ワニス
を送り込む樹脂ワニス供給口が設けられ、前記基材が邪
魔板となり前記含浸槽内に形成される樹脂ワニスが循環
しにくく滞留し易い箇所から樹脂ワニスを吸い上げて前
記樹脂ワニスを取り出す抜き取り口を有する樹脂含浸装
置である。 [3]前記項[2]において、樹脂ワニス供給装置から
含浸槽内に供給される温度、粘度の管理された樹脂ワニ
スの粘度(η1)mPa・sと、基材が邪魔板となって
形成された樹脂ワニスが停滞し易い箇所の樹脂ワニスの
粘度(η2)mPa・sの(η1)/(η2)が1.00
/0.95〜1.00/1.00であることを特徴とす
る。 [4]前記項[1]、[2]及び[3]のいずれかにお
いて、樹脂ワニスがフィラ―を含む樹脂含浸装置であ
る。
[Means for Solving the Problems] In order to achieve the above object, the present invention [1] Resin impregnation in which a resin varnish is supplied from a resin varnish supply device into an impregnation tank, and a base material is impregnated with the resin varnish. In the device, a resin varnish supply port is provided on a bottom wall surface of the impregnation tank, and a resin impregnation device having a withdrawal port for taking out a highly viscous resin varnish is provided at a central portion of the impregnation tank where the resin varnish easily accumulates. . [2] In a resin impregnating device for supplying a resin varnish whose temperature and viscosity are controlled from a resin varnish supplying device into the impregnation tank and impregnating the base material with the resin varnish in the impregnating tank, the resin varnish is provided on the wall surface of the impregnating tank. A resin varnish supply port for feeding the resin varnish from the resin varnish injection port provided is provided, and the resin varnish formed in the impregnation tank becomes a baffle plate and is difficult to circulate, and the resin varnish is sucked up from a portion that easily accumulates. It is a resin impregnating apparatus having an extraction port for taking out the resin varnish. [3] In the above item [2], the temperature of the resin varnish supplied from the resin varnish supply device and the viscosity (η 1 ) mPa · s of the resin varnish whose viscosity is controlled, and the base material serving as a baffle plate. The viscosity (η 2 ) mPa · s of (η 1 ) / (η 2 ) of the resin varnish at the portion where the formed resin varnish is stagnate is 1.00.
/0.95-1.00/1.00. [4] The resin impregnating device according to any one of the items [1], [2], and [3], in which the resin varnish contains a filler.

【0006】[0006]

【発明の実施の形態】本発明において、上記の樹脂ワニ
ス供給装置は、送液口7の他に、含浸槽1の側面で槽内
ロール4の上部に樹脂ワニスを噴流として供給する供給
口10を両側に設ける。さらに、槽内ロール接触側で粘
度の高い樹脂ワニスが滞留し易い箇所8の中央に樹脂ワ
ニスを吸い上げ除去する抜取口11を設ける。樹脂ワニ
スの供給量は、送液口7と噴流供給口10の比率をほぼ
1:1とし、抜取口11から吸い上げる量は、噴流供給
口10からの供給量よりもやや少ない程度とする。
BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, the above-mentioned resin varnish supply device includes a supply port 10 for supplying a resin varnish as a jet stream to the upper part of the in-tank roll 4 on the side surface of the impregnation tank 1 in addition to the liquid supply port 7. On both sides. Further, an extraction port 11 for sucking up and removing the resin varnish is provided at the center of the portion 8 where the resin varnish having a high viscosity tends to stay on the roll contact side in the tank. The resin varnish is supplied at a ratio of the liquid supply port 7 and the jet flow supply port 10 of approximately 1: 1, and the amount of the resin varnish sucked up from the extraction port 11 is slightly smaller than the supply amount from the jet flow supply port 10.

【0007】また、本発明において、樹脂ワニス供給装
置から含浸槽内に供給される温度、粘度の管理された樹
脂ワニスの粘度(η1)mPa・sと、基材が邪魔板と
なって形成された樹脂ワニスが停滞し易い箇所の樹脂ワ
ニスの粘度(η2)mPa・sの(η1)/(η2)が
1.00/0.95〜1.00/1.00であることが
好ましい。(η1)/(η2)が1.00/0.95未満
では槽内ロール接触側の粘度と槽内ロール非接触側の粘
度差が大きくなり、プリプレグにおける表裏両面の樹脂
分差が拡大する。また、(η1)/(η2)が1.00/
1.00の状態が含浸槽内の樹脂ワニスの均一化を図る
上で最も好ましい。
In the present invention, the temperature of the resin varnish supplied from the resin varnish supply device and the viscosity (η 1 ) mPa · s of the resin varnish whose viscosity is controlled, and the base material forms a baffle plate. The viscosity (η 2 ) mPa · s (η 1 ) / (η 2 ) of the resin varnish at the portion where the generated resin varnish tends to stay is 1.00 / 0.95 to 1.00 / 1.00 Is preferred. If (η 1 ) / (η 2 ) is less than 1.00 / 0.95, the difference in viscosity between the in-tank roll contact side and the in-tank roll non-contact side becomes large, and the resin difference between the front and back surfaces of the prepreg expands. To do. Also, (η 1 ) / (η 2 ) is 1.00 /
The state of 1.00 is most preferable in order to make the resin varnish in the impregnation tank uniform.

【0008】また、本発明によれば、基材が邪魔板とな
るため、含浸槽内で樹脂ワニスが循環しにくく停滞し易
い箇所に、塗布量制御装置により欠き落とされた粘度の
高い樹脂ワニスが滞留しないように、噴流によるワニス
供給と高粘度樹脂ワニスの除去装置により、温度、粘度
が管理された樹脂ワニスを循環させることができる。こ
れによって、含浸槽内の樹脂ワニスの均一化を図り、プ
リプレグにおける表裏両面の樹脂分差の発生を防止す
る。
Further, according to the present invention, since the base material serves as a baffle plate, the resin varnish with a high viscosity which is cut off by the coating amount control device at a place where the resin varnish is difficult to circulate in the impregnation tank and is easily stagnant. The resin varnish whose temperature and viscosity are controlled can be circulated by a varnish supply by a jet flow and a high-viscosity resin varnish removing device so as not to stay. As a result, the resin varnish in the impregnation tank is made uniform, and the occurrence of resin difference between the front and back surfaces of the prepreg is prevented.

【0009】[実施例]以下、本発明の実施例を図面に
基づき詳細に説明する。図1は、本発明の樹脂含浸装置
を示す概略構成図である。なお、従来と同様な構成は、
図3と同一の符号によって説明する。図1において、含
浸槽1の下面に設けられた樹脂ワニス供給装置2の送液
口7から、温度、粘度の管理された樹脂ワニス3が供給
される。ガラス布などの基材6は、図中A方向から含浸
槽1内へ送りこまれて樹脂ワニス3に浸漬されながら槽
内ロール4によってB方向へと搬送される。含浸槽1か
らB方向へ送り出された基材6は、余分に付着された樹
脂ワニス分を塗布量制御装置5により欠き落とされて除
去され、次の工程で半硬化状態に乾燥処理される。本発
明にあっては、槽内ロール4の上方に樹脂ワニスを噴流
として供給する供給口10と、高い粘度の樹脂ワニスが
滞留し易い箇所から、高粘度樹脂ワニスを吸い上げて除
去する抜取口11が設けられている。これによって、含
浸槽1の上面側で槽内ロール4と接する側の基材6に囲
まれる部分8、つまり槽内ロール接触側の部分に、槽内
ロール非接触側9と同じような温度、粘度の管理された
樹脂ワニス3を強制的に供給するように構成されてい
る。この部分8は、上記するように、特に基材6が邪魔
板となり、含浸槽1内において樹脂ワニス3が循環しに
くく停滞し易い箇所であるため、塗布量制御装置5から
滴下される高い粘度の樹脂ワニスが停滞し易く、槽内ロ
ール非接触側の部分9と樹脂ワニス粘度差を生ずる。し
かしながら、本発明では、噴流による樹脂ワニス供給口
10と、高粘度樹脂ワニス抜取口11によって、槽内ロ
ール非接触側9と同様な温度、粘度の管理された樹脂ワ
ニス3が強制的に供給されるので、含浸槽1内における
樹脂ワニスの粘度の安定化を図り、プリプレグにおける
表裏面の樹脂分差の発生を防止することができる。
Embodiments Embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a schematic configuration diagram showing a resin impregnating apparatus of the present invention. In addition, the same configuration as the conventional one,
Description will be given by using the same reference numerals as those in FIG. In FIG. 1, a resin varnish 3 of which temperature and viscosity are controlled is supplied from a liquid supply port 7 of a resin varnish supply device 2 provided on the lower surface of the impregnation tank 1. A base material 6 such as a glass cloth is fed into the impregnation tank 1 from the direction A in the figure and immersed in the resin varnish 3 while being conveyed in the direction B by the in-tank roll 4. The base material 6 delivered from the impregnation tank 1 in the B direction is removed by removing the excessively attached resin varnish by the coating amount control device 5, and is dried in the next step to a semi-cured state. In the present invention, the supply port 10 for supplying the resin varnish as a jet flow above the in-tank roll 4 and the extraction port 11 for sucking and removing the high-viscosity resin varnish from the location where the high-viscosity resin varnish is likely to stay. Is provided. As a result, at a portion 8 surrounded by the base material 6 on the upper surface side of the impregnation tank 1 that is in contact with the in-tank roll 4, that is, a portion on the in-tank roll contact side, the same temperature as the in-tank roll non-contact side 9, The resin varnish 3 whose viscosity is controlled is forcibly supplied. As described above, this portion 8 is a portion where the base material 6 serves as a baffle plate and the resin varnish 3 is difficult to circulate in the impregnation tank 1 and easily stagnates. Therefore, the high viscosity dropped from the coating amount control device 5 is high. Of the resin varnish is likely to be stagnant, which causes a difference in viscosity of the resin varnish from the portion 9 on the non-contact side of the in-tank roll. However, in the present invention, the resin varnish 3 whose temperature and viscosity are controlled in the same manner as the non-tank roll non-contact side 9 is forcibly supplied by the resin varnish supply port 10 by the jet flow and the high-viscosity resin varnish extraction port 11. Therefore, it is possible to stabilize the viscosity of the resin varnish in the impregnation tank 1 and prevent the difference in resin between the front and back surfaces of the prepreg.

【0010】次に、本発明者らによる本発明の樹脂含浸
装置と、従来の樹脂含浸装置による実験結果について説
明する。ブロム化エポキシ樹脂(エポキシ当量500、
平均分子量1000)100部(重量部、以下同じ)、
ジシアンジアミド3部、2−エチル−4−メチルイミダ
ゾール0.17部、エチレングリコールモノメチルエー
テル25部、水酸化アルミ140部を混合して樹脂ワニ
スを作製し、温度;30℃、粘度;300mPa・sに
なるようにメチルエチルケトンを加えて調整管理された
フィラー入りエポキシ樹脂ワニスを使用し、図1に示し
た本発明の樹脂含浸装置によりプリプレグを作製した。
なお、粘度の測定には、(株)東京計器製造所製B型粘
度計型式BLを用いた。また、測定条件は、No.2ロータ
ーを用い、30rpmにて測定した。
Next, the experimental results of the resin impregnating apparatus of the present invention by the present inventors and the conventional resin impregnating apparatus will be described. Brominated epoxy resin (epoxy equivalent 500,
Average molecular weight 1000) 100 parts (parts by weight, the same applies hereinafter),
3 parts of dicyandiamide, 0.17 part of 2-ethyl-4-methylimidazole, 25 parts of ethylene glycol monomethyl ether and 140 parts of aluminum hydroxide are mixed to prepare a resin varnish, and the temperature is 30 ° C. and the viscosity is 300 mPa · s. Using a filler-containing epoxy resin varnish that was adjusted and managed by adding methyl ethyl ketone as described above, a prepreg was produced by the resin impregnating apparatus of the present invention shown in FIG.
A B-type viscometer model BL manufactured by Tokyo Keiki Seisakusho Co., Ltd. was used to measure the viscosity. Moreover, the measurement conditions were measured at 30 rpm using a No. 2 rotor.

【0011】また、上記実験例と同様な樹脂ワニスを使
用し、比較例として図3に示した従来の樹脂含浸装置に
よりプリプレグを作製した。両装置により、プリプレグ
を連続的に製造している際の経過時間毎に、含浸槽1内
の樹脂ワニスの粘度変化を測定した。測定結果を表1に
示す。なお、単位はmPa・sである。
A resin varnish similar to that used in the above experimental example was used, and a prepreg was prepared as a comparative example by the conventional resin impregnating apparatus shown in FIG. The viscosity change of the resin varnish in the impregnation tank 1 was measured at each elapsed time when the prepreg was continuously manufactured by both devices. The measurement results are shown in Table 1. The unit is mPa · s.

【0012】[0012]

【表1】表 1 [Table 1] Table 1

【0013】表1の結果によれば、本発明の樹脂含浸装
置では、基材6が邪魔板となり、含浸槽1内で樹脂ワニ
スが循環しにくく停滞し易い箇所(図示の部分8)に
も、温度、粘度の管理された樹脂ワニス3が強制的に循
環され、含浸槽1内で樹脂ワニスが均一に循環している
ことが判明した。
According to the results shown in Table 1, in the resin impregnating apparatus of the present invention, the base material 6 serves as a baffle plate, and the resin varnish is difficult to circulate in the impregnation tank 1 and is easily stagnant (a portion 8 in the figure). It was found that the resin varnish 3 whose temperature and viscosity were controlled was forcibly circulated and the resin varnish was uniformly circulated in the impregnation tank 1.

【0014】[0014]

【発明の効果】以上説明したように、本発明によれば、
塗布量制御装置により欠き落とされた高い粘度の樹脂ワ
ニスが滴下しても、含浸槽内の一箇所に滞留することが
なくなり、含浸槽内の樹脂ワニスの循環が均一となり、
樹脂ワニスの粘度の安定化が図れる。このため、プリプ
レグの表裏両面の樹脂分差を少なくでき、積層板のそり
等を防ぐことができる。
As described above, according to the present invention,
Even if the high-viscosity resin varnish dropped off by the coating amount control device drips, it does not stay in one place in the impregnation tank, and the circulation of the resin varnish in the impregnation tank becomes uniform,
The viscosity of the resin varnish can be stabilized. Therefore, the resin difference between the front and back surfaces of the prepreg can be reduced, and warpage of the laminated plate can be prevented.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の樹脂含浸装置の概略構成図である。FIG. 1 is a schematic configuration diagram of a resin impregnating apparatus of the present invention.

【図2】 噴流樹脂ワニス供給口と高粘度ワニスの抜取
口の概略構成図である。
FIG. 2 is a schematic configuration diagram of a jet resin varnish supply port and a high viscosity varnish extraction port.

【図3】 従来の樹脂含浸装置を示す概略構成図であ
る。
FIG. 3 is a schematic configuration diagram showing a conventional resin impregnation device.

【符号の説明】[Explanation of symbols]

1…含浸槽、2…樹脂ワニス供給装置、3…樹脂ワニ
ス、4…槽内ロール、5…塗布量制御装置、6…基材、
7…送液口、8…槽内ロール接触側、9…槽内ロール非
接触側、10…噴流樹脂ワニスの供給口、11…高粘度
樹脂ワニスの抜取口。
DESCRIPTION OF SYMBOLS 1 ... Impregnation tank, 2 ... Resin varnish supply device, 3 ... Resin varnish, 4 ... In-tank roll, 5 ... Coating amount control device, 6 ... Base material,
7 ... Liquid sending port, 8 ... In-tank roll contact side, 9 ... In-tank roll non-contact side, 10 ... Jet resin varnish supply port, 11 ... High viscosity resin varnish extraction port.

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】樹脂ワニス供給装置から含浸槽内に樹脂ワ
ニスを供給し、基材に前記樹脂ワニスを含浸する樹脂含
浸装置において、前記含浸槽の底部壁面に樹脂ワニス供
給口が設けられ、前記含浸槽内の樹脂ワニスが滞留し易
い箇所の中央部分に高粘度の樹脂ワニスを取り出す抜き
取り口を有することを特徴とする樹脂含浸装置。
1. A resin impregnation device for supplying a resin varnish from a resin varnish supply device into an impregnation tank to impregnate a base material with the resin varnish, wherein a resin varnish supply port is provided on a bottom wall surface of the impregnation tank. A resin impregnating apparatus having a discharge port for taking out highly viscous resin varnish in a central portion of a portion of the impregnation tank where the resin varnish is likely to stay.
【請求項2】樹脂ワニス供給装置から含浸槽内に温度、
粘度の管理された樹脂ワニスを供給し、基材に前記含浸
槽内の樹脂ワニスを含浸する樹脂含浸装置において、前
記含浸槽の壁面に設けられた樹脂ワニス注入口から樹脂
ワニスを送り込む樹脂ワニス供給口が設けられ、前記基
材が邪魔板となり前記含浸槽内に形成される樹脂ワニス
が循環しにくく滞留し易い箇所から樹脂ワニスを吸い上
げて前記樹脂ワニスを取り出す抜き取り口を有すること
を特徴とする樹脂含浸装置。
2. A resin varnish supply device is used to control the temperature in the impregnation tank,
In a resin impregnation device that supplies a resin varnish whose viscosity is controlled and impregnates a substrate with the resin varnish in the impregnation tank, a resin varnish supply that feeds the resin varnish from a resin varnish injection port provided on the wall surface of the impregnation tank. A mouth is provided, and the base material serves as a baffle and has a discharge port for sucking up the resin varnish from a portion where the resin varnish formed in the impregnation tank is difficult to circulate and easily accumulates, and takes out the resin varnish. Resin impregnation equipment.
【請求項3】請求項2において、樹脂ワニス供給装置か
ら含浸槽内に供給される温度、粘度の管理された樹脂ワ
ニスの粘度(η1)mPa・sと、基材が邪魔板となっ
て形成された樹脂ワニスが停滞し易い箇所の樹脂ワニス
の粘度(η2)mPa・sの(η1)/(η2)が1.0
0/0.95〜1.00/1.00であることを特徴と
する樹脂含浸装置。
3. The viscosity (η 1 ) mPa · s of the resin varnish whose temperature and viscosity are controlled from the resin varnish supply device according to claim 2, and the substrate serves as a baffle plate. The viscosity (η 2 ) mPa · s (η 1 ) / (η 2 ) of the resin varnish at the portion where the formed resin varnish is likely to stay is 1.0.
The resin impregnating device is characterized in that it is 0 / 0.95 to 1.00 / 1.00.
【請求項4】請求項1、2及び3のいずれかにおいて、
樹脂ワニスがフィラ―を含むことを特徴とする樹脂含浸
装置。
4. The method according to any one of claims 1, 2 and 3,
A resin impregnating device, wherein the resin varnish contains a filler.
JP2001362700A 2001-11-28 2001-11-28 Resin impregnating device Pending JP2003159708A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001362700A JP2003159708A (en) 2001-11-28 2001-11-28 Resin impregnating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001362700A JP2003159708A (en) 2001-11-28 2001-11-28 Resin impregnating device

Publications (1)

Publication Number Publication Date
JP2003159708A true JP2003159708A (en) 2003-06-03

Family

ID=19173158

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001362700A Pending JP2003159708A (en) 2001-11-28 2001-11-28 Resin impregnating device

Country Status (1)

Country Link
JP (1) JP2003159708A (en)

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