JP2003146678A - Cutting method and cutting apparatus for brittle material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cutting method and a cutting apparatus which enable easy fixing of a substrate consisting of a brittle material, prevention of the occurrence of chipping and a crack f a cut piece and simplification of the cleaning of the piece thereby enable improvement in productivity and reduction in an environmental burden. SOLUTION: Straight grooves 18b having width larger than that of a blade 13a mode of a grindstone of a cutting wheel 13 are provided at the upper surface 18a of the chuck table 18 of the cutting apparatus at predetermined pitches. The substrate 11 consisting of the brittle material is fixed through a frozen layer E by feeding a liquid W on the upper surface 18a and the groove 18b of the chuck table 18 and cooling them. The substrate 11 is cut while cutting the frozen layer E in the groove 18b by running the blade 13a made of the grindstone of the rotating cutting wheel 13 along the groove 18b in the state where the blade 13a made of the grindstone is fitted into the groove 18b.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a cutting method and a cutting apparatus for cutting a substrate made of a brittle material such as glass, crystallized glass, and ceramics into a plurality of small pieces.

[0002]

2. Description of the Related Art Conventionally, as a method for cutting brittle materials such as glass and ceramics, the technique described in JP-A-1-93432 is known.

In a conventional method for cutting a thin plate-like substrate made of a brittle material, as shown in FIG. 2, first, a substrate 1 and a substrate 1 are cut.
A cutting work composed of a backing plate 4 which is fixed with wax 2 to be half cut together with the substrate 1 and a chucking plate 5 which is fixed to the plate 4 with wax 2 and is set in a cutting machine is prepared. The cutting work is fixed to an XY indexing table 6 of a cutting machine having an XY direction indexing mechanism. The substrate 1 fixed in this way is provided with a cutting wheel 3 having a grindstone blade 3a in which diamond abrasive grains are fixed with a sintered metal.
Is cut into a plurality of small pieces 7.

[0004]

When the substrate 1 made of a brittle material such as glass or ceramics is cut by the above-mentioned conventional cutting method, some nicks and cracks are generated on the ridge line of the cut surface of the small piece 7. These cracks and cracks are serious defects in terms of quality because they are likely to develop into cracks in the subsequent cleaning process, especially ultrasonic cleaning, so such cracks and cracks should be made as small and small as possible. This is very important. In the conventional cutting method, if the lower surface of the substrate 1 is cut without using a backing plate, a large chip or crack is generated on the ridge line on the lower surface of the small piece 7. In order to prevent this chipping and cracking, as preparatory work before cutting,
First, the thin plate-shaped substrate 1 is attached to the backing plate 4 with the wax 2 and fixed. The layer of wax 2 is soft and the grindstone blade 3a
The smaller the quality, the better the quality of the small piece 7 as it becomes a cause of clogging. Further, in fixing the backing plate 4 and the chucking plate 5, if the fixation is not complete, the thin substrate 1 and the backing plate 4 may vibrate or chatter to easily cause chipping or cracking on the cut surface. Perfect fixation is required. For this reason, when the contact plate 4 and the chucking plate 5 are fixed by a mechanical clamp or the like, a thick contact plate 4 with high rigidity that does not cause vibration or chatter is required, while the contact plate 4 is thin. In this case, the chucking plate 5 also needs to be attached with the wax 2.

At the time of cutting, the thin substrate 1 is completely cut and the backing plate 4 is partially cut. Naturally, the backing plate 4
Is a consumable material that can be used once, which increases costs. When the thin plate-shaped piece 7 is removed from the contact plate 4 after cutting, it is separated by a spatula and a hammer, or it is immersed in an organic solvent for a long time to dissolve the wax 2 and separated. In this way, the work is complicated and automation is difficult, and since the wax 2 is attached to the small piece 7 separated from the substrate 1, the cleaning liquid requires an organic solvent or a special detergent.
It is desired to improve environmental problems including the disposal of waste.

According to the present invention, a substrate made of a brittle material such as glass, crystallized glass, or ceramics can be easily fixed to a cutting device, and chipping or cracking of small pieces at the time of cutting can be prevented, and at the same time, cutting can be performed. It is an object of the present invention to provide a brittle material cutting method and a cutting device that enable both improvement of productivity and reduction of environmental load by simplifying subsequent washing of small pieces.

[0007]

In order to solve this problem, a method for cutting a brittle material according to the present invention is a method in which a substrate made of a brittle material is fixed on a chuck table and a plurality of small pieces are cut by a cutting foil that rotates the substrate. In the method for cutting a brittle material to be cut into, the chuck table is provided with linear grooves having a width wider than the width of the grindstone blade of the cutting foil on the upper surface at a predetermined pitch, and the upper surface of the chuck table. Also, the substrate is fixed to the upper surface of the chuck table through a frozen layer of the liquid by supplying a liquid to the groove to cool it, and the grinding wheel blade of the rotating cutting wheel is inserted into the groove to run along the groove. This is characterized in that the substrate is completely cut while cutting a part of the frozen layer in the groove.

According to the present invention, a substrate made of a brittle material is fixed to the upper surface of the chuck table via a frozen layer of a substance that is liquid at room temperature, and after cutting, the frozen layer is returned to the liquid so that it can be attached and detached. The liquid used in the present invention has a melting point at room temperature, does not contaminate the substrate, and does not cause clogging of a grindstone blade made of abrasive grains such as diamond or CBN in a frozen layer state. It can be used if it shows machinability.

Further, linear grooves wider than the blade width of the cutting foil are provided on the upper surface of the chuck table at a predetermined pitch, and a frozen layer is formed in the groove, so that the grindstone blade of the rotating cutting wheel can be formed. It is possible to run along the groove while it is inserted in the groove and cut while cutting a part of the frozen layer in the groove, which causes chipping on the cut edge of the lower surface of the substrate when completely cutting the substrate Is important in preventing.

The brittle material cutting method of the present invention is characterized in that the substrate is made of glass or crystallized glass, and the liquid is water.

Since the substrate made of the brittle material of the present invention is made of glass or crystallized glass and the liquid is water, when cutting the substrate made of glass or crystallized glass fixed by a conventional wax or adhesive sheet. In addition, when the wax or the adhesive sheet is too soft, there is no phenomenon in which a large amount of chipping occurs on the cut edge of the lower surface of the substrate or a grindstone blade made of abrasive grains such as diamond or CBN is clogged. Moreover, wax or the like is not attached to the thin plate-shaped pieces after cutting, and when cleaning the small pieces, a cleaning liquid such as an organic solvent and a special detergent which have been conventionally used are not required at all.

In the brittle material cutting apparatus according to the present invention, a linear groove having a width wider than the width of the grinding wheel blade of the cutting foil is provided on the upper surface at a predetermined pitch to fix the substrate made of the brittle material to the upper surface. A chuck table; and a cutting wheel that travels while rotating while a grindstone blade is fitted in the groove to cut the substrate fixed on the chuck table upper surface,
In a brittle material cutting device that cuts a substrate into a plurality of small pieces by the cutting foil, the chuck table has an upper surface and a groove capable of holding a liquid, and liquid supply means for supplying the liquid to the upper surface of the chuck table. A freezing means for fixing the substrate through a frozen layer of the liquid by freezing the liquid interposed between the substrate and the upper surface of the chuck table and the liquid in the groove after placing the substrate on the upper surface of the chuck table; And a heating unit that melts the frozen layer containing a plurality of small pieces cut by the cutting foil and releases the frozen layer from the upper surface of the chuck table.

The chuck table used in the brittle material cutting apparatus of the present invention rotates in order to prevent the occurrence of large chipping on the lower surface of the substrate, that is, the cut edge of the small piece when the substrate is completely cut. In order to make it possible to cut while cutting a part of the frozen layer in the groove by running along the groove with the grindstone blade of the cutting wheel fitted in the groove,
It is important to have a structure capable of retaining liquid on the upper surface and the groove. As the linear groove wider than the blade width of the cutting foil provided on the upper surface of the chuck table, if the shape of the small piece to be obtained is rectangular, it is in a lattice shape, if it is a rhombus, it is in a twill shape forming a predetermined angle with each other, If it is a hexagon, it should be provided so as to form an angle of 60 ° with each other. The depth of the groove should be such that the grindstone blade is inserted into the cutting edge of the small piece to the extent that the size and shape of burrs etc. are not adversely affected. Anything can be used.

Further, as the freezing means, it is sufficient if the liquid between the substrate and the upper surface of the chuck table and in the groove can be frozen after the substrate is placed on the upper surface of the chuck table. The entire table is cooled by cold air, etc., the chuck table is made of a material with high thermal conductivity such as metal, and a cooling element such as a Peltier type is arranged on the back surface of the chuck table itself. The liquid may be frozen by spraying.

As a heating means for melting the intervening frozen layer to release the small pieces from the chuck table, a heating means for blowing hot air over the entire chuck table to which the small pieces are fixed or a material having a high thermal conductivity such as metal is used. The heating element may be embedded in the inner surface of the chuck table itself, or the back surface of the chuck table may be heated by radiating heat rays or blowing hot air.

[0016]

The brittle material cutting method according to the present invention is a brittle material cutting method in which a substrate made of a brittle material is fixed to a chuck table, and the substrate is cut into a plurality of small pieces by a rotating cutting foil. The upper surface of the chuck table is provided with linear grooves having a width wider than the width of the grindstone blade of the cutting foil at a predetermined pitch, and the liquid is supplied to the upper surface and the grooves of the chuck table to cool the substrate. Is fixed to the upper surface of the chuck table via a frozen layer of liquid, and a part of the frozen layer in the groove is cut by running along the groove with the grindstone blade of the rotating cutting wheel fitted in the groove. However, because the substrate is completely cut, the substrate made of brittle material can be directly attached to the upper surface of the chuck table of the cutting device without damaging the substrate surface without using wax or a patch plate. By cutting the frozen layer, it plays the same role as when the substrate is attached to the backing plate with wax, and it is possible to suppress the occurrence of large chipping at the cut edge of the small piece after cutting. .

Further, a substrate made of the brittle material of the present invention is
Since it is made of glass or crystallized glass and the liquid is water, by cutting a frozen layer made of ice, a large chipping is formed on the cut edge of the lower surface of the conventional substrate, and a grindstone made of abrasive grains such as diamond or CBN. It becomes easy to prevent the blade from clogging, and it becomes possible to simplify the cleaning of the small pieces after cutting.

In the brittle material cutting apparatus according to the present invention, linear grooves having a width wider than the width of the grinding wheel blade of the cutting foil are provided on the upper surface at a predetermined pitch to fix the substrate made of the brittle material to the upper surface. A chuck table; and a cutting wheel that travels while rotating while a grindstone blade is fitted in the groove to cut the substrate fixed on the chuck table upper surface,
In a brittle material cutting device that cuts a substrate into a plurality of small pieces by the cutting foil, the chuck table has an upper surface and a groove capable of holding a liquid, and liquid supply means for supplying the liquid to the upper surface of the chuck table. A freezing means for fixing the substrate through a frozen layer of the liquid by freezing the liquid interposed between the substrate and the upper surface of the chuck table and the liquid in the groove after placing the substrate on the upper surface of the chuck table; Since it has a heating means that melts and releases the intervening frozen layer from the chuck table upper surface of the plurality of small pieces cut by the cutting foil, the brittle material cutting method of the present invention can be smoothly carried out without any trouble. Become.

As described above, according to the present invention, the substrate made of the brittle material can be easily fixed, and the quality of the cut surface of the cut small piece is that when the caul plate glass is pasted with the hard wax. The level is equal to or higher than that, and the cleaning process after the cutting can be greatly simplified because the plate glass is not required and the cleaning after cutting does not require an organic solvent or a special detergent.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below.
First, a brittle material cutting device according to the present invention will be described with reference to the drawings.

As shown in FIG. 1, the brittle material cutting apparatus uses, for example, # 350 diamond abrasive grains with a concentration degree of 50.
In the vertical direction, a spindle unit 14 having a cutting wheel 13 having a grindstone blade 13a made of sintered metal attached thereto and a plate glass 11 as a substrate made of a brittle material and movable to any position on the XY biaxial coordinates is used. Is provided with an indexing table 16 capable of indexing at an arbitrary angle, and a freezing chuck 17 for fixing the positioned plate glass 11. On the upper surface 17a of the freezing chuck 17, there is provided a chuck table 18 made of copper having a high thermal conductivity in which grooves 18b having a width of 0.5 mm and a depth of 3 mm are carved in a grid pattern at a predetermined pitch on the upper surface 18a. In addition, the freeze chuck 17
A refrigerating pipe 19 is laid inside and a heater wire 20 is buried in the upper layer. On the upper side of the chuck table 18, there is provided a supply nozzle 21 that wets the upper surface 18a and the groove 18b of the chuck table 18 and supplies an appropriate amount of water W until the upper surface of the plate glass 11 on which the plate glass 11 is positioned is wet. On both sides of the grindstone blade 13a of the cutting foil 13, there are coolant nozzles 22 for pouring the cutting fluid C for cooling the cut portion of the plate glass 11.

Next, an example of the brittle material cutting method according to the present invention will be described using the above brittle material cutting device.

First, the upper surface 18a of the chuck table 18
The plate glass 11 is placed on the upper surface of the chuck table 18, and the water W is sprayed and supplied from the supply nozzle 21 until the upper surface 18a of the chuck table 18 and the groove 18b are wet with the lower surface of the plate glass 11.

Then, after spraying an appropriate amount of water W on the upper surface of the plate glass 11, a refrigerator (not shown) is used to -30 ° C.
The refrigerant cooled to the freezing pipe 19 is used to freeze the chuck 17
To the upper surface 18a of the chuck table 18 and the groove 1
The plate W is fixed to the upper surface 18 a of the chuck table 18 by freezing the water W of 8 b to form the frozen layer E made of ice. At this time, if the frozen layer E is also formed on the upper surface of the plate glass 11, it becomes possible to prevent the occurrence of large chips and cracks on the cut edge of the upper surface of the small piece 23.

Next, from the coolant nozzle 22 to the cutting fluid C
While cutting the plate glass 11 to the cutting portion, the cutting foil 13
However, the center of the groove 18b filled with the frozen layer E made of ice on the chuck table 18 is moved to the depth of 1 mm by the grindstone blade 13a.
The plate glass 11 is completely cut along the pre-programmed locus in the state of being cut to obtain a plurality of small pieces 23. At this time, the cutting fluid C was cooled to about −5 ° C. so that the cutting fluid C did not thaw the frozen layer E.

When the cutting is completed, the supply of the refrigerant is stopped and the heater of the freezing chuck 17 is turned on.
Then, the heater wire 20 is energized to thaw the frozen layer E interposed between the upper surface 18a of the chuck table 18 and the small piece 23 and remove the small piece 23 from the chuck table 18.

By the above-mentioned cutting method, when the plate glass 11 is cut, there are almost no cracks and cracks which are problematic in terms of quality of the small pieces 23, and the cutting is at the same level as when the plate glass 11 is stuck to the backing plate with hard wax. A small piece 23 having a surface quality was obtained.

The plate glass 11 to be cut in the embodiment.
However, in the present invention, a laminated body in which a plurality of substrates made of a brittle material are laminated by a frozen layer may be used, and the laminated body can be fixed by a freeze chuck.

[0029]

As described above, according to the present invention, linear grooves having a width wider than the width of the grindstone blade of the cutting wheel are provided on the upper surface of the chuck table at a predetermined pitch.
A substrate made of a brittle material is fixed to the upper surface of the chuck table through a frozen layer of the liquid by supplying a liquid to the upper surface and the groove of the chuck table, and the grindstone blade of a rotating cutting wheel is fitted into the groove. Since the substrate is completely cut while cutting a part of the frozen layer in the groove by running along the groove in this state, the substrate made of brittle material can be directly attached to the upper surface of the chuck table without scratching the surface. It can be fixed, and by cutting the frozen layer, a small piece with high cutting surface quality can be obtained without large chipping at the cutting edge of the small piece after cutting, diamond or CBN
It is possible to remarkably improve the efficiency of the cutting process without causing clogging by wax or the like on the surface of the grindstone blade made of abrasive grains such as.

Further, according to the present invention, since the substrate made of brittle material is made of glass or crystallized glass and the liquid is water, the lower surface of the conventional substrate is cut by cutting the frozen layer made of ice. It is easy to prevent large chippings on the edges and clogging of the grindstone blade made of abrasive grains such as diamond and CBN, and to simplify the washing process of small pieces after cutting. It is possible to significantly reduce the cost of utilities and maintenance.

The brittle material cutting apparatus according to the present invention is a brittle material cutting apparatus for cutting a substrate into a plurality of small pieces by a cutting foil, wherein the upper surface and the groove of the chuck table are capable of holding liquid. A liquid supply means for supplying a liquid to the upper surface of the table, and a freezing layer of the substrate by freezing the liquid existing between the substrate and the upper surface of the chuck table and the liquid in the groove after the substrate is placed on the upper surface of the chuck table. Since it has a freezing means for fixing it via a heating means and a heating means for melting and releasing the intervening frozen layer from the upper surface of the chuck table of a plurality of small pieces cut by the cutting foil from the substrate, cutting of the brittle material of the present invention It becomes possible to carry out the method smoothly and with high efficiency.

As described above, according to the present invention, the substrate made of the brittle material can be easily fixed, and the quality of the cut surface of the cut small piece is the same as when the backing substrate is attached with the hard wax. It is at the same level as that of the conventional one, and it eliminates the need for a backing plate, wax, and an organic solvent or special detergent used to wash small pieces after cutting, which simplifies the washing process of small pieces. In terms of reduction of cutting cost due to improvement in productivity and reduction of environmental load, it has an excellent effect in practical use.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a brittle material cutting method and a cutting device according to an embodiment of the present invention.

FIG. 2 is an explanatory view showing a conventional substrate cutting method and substrate cutting apparatus.

[Explanation of symbols]

1, 11 substrate 2 wax 3,13 cutting foil 3a, 13a Grindstone blade 4 reliance plate 5 chucking plate 6, 16 XY indexing table 7,23 small pieces 14 spindles 17 Freezing chuck 17a upper surface 18 Chuck table 18a upper surface 18b groove 19 Frozen piping 20 heating heater wiring 21 Supply nozzle 22 Coolant nozzle C cutting fluid E frozen layer W water

Claims (3)

[Claims] 1. A method for cutting a brittle material in which a substrate made of a brittle material is fixed to a chuck table and the substrate is cut into a plurality of small pieces by a rotating cutting foil, wherein the chuck table has an upper surface on which a grindstone of the cutting foil is provided. Linear grooves having a width wider than the width of the blade are provided at a predetermined pitch, and the liquid is supplied to the upper surface of the chuck table and the grooves to cool the substrate so that the liquid on the upper surface of the chuck table is covered with liquid. The substrate is completely cut while cutting a part of the frozen layer in the groove by running along the groove while the grinding wheel blade of the rotating cutting wheel is fixed in the frozen layer and inserted into the groove. A method for cutting a brittle material characterized by the following. 2. The method for cutting a brittle material according to claim 1, wherein the substrate is made of glass or crystallized glass, and the liquid is water. 3. A chuck table for fixing a substrate made of a brittle material on the upper surface with linear grooves having a width wider than the width of the grinding wheel blade of the cutting foil on the upper surface, and the grinding wheel blade in the groove. In a cutting device for a brittle material, the cutting device cuts a substrate fixed on the chuck table by running while rotating in a state of being inserted, and cutting the substrate into a plurality of small pieces by the cutting foil. The upper surface and the groove of the table have a structure capable of holding a liquid, and are interposed between the liquid supply means for supplying the liquid to the upper surface of the chuck table and the substrate and the upper surface of the chuck table after the substrate is placed on the upper surface of the chuck table. Freezing means for fixing the substrate through the frozen layer of the liquid by freezing the liquid and the liquid in the groove, and a compound cut from the substrate by the cutting foil. Cutting device of the brittle material characterized by having a heating means for pieces by dissolving frozen layer interposed a release from the chuck table top of.