JPH08229943A - Apparatus for impregnation with resin - Google Patents

Apparatus for impregnation with resin

Info

Publication number
JPH08229943A
JPH08229943A JP4270295A JP4270295A JPH08229943A JP H08229943 A JPH08229943 A JP H08229943A JP 4270295 A JP4270295 A JP 4270295A JP 4270295 A JP4270295 A JP 4270295A JP H08229943 A JPH08229943 A JP H08229943A
Authority
JP
Japan
Prior art keywords
resin varnish
resin
viscosity
impregnation
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4270295A
Other languages
Japanese (ja)
Inventor
Masanori Iizuka
正則 飯塚
Yasuhiro Murai
康裕 村井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP4270295A priority Critical patent/JPH08229943A/en
Publication of JPH08229943A publication Critical patent/JPH08229943A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: To facilitate manufacture of a prepreg which is uniform in resin distribution on both front and rear surfaces by stabilizing viscosity by a method wherein a resin feeder for supplementation of resin varnish a temperature and a viscosity of which are controlled is annexed to a position where the resin is difficult to be circulated and apt to stay since a base material becomes a baffle. CONSTITUTION: A supplementary resin varnish feeder 10 is provided on an upper surface of an impregnation bath 1. Resin varnish 3 a temperature and a viscosity of which are controlled in the same way as for the resin varnish feeder 2 is supplementarily constituted in a part 8 enclosed by a base material 6 on a side in contact with a roll 4 in the bath on the upper surface side of the impregnation bath 1. Since the part 8 is a position where the resin varnish 3 is difficult to be circulated and apt to stay in the impregnation bath 1, a difference in viscosity of the resin varnish 3 is generated between a non-contact side part 9 of the roll 4 in the bath and that position. However, since the resin varnish 3 the temperature and viscosity of which are controlled is compulsorily fed from the supplementary resin feeder 10, stabilization of the viacosity of the resin varnish 3 in the impregnation bath 1 can be achieved.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、表裏両面の樹脂分が均
一なプリプレグを製造するのに最適な樹脂含浸装置に関
するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin impregnating apparatus most suitable for producing a prepreg having a uniform resin content on both front and back surfaces.

【0002】[0002]

【従来の技術】金属張り積層板に使用するプリプレグ
は、図2に示すような樹脂含浸装置を用いて製造されて
いる。含浸槽1内へ樹脂ワニスの供給装置2から温度,
粘度の管理された樹脂ワニス3が供給され、図中A方向
からガラス布などの基材6が含浸槽1内へ送り込まれ
る。
2. Description of the Related Art A prepreg used for a metal-clad laminate is manufactured by using a resin impregnation apparatus as shown in FIG. From the resin varnish supply device 2 into the impregnation tank 1, the temperature,
The resin varnish 3 whose viscosity is controlled is supplied, and the base material 6 such as glass cloth is fed into the impregnation tank 1 from the direction A in the figure.

【0003】含浸槽1内へ送り込まれたガラス布などの
基材6は、含浸槽1内の樹脂ワニス3に浸漬されながら
槽内ロール4によってB方向へ搬送され、含浸槽1から
B方向へ送り出された基材6は、余分に付着された樹脂
ワニス分が塗布量制御装置5により欠き落とされて除去
され、次の工程において半硬化状態に乾燥処理されてプ
リプレグとされる。
A substrate 6 such as a glass cloth sent into the impregnation tank 1 is conveyed in the B direction by the in-tank roll 4 while being immersed in the resin varnish 3 in the impregnation tank 1, and is moved from the impregnation tank 1 in the B direction. Excessively adhered resin varnish is cut off by the coating amount control device 5 to remove the base material 6 that has been sent out, and in the next step, it is dried to a semi-cured state to be a prepreg.

【0004】一般に樹脂ワニスの温度、粘度は、プレプ
レグの樹脂分に対する影響が大きいため、供給装置2か
ら供給される樹脂ワニス3は、所定の温度,粘度に管理
されて供給されている。また、含浸槽1内でもオーバー
フロー方式による液面コントロールや温度制御などが行
われ、含浸槽1内における樹脂ワニス3の粘度が均一と
なるように循環されている。
In general, the temperature and viscosity of the resin varnish have a great influence on the resin content of the prepreg, so the resin varnish 3 supplied from the supply device 2 is supplied while being controlled to a predetermined temperature and viscosity. Liquid level control and temperature control by the overflow method are also performed in the impregnation tank 1, and the resin varnish 3 is circulated so that the viscosity of the resin varnish 3 in the impregnation tank 1 becomes uniform.

【0005】[0005]

【発明が解決しようとする課題】ところで、塗布量制御
装置5により欠き落とされた樹脂ワニス3は、含浸槽1
まで流れ落ちる際に、樹脂ワニス3中に含まれている溶
剤分が揮発するため、含浸槽1内に供給される樹脂ワニ
ス3よりも粘度の高い樹脂ワニスとなる。
By the way, the resin varnish 3 cut off by the coating amount control device 5 is used as the impregnation tank 1.
When the resin varnish 3 flows down, the solvent component contained in the resin varnish 3 is volatilized, so that the resin varnish has a higher viscosity than the resin varnish 3 supplied into the impregnation tank 1.

【0006】このような樹脂含浸装置では、含浸槽1に
供給される樹脂ワニス3は、含浸槽1の下面側に設けら
れている供給装置2の送液口7から行われるため、含浸
槽1内の一部に樹脂ワニス3が循環しにくい箇所、つま
り樹脂ワニス3が停滞し易い箇所が発生する。
In such a resin impregnation apparatus, since the resin varnish 3 supplied to the impregnation tank 1 is supplied from the liquid supply port 7 of the supply device 2 provided on the lower surface side of the impregnation tank 1, the impregnation tank 1 A portion where the resin varnish 3 is difficult to circulate, that is, a portion where the resin varnish 3 easily stagnates occurs in a part of the inside.

【0007】例えば、図2に斜線で示したように、槽内
ロール4と接する側の基材6に囲まれる部分7(槽内ロ
ール接触側)は、基材6自体が邪魔板となるため、含浸
槽1内を樹脂ワニス3が循環しにくい箇所となる。
For example, as shown by hatching in FIG. 2, the portion 7 surrounded by the base material 6 on the side in contact with the in-tank roll 4 (in-tank roll contact side) has the base material 6 itself as a baffle plate. The resin varnish 3 is difficult to circulate in the impregnation tank 1.

【0008】しかし、この部分7では、塗布量制御装置
5から除去されてくる粘度の高い樹脂ワニスは循環・拡
散性が悪いので、高粘度の樹脂ワニスの滞留箇所となっ
てしまうが、槽内ロール非接触側の部分9では、温度,
粘度の管理された樹脂ワニス3が良好に循環でき、目標
とする粘度の樹脂ワニス状態を維持することができる。
However, in this portion 7, since the resin varnish having a high viscosity removed from the coating amount control device 5 has a poor circulation and diffusibility, it becomes a residence site of the resin varnish having a high viscosity, but in the tank. In the part 9 on the non-contact side of the roll, the temperature,
The resin varnish 3 whose viscosity is controlled can be circulated favorably, and the resin varnish state of the target viscosity can be maintained.

【0009】このように含浸槽1内で基材6の表裏両
面、つまり槽内ロール接触側と槽内ロール非接触側にお
いて、含浸される樹脂ワニスの粘度が異なると、表裏両
面の樹脂分が異なるプリプレグとなり、積層板とした場
合、そりなどが発生する原因となる。このような現象
は、特にフィラー入りワニスを使用した場合に影響が大
きく現れ、積層板の特性を悪化させている。
As described above, when the viscosity of the resin varnish to be impregnated is different between the front and back surfaces of the substrate 6 in the impregnation tank 1, that is, the in-tank roll contact side and the in-tank roll non-contact side, the resin content on both front and back surfaces is If different prepregs are used and a laminated plate is used, warpage may occur. Such a phenomenon has a great influence particularly when a varnish containing a filler is used, and deteriorates the properties of the laminated plate.

【0010】本発明は、このような事情に基づいてなさ
れたものであり、含浸槽内の樹脂ワニスの粘度の安定化
を図り、表裏両面における樹脂分が均一なプリプレグを
製造するのに最適な樹脂含浸装置を提供することを目的
とするものである。
The present invention has been made under such circumstances, and it is suitable for stabilizing the viscosity of the resin varnish in the impregnation tank and producing a prepreg having a uniform resin content on both front and back surfaces. An object of the present invention is to provide a resin impregnation device.

【0011】[0011]

【課題を解決するための手段】本発明は、上記目的を達
成するために、樹脂ワニス供給装置から含浸槽内に温
度,粘度の管理された樹脂ワニスを供給し、含浸槽内で
基材を樹脂ワニスに浸漬する樹脂含浸装置において、基
材が邪魔板となり含浸槽内で樹脂ワニスが循環しにくく
停滞し易い箇所に、温度,粘度の管理された樹脂ワニス
を供給する補助用の樹脂ワニス供給装置を付設すること
を特徴とする。
In order to achieve the above object, the present invention supplies a resin varnish whose temperature and viscosity are controlled from an apparatus for supplying a resin varnish into the impregnation tank, and the substrate is placed in the impregnation tank. In a resin impregnation device that is immersed in resin varnish, the resin varnish for temperature and viscosity control is supplied to a place where the base material becomes a baffle and the resin varnish is difficult to circulate and stagnant in the impregnation tank. It is characterized in that a device is attached.

【0012】この補助用の樹脂ワニス供給装置は、含浸
槽内の槽内ロールの上方に付設するとよい。
This auxiliary resin varnish supply device may be installed above the in-tank roll in the impregnation tank.

【0013】[0013]

【作用】本発明によれば、基材が邪魔板となるため、含
浸槽内で樹脂ワニスが循環しにくく停滞し易い箇所に、
温度、粘度の管理された樹脂ワニスを補助的に供給で
き、塗布量制御装置により欠き落とされた粘度の高い樹
脂ワニスが含浸槽内の一箇所に滞留せず、含浸槽内の樹
脂ワニスの均一化を図り、プリプレグにおける表裏両面
の樹脂分差の発生を防止する。
According to the present invention, since the base material serves as a baffle plate, the resin varnish is less likely to circulate in the impregnation tank and is easily stagnated.
A resin varnish whose temperature and viscosity are controlled can be supplementarily supplied, and the high-viscosity resin varnish cut off by the coating amount control device does not stay in one place in the impregnation tank, and the resin varnish in the impregnation tank is uniform To prevent the occurrence of resin difference between the front and back surfaces of the prepreg.

【0014】[0014]

【実施例】以下、本発明の実施例を図面に基づき詳細に
説明する。図1は、本発明の樹脂含浸装置を示す概略構
成図である。なお、従来と同一な構成は、図2と同一の
符号によって説明する。
Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 is a schematic configuration diagram showing a resin impregnating apparatus of the present invention. The same configuration as the conventional one will be described with the same reference numerals as those in FIG.

【0015】図1において、含浸槽1の下面に設けられ
た樹脂ワニス供給装置2の送液口7から、温度、粘度の
管理された樹脂ワニス3が供給される。ガラス布などの
基材6は、図中A方向から含浸槽1内へ送り込まれて樹
脂ワニス3に浸漬されながら槽内ロール4によってB方
向へと搬送される。
In FIG. 1, a resin varnish 3 whose temperature and viscosity are controlled is supplied from a liquid supply port 7 of a resin varnish supply device 2 provided on the lower surface of the impregnation tank 1. A substrate 6 such as a glass cloth is fed into the impregnation tank 1 from the direction A in the figure and immersed in the resin varnish 3 while being conveyed in the direction B by the in-tank roll 4.

【0016】含浸槽1からB方向へ送り出された基材6
は、余分に付着された樹脂ワニス分を塗布量制御装置5
により欠き落とされて除去され、次の工程で半硬化状態
に乾燥処理される。
Substrate 6 sent out from impregnation tank 1 in direction B
Is the coating amount control device 5 for the resin varnish that has been excessively attached.
Then, it is cut off and removed, and in the next step, it is dried to a semi-cured state.

【0017】本発明にあっては、含浸槽1の上面に補助
用の樹脂ワニス供給装置10が設けられている。この補
助用の樹脂ワニス供給装置10は、含浸槽1の上面側で
槽内ロール4と接する側の基材6に囲まれる部分7、つ
まり槽内ロール接触側の部分に、上記樹脂ワニスの供給
装置2と同様に温度、粘度の管理された樹脂ワニス3を
補助的に供給できるように構成されている。
In the present invention, an auxiliary resin varnish supply device 10 is provided on the upper surface of the impregnation tank 1. This auxiliary resin varnish supply device 10 supplies the resin varnish to a portion 7 on the upper surface side of the impregnation tank 1 surrounded by the base material 6 on the side in contact with the in-tank roll 4, that is, a portion on the in-tank roll contact side. Like the device 2, the resin varnish 3 whose temperature and viscosity are controlled can be supplementarily supplied.

【0018】この部分7は、上記するように、特に基材
6が邪魔板となり、含浸槽1内において樹脂ワニス3が
循環しにくく停滞し易い箇所であるため、塗布量制御装
置5から滴下される高い粘度の樹脂ワニスが滞留し易
く、槽内ロール非接触側の部分9と樹脂ワニス粘度差を
生ずる。
As described above, since the base material 6 serves as a baffle plate and the resin varnish 3 is difficult to circulate in the impregnation tank 1 and is easily stagnant, this portion 7 is dripped from the coating amount control device 5. The resin varnish having a high viscosity tends to stay, and a difference in viscosity of the resin varnish occurs between the portion 9 on the non-contact side of the in-tank roll.

【0019】しかしながら、本発明では、補助用の樹脂
ワニス供給装置10から温度,粘度の管理された樹脂ワ
ニス3が強制的に供給されるので、含浸槽1内における
樹脂ワニスの粘度の安定化を図り、プリプレグにおける
表裏面の樹脂分差の発生を防止することができる。
However, in the present invention, since the resin varnish 3 whose temperature and viscosity are controlled is forcibly supplied from the auxiliary resin varnish supply device 10, the viscosity of the resin varnish in the impregnation tank 1 is stabilized. As a result, it is possible to prevent the occurrence of resin difference between the front and back surfaces of the prepreg.

【0020】次に、本発明者らによる本発明の樹脂含浸
装置と、従来の樹脂含浸装置による実験結果について説
明する。
Next, the experimental results of the resin impregnating apparatus of the present invention by the present inventors and the conventional resin impregnating apparatus will be described.

【0021】温度;30°C,粘度;300cpに管理
されたフィラー入りエポキシ樹脂ワニスを使用し、図1
に示した本発明の樹脂含浸装置によりプリプレグを作製
した。
Using a filler-containing epoxy resin varnish controlled at a temperature of 30 ° C. and a viscosity of 300 cp, FIG.
A prepreg was produced by the resin impregnating apparatus of the present invention shown in FIG.

【0022】上記実験例と同様な樹脂ワニスを使用し、
比較例として図2に示した従来の樹脂含浸装置によりプ
リプレグを作製した。
Using a resin varnish similar to the above experimental example,
As a comparative example, a prepreg was produced by the conventional resin impregnation apparatus shown in FIG.

【0023】両装置により、プリプレグを連続的に製造
している際の経過時間毎に、含浸槽1内の樹脂ワニスの
粘度変化を測定した。測定結果を表1に示す。なお、単
位はmPa・sである。
With both devices, the viscosity change of the resin varnish in the impregnation tank 1 was measured at each elapsed time during the continuous production of the prepreg. Table 1 shows the measurement results. The unit is mPa · s.

【0024】[0024]

【表1】 [Table 1]

【0025】表1の結果によれば、本発明の樹脂含浸装
置では、基材6が邪魔板となり、含浸槽1内で樹脂ワニ
スが循環しにくく停滞し易い箇所(図示の部分8)に
も、温度,粘度の管理された樹脂ワニス3が強制的に供
給され、含浸槽1内で樹脂ワニスが均一に循環している
ことが判明した。
According to the results shown in Table 1, in the resin impregnating apparatus of the present invention, the base material 6 serves as a baffle plate, and the resin varnish is less likely to circulate in the impregnation tank 1 and is likely to be stagnant (part 8 in the figure). It was found that the resin varnish 3 whose temperature and viscosity were controlled was forcibly supplied and the resin varnish circulated uniformly in the impregnation tank 1.

【0026】[0026]

【発明の効果】以上説明したように、本発明によれば、
塗布量制御装置により欠き落とされた高い粘度の樹脂ワ
ニスが滴下しても、含浸槽内の一箇所に滞留することが
なくなり、含浸槽内の樹脂ワニスの循環が均一となり、
樹脂ワニスの粘度の安定化が図れる。このため、プリプ
レグの表裏両面の樹脂分差を少なくでき、積層板のそり
などを防ぐことができる。
As described above, according to the present invention,
Even if the high-viscosity resin varnish dropped off by the coating amount control device drips, it does not stay in one place in the impregnation tank, and the circulation of the resin varnish in the impregnation tank becomes uniform,
The viscosity of the resin varnish can be stabilized. Therefore, the difference in resin between the front and back surfaces of the prepreg can be reduced, and warpage of the laminate can be prevented.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の樹脂含浸装置を示す概略構成図であ
る。
FIG. 1 is a schematic configuration diagram showing a resin impregnating apparatus of the present invention.

【図2】従来の樹脂含浸装置を示す概略構成図である。FIG. 2 is a schematic configuration diagram showing a conventional resin impregnation device.

【符号の説明】[Explanation of symbols]

1 含浸槽 3 樹脂ワニス 6 基材 10 補助用の樹脂ワニス供給装置 1 Impregnation Tank 3 Resin Varnish 6 Base Material 10 Auxiliary Resin Varnish Supply Device

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 樹脂ワニス供給装置から含浸槽内に温
度,粘度の管理された樹脂ワニスを供給し、含浸槽内で
基材を樹脂ワニスに浸漬する樹脂含浸装置において、基
材が邪魔板となり含浸槽内で樹脂ワニスが循環しにくく
停滞し易い箇所に、温度,粘度の管理された樹脂ワニス
を供給する補助用の樹脂ワニス供給装置を付設すること
を特徴とする樹脂含浸装置。
1. A resin impregnating apparatus in which a resin varnish whose temperature and viscosity are controlled is supplied from a resin varnish supplying device to a resin varnish and the substrate is immersed in the resin varnish in the impregnating tank. A resin impregnating device, characterized in that an auxiliary resin varnish supplying device for supplying a resin varnish whose temperature and viscosity are controlled is attached to a place where the resin varnish is less likely to circulate and stagnant in the impregnation tank.
【請求項2】 補助用の樹脂ワニス供給装置は、含浸槽
内の槽内ロールの上方に付設することを特徴とする請求
項1記載の樹脂含浸装置。
2. The resin impregnating apparatus according to claim 1, wherein the auxiliary resin varnish supplying apparatus is provided above the in-tank roll in the impregnating tank.
JP4270295A 1995-03-02 1995-03-02 Apparatus for impregnation with resin Pending JPH08229943A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4270295A JPH08229943A (en) 1995-03-02 1995-03-02 Apparatus for impregnation with resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4270295A JPH08229943A (en) 1995-03-02 1995-03-02 Apparatus for impregnation with resin

Publications (1)

Publication Number Publication Date
JPH08229943A true JPH08229943A (en) 1996-09-10

Family

ID=12643397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4270295A Pending JPH08229943A (en) 1995-03-02 1995-03-02 Apparatus for impregnation with resin

Country Status (1)

Country Link
JP (1) JPH08229943A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101005330B1 (en) * 2010-05-18 2011-01-24 김철환 Impregnating device of liner
JP4696399B2 (en) * 2001-05-30 2011-06-08 日立化成工業株式会社 Method for producing prepreg for printed wiring board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4696399B2 (en) * 2001-05-30 2011-06-08 日立化成工業株式会社 Method for producing prepreg for printed wiring board
KR101005330B1 (en) * 2010-05-18 2011-01-24 김철환 Impregnating device of liner

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