JP2003158105A5 - - Google Patents
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- Publication number
- JP2003158105A5 JP2003158105A5 JP2001355020A JP2001355020A JP2003158105A5 JP 2003158105 A5 JP2003158105 A5 JP 2003158105A5 JP 2001355020 A JP2001355020 A JP 2001355020A JP 2001355020 A JP2001355020 A JP 2001355020A JP 2003158105 A5 JP2003158105 A5 JP 2003158105A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- substrate holding
- contact
- elastic film
- ring body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 37
- 238000005498 polishing Methods 0.000 claims 17
- 239000000463 material Substances 0.000 claims 3
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001355020A JP3989234B2 (ja) | 2001-11-20 | 2001-11-20 | 基板保持装置及びポリッシング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001355020A JP3989234B2 (ja) | 2001-11-20 | 2001-11-20 | 基板保持装置及びポリッシング装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007160986A Division JP2007229922A (ja) | 2007-06-19 | 2007-06-19 | 基板保持装置及びポリッシング装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003158105A JP2003158105A (ja) | 2003-05-30 |
| JP2003158105A5 true JP2003158105A5 (enrdf_load_stackoverflow) | 2005-06-30 |
| JP3989234B2 JP3989234B2 (ja) | 2007-10-10 |
Family
ID=19166785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001355020A Expired - Fee Related JP3989234B2 (ja) | 2001-11-20 | 2001-11-20 | 基板保持装置及びポリッシング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3989234B2 (enrdf_load_stackoverflow) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4515047B2 (ja) * | 2003-06-06 | 2010-07-28 | 株式会社荏原製作所 | 弾性膜、基板保持装置、研磨装置、及び研磨方法 |
| JP2005123485A (ja) * | 2003-10-17 | 2005-05-12 | Ebara Corp | 研磨装置 |
| JP4822744B2 (ja) * | 2004-06-04 | 2011-11-24 | 三星電子株式会社 | 化学機械的研磨装置、キャリアヘッド及び区画リング |
| US7364496B2 (en) * | 2006-03-03 | 2008-04-29 | Inopla Inc. | Polishing head for polishing semiconductor wafers |
| JP5081490B2 (ja) * | 2007-04-19 | 2012-11-28 | 不二越機械工業株式会社 | ワークの片面研磨装置および片面研磨方法 |
| JP2009131920A (ja) | 2007-11-29 | 2009-06-18 | Ebara Corp | 研磨装置及び方法 |
| JP5197644B2 (ja) * | 2010-02-08 | 2013-05-15 | 株式会社荏原製作所 | 研磨装置及び研磨方法 |
| JP5635482B2 (ja) | 2011-11-30 | 2014-12-03 | 株式会社荏原製作所 | 弾性膜 |
| JP5976522B2 (ja) * | 2012-05-31 | 2016-08-23 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
| CN119328670A (zh) * | 2024-12-19 | 2025-01-21 | 荣芯半导体(宁波)有限公司 | 研磨头及化学机械研磨设备 |
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2001
- 2001-11-20 JP JP2001355020A patent/JP3989234B2/ja not_active Expired - Fee Related