JP2003158095A - Ring peeling and cleaning device and manufacturing method for semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique capable of improving work efficiency of a reproduction processing of a ring used in a dicing process of a semiconductor wafer. SOLUTION: By using a ring peeling and cleaning device 1 and automating a series of work composed of heating of the ring (hot plate part 3), peeling of a UV tape from the ring (peeling part 4), inversion of the ring (inversion part 5) and cleaning of the ring (cleaning part 6), work time required for the reproduction processing of the ring is shortened to be about 1/4 to 1/5 compared to manual work.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing technique, and more particularly to a technique effective when applied to a dicing process of cutting a semiconductor wafer having a circuit pattern formed therein and cutting it into individual semiconductor chips.

[0002]

2. Description of the Related Art A circuit pattern is formed on a semiconductor wafer in a pre-process, and after each semiconductor chip is judged as good or bad in an inspection process, the semiconductor wafer is cut in a post-process so that only good chips are obtained. Is wrapped in a package.

The present inventor has studied dicing, which is a work of cutting a semiconductor wafer into individual semiconductor chips in a subsequent process. The following is the technique examined by the present inventor, and the outline thereof is as follows.

First, a UV tape is attached to the ring, a semiconductor wafer is attached to the UV tape, and the semiconductor wafer is fixed to the ring. Then, the semiconductor wafer is cut lengthwise and breadthwise using an ultrathin circular blade to which fine diamond particles are attached, which is called a dicing saw.

Next, after irradiating ultraviolet rays from the back side of the UV tape to transform the UV tape to weaken the adhesive force, a good chip is picked up by a vacuum chuck and attached to the island of the lead frame.

UV with wafer debris containing defective chips
The tape is then stripped from the ring. First, after warming the ring with a hot plate, UV with wafer debris
Remove the tape from the ring, then clean the ring,
Remove the tape glue residue on the ring. By warming the ring, the UV tape can be stripped from the ring without leaving tape glue.

[0007]

However, since the above-mentioned series of work for peeling off the UV tape from the ring and cleaning is performed by hand, it takes 3 minutes or more for each ring, and the ring The problem remains that the work efficiency of the regeneration process is low.

An object of the present invention is to provide a technique capable of improving the work efficiency of the recycling process of the ring used in the dicing process of a semiconductor wafer.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0010]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

According to the present invention, a loader section for setting a ring on which a UV tape with wafer debris is attached, a hot plate section for heating a ring on which a UV tape with wafer debris is attached on a hot plate, and a ring are used. A ring peeling / cleaning device including a peeling unit for peeling off the UV tape with wafer debris, a reversing unit for inverting the ring, a cleaning unit for cleaning the ring and removing debris, and an unloader unit for stacking the rings. Is used to automate a series of operations for removing the UV tape from the ring and cleaning it.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. In all the drawings for explaining the embodiments, members having the same function are designated by the same reference numerals, and the repeated description thereof will be omitted.

FIG. 1 is a schematic configuration diagram showing an example of a ring peeling cleaning apparatus according to an embodiment of the present invention. Figure 2
Is an example of a member showing a ring to which a UV tape with wafer debris according to an embodiment of the present invention is attached,
(A) is a top view of the member, (b) is AA 'of the same figure (a).
It is sectional drawing of the member in a line.

The ring peeling / cleaning apparatus 1 is composed of a loader unit 2, a hot plate unit 3, a peeling unit 4, a reversing unit 5, a cleaning unit 6 and an unloader unit 7, and works for each unit and conveyance of members between each unit. Is automated.

First, a ring 10 to which a UV tape (shown by hatching in the drawing) 9 with a wafer wreckage 8 is attached is set in the loader section 2. The wafer debris 8 is the rest of the semiconductor wafer obtained by separating the semiconductor wafer into individual semiconductor chips and then removing the non-defective chips, and the defective chips determined to be defective in the inspection process and the defects in which defects and scratches are detected. Chips are also included. Also, U
The V tape 9 is a tape which is modified by ultraviolet rays and whose adhesive strength changes.

Next, the ring 10 is formed in the hot plate section 3.
Is heated to melt the glue of the UV tape 9, and then the UV tape 9 having the wafer debris 8 attached thereto is peeled off from the ring 10 at the peeling section 4. As a hot plate for warming the ring 10, for example, a hot plate having a device specification of a temperature of room temperature to 200 ° C. and a time of 1 to 99 seconds can be exemplified. Subsequently, the reversing unit 5 reverses the ring 10 and the cleaning unit 6 reverses the ring 1.
Wipe 0 with an abrasive cloth to remove glue residue and then ring 1.
0 is conveyed to the unloader unit 7.

Thus, heating of the ring 10 and the ring 1
By automating a series of operations including peeling of the UV tape 9 from 0, inversion of the ring 10 and cleaning of the ring 10, the work time required for one ring 10 can be set to about 40 seconds, and manual work 1 / working time compared to
It can be reduced to about 4 to 1/5.

Next, the flow of work in the ring peeling cleaning apparatus according to one embodiment of the present invention will be described with reference to the schematic configuration diagrams of the respective parts constituting the ring peeling cleaning apparatus shown in FIGS.

First, the following work is performed in the loader unit 2 shown in FIG. Set the ring cassette 11 to the loader, and push the ring pusher 12 to the ring 10a.
Is pushed out, and the ring 10a is chucked by the ring clamp 13 and conveyed. The ring 10a is the ring 10 to which the UV tape 9 with the wafer debris 8 is attached.

Next, the following work is performed in the hot plate section 3 shown in FIG. The conveyed ring 10
A is placed on the hot plate 14 and heated at a predetermined temperature, for example, about 100 ° C. for a predetermined time, for example, 20 seconds.

Next, the following work is performed in the peeling section 4 shown in FIG. The ring 10 to which the UV tape 9 with the wafer debris 8 is attached is placed on the ring fixing base 15 using the suction transfer arm, and the wafer fixing table 16
And sandwiched by the wafer debris stacking table 17.
Subsequently, the peeling claw 18 is lowered to peel off the UV tape 9 with the wafer debris 8 from the ring 10, and the UV tape 9 with the wafer debris 8 on the wafer debris stacking table 17
Put it on top. Next, the wafer fixing table 16 and the peeling claw 18 are raised, the wafer debris stacking table 17 is further lowered, and then the ring 10 is conveyed to the reversing unit 5.

Next, the following work is performed in the reversing unit 5 shown in FIG. The ring 10 placed on the reversing table 19 is sandwiched and fixed by the ring clamps 20, the reversing table 19 is lowered, and then the ring 10 is rotated by 180 degrees. After that, after raising the reversing table 19, the ring 10 is released from the ring clamp 20.

Next, the following work is performed in the cleaning unit 6 shown in FIG. Ring 1 conveyed from reversing unit 5
0 is placed on the cleaning table 21, and the polishing cloth unit 22 and the rotating brush 23 are pressed against the ring 10. While rotating the cleaning table 21 at a predetermined number of rotations, the polishing pad unit 22 is repeatedly operated and the rotating brush 23 is rotated to clean the ring 10, and the debris is removed by the exhaust fan 24.

Finally, the following work is performed in the unloader section 7 shown in FIG. The washed ring 10 is conveyed to the ring stacking table 26 by the ring suction arm 25, and the rings 10 are stacked.

Next, detailed working steps in the hot plate section will be described. FIG. 9A is a top view showing the device configuration of the hot plate unit, and FIG. 9B is a B view of FIG. 9A.
It is a sectional view taken along the line -B '. 10 (a) to (f)
FIG. 3 is an apparatus configuration diagram for explaining a work process in a hot plate unit in process order.

The hot plate section 3 is composed of a heat insulating material 27, a plate 28 and a heater wire 29, and can be controlled to a predetermined temperature by a temperature controller.

First, the ring 10a is placed on the plate 28 using the ring clamp 13 (FIG. 10 (a)-
(C)), The ring clamp 13 is released and retracted (FIG. 10 (d)).

Then, after heating the ring 10a at a predetermined temperature for a predetermined time, the ring 1 is moved by the ring transfer pad 30.
0a is adsorbed and conveyed to the next step (peeling unit 4) (FIG. 10).
(E), (f)).

Next, detailed working steps in the reversing unit will be described. 11A is a top view showing the device configuration of the inversion unit, and FIG. 11B is a sectional view taken along the line CC ′ of FIG. 11A. 12A to 12H are device configuration diagrams for explaining the work process in the reversing unit in process order.

The reversing unit 5 is composed of a reversing table 19 and a ring clamp 20.

First, the ring 10 is placed on the reversing table 19 by the ring transfer pad 31 (FIG. 12A).
Next, after the ring 10 is clamped using the ring clamp 20 (FIGS. 12B and 12C), the reversing table 19
Is lowered (FIG. 12 (d)).

Then, the ring clamp 20 is rotated 180 degrees to turn the ring 10 upside down (see FIG. 12).
(E)), and the inversion table 19 is raised (see FIG. 12).
(F)) Then, the ring clamp 19 is released and retracted (FIG. 12 (g)). Then, the ring transfer pad 32
The ring 10 is adsorbed by means of and is transported to the next step (cleaning section 6) (FIG. 12 (h)).

Next, an example of a dicing process to which the ring peeling cleaning apparatus according to one embodiment of the present invention is applied is shown in FIG.
This will be described with reference to the process chart shown in FIG.

A circuit pattern is formed on the semiconductor wafer in the previous step, and the quality of each semiconductor chip on the semiconductor wafer is determined in the inspection step.

Then, a UV tape is attached to the ring,
Further, the semiconductor wafer is attached to a UV tape, and the semiconductor wafer is fixed to a ring (step 100). Then, the semiconductor wafer is cut vertically and horizontally by using a dicing saw, and one by one.
Divide into individual semiconductor chips (step 101). Subsequently, after irradiating ultraviolet rays from the back surface side of the UV tape to transform the UV tape to weaken the adhesive force (step 102), the appearance of the semiconductor chip is inspected to check for defects or scratches.

Next, a semiconductor chip which has no defective appearance and is determined to be non-defective in the inspection step is picked up by a vacuum chuck (step 103) and attached to, for example, an island of a lead frame (step 104). After that, the electrodes on the semiconductor chip and the leads of the lead frame are electrically connected by, for example, a gold wire.

On the other hand, a UV tape with a wafer remnant including semiconductor chips judged to be defective in the inspection process and semiconductor chips whose defects and scratches have been detected is a series using the ring peeling cleaning device 1. Is peeled off from the ring (step 105). The ring from which the UV tape has been peeled off and which has been cleaned is repeatedly used in the dicing process.

As described above, according to this embodiment, the ring 10 is heated, the UV tape 9 is peeled from the ring 10,
By using the ring peeling cleaning device 1 that automates a series of operations including inversion of the ring 10 and cleaning of the ring 10, the working time required for the regenerating process of the ring 10 is about ¼ to ⅕ compared to the manual work. Can be shortened to

Although the invention made by the present inventor has been specifically described based on the embodiments of the present invention, the present invention is not limited to the above-mentioned embodiments, and various modifications can be made without departing from the scope of the invention. It goes without saying that it can be changed.

For example, in the above-described embodiment, the case where the invention is applied to the recycling process of the ring used in the dicing process of the semiconductor wafer has been described. It is possible to apply.

[0041]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

By automating the recycling process of the ring used in the dicing process of the semiconductor wafer,
The work efficiency can be improved as compared with the ring recycling process by hand.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing an example of a ring peeling cleaning apparatus according to an embodiment of the present invention.

2A is a top view showing an example of a ring to which a UV tape with a wafer debris is attached, and FIG. 2B is a sectional view taken along the line AA ′ in FIG. 2A.

FIG. 3 is a schematic configuration diagram of a loader unit that constitutes a ring peeling cleaning device that is an embodiment of the present invention.

FIG. 4 is a schematic configuration diagram of a hot plate unit that constitutes a ring peeling cleaning device that is an embodiment of the present invention.

FIG. 5 is a schematic configuration diagram of a peeling unit that constitutes a ring peeling cleaning device that is an embodiment of the present invention.

FIG. 6 is a schematic configuration diagram of a reversing unit that constitutes the ring peeling cleaning device that is an embodiment of the present invention.

FIG. 7 is a schematic configuration diagram of a cleaning unit included in the ring peeling cleaning device according to the embodiment of the present invention.

FIG. 8 is a schematic configuration diagram of an unloader unit that constitutes a ring peeling cleaning device that is an embodiment of the present invention.

9A is a top view showing a device configuration of a hot plate section, and FIG. 9B is a sectional view taken along line BB ′ in FIG. 9A.

FIG. 10 is an apparatus configuration diagram for explaining work steps in the hot plate section according to the embodiment of the present invention in order of steps.

11A is a top view showing a device configuration of an inversion unit, and FIG. 11B is a cross-sectional view taken along line CC ′ of FIG. 11A.

FIG. 12 is an apparatus configuration diagram for explaining a work process in a reversing unit which is an embodiment of the present invention in process order.

FIG. 13 is a process chart showing an example of a dicing process to which the ring peeling cleaning device according to the embodiment of the present invention is applied.

[Explanation of symbols]

1 Ring peeling cleaning device 2 Loader section 3 Hot plate part 4 Peeling part 5 Inversion section 6 Cleaning section 7 Unloader section 8 Wafer remnants 9 UV tape 10 rings 10a ring 11 ring cassette 12 ring extrusion pusher 13 ring clamp 14 hot plate 15 Fixed base 16 wafer fixed table 17 Wafer debris stacking table 18 peeling nail 19 Inversion table 20 ring clamp 21 Washing table 22 Polishing cloth unit 23 rotating brush 24 exhaust fan 25 ring suction arm 26 ring stacking stand 27 Insulation 28 plates 29 heater wire 30 ring transfer pad 31 ring transfer pad 32 ring transfer pad

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Claims (5)

[Claims] 1. A ring peeling characterized by automating a series of operations including heating of a ring to which a UV tape is attached, peeling of the UV tape from the ring, reversal of the ring and cleaning of the ring. Cleaning device. 2. A ring peeling and cleaning apparatus which automates a series of operations including heating a ring to which a UV tape is attached by a hot plate, peeling the UV tape from the ring, reversing the ring and cleaning the ring. After heating the ring by the hot plate,
A ring peeling cleaning device characterized by being 0 ° C. or lower. 3. A loader section for setting a ring to which a UV tape is attached, a hot plate section for heating the ring to which the UV tape is attached on a hot plate, and the UV tape is peeled from the ring. A ring peeling / cleaning apparatus comprising: a peeling unit, a reversing unit that reverses the ring, a cleaning unit that cleans the ring, and an unloader unit that stacks the rings. 4. A loader section for setting a ring to which a UV tape is attached, a hot plate section for heating the ring to which the UV tape is attached on a hot plate, and peeling the UV tape from the ring. A UV tape is applied to a ring that has been regenerated by using a ring peeling cleaning device including a peeling unit, a reversing unit that reverses the ring, a cleaning unit that cleans the ring, and an unloader unit that stacks the rings. A method of manufacturing a semiconductor device, which comprises bonding, and further bonding a semiconductor wafer having a circuit pattern formed therein to the UV tape, and then cutting the semiconductor wafer into individual semiconductor chips. 5. A UV tape is attached to the ring (a),
Further, a step of attaching a semiconductor wafer having a circuit pattern formed thereon to the UV tape, and (b) a step of cutting the semiconductor wafer into individual semiconductor chips.
(C) a step of irradiating the UV tape with ultraviolet rays,
(D) A process of attaching a good product of the semiconductor chip to the island of the lead frame, and (e) a series of operations including heating of the ring, peeling of the UV tape from the ring, reversal of the ring, and cleaning of the ring. And a step of peeling off the UV tape having the wafer debris from the ring by using an automated ring peeling cleaning device.